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Gemini now turns your messy spreadsheets into interactive mini-apps
Sheets canvas is rolling out now
WATCH: Trump signs executive order on childhood vaccine recommendations
The order recommends separating the MMR vaccine into three different shots administered in separate visits, and directs the nation's health department to improve vaccine research, says a White House fact sheet.
Did Klutch Sports Group, Nuggets’ Peyton Watson misread his market?
The Bucks and Clippers are confirmed suitors, but neither appears willing to provide a lucrative offer sheet. That falls back on the agent. The Nuggets are winning this game of chicken.
Why Hybrid Healthcare Is a Business Imperative for Employers in Colorado
Health insurance is one of the largest line items on companies’ balance sheets and a critical factor in workforce stability. As costs and expectations rise, employers and employees want a simpler, more integrated healthcare experience. Yet for many, navigating healthcare still feels fragmented, time-consuming, and overwhelming — from finding the right care provider to understanding […]
The Beauty Of Settled Science
Commenters convinced me I made a subtle mis-step in my framing of Psychology Research Is Mostly Fine. My framing emphasized that social priming studies had failed to replicate, but that many other subfields of psychology hadn’t. This naturally led commenters to point to failed replications in other subfields. Although none of these were as bad as social priming, few or none were entirely problem-free. Instead of emphasizing the difference between social priming and other subfields, I should have emphasized the difference between settled science and novel research. Here are some of my favorite psychology findings: The brain is sculpted by reinforcement learning, and a key driver of this learning is a prediction-error-based algorithm located in the nucleus accumbens and implemented through dopamine. Psychedelic drugs exert their effects through 5-HT2A receptors, pointing to a role for these receptors in some sort of construct like the balance between priors and new evidence. Certain cognitive functions are localized to certain brain areas (for example, impulse control to the frontal lobes; linguistic structure to Broca’s area, linguistic meaning to Wernicke’s area. But injure one of these areas, or render a certain function useless (eg a blind person having no more use for their visual cortex), and these mappings can gradually shift - suggesting that neurons are general-purpose compute whose specialization is a contingent fact about convenience and efficiency rather than a necessity. Most personality traits and general capabilities are about 50% genetic and 50% random, with little role for family environment or childhood history, with a few notable exceptions like partisan preference. Recent research complicates this story, but the further you go from this basic picture, the gnarlier the chains of indirect causation you require. Neurons fire together in “brain waves”, whose exact frequency corresponds with the character of consciousness; These divide neurons into natural subpopulations and linked graphs. The gamma rhythm corresponds surprisingly well to items in conscious awareness. GABA receptors seem to be involved in something like relaxation. By hitting different GABA receptors in different ways, you can modulate the exact type of relaxation you produce. Hitting GABA-A directly is too powerful and can cause dangerous levels of sedation, but allosteric modulation of GABA is an incredibly fruitful strategy that underlies drugs from benzos to barbituates to alcohol. If you know your GABA-A subunits, you can target specific subtypes of relaxation; for example, Ambien hits GABA-A1 and induces sleep. Memory divides somewhat fuzzily into bins of immediate-sensory, short-term, and long-term, with separate retrieval and storage functions, and separate systems for declarative vs. procedural learning. These can be harmed selectively, usually by hippocampal injury, so that some patients can remember their life stories but not form new long-term memories, or learn new skills like bike-riding but not new facts. The exact substrate of memory is unclear but seems to involve new synaptic connections between neurons in at least some way. The ability of modern psychology and psychiatry to treat mental illness is real but limited. SSRIs work for half or slightly fewer than half of patients; antipsychotics work with extreme side effects; benzodiazpines work but produce addiction and tolerance in many (not all) people. Most supplements are stuck in Poor Quality Study Replication Crisis Hell, but melatonin and l-theanine stand out as especially promising. Psychotherapy works with moderate effect size, but (with a few exceptions) seems to be more about the relationship with the provider than the details of the therapy itself. Mental hospitalization can sometimes defuse immediate crises but work less well than mental hospitals would like, with some studies showing overall negative effects. Schizophrenia is mostly genetic, but risk also increases with prenatal infection (especially rubella) and obstetric complications; there is suggestive evidence for roles of social stress and drug use (with psychedelics and marijuana making things worse, and nicotine if anything making things better). Bipolar and schizophrenia are so closely linked on a pathophysiological level that it seems like they might be the same disease; on the clinical level, they do seem to follow two separate courses/prognoses but can sometimes surprise clinicians by eg someone who seemed condemned to permanent schizophrenia unexpectedly recovering. The brain’s native reinforcement learning algorithms cash out in the phenomena of classical and operant conditioning; different reinforcement schedules reinforce at different levels, which can be exploited by bad actors to make especially compelling products (eg slot machines). None of these are immune to doubt. A few are speculative; one or two are genuinely unorthodox. But they’re all a step above one p = 0.049 paper that might not replicate. If they get overturned, they’ll be overturned by the same sort of genuine scientific shift that replaced Ptolemy with Copernicus or Lamarck with Darwin, not some sort of sordid discovery about someone entering random numbers into a spreadsheet. In 2008, Eliezer Yudkowsky wrote about The Beauty Of Settled Science: If you only care about scientific issues that are controversial, you will end up with a head stuffed full of garbage. The media thinks that only the cutting edge of science is worth reporting on. How often do you see headlines like “General Relativity still governing planetary orbits” or “Phlogiston theory remains false”? So, by the time anything is solid science, it is no longer a breaking headline. “Newsworthy” science is often based on the thinnest of evidence and wrong half the time—if it were not on the uttermost fringes of the scientific frontier, it would not be breaking news. Scientific controversies are problems so difficult that even people who’ve spent years mastering the field can still fool themselves. That’s what makes for the heated arguments that attract all the media attention. Worse, if you aren’t in the field and part of the game, controversies aren’t even fun. Don’t be embarrassed to read elementary science textbooks, either. If you want to pretend to be sophisticated, go find a play to sneer at. If you just want to have fun, remember that simplicity is at the core of scientific beauty [...] A steady diet of science news is bad for you: You are what you eat, and if you eat only science reporting on fluid situations, without a solid textbook now and then, your brain will turn to liquid. Psychology isn’t centrally the new paper in Annals Of Recently-Breaking News saying that an n=5 study showing that large portion sizes increase support for terrorism. Psychology is centrally ideas like brain waves, GABA receptors, reinforcement learning, twin studies, and connectionism. People who think differently are worrying too much about BREAKING NEWS!!!, and should stop. The key distinction isn’t “recent research in social psychology” vs. “recent research in cognitive/bio/behavioral psychology”, as my essay last week unfortunately implied. It’s recent research in general vs. the deposit of settled science, battle-tested hypotheses, and carefully-earmarked speculation. And part of the reason social priming in particular was such a disaster was that it defied that heuristic, building itself up over hundreds of studies until it approached or even entered the pantheon of settled science - before collapsing (5-HTTLPR was also sort of like this). This isn’t a claim that settled science is always right - Freud was “settled science” for a long time - just that there’s an intuitive distinction between the level of credence you should have in the existence of power posing vs. the existence of Broca’s Area. (I compounded this error by calling the last post “Psychology Research Is Mostly Fine”, which suggested I was talking about the new research rather than the settled science. I actually meant to distinguish between research-psychology-the-field vs. clinical-psychology-aka-therapy, but this framing unintentionally pushed against the point I wanted to make) Some commenters on the previous article understood this point, but challenged its weight. It’s very cool, they said, to know how many neurons are in which brain lobe, but the main way that Psychology affected their lives was through bad clickbait studies used to buttress dumb policies; some p = 0.049 study says that exposure to microaggressions makes minorities’ brains shrivel into raisins, and now their company has to implement punitive DEI or be sued for hazardous work conditions. I won’t dispute this as an accurate description of how the sausage gets made, but it’s worth examining the trains of thought that connect this observation to a campaign against psychology in general: The dumb woke psychology was wrong and bad, and I don’t have good heuristics for distinguishing dumb woke psychology from other psychology, so I’m going to assume it’s all wrong and bad. The dumb woke psychology was wrong and bad; it seems useful to punish/discredit psychology as a whole to assist my campaign against it, so for propaganda purposes I will try to discredit psychology as a whole. To people in the first camp, my response is: come on, your heuristics aren’t that bad. “Microaggressions makes minorities’ brains shrivel up like raisins” is in the woke category; “the hippocampal theta rhythm seems to be associated with both memory and pathfinding, suggesting an unexpected yet surprisingly compelling relationship between the two” is in the not-woke category, don’t play dumb here. To people in the second camp, my response is: deliberately exaggerated propaganda campaigns are bad and this is a confession, not an excuse. Inability to view science through anything but a political lens was what got us into this problem; doubling down on it is a temporary solution but a recipe for permanent disaster. If you pronounce entire fields of science to be acceptable collateral damage in your campaign against bad political actors, you will alienate not just scientists but patients, clinicians, and general lovers of truth. Instead, you can say the thing you mean - that woke partisans shouldn’t try to occupy and exploit the otherwise-noble science of psychology for their own political gain - and wage the same campaign with a halo rather than a comic-book-villain goatee. From the font of oracular wisdom that is Weird Sun Twitter: [ Vessel Of Spirit@VesselOfSpirit i love you all conditionally but i love the good part of you unconditionally. even if it becomes a very small part 2:11 AM · Jan 22, 2015 1 Reply · 5 Reposts · 29 Likes ](https://x.com/VesselOfSpirit/status/558084551772471298) This is how I feel about psychology1, too, but with a touch more optimism. The good part of psychology is enormous, a hoard of endless treasures. You just have to look past the headlines! 1 To play devil’s advocate - should one always be so magnamious? Astrology? Phrenology? These seem different in that their entire orientation was flawed from the start; they didn’t simply fail to find the correct constellation-personality connections, the whole project of searching for connections between constellations and personality was doomed from the start. More difficult might be asking the same question about education research, which is notoriously bad. I don’t know enough about education research to know if there’s some settled science of correct and enlightening results lurking in the background beyond the day-to-day froth of poorly-conducted and politically-motivated studies. I think if it’s 90% bad, 10% good, it’s correct to call it bad as a compact way of communicating a useful truth; I think psychology is better than that, but admit it’s a tough judgment call.
Huge Pixel Watch 5 leak leaves little to the imagination
A fresh leak includes marketing materials and a spec sheet for the new Pixel Watch 5, about a week ahead of Google's official reveal.
Google tests new features designed to make the Google Messages app easier to use
For the first time ever, the Google Messages attachment sheet icons can be customized and made to take up a full page.
Healthcare costs have more than doubled for many farmers this year, on top of soaring expenses
When Congress allowed Affordable Care Act tax credits to lapse, healthcare premiums spiked for millions of Americans — especially self-employed farmers and ranchers. That added cost is multiplying the stress on their already stretched balance sheets.
Four Teams Showing Interest in Nuggets Wing Peyton Watson
The Denver Nuggets finally found NBA Championship success back in 2023, but since then, the team have failed to get back to the NBA Finals, and now, they’ve been forced into some major decisions this summer.Recently, they matched an offer sheet for Spencer Jones, putting the team into the second apron, the only team in […] The post Four Teams Showing Interest in Nuggets Wing Peyton Watson appeared first on HEAVY.
Why Hybrid Healthcare Is a Business Imperative for Indiana Employers
Access to healthcare is more than a recruiting or retention tool. It’s one of the largest line items on the balance sheet and a critical factor in workforce stability. As costs and expectations rise, employers and employees want a simpler, more integrated healthcare experience.
Wildfires
WHO fact sheet on wildfires, including climate change, air pollution, health effects, populations at risk and WHO response.
Sheet metal, Plainview dentist, data leak make Lubbock business news
Business Reporter Alana Edgin reviews recent Lubbock area businesses news and hints at upcoming articles in the Around the Hub column.
Healthcare costs have more than doubled for many farmers this year, on top of soaring expenses
When Congress allowed Affordable Care Act tax credits to lapse, healthcare premiums spiked for millions of Americans — especially self-employed farmers and ranchers. That added cost is multiplying the stress on their already stretched balance sheets.
Lubbock business news includes best jerky, sheet metal, AI flyers
Business Reporter Alana Edgin reviews recent Lubbock area businesses news and hints at upcoming articles in the Around the Hub column.
Using Excel to Track and Grow Business - New York State Bar Association
Lawyers may excel in learning case law, but a working knowledge of Excel spreadsheets and other bookkeeping tasks can be daunting. A recent program sponsored by the New York State Bar Association offered tips and tricks to better navigate spreadsheet programs. The webinar was presented by Jordan Turk, a family law attorney in Texas and
Samsung Galaxy Watch 9 and Ultra 2 specs and pricing leak in full ahead of launch
A fresh leak purports to reveal the full specs sheet of the Galaxy Watch 9 and Watch Ultra 2, as well as likely European pricing.
Mavericks match Knicks' offer sheet to restricted free agent C Moussa Cisse for 2-year, $4.7 million deal
Mavs Block Knicks, Match Offer To Keep Promising Young Center
Dallas secured frontcourt depth by matching a $4.7 million offer sheet for Moussa Cissé, preventing the New York Knicks from poaching the defensive specialist after his standout rookie season.
Mavs match Knicks' two-year, $4.7M offer to Moussa Cisse
The Dallas Mavericks have matched the New York Knicks' two-year, $4.7 million offer sheet on restricted free agent Moussa Cisse, Yann Balikouzou and Kevin Bradbury of LIFT Sports Management tell ESPN.
AMC (AMC) Stock Trades At A Discount On Its 99% Five Year Slump
AMC Entertainment Holdings stock now trades around US$1.94 after a long slide in which shareholders have seen the value of their investment fall about 99% over five years, while some valuation checks still suggest the shares are not clearly expensive on current metrics. Over the past five years, AMC Entertainment Holdings has declined about 99%, which means any fresh move in the share price carries outsized importance for existing holders. Recent balance sheet moves to refinance high...
AMC Entertainment Holdings (AMC) Is Up 8.9% After Debt Refinancing And Note Conversion - Has The Bull Case Changed?
AMC Entertainment Holdings has advanced its balance-sheet overhaul by refinancing US$400 million of high-interest debt on better terms and converting about US$155.8 million of senior secured exchangeable notes into equity, while also preparing to report its second-quarter 2026 results on July 20. These moves reduce long-term obligations and loosen restrictive covenants, potentially giving AMC more room to support core theater operations and future refinancing efforts ahead of its upcoming...
Portland councilors release draft term sheet as business coalition presses for public Moda Center funding
The draft term sheet kicks off a new round of negotiations with Trail Blazers owners over funding for arena improvements.
Scientists sail to Greenland to study melting ice sheets
A Cambridge scientist is leading the pioneering study into the impact of melting glaciers on our oceans.
Leak reveals nearly full spec sheet for Samsung Galaxy Watch 9 and Ultra 2
Ahead of a July 22 Unpacked event, a new report details battery upgrades, chip changes, and pricing for Samsung's next smartwatches.
Opinion | Markets, not politics, will make China’s yuan a global currency
Until authorities can reduce costs and allay the market’s concerns, yuan internationalisation will be stronger on paper than balance sheets.
Scientists Sound Alarm as Disturbing Volcanic Scenario Unfolds Beneath Antarctica - Futura-Sciences
When Climate and Volcanoes Collide It’s well known that major volcanic events can influence the climate. But—as it turns out—the reverse is also true. The ongoing destabilization of the Antarctic ice sheet, driven by global warming, could actually lead to an increase in subglacial eruptions on this icy continent. You...
Navigating the Business Tax Account: Summer 2026 Enhancements, Access Protocols, and Strategic Implications for Practitioners
Internal Revenue Service. Summer 2026 Expanded Features for BTA. Fact Sheet FS-2026-11. July 2026. Retrieved from IRS.gov Newsroom. Internal Revenue Service. Business Tax Account. Official Platform Documentation & Eligibility Guide. Last Updated: July 9, 2026. Retrieved from IRS.
Bayer sells stake in contraceptives business to Apollo in €3bn financing deal
Sale will help German pharmaceuticals group to bolster its balance sheet after years of litigation over Roundup weedkiller
New Sheetz becomes first business to open in new development in Greater Cincinnati
Sheetz will celebrate the grand opening of its newest store on July 10.
Warsh Taps Fed Task Force Chiefs. They’re Global Bankers, Business Leaders and Academics.
The task forces will study Fed communications, the balance sheet, economic data usage, productivity and jobs, and inflation.
D-backs @ Padres Discussion
Today’s Lineups DIAMONDBACKS PADRES Ketel Marte – 2B Fernando Tatis – RF Ildemaro Vargas – SS Jackson Merrill – CF Corbin Carroll – RF Xander Bogaerts – SS Gabriel Moreno – C Gavin Sheets – 1B Max Kepler – LF Jake Cronenworth – 2B Lourdes Gurriel – DH Luis Campusano – C Nolan Arenado – […]
Stock Market Today, July 6: AMC Entertainment Falls as Share Sales Complicate Summer Box Office Rebound
AMC’s recent share sales improved liquidity, while stronger theater traffic now needs to show up in margins and balance-sheet progress.
Stock Market Today, July 6: AMC Entertainment Falls as Share Sales Complicate Summer Box Office Rebound
AMC’s recent share sales improved liquidity, while stronger theater traffic now needs to show up in margins and balance-sheet progress.
Report: Quinten Post signs offer-sheet with Memphis Grizzlies
The Warriors will now have until Tuesday to match the Grizzlies contract offer.
Why Antarctica Froze 25 Million Years Before the Arctic Even Though They're Both at the Poles
New solutions to two interlinked mysteries reveal how and why the Antarctic’s enormous ice sheet formed.
Ducks extend Mintyukov ahead of reported offer sheet
Pavel Mintukov signed a five-year, $7.2 million-per-season deal, with offer sheets reportedly presented to the 22-year-old blue liner. Ducks are still weighing NHL-record offer sheet to star Leo Carlsson
Samsung's Galaxy Z Fold 8 Ultra reportedly revives the S Pen, but there's a catch
The rumored spec sheet checks nearly every box the Fold 7 missed, except one.
Secure the Future of Children's Health Care Coverage
Nearly half of America's children rely on Medicaid and CHIP for their health coverage. This fact sheet lays out the steps Congress must take to secure children's health care coverage for the future.
Ducks Should Let Leo Carlsson Walk
The Philadelphia Flyers rocked the NHL world on June 3 when the team announced it had signed restricted free agent center Leo Carlsson of the Anaheim Ducks to a five-year offer sheet for $90 million. At $18 million per season, Carlsson is now the highest-paid player in the NHL, beating the ...
Carlsson's Flyers offer sheet was entirely avoidable for Verbeek, Ducks
If Anaheim does match, they'll be in tight salary cap straights with much more to do. If they don't match, they'll lose their franchise center for four first-round picks. How did we get here?
Breast cancer
WHO fact sheet on breast cancer, including information on prevalence, risk factors, symptoms, management, global impact and WHO's work on breast cancer.
Is AMC Entertainment Holdings (AMC) A Bargain Following Its $350 Million Equity Raise?
AMC Entertainment Holdings (AMC) is back in focus after raising US$350 million through equity offerings. The company is using the cash to fully redeem its 2027 notes, extend major debt maturities and reshape its balance sheet. See our latest analysis for AMC Entertainment Holdings. Recent equity offerings and the full redemption of AMC Entertainment Holdings' 2027 notes have coincided with a sharp 90 day share price return of 68.75%, although the 1 year total shareholder return is still down...
Scientists discover giant fan-shaped structure beneath Antarctica's ice sheet: The hidden structure rewriting Earth's ancient history
For decades, Antarctica has been treated as a kind of frozen time capsule, a place where evidence of Earth's deep past sits preserved, undisturbed, beneath layers of ice that have built up over millions of years. As per the study published in Nature Geoscience, scientists have now uncovered something remarkable within that buried record: an enormous, fan-shaped geological structure stretching across a huge swath of East Antarctica, hidden entirely from view beneath the ice.
Scientists have detected a giant fan-shaped structure buried beneath the East Antarctic Ice Sheet, suggesting the frozen continent may be hiding the geological scars of the breakup that helped separate Antarctica from Australia
East Antarctica can look, from above, like the quiet half of the frozen continent: old, thick, cold and buried under kilometres of ice. But beneath that ice, new mapping suggests the bedrock may carry the shape of a much more violent past. In a Nature Geoscience study published in June 2026, researchers described a giant […]
Read the memo sent to Comcast employees about media spinoff plans
In a memo shared with Comcast employees, the company's co-CEOs spoke of both units' "great business prospects" and "strong balance sheets."
Commentary: Putting students before politics
After another school year, superintendents across Texas are not just packing up classrooms; we are staring down spreadsheets, trying to piece together next year’s budgets. It is a grueling annual...
Giant viruses discovered on Greenland ice sheet may slow glacial melting - Futura-Sciences
Giant viruses defy microbiological norms Lead author Laura Perini and her team at the Department of Environmental Science at Aarhus University identified the microorganisms during a field survey of Arctic ice. Measuring up to 2.5 micrometers in length, these viral specimens are roughly 125 times larger than conventional viral strains....
AMC Entertainment Holdings (AMC) Is Down 16.5% After Dilutive Debt-Reduction Equity Raise - Has The Bull Case Changed?
Earlier today, AMC Entertainment Holdings announced a registered direct follow-on equity offering of 95,250,000 common shares at about US$2.10 each, aiming to raise roughly US$200.03 million primarily to redeem 6.125% Senior Subordinated Notes due 2027 and for general corporate purposes. This latest capital raise follows AMC’s roughly US$150 million at-the-market equity offering completed in early June, underlining how ongoing balance sheet repair is coming at the cost of further dilution...
Zacks Initiates Coverage of Golf Entertainment With Underperform Recommendation
Discover why Zacks rates Golf Entertainment as "Underperform", being the first on Wall Street to initiate coverage on the stock. Explore GLFE's struggles with widening losses, weak entertainment-golf demand and balance-sheet pressure.
This simple twist could bring quantum computers closer to reality
Researchers found that twisting layered sheets of hexagonal boron nitride can dramatically change the light produced by quantum emitters embedded within the material. The technique offers an unexpected new level of control over components that could power future quantum computers, communications systems, and sensors.
AMC Entertainment (AMC) Is Up 24.1% After Record May Attendance And $150 Million Equity Sale - Has The Bull Case Changed?
Earlier in June 2026, AMC Entertainment Holdings completed a US$150,000,000 at-the-market equity offering, issuing roughly 105,300,000 new common shares across multiple tranches priced between about US$1.03 and US$1.50. This fundraising comes as AMC reports record May attendance of 25.5 million guests, its strongest May since 2019, highlighting a recovering box office alongside continued reliance on equity issuance to support its balance sheet. Next, we’ll examine how record May attendance...
AMC Entertainment Stock Advances As Retail Traders Fuel Volatility Following Latest Corporate Equity Capital Raise
AMC Entertainment stock jumps 9.8% on record May attendance, CEO insider buying, and improving U.S. box office — but balance sheet risks remain elevated.
Stop managing your business finances in spreadsheets — QuickBooks is $300 right now
Intuit QuickBooks Desktop Pro Plus 2024 is on sale for $299.99 (reg. $536) for one year. Built for small business owners, freelancers, and accountants, it handles invoicing, expense tracking, inventory, payroll hours, and project profitability reporting.
Scientists pinpoint biggest driver of sea level rise, and it's not melting ice sheets or glaciers
"We can [now] explain sea level rise with greater confidence."
Your cheat sheet to Anthropic's White House drama
Anthropic is at the center of another showdown with the Trump administration, this time over the company's Fable 5 and Mythos 5 AI models.
Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?
Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.
Olivia Rodrigo's new album, Steven Spielberg's latest UFO film, and “Every Year After” top this week's Must List
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Scientists discover giant, fan-shaped structure deep beneath the East Antarctic Ice Sheet
A mysterious geological structure that resembles a human hand with outstretched fingers has been revealed beneath East Antarctica. The discovery shows the frozen continent still hides many geological ...
Scientists discover giant, fan-shaped structure deep beneath the East Antarctic Ice Sheet
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31 hours with the spit-shined Mina the Hollower (and 34 with the four games that came before it)
To truly appreciate Mina The Hollower, an extraordinary new throwback of a game, I sent myself to Yacht Club University. That’s not a real institution of higher learning, but it’s the best way I can explain much of the past several weeks as I prepared to play Mina by playing the four biggest game previously made by studio Yacht Club Games. I had expected Mina the Hollower, in development for six years for PC and consoles, to potentially be something special. A demo I tried in March had felt great. Mina the Hollower had an old-school premise: a singular move for its hero that felt so good to control and so rich with possibilities that, in the hands of skilled designers, it could be riffed on in various ways for the length of a full game. Mina’s core maneuver, her hollowing, made her sort of an upside down Super Mario. Nintendo’s hero jumps through the air, discovering power-ups at the apex of his jump by bonking overhead blocks, then defeating enemies by landing on them. Mina essentially jumps into the ground, digging (“hollowing”) into the earth to fetch buried treasure, then burrows for a short distance to emerge on the other side of a wall that hides treasure or an enemy that needs some battering. I wanted to understand how good Yacht Club was at making games. I wanted to see how far they’d come. If Mina was terrific—as I predicted it might be—I wanted to feel how they got there, one button press at a time. On May 6, 21 days before the writing of this review, I checked with Yacht Club Games co-founder and programmer David D’Angelo, to ask which of the studio’s games I should play to truly appreciate the new one’s design. “Hmmm all of them?” he wrote back. “Starting with Shovel Knight definitely is helpful,” he continued, referring to Yacht Club’s first game. He gave me a link to a spreadsheet of over 400 cheat codes that could help me out, if I found the game too tough.1 “Most folks say Specter of Torment is the least difficult and quickest to finish in terms of playtime, and [it] refines much of Shovel Knight,” he told me. “King of Cards is a big celebration of everything we did in [the Shovel Knight compilation] Treasure Trove— might work for you better if you’re a fan of shorter, Mario-style courses. And it’s probably the closest to Mina in terms of polish.” So that was that. Four games, none of which were required. Mina is a whole new game in a whole new world, best I can tell. I’d barely played that first Shovel Knight before and never the other three. I just thought it’d help. It did. It turns out that playing a game studios major works before their latest is very illuminating.
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Science diplomacy lessons from a North Korean volcano
Mount Paektu, a mythic, active volcano on the border between North Korea and China, is almost the epitome of a scientific challenge that crosses political lines. In 946 CE, it erupted in one of the five biggest volcanic events of the past 10,000 years, kicking up huge quantities of ash and sending destructive mud flows down river channels for hundreds of kilometres. Should this happen again, the entire region, including easternmost Russia, South Korea and even Japan could be hit. “It’s definitely got the potential to be big,” said James Hammond, a professor of geophysics at Birkbeck, University of London. An eruption on the scale of 946 would have “huge regional impact.” For the past 15 years, Hammond has helped lead a groundbreaking collaboration with North Korean scientists to study the volcano, navigating scientific sanctions, tough export controls on scientific equipment and a long, pandemic-enforced exodus from the country. Although he seems more at home on far-flung research expeditions – before speaking to Science|Business, Hammond was camping out on a Greenland ice sheet – he has also advised the European Commission on its changing science diplomacy strategy. His long experience with North Korea has made Hammond sceptical of blanket bans on science collaboration, no matter the country.This is a live question in Europe, where in the wake of Russia’s 2022 invasion of Ukraine, institutional ties with Russian universities were almost entirely severed, although some scientists fear this could undermine our understanding of climate change’s impact on the Arctic. Here, Hammond tells the story of the Mount Paektu mission and the policy lessons he takes from it. Ominous rumblingsThe genesis of Hammond’s collaboration came in 2002, when Mount Paektu began to rumble ominously. Earthquake activity picked up and the volcano began to emit unusual gases. North Korean scientists took notice. “People felt we need to know more about this volcano,” said Hammond. In 2011, North Korean vulcanologists put out a request for international expertise to help them learn more. At the time, Hammond and his collaborator, Clive Oppenheimer, were working on a vulcanology project in another sanctioned country, Eritrea, and so decided to answer the call. Within a month, they had flown into Pyongyang. “It was pretty incredible,” recalls Hammond (left). “We were made to feel like honoured guests, and invited to official celebrations.” The scientific opportunity was huge. Paektu is unusually positioned, a thousand kilometres from where tectonic plates rub against each other in the Pacific. “It was an incredibly interesting volcano, but not much research had been done, at least not in the international community,” he said. “There was so much we felt we could do. And we had these partners that were super keen to engage.”The mission received an unusual visitor in the form of volcano-obsessed filmmaker Werner Herzog, who accompanied Hammond and Oppenheimer while directing his 2016 film Into the Inferno about volcanos across the world. Four days into the trip, the German director delivered a long speech about reunification to his North Korean hosts, recalls Hammond. “He got to the heart of the Koreans and how they felt, and how they thought, in a way that I'm not sure I ever will,” he said. UN sanctionsHowever, Hammond realised he’d been “naïve” about how difficult it would be to collaborate with North Korea, which was sanctioned far more heavily than Eritrea. “We didn’t fully appreciate the all-encompassing nature of restrictions,” he said. In 2016, as tensions escalated over Pyongyang’s nuclear tests, a United Nations resolution banned all joint scientific work with North Korea. However, the UN sanctions did allow countries to request carve outs, and the UK successfully requested an exemption for Hammond’s work. Related articlesEU pushes for joint science diplomacy, but care needed to avoid gridlock, experts sayRussia severs its last ties with German scienceAnchor Greenlanders in Arctic climate research, experts tell EU ahead of policy updateExport controls have also delayed Hammond’s work. In one case, it took 18 months to get approval from the UK government to take seismometers, which measure earthquakes, to North Korea. “It was frustrating,” he said. “But they didn’t just say no.” However, one instrument, called an induction coil, used to measure how the earth conducts electricity, was blocked entirely because it can in theory be used to detect submarines. Karaoke bondingSince the collaboration started in 2011, Hammond has visited the country around 15 times, although the pandemic closed off North Korea for more than five years. A trip last November was Hammond’s first since the outbreak. Despite this lengthy interlude, Hammond has deep bonds in the country. The North Korean scientists Hammond works with are somewhat isolated, as they struggle to access the latest research papers and travel to international conferences. That said, they are “excellent geophysicists” and are “very well trained in the field,” he said. Over karaoke and chats about their families, “we’ve made friendships, for sure,” he said. The authorities have to sign-off things like the placement of seismometers, for example, but Hammond said these requests have been approved. “Everything that we've asked for within a scientific context has been delivered.”Scientific backchannels? These kind of personal links between scientists across political lines are one purported benefit of science diplomacy. During the Cold War, some historians argue, scientific contact between the US and Soviet Union laid a groundwork of trust for other cooperation, such as on arms control. Hammond agrees that backchannel contacts to North Korean geophysicists are hardly likely to defuse a military crisis on the Korean peninsula, but the simple fact of the scientific collaboration makes contacts between diplomats that little bit easier. “It creates opportunities to understand each other a little bit better,” he said. “When maybe you have those more difficult discussions as diplomats, it's coming from a slightly better place.” Cutting tiesDrawing lessons from the Mount Paektu mission for today’s links with Russian science isn’t simple. The analogy is far from exact, Hammond said, “because one is essentially a Cold War, versus a pretty hot war in the case of Russia.” But Hammond’s broader argument is that the challenges we face, such as climate change, pandemics, biodiversity loss, pollution and so on, have globalised in an unprecedented way, making blanket shutdowns in collaboration with any country unwise.He’s somewhat critical of the UN scientific sanctions imposed on North Korea in 2016, even though they did allow for exceptions. “I think a blanket halt to some of these things, when we face big global challenges [. . .] that’s quite a risky thing to do,” he said.Institutional endorsement?European academics are still by and large free to work individually with Russian counterparts. However, official, institutional partnerships have largely ended. Shortly following the full-scale invasion of Ukraine in 2022, Russian university rectors wrote a public letter endorsing the war, meaning European universities fear official collaboration could also be seen as a kind of endorsement. Hammond acknowledges there is a risk of legitimising regimes, and state-controlled universities, through scientific cooperation. “That’s the trade off you have to make,” he said. Strategic projectsWith Russia, instead of giving a green light to restart all Arctic science, a middle ground might be firing up a few carefully selected “strategic” projects, said Hammond. After all, European countries are still collaborating with Russia on the International Thermonuclear Experimental Reactor, an experimental nuclear fusion plant in the south of France. However, even if Europe did try to revive Arctic science with Russia, there’s no guarantee Russian scientists would play ball. A series of high-profile arrests of physicists in Russia accused of sharing their findings with the outside world has made collaboration fraught. Even before the invasion of 2022, “the Russian regime made it increasingly difficult, and this sort of discouraged people,” Dag Rune Olsen, rector of the Arctic University of Norway, told Science|Business last year.
The WNBA’s 2026 TV distro plan is (almost) perfect. Let’s resolve that ‘almost’
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Scientists Discover Evolution’s 120-Million-Year-Old “Cheat Sheet”
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How ‘Storage Wars’ Paid Tribute to Darrell Sheets on Air, 3 Days After His Death
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