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New formulation helps RNA vaccines withstand high temperatures
MIT researchers used artificial intelligence to create more stable, heat-resistant RNA vaccines.
HEALTH AND FITNESS: This is your brain on football
Football season is underway, much to the delight of professional, college and high school fans. Football has also been in the news for another more serious reason – the association with brain injury. Over the years, it has been reported that several former NFL players suffered from brain injury because of concussions sustained over years of playing. Some players have even retired early in their careers to avoid such injury. Recently reported research suggests that this brain damage may start earlier and be the result of cumulative “minor” injuries rather than a single major trauma.
Take-home toxins
Work-related hazardous substances “very well may be riding with you on the car ride home.”
Walmart’s Grocery Business Is Emerging as Its Answer to Prime, PYMNTS Data Finds
Amazon spent decades building a machine designed to make consumers come back constantly. Walmart has had one all along. It’s called grocery. Food and
NFL Week 3 instant reactions: Broncos-Rams SNF shootout, Ravens' Rio walkoff, Mariota leads upset win
IRGC Reaffirms Commitment to Resistance Path on Nasrallah’s Martyrdom Anniversary
TEHRAN (Tasnim) – The Islamic Revolution Guards Corps reaffirmed its commitment to the path of Hezbollah late Secretary General Sayyed Hassan Nasrallah, saying his legacy continues to strengthen the resistance front and Lebanon’s Hezbollah.
New Huaka‘i Benefits Go the Distance for Locals
Hawaiian Airlines’ free kama‘āina travel benefits program expands, making local travel even more rewarding.
Iran Ready to Resist Any Aggression, Even ‘Apocalyptic War’: Araghchi
TEHRAN (Tasnim) – Iran is fully prepared to confront any aggression and stands firm even if the confrontation escalates into an “apocalyptic war”, Foreign Minister Abbas Araqchi said, stressing that Tehran keeps the door open to diplomacy and a proposed seven-day plan to reopen the Strait of Hormuz.
Iran’s Foreign Ministry Marks 2nd Anniversary of Nasrallah’s Martyrdom
TEHRAN (Tasnim) – The Foreign Ministry of Iran commemorated the second anniversary of the martyrdom of Hezbollah Secretary General Sayyed Hassan Nasrallah, hailing his decades-long leadership of the Lebanese resistance and reaffirming Iran’s support for Lebanon’s sovereignty.
After five years of war, how do Ukrainian small businesses survive?
In this interview, writer and journalist Victoria Belim-Frolova shares her observations about Russia’s war on Ukraine and how it forces “a constant process of adaptation,” especially in women-led small businesses.
3 business risks of AI-assisted coding executives can’t ignore
Without oversight, AI coding assistants can leak secrets, act sans accountability and spike spend.
Navigating the American Dream: How Integrated Financial Tools, Credit and Rewards Can Help Small Businesses Succeed
(Feature Impact) Owning a small business has been a cornerstone of the “American Dream” for generations. It represents the chance to transform a passion into a livelihood and legacy. However, turning dreams into reality is rarely a smooth or easy process and requires more than ambition alone. Today’s business owners need support and access to tools that enable them to overcome challenges and keep growing.#placement_678081_0_i{width:100%;margin:0 auto;}var rnd = window.rnd || Math.floor(Math.random()*10e6);var pid678081 = window.pid678081 || rnd;var plc678081 = window.plc678081 || 0;var abkw = window.abkw || '';var absrc = 'https://ads.empowerlocal.co/adserve/;ID=181918;size=0x0;setID=678081;type=js;sw='+screen.width+';sh='+screen.height+';spr='+window.devicePixelRatio+';kw='+abkw+';pid='+pid678081+';place='+(plc678081++)+';rnd='+rnd+';click=CLICK_MACRO_PLACEHOLDER';var _absrc = absrc.split("type=js"); absrc = _absrc[0] + 'type=js;referrer=' + encodeURIComponent(document.location.href) + _absrc[1];document.write('');Recent research conducted by the Capital One Insights Center shows 75% of more than 1,000 surveyed small business owners with more than one employee and annual revenues of up to $20 million are confident about the future, and 69% believe their business is actively primed for growth.While this optimism is promising, 47% of business owners still said their operations either stayed the same or became less efficient over the past year, citing issues like back-office friction and fragmented financial systems that make it difficult to get a clear picture of the health of their businesses.If you’re a small business owner eager to grow but not sure how to get there, start with this advice from real small business owners and experts at Capital One.Identify Sources of FrictionBefore you can pour effort into growth, you must understand what barriers are holding you back. Take time to look under the hood of your business to identify where time and energy is being lost.For example, you may be among the 78% of small business owners who feel stressed and uncertain about expense management – think hours spent hunting for receipts, manually entering numbers into software and reconciling accounts. Operational challenges aren’t just a hassle; they also pull attention away from important priorities like serving your customers and planning for growth. “We were focused on making as many candles as possible, especially during the busy season,” said Katie Roering, co-owner of Fontana Candle Co. “A lot of the back-office tasks like procurement, raw material purchasing, forecasting – all the really important things – were done at 3 a.m., 8 p.m. or on Saturday and Sunday, and there really just was not enough time in the day to get everything done that we needed to. We just knew as we continued to grow, we needed to streamline our processes, build out our team and keep moving forward.”Use Integrated Tools to Manage FinancesInstead of balancing 10 different tracking and analysis tools, you can turn to one-stop solutions to improve efficiency. Time gets lost when you’re forced to manually gather and interpret relevant data before you’re able to act. You need a platform that handles the busywork for you.Integrated, or “all-in-one,” financial tools – like accounting and bookkeeping platforms with automation capabilities or business credit cards featuring built-in analytical tools – allow you to easily stay on top of cash flow and day-to-day operations. For small businesses where every hour and dollar makes a difference, consolidating and automating systems can have an immediate impact. In fact, 51% of survey respondents said integrated tools have already fueled their growth.Leverage Credit Access and Rewards WiselyGrowth requires capital, so access to credit is a game-changer for many business owners, with 77% describing it as a key factor in achieving business resilience. Having funds accessible when you need them makes your business more capable of weathering storms such as equipment failures and seasonal slowdowns. It also puts the power in your hands to act when an exciting opportunity presents itself, like an inventory flash sale or the chance to advertise in a new market.Access to credit comes with another advantage: rewards. By using credit cards for your daily business expenses, you can earn cash back, points or travel rewards. Whether you redeem these to cover everyday expenses, book business trips or reinvest in the business, they can act as a bonus source of income. Learn to maximize rewards like the 84% of small business cardholders surveyed so you aren’t leaving money on the table.To learn more about how small business owners can identify obstacles, employ integrated financial tools and use credit as a tool for growth, read the full report at capitalone.com/about/insights-center.Photos courtesy of Shutterstock
Your Amazon Prime Subscription Comes With An Alexa Upgrade You Should Use More
Amazon Prime comes with many benefits for subscribers, but one many might not be familiar with involves and upgrade to Amazon's Alexa AI assistant.
Situation analysis of disability-inclusive health systems in the Eastern Mediterranean Region
Analysis in English on Afghanistan and 21 other countries about Health and Protection and Human Rights; published on 28 Sep 2026 by WHO
WHO Situation Report No.3: Health emergencies in the Eastern Mediterranean Region (August 2026)
Situation Report in English on Afghanistan and 11 other countries about Food and Nutrition, Health, Epidemic and more; published on 27 Sep 2026 by WHO
LAFC part ways with head coach Marc Dos Santos
By Jonathan SigalLAFC have parted ways with head coach Marc Dos Santos, the club announced Sunday evening.Dos Santos was appointed in December 2025, taking over after being an assistant under previous...
NASCAR Cup Series Standings After Kansas: Full Chase Points Update
Kyle Larson did more than win Sunday at Kansas Speedway. He left the track with a commanding lead atop the NASCAR Cup Series Chase standings. Larson’s victory, his fourth career Cup win at Kansas, capped a massive points day for the Hendrick Motorsports driver. He earned 76 points, the most by any driver in a […] The post NASCAR Cup Series Standings After Kansas: Full Chase Points Update appeared first on HEAVY.
China's space diplomacy lifts Pakistani astronaut toward orbit
Two Pakistani pilots are memorising Mandarin, spinning in centrifuge drills and learning to eat, sleep and repair equipment while weightless as a decision nears on which one will become the first foreign astronaut aboard China's Tiangong space station.
Instant analysis of Ravens’ thrilling 34-31 win over Cowboys
The Ravens lost an 11-point lead but recovered behind Lamar Jackson and Tyler Loop to defeat the Cowboys 34-31 in Brazil
See the brilliance: Dunn artist creates and sells glass artwork that shines brightly
Cindy Akers-Gilford creates stained glass, fused glass, mosaics, handmade glass jewelry, pendants, suncatchers and other original glass artwork in her studio in Dunn, N.C. Photos provided by Cimply Broken.Self-made Artist and Founder of Cimply Broken, Cindy Akers-Gilford is helping people “see the brilliance” in all things with her glass artwork. Akers-Gilford started her business right after she retired from 20+ years as a civilian contractor at Fort Bragg. The official opening date for Cimply Broken was Nov. 8, 2021.“It’s been quite the adventure ever since. Not only did I have to learn how to manage a small business, but I’ve never taken a class in stained glass or anything I currently do,” shared Akers-Gilford. Her work includes stained glass, fused glass, mosaics, handmade glass jewelry, pendants, suncatchers and other original glass artwork.“I chose glass art just by happenstance. I saw a video on YouTube with a gentleman using plates and resin to make beautiful windows. I used that idea and created a simple picture frame-sized piece for myself. It was beautiful. I put it up in my window and pretty much forgot about it for a few days. Well, one beautiful sunny morning I went up to my studio, and the sun was rising and the light was shining beautifully through that piece. It was absolutely stunning. I thought that it was the perfect reflection of how God’s light shines through each of us. It was broken glass, so it changed ever so slightly as the sun continued to rise in the sky. I thought it poignant – like each of us – we all shine bright and differently in God’s glorious light, and we are all simply broken as well. We are all made beautiful in his light,” explained Akers-Gilford.The name of the business was inspired by the artist’s name and her faith-driven mission. “Simply became ‘Cimply’ as a play on my name and ‘simply’… and ‘Broken’ because we are all Cimply Broken – but each of us is beautiful,” added Akers-Gilford.Akers-Gilford sells her glass art at the Dunn Farmers Market when the weather is bearable, but mostly from her website at www.cimplybroken.com. “I enjoy getting lost in the creative process. I work out of my home, and I often compare my studio to Walmart returns after Christmas time. It’s hectic, busy and there are always at least 10 things being created simultaneously- it is fun!” shared Akers-Gilford. Her goal for the business is to continue to watch customers as they spot a piece of work from a distance and walk up to it in awe. “That is my biggest joy! I don’t speak to them until they speak – that is their moment to ‘See The Brilliance,’ which is my moniker,” shared Akers-Gilford. She also shared she would love to someday become part of an artist collective in Dunn.
WHO recognizes healthy, innovative cities across the Western Pacific Region
Nine Healthy City champions from across the World Health Organization (WHO) Western Pacific Region received special recognition at an awarding ceremony during the 11th Global Conference of the Alliance for Healthy Cities in Sydney, Australia.The WHO Regional Office for the Western Pacific has presented the Healthy Cities Recognition Awards every two years since 2004 to celebrate innovative and impactful city-led initiatives that improve the health and well-being of urban populations.Eight cities received awards for their best practices, and one National Forum received the WHO Regional Director’s Special Award in recognition of its long-standing leadership in advancing the Healthy Cities movement.Awardees were selected through a rigorous evaluation process and recognized for demonstrating measurable, innovative and sustainable approaches to health challenges faced by cities.Remarking on the significance of the awards, Dr Huong Tran, Director of the Division of Health Promotion, Disease Prevention and Control at the Regional Office, said that, “There is no single blueprint for a healthy city. What works in one context may need to be adapted to another. But by sharing our experiences, including what worked, what was challenging, and what we learnt along the way, we can help one another move faster and further.”Award-winning cities and initiativesThis year's awards recognize outstanding city-led initiatives that have demonstrated measurable impact, innovation and sustainability in advancing health initiatives for urban populations.Baguio City (Philippines) – Data for equity: informing action, improving healthDr Donnabel Tubera-Panes, City Epidemiologist – Medical Officer IV of the Health Services Office accepted the award on behalf of Baguio City. Photo credit: Maria BoyadgisBaguio City was recognized for developing a pioneering Livability Index that provides village-level data across all 128 barangays (villages), enabling evidence-based planning and more equitable allocation of resources. By integrating community participation and institutionalizing the index within city planning and budgeting processes, the city has demonstrated how data can drive action to reduce health and social inequities.Eunpyeong-gu (Seoul, Republic of Korea) – Communities living in vulnerable situations: advancing health equity through community engagementVice Mayor Honourable Ahn Hyoung Jun accepted the award on behalf of Eunpyeong-gu. Photo credit: Maria BoyadgisEunpyeong-gu was recognized for its inclusive health equity programme supporting vulnerable populations, including isolated older adults and LGBTQI+ communities. Through peer-led community networks, social cooperatives and inclusive service design, the district has strengthened access to care, promoted social inclusion and advanced community ownership of health initiatives.Madiun City (Indonesia) – Adapting and mitigating climate-related crises: building heat resilience and preventing flood-related health risksMs Yuni Dwi Purwani, Secretary General of the National Forum for Indonesian Healthy Cities/Regencies, accepted the award on behalf of Madiun City. Photo credit: Maria BoyadgisMadiun City was recognized for its SUPERMIE (Sustainable Public Environmental Management Initiative) – a community-based environmental governance model that addresses urban flooding, climate resilience and environmental sustainability. The initiative contributed to reductions in flood-prone areas, greenhouse gas emissions, diarrhoeal disease and dengue fever, while at the same time improving food security through neighbourhood food gardens. The programme has already been replicated in 15 cities and regencies across Indonesia.Macao Special Administrative Region (China) – Protecting communities from tobacco and alcohol-related harms: tackling commercial drivers of riskDr LO Iek Long, Director of the Health Bureau, Macao SAR, China accepted the award on behalf of Macao. Photo credit: Maria BoyadgisMacao SAR was recognized for implementing a comprehensive and integrated approach to tobacco and alcohol control. Through legislation, monitoring systems, enforcement, public awareness campaigns and multisectoral partnerships, the programme has strengthened protection against major risk factors for noncommunicable diseases and established a model that is highly transferable to other urban settings.Phnom Penh Capital City (Cambodia) – Safe, active and health-enabling transport: advancing health and reducing inequities in urban mobilityH.E. Khoung Sreng, Governor of Phnom Penh Capital City accepted the award on behalf of Phnom Penh Capital City. Photo credit: Maria BoyadgisPhnom Penh received the award for its Safe School Zone Project, which combines infrastructure improvements, speed management, enforcement, education and stakeholder engagement to protect children and communities. The initiative has demonstrated measurable reductions in crashes and vehicle speeds while providing a scalable model for safer urban mobility across the country.Quezon City (Philippines) – Transforming food environments: addressing policy, market and urban design drivers of health and nutritionMs Jirah Asa M. Sideco, Chief of the Nutrition Section of the Quezon City Health Department accepted the award on behalf of Quezon City. Photo credit: Maria BoyadgisQuezon City was recognized for its public food procurement policy that promotes healthier diets through government-run institutions and feeding programmes. Supported by strong policy frameworks and monitoring systems, the initiative improves access to nutritious food for vulnerable populations while serving as a benchmark for other local governments.Samarinda City (Indonesia) – Preventing violence and promoting gender equality: transforming urban systems, norms and spaces Mrs Rinda Wahyuni, Chairperson of Samarinda Healthy City Forum accepted the award on behalf of Samarinda City. Photo credit: Maria BoyadgisSamarinda City was recognized for its multisectoral approach to preventing violence and advancing gender equality. Responding to local evidence on violence against women and children, the city has positioned violence prevention as a public health priority, bringing together health services, schools, social welfare institutions, law enforcement, civil society and community leaders to strengthen prevention, reporting, survivor-centred support and legal protection. Through inclusive policies, community engagement and sustainable city financing, Samarinda has developed a locally owned and scalable model for creating safer, more equitable and inclusive urban communities.Singapore – Age-friendly cities: transforming systems to bridge generations for a healthier tomorrowDr Tan Weng Mooi, Director, Integrated Health Promotion, accepted the award on behalf of Singapore. Photo credit: Maria BoyadgisSingapore received recognition for its Healthy Precinct Framework, which translates national healthy ageing priorities into neighbourhood-level action. The initiative integrates preventive care, social support, service coordination and age-friendly environments while actively engaging older persons, caregivers and community organizations. Its expansion across multiple precincts demonstrates its scalability and long-term sustainability.WHO Regional Director’s Special AwardNational Forum for Indonesian Healthy Cities/Regencies (Indonesia)Ms Yuni Dwi Purwani, Secretary General of the National Forum for Indonesian Healthy Cities/Regencies, accepted the award on behalf of the National Forum. Photo credit: Maria BoyadgisThe WHO Regional Director's Special Award was presented to the National Forum for Indonesian Healthy Cities/Regencies (FKKSI) in recognition of its long-standing leadership in advancing the Healthy Cities movement across Indonesia. As a national platform bringing together local governments, communities, academia and civil society, FKKSI has played a critical role in promoting collaboration, capacity-building, knowledge exchange and advocacy. Its efforts have strengthened and institutionalized healthy urban development nationwide and established a model for multisectoral engagement in the Region. Healthy Cities for allThe 2026 Healthy Cities Recognition Awards highlight how cities can lead transformative action on health by addressing climate change, inequity, ageing, nutrition, mobility, social inclusion, violence prevention and the commercial determinants of health. The recognized initiatives demonstrate that local governments, communities and partners can work together to create healthier, safer and more resilient urban environments for everyone. As urban populations continue to grow across the Western Pacific Region, WHO remains committed to supporting cities in advancing health, equity and sustainable development through the Healthy Cities approach and the Alliance for Healthy Cities. ###Note to editorsSince 2004, the WHO Healthy Cities Recognition Awards have provided a platform for cities to share innovative and effective approaches to improving health and well-being. The awards recognize achievements in areas including climate resilience, healthy ageing, health equity, gender equality, tobacco and alcohol control, urban mobility, nutrition and data-driven governance. In 2026, more than 150 submissions were received from cities and local governments across the Western Pacific Region. The titles and affiliations of awardees are presented as they were at the time the photo was taken.______________For more information, or to arrange media interviews, contact: WHO Regional Office for the Western Pacific: wprocom@who.int
HSBC Private Bank's CEO In Optimistic Mood Over Business Growth, Strategy
The volatile market environment and changes wrought by AI and other forces aren't distractions but opportunities for private bankers to demonstrate their value. That's the stance of the HSBC Private Bank chief executive who was appointed at the start of this year.
Scheffler makes sportsmanship stand over tee screamer
Top-ranked Scottie Scheffler was so aggravated by a yelling US supporter at the Presidents Cup on Sunday that he conceded a 30-foot chip shot to Colombia's Nico Echavarria.
Nations League, the 3 standout men of the night
The heroes of the night.A star, an “unknown,” and CR7’s replacement: discover the three standout men from this new Nations League night.🥉 Konstantínos Karétsas - GreeceHe may not have been ...
Following the Dollars in American Politics
Money plays a powerful—and sometimes difficult to understand—role in American elections. Voters regularly hear terms such as campaign committees, PACs, Super PACs, independent expenditures, and issue advocacy. However, it is
49ers vs Cardinals live updates: Score, highlights, analysis
The San Francisco 49ers face the Arizona Cardinals in Week 3. Follow live score updates, highlights, injury news, key plays and instant analysis.
Napoli reach agreement to extend Rrahmani contract until 2029
Napoli have agreed terms with Amir Rrahmani over a new deal, with only the official announcement outstanding.According to TuttoMercatoWeb, the Kosovo international has reached an agreement with Aureli...
Raiders vs Saints live updates: Score, highlights, predictions, analysis
The Raiders are in New Orleans in a pivotal Week 3 matchup. Follow live score updates, highlights, injury news, key plays, and instant analysis.
The longevity boom is getting ahead of the science
Billions are pouring into anti-ageing biotech, but manipulating ageing has risks we are only beginning to understand.
Giancarlo Stanton’s Yankees comeback could come without a starting job
Giancarlo Stanton took live at-bats again Friday. That’s good news for the Yankees, but it doesn’t mean he is about […]
Sennheiser Momentum 5 review: Great sound, incredible battery life, and few compromises
I spent the last few weeks with the Sennheiser Momentum 5 to determine if this pair actually stands out, testing everything from sound quality and noise cancellation to comfort and battery life.
What Was Brent Venables Thinking?
You know the scene. You’ve seen it a thousand times. A college football coach stands alone on the sidelines, his players and assistants looking to him for answers that he doesn’t have. They’ve lost this football game, and lost it badly. “Charley Pell’s off-the-books slush fund!” you think, “what must that guy be thinking in […]
Beshear declines to say if he’s allocating substantial funds to boost Dem in Texas Gov. race
Patriots vs Jaguars live updates: Score, highlights, analysis
The Patriots play the Jaguars in a pivotal Week 3 AFC clash. Follow live score updates, highlights, injury news, key plays and instant analysis.
Does UNC stand a chance against Notre Dame?
Anything can happen, but are the Heels even capable of pulling off a miracle win?
Rogers Tries to Make El-Sayed’s Health Care Plan Scary
_Taylor, Michigan_HERE’S HOW YOU CAN TELL Mike Rogers is anxious to make up ground in the Michigan Senate race: He held a press conference on health care last weekend. Health care is usually a rough issue for Republicans, because voters associate the GOP with attacking cherished programs like Medicare and Medicaid that Democrats have historically supported. It’s a particularly difficult issue in this campaign, because a few months ago Donald Trump and the Republicans refused to extend temporary financial assistance in the Affordable Care Act. As a result of that decision, more than 20 million Americans faced higher insurance prices this year. That’s not a policy choice you want to be defending at a time when voters frequently cite the cost of health care as a top concern. Throw in the fact that Democratic nominee Abdul El-Sayed can draw on his credibility as a doctor and former public health director in Detroit, and it might seem like Rogers’s best bet would be to avoid health care altogether. But Rogers had his reasons to spotlight health care last Saturday. And they became apparent a few minutes before he spoke, when members of his campaign staff There’s a lot happening. Too much, some days. We can’t promise to have all the answers. But we can promise to keep asking the questions, following the facts, and figuring things out alongside people who care about where this country is headed. Read with us. Learn with us. And when it matters, stand with us. Join the side you’re already on. Join Bulwark+
A giant cosmic 'fart' is making a wobbling zombie star repeatedly flash us, 'groundbreaking' observations reveal
A very strange binary star system keeps flashing Earth with X-ray flares. Scientists now understand why.
This weather threat costs us billions. And it’s about to get worse.
Scientists are chasing hail to understand what’s happening to these dangerous projectiles.
Politicians' superpower might allow them to avoid blame
Politicians' superpower is that we, members of the voting public, often do not understand how elected officials' actions can impact issues such as healthcare costs.
Everton Player Ratings Season Averages As Jarrad Branthwaite Shines
Let's take a look at the average player ratings for Everton from the first seven games of the season, with Jarrad Branthwaite and Tyler Dibling standing out.
Scientists analyzed 22,000 hours of bear videos. This is what they learned.
Virginia Tech researchers sought a better understanding of the factors shaping hibernation.
Pezeshkian Congratulates Turkmenistan on Independence Day
TEHRAN (Tasnim) – Iranian President Masoud Pezeshkian congratulated Turkmenistan on the anniversary of its Independence Day.
Pennsylvania voters are split on whether they want Gov. Josh Shapiro to run for president in 2028
While poll respondents praised Shapiro's work as Pennsylvania governor, his stance on Israel — which has evolved over time— gives some voters pause on a White House run.
Could AI Commerce Reshape Meta (META)’s Business Model?
Meta Platforms, Inc. (NASDAQ:META) is expanding the commercial capabilities of its Muse AI assistant through a strategic partnership with Shopify, giving investors another potential avenue for AI monetization beyond digital advertising. On September 21,Shopify CEO Tobias Lütke announced a partnership with Meta to bring Shop Pay agentic checkout to Muse, allowing users to shop from […]
Iran Condemns Rutte’s Remarks on European Support for US Aggression
TEHRAN (Tasnim) – Iran condemned NATO chief’s remarks about the extensive use of European military bases in support of US war of aggression against Iran, warning that such assistance could raise questions of international responsibility for the countries involved.
Seahawks: JSN paces Sports Illustrated’s latest fantasy WR rankings
Seahawks star Jaxon Smith-Njigba sets the standard at the wide receiver position in fantasy football heading into the Week 3 slate of games.
MVDs: Oklahoma Edition
You don’t unceremoniously sink the Sooner Schooner without a total team effort. But even then some Bulldogs are bound to stand out above the crowd for their efforts. Those dandy ‘‘Dawgs are your MVDs, the Most Valuable Dawgs from Georgia’s 41-13 victory over Oklahoma. Offense: Talyn Taylor. Taylor’s 4 catches for 110 yards represented a […]
Patriots ST coach reacts to underrated rookie's instant success
Patriots special teams coordinator Jeremy Springer has been impressed by rookie linebacker Namdi Obiazor.
Difficult Afternoon for Chivas, Who Fell to Querétaro
Despite the fact that Chivas took the initiative, created chances and constantly looked for the opponent's goal, they could not overcome the deficit and fell 2-0 to Querétaro this afternoon at Estadi...
Three instant takeaways from Nebraska football’s win at Michigan State
Nebraska football (4-0) started conference play with a dominating win at Michigan State (2-2), 31-14, on Saturday, Sept. 26. After sweeping the non-conference slate for the third straight year, NU improved to 4-0 for the first time in 10 seasons. The Huskers earned their first win in East Lansing since 2012.
UCLA receives $75 million in NSF grants for quantum technology
Two UCLA quantum computing institutes received grants from the National Science Foundation worth a combined $75 million Aug. 25. The institutes – Fault-Tolerant Quantum Systems, Architectures and Applications and Challenge Institute for Quantum Computation – aim to advance quantum technologies, which function faster than classical computers or standard digital devices.
EU boosts humanitarian aid for displaced people
"Europe stands with you," von der Leyen said
Trump calls Iranian plan to reopen Strait of Hormuz not 'acceptable'
President Trump said he was rejecting an Iranian plan to reopen the Strait of Hormuz. The Iranian proposal is similar to a memorandum of understanding agreed upon by the U.S. and Iran back in June.
Trump calls Iranian plan to reopen Strait of Hormuz not 'acceptable'
President Trump said he was rejecting an Iranian plan to reopen the Strait of Hormuz. The Iranian proposal is similar to a memorandum of understanding agreed upon by the U.S. and Iran back in June.
Pakistan’s Political Standoff Deepens as Imran Khan’s PTI Delays Islamabad March
Just twenty-four hours before a nationwide protest march […]
76ers Star Jaylen Brown's Work Ethic Complemented by LeBron James
Jaylen Brown may have been why James joined, but it's really the work he puts in on the court that stands out.
Juventus make contact over January deal for Barcelona star
Barcelona star Alejandro Balde has made his way into the sights of one of Italian football’s leading clubs with a view to the winter transfer window.This comes amid the understanding that the board ...
Boston College Comes Up Short, 21-14, to Virginia Tech
On Saturday afternoon, Boston College lost 21-14 to Virginia Tech. The storyline on everyone’s mind heading into this contest was the weather. With a nor’easter rolling into town on Saturday morning, the game was played in constant rain and gusty wind. The conditions drilled both teams, especially in the first half. We did not see […]
Joliet gets $1 million federal grant for community mental health program
The funds are part of more than $3.17 million in federal grants for Will County programs related to childcare, nursing education, substance abuse treatment, and university research, according to Rep. Lauren Underwood's office.
LIVE! Till vs. Romero Streaming Updates TODAY!
Former Ultimate Fighting Championship (UFC) standouts Darren Till vs. Yoel Romero will take their talents to the bareknuckle boxing ring later TODAY (Sat., Sept. 26, 2026), headlining BKFC 94 from inside Manchester Arena, Manchester, England, streaming live on DAZN. Neither man is a stranger to the bare knuckle boxing scene, as Romero is fresh off […]
Your $2,000 phone is being safety-tested with 1996 radiation science
Federal radiation standards from 1996 cannot measure modern folding phones. Testing metrics must evolve to protect public health.
Intel Panther Lake Teardown, 18A, BSPD, GAAFET, SemiAnalysis STEEL
Panther Lake debuts the first commercial implementation of backside power delivery (BSPDN), introduces Intel’s first iteration of gate-all-around (GAA) transistors, and showcases their advanced packaging capabilities with its Foveros-S assembly. With Panther Lake, Intel’s manufacturing arc has shifted from nebulous roadmaps to shipped silicon, a significant milestone on their long road back to competitive semiconductor manufacturing. To evaluate the extent of Intel’s comeback, we tore down Panther Lake. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Our teardown traces 18A from its four-sheet RibbonFETs (Intel’s marketing name for GAAFETs) and gate stacks through contacts, frontside and backside wiring, and the bonded carrier. We explain how these material and integration choices improve gate control and reduce resistance, while adding capacitance, thermal resistance, and process complexity. Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. However, 18A does not lead TSMC N3P, N2 or Samsung SF2 in peak density. Panther Lake’s CPU cores are incremental updates, and the high-end GPU still uses TSMC N3E. Panther Lake assembles one compute tile, one GPU tile, and one I/O tile atop a passive base tile using Intel’s Foveros-S advanced packaging. Both compute tile variants use Intel 18A. The Xe3 GPU options are a 4-core GT1 tile on Intel 3 and a larger 12-core GT2 tile on TSMC N3E. Both I/O tile variants use TSMC N6. [1], [2] Our analysis centers on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery (BSPD) moves the main power network behind the transistor layer, to the backside, separating it from frontside signal routing. We covered BSPD and its impacts in 2024. [3], [4], [5] Intel’s BSPD implementation, branded as “PowerVia”, routes power through dedicated backside metals to nano-TSVs, which connect those rails to local source/drain (S/D) contacts. Implementing that separation requires Intel to build the interconnect stacks from both sides of the wafer. The frontside comprises the M0-M14 signal stack, while the backside comprises the BM0-BM5 power stack. M0 and BM0 are closest to the transistors. The nano-TSVs connect the two sides, but Intel patterns and etches each via from the front after forming the contacts. A narrow via runs from the side of the contact deep into the silicon substrate. Intel then completes the frontside signal metal stack, bonds the wafer to a carrier, flips it and removes the original substrate until the buried via tips are exposed. The backside metal stack is then deposited directly on the revealed vias. The nano-TSV and backside-via profiles taper in opposite directions because Intel forms them from opposite sides of the wafer. The transistor structures form the FEOL. Local contacts and nano-TSVs connect them to the wiring. M0 begins the frontside interconnect stack. The silicon carrier remains attached above the frontside interconnects. It supports the device wafer during substrate removal and backside processing and remains part of the finished chip’s thermal path. PowerVia removes the main power distribution from the congested frontside metals, routing supply through shorter and wider backside wires. Its lateral landing still occupies area in the standard cell, so it recovers less cell area than a direct backside contact. [3] Nano-TSVs beside the logic devices carry VDD or VSS from the backside power network, while signal connections continue upward through the frontside metals. Backside Interconnects Samsung SF2 data is included for comparison to Panther Lake’s within this article. SF2 is the incumbent GAA foundry node but lacks BSPD, serving as a useful reference to evaluate 18A. A full teardown of Samsung’s S26 products, processed on SF2, will be shared soon.Nanosheet-cut EDS comparison. The PowerVia supply path runs from the backside Cu rails through Mo-lined W nano-TSVs to the local transistor contacts. In this cross section, the tapered connection spans roughly 150 nm from the contact level to BM0. The Ta liner confines Cu and promotes adhesion to the surrounding stack; the AlOₓ etch stop controls the next dielectric etch above the rail. Dielectric beneath the ribbons electrically separates the devices from the backside wiring and removes the conducting silicon body below the channel. [6] AlOₓ serves as an etchstop (ES), enabling endpointing and protecting the underlying layers. Low-volatility aluminum fluoride reaction products resist the fluorinated plasma, allowing a thin AlOₓ film to protect the metal while the surrounding low-k dielectric is removed. [6], [7]. While the BM0 and layers above the M1 lines show double AlOx layers, Our SMIC N+3 teardown showed single AlOₓ layers. SMIC uses a simpler local AlOₓ substack, while the remaining cap and etch sequence provide the required landing protection. So why double layers? The closely spaced AlOₓ doublets provide two protected endpoints in the etch sequence. Intel documents an AlOₓ/SiN/AlOₓ stack that explains the benefit. The main dielectric plasma etch stops on the first AlOₓ film; a selective wet clear opens that film; a second plasma etch removes the intermediate SiN and stops on the second AlOₓ film. The final wet clear exposes the metal landing surface. SiN is the intermediate dielectric in Intel’s published example. [8] The second stop protects the metal through a cap breakthrough. Wide openings can etch faster than narrow ones, and etch depth varies across the wafer. Metal under an early-clearing opening would otherwise be exposed while other openings still need more etching. Staged protection widens the process window and reduces metal erosion, corrosion and void formation. [8] TSMC documents AlN/AlOₓ/SiOC/AlOₓ above Cu, with AlN blocking Cu diffusion, and a simpler AlN/SiOC/AlOₓ variant that omits one AlOx film. [9] Levels with different opening sizes, aspect ratios, pattern densities and cap materials need different etch margins. A double AlOx stop is useful where another protected endpoint justifies the added processing. The extra film adds formation, selective opening and cleaning steps, plus another set of interfaces to control adhesion, moisture, and stress. These blanket films are opened through the existing via pattern, so each film does not require another lithography mask. AlOₓ adds parasitic capacitance when it replaces lower-k dielectric; two thin AlOₓ films can nevertheless contain less AlOₓ than one thick film. Total thickness, placement, and theintermediate dielectric determine the electrical cost. Deposition chemistry also changes AlOx permittivity and residual hydroxyl content, which can oxidize the underlying metal. [7], [8], [10], [11] The backside stack separates into relatively fine BM0-BM2 wiring near the devices and coarser BM3-BM5 power distribution. The largest pitch increase occurs between BM2 and BM3. BM0’s pitch closely matches the logic-row height, fitting local power delivery to the cell rows. Higher levels aggregate current through larger conductors: routing density becomes less important than low resistance and current capacity as the network approaches the package. This hierarchy provides wide power wiring for the power delivery network without consuming scarce frontside signal-routing resources. [3] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Frontside Interconnects Intel 18A combines Mo-lined W contacts and nano-TSVs with a separate backside Cu power network. Samsung SF2 keeps power on the frontside, using Ti-based contact interfaces and Ta-based barriers and Co liners around Cu wiring. In 18A standard-cell rows, backside power rails supply the devices through nano-TSVs within the cells, freeing frontside routing resources. Samsung’s M0 accommodates both power and signal connections. From the device toward M0, the connection runs through a Ti-based S/D interface, W contact fill, a Mo-lined W via, and the Cu M0 wire. Mo supplies a conductive nucleation and adhesion layer for W, replacing the resistive TiN liner used in conventional W integration. This increases the effective conduction volume within the feature while retaining W fill and its established polishing, cleaning and etching processes. Intel’s Mo/W patent describes this integration tradeoff. The nano-TSV uses the same Mo-lined W construction in the backside supply path. [12] The move from TiN to Mo is an incremental change. While a full Co or Mo fill can also reduce the volume lost to liners in very small features, it requires new integration schemes that increase complexity and risk. Cu remains attractive for wider wires due to its low resistance. As wires and vias shrink, the diffusion barrier consumes an increasing fraction of their cross-section. [12], [12], [14] Intel uses Co/Ru liners at M0-M1, Co at M2-M4, and Nb at M5-M9. The lower-level liners help Cu adhere and reduce void formation during trench fills. Applied Materials’ Endura has new thermal control that facilitate wetting process, so the thin film continuity is good enough that good capillary pressure will drive Cu atoms to the via bottom without voiding. Intel’s choice to use Nb is particularly interesting. Intel’s Nb patent describes a conductive diffusion barrier intended to reduce the barrier’s contribution to resistance relative to conventional Ta-based barriers, particularly at via bottoms where all current crosses the barrier. The patent pairs Nb in coarser levels with the option of lower-cost PVD processing. [15], [16] The upper metal layers support thicker barriers formed through physical vapor deposition (PVD) despite its worse coverage and uniformity. Meanwhile, the lower metal layers require thinner barriers deposited through conformal atomic layer deposition (ALD). Co/Ru adds another material interface and requires controlled deposition and Cu fill. Changing liners and barriers by metal layer allows Intel to optimize interconnect resistance, process complexity, and reliability. [15, 16] RibbonFET, Intel’s name for its gate-all-around FETs (GAAFETs), replaces the FinFET’s vertical fins with four stacked horizontal silicon nanosheets, allowing the gate to surround the channel on every side. The path to GAAFET begins with the planar transistor. A planar MOSFET places the gate above the channel between its source and drain. Pairing an NMOS with a PMOS transistor creates a CMOS inverter, in which the NMOS pulls the output low for a high input, and the PMOS pulls it high for a low input. The gate must retain electrostatic control of the channel to ensure clean switching. As gate lengths shrank, the drain began to compete with the gate for that control, increasing off-state leakage. Electrostatic control was restored through an architectural evolution that raised the channel into a vertical fin and wrapping the gate around three sides. Called “FinFET”, this new architecture packed more effective channel width into a smaller footprint. Further scaling made it harder to maintain both drive current and leakage within smaller cells, and reintroduced the same problems planar MOSFETs faced. Nanosheet GAAFETs close the fourth side by replacing the vertical fin with a stack of horizontal nanosheets, each surrounded by the gate. The tighter electrostatic control suppresses leakage at shorter gate lengths while stacking adds effective channel width within the cell footprint. In a FinFET process, channel width changes in discrete steps as designers must add or remove whole fins. Nanosheet width can instead be adjusted continuously within the process’s design rules. Wider sheets increase drive current, while narrower sheets reduce capacitance at the cost of drive current. Intel 18A uses stacks of four nanosheets each and varies their widths across logic and SRAM. At the process level, adding more sheets to each stack increases effective channel width and drive current, but complicates fabrication. RibbonFET vs MBCFET Samsung began GAAFET production in 2022 with SF3E, following with SF3 and now SF2. Its ‘MBCFET’ provides a useful structural comparison with Intel’s first RibbonFET implementation. [17] STEEL is digging deeper into SF2, used in the Exynos 2600, and TSMC’s GAAFET N2, used in Apple’s A20 Pro, in upcoming newsletter articles. We’re throwing some teasers on X. Let’s compare Samsung SF2’s MBCFET with Intel 18A’s RibbonFET. Subscribe Even to the untrained eye, Intel’s extra nanosheet is obvious. Intel stacks four ribbons to Samsung’s three. Samsung’s sheets are much wider in these fields, so both sheet count and width matter to the available channel perimeter. Sheet width also changes which silicon surfaces carry current. On conventional (001) silicon, wide nanosheets emphasize the broad top and bottom surfaces, favoring electron transport; the larger sidewall contribution in a narrow sheet favors hole transport. Thinner sheets improve gate control but increase confinement and scattering. This makes width and thickness part of the NMOS/PMOS balance, alongside strain and threshold voltage. [18], [19] GAAFET designs like 18A use different work-function-metal (WFM) stacks for NMOS and PMOS. Around each ribbon, a thin SiOx interfacial layer separates the silicon channel from the HfOx high-k dielectric, with La providing dipole tuning and the WFM wrapping the dielectric. NMOS uses a TiAl-based stack, while PMOS uses TiN WFM. W fills the remaining gate trench, providing a lower-resistivity path where the work-function layers are no longer needed. In this field, the PMOS stacks leave room for W between ribbons, while the NMOS stacks occupy more of those gaps. A silicon-based dielectric marks the P/N boundary, allowing the PMOS and NMOS gates, sharing the same gate trench, to be processed sequentially. Fast logic paths, retention circuits, and SRAM need a family of threshold options. Changing threshold without substantially changing device dimensions, capacitance or fabrication complexity is valuable. FinFET processes typically use different work-function-metal stacks. In a four-ribbon GAA stack, the narrow sheet-to-sheet gap limits how much WFM can fit around each channel. La in the gate dielectric creates interfacial dipoles at the SiOx/HfOx boundary, shifting effective work function and tuning threshold voltage. This gives Intel another control alongside its NMOS and PMOS WFM stacks. Low-threshold devices improve critical-path drive; higher thresholds reduce leakage elsewhere. Dipole tuning is especially useful in GAA because it changes threshold without consuming the narrow intersheet gap with thicker WFM. Precise control of La incorporation, diffusion and interface quality has long been a challenge, limiting viability in high volume production but is now seen from every leading-edge foundry. Intel’s patent describes depositing a dipole-forming oxide above HfOx and annealing it toward the interfacial oxide before completing the work-function and fill metals. This separates threshold tuning from the space available for metal. Newer research addresses the thermal cost: imec’s 2026 dipole-middle research inserts the shifter between two HfOx depositions, shortening the diffusion path while protecting SiOx during patterning. [20], [21]Matched-cut EDS, Intel 18A (left) vs. Samsung SF2 (right). Intel retains raised source/drain epi beneath its contacts, while Samsung recesses W deep into the epi to form a V-shaped Ti-lined interface. The deeper contact increases metal-to-semiconductor area and shortens the current path from the lower sheets, reducing contact and spreading resistance. It also removes epi volume and brings the contact etch closer to the channel ends. Retaining more epi preserves the material available for strain transfer, especially from SiGe into PMOS. These geometries balance contact access against stress engineering and etch margin. [22], [23] Samsung stacks three sheets to Intel’s four ribbons, and both processes use sheet width to tune drive strength. In our Samsung cross-sections, widths range roughly from 19 to 30 nm in the NPU rows and 37 to 50 nm in the CU cell. The Samsung nanosheets taper, with the widest sheet at the bottom and the narrowest at the top. Both processes use HfOx gate dielectric and Ti-based work-function stacks, with Al in the NMOS stack. In the Samsung devices shown here, the dielectric and WFM occupy the intersheet gaps, leaving W above the top sheet. Intel’s PMOS stack leaves more room between ribbons, and W fills those gaps while the thicker NMOS stack leaves W mainly in the upper trench. Gate-stack EDS maps. The W between Intel’s PMOS ribbons provides a conductive path close to the lower gates. Where WFM fills the entire gap, the gate still surrounds the channel, but voltage reaches it through the more resistive work-function films. Thinner WFM and dipole tuning preserve room for low-resistivity fill; Mo and Ru are alternative fill metals being developed for further scaling. [24] A masked, sequential WFM flow explains the different gate heights and inter-nanosheet fill. The proposed sequence below shows how separate NMOS and PMOS work-function steps produce that geometry. Enabled by the BSPDN process, Intel replaces the dense-logic silicon subfin with dielectric, removing the parasitic conduction path below the ribbons and reducing substrate-related capacitance. A retained silicon body as in classical, non-SOI, planar and FinFET designs needs junction and punchthrough-stop engineering to suppress leakage. Dielectric isolation makes that leakage less sensitive to the subfin doping profile but adds removal and fill steps. It also weakens the direct thermal path through silicon, making the contacts, metal stacks and package more important for heat extraction. [24], [26] Fluorine is concentrated around selected Intel device structures in the maps. WF6 is a standard precursor for W nucleation and fill, while barrier films protect adjacent dielectrics from fluorine attack. Low-fluorine W processes reduce the residual-F burden. Chloride-based precursors avoid introducing F during W deposition, but require control of chlorine attack, nucleation and fill quality. The integration target is a continuous, low-resistance W path with a thin protective liner and minimal chemical damage to the surrounding stack. [20], [27], [28] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. We measured cell height, gate pitch, metal geometry, and ribbon dimensions at the XTEM sites shown below. The tables group these dimensions by site and device polarity. Our “sheet cuts” cross the silicon channel and show the ribbons end-on. “gate cuts” run along the channel through successive gates. The 18A logic cell dimensions point to a five-track logic library while the N3E and Intel 3 cell dimensions evidence a seven-track logic library. The DDR-PHY uses wider M0 wires and much larger spacing than core logic. That trades routing density for lower wire resistance and weaker coupling between neighboring nets. The geometry suits the current delivery and coupling requirements of analog, clock, and I/O circuitry. PowerVia lets 18A combine a compact cell height with wider M0 geometry by moving the main power rails off the signal-routing tracks. That relaxes local wire scaling while preserving a small cell footprint. Cell height and gate pitch set the geometric density; pin access and routability determine how much of it a real block can use. [29] The biggest takeaway from our gate-pitch measurements is that Intel 18A compute logic and TSMC N3E GPU logic have similar density in the Bohr representative-cell model. The 18A example is 18.6% denser than the Intel 3 GPU example. Gate pitches are nearly identical across the three sites, so cell height drives most of the difference. The Bohr model combines a four-transistor NAND2 spanning three gate pitches and a 32-transistor scan flip-flop (SFF) spanning nineteen pitches, weighting their densities 60:40. The sensitivity column shows how independently changing cell height and gate pitch by ±1 nm changes the result. This compares representative cell geometries; whole-die density also depends on cell mix and placement. The 18A P-core gives M0 substantially more metal cross section than the N3E vector engine. Treating each profile as a trapezoid gives 2.63 times the area per line and 1.84 times the area after normalization by routing pitch. The larger section reduces the geometric contribution to line resistance and lowers current density for a given current. Taller and wider wires also add capacitance, so circuit delay depends on the balance of resistance and capacitance. The DDR-PHY has less metal area per routing width than the 18A core fields, while remaining above N3E. [30] Area = height × (top CD + bottom CD) / 2, including liners. Area/pitch normalizes by routing width. Taper is the symmetric sidewall angle from vertical, with the largest angle belonging to the DDR-PHY. Compute tile The measurements show how ribbon dimensions and gate-stack geometry vary across the compute tile and between NMOS and PMOS to balance channel drive, gate load and the space needed for the dielectric/WFM stack across logic, SRAM and the DDR-PHY. Width mainly changes available channel perimeter; thickness also changes electrostatic control and carrier confinement. Gate-stack thickness then determines the space left for low-resistivity fill P-core and LP E-core logic Both the P-core and LP E-core use multiple nanosheet widths. Widths are measured on high-magnification XTEMs while wider-field images demonstrate additional width choices within the LP E-core. Multiple widths are expected even within an LP E-core. Timing-critical paths, buffers and cells with different fanout need different drive strengths. The lower-magnification fields show this width diversity beyond the sites quantified in the table. L2 and L3 SRAM GAA gives SRAM designers another way to balance the pull-up (PU), pass-gate (PG), and pull-down (PD) transistors. FinFET bitcells set device strength through fin count while GAA adds nanosheet width as a sizing knob. In a 6T SRAM cell, a strong pull-down relative to the pass-gate limits read disturbance, while a strong pass-gate relative to the pull-up improves writability. During a write, the pass-gate and write driver pull the node storing “1” below the inverter trip point. During a read, the pull-down holds the node storing “0” low. Bias, threshold voltage, mismatch and assist circuitry set the remaining margin. FinFET high-current cells commonly use a PU:PG:PD fin-count pattern of 1:2:2, a device-sizing ratio rather than a current ratio. Ribbon width lets Intel balance SRAM strengths without adding whole fins. The L2 cell uses its narrowest ribbons for PU and widest for PD, improving writability and read stability respectively. Intel’s disclosed HCC operates without assist; its denser HDC uses negative-bitline write assist. Pulling the selected bitline briefly below ground increases pass-gate overdrive so it can overpower the pull-up at lower supply voltage. That buys density and low voltage writability at the cost of boosting circuitry, switching energy, and additional voltage stress that must be controlled. [31], [32] Four rectangular ribbons give the perimeter = 8 × (width + thickness), before corner rounding. PG/PU is 1.49 and PD/PG is 1.16. The L3 structures closely resemble L2 in layout and cell height. Fewer L3 nanosheet widths are tabulated because fewer high-magnification images were available. DDR PHY The DDR-PHY trades density for controlled analog behavior and reliable off-chip signaling. It contains drivers, receivers, delay circuits, and calibration logic that set drive strength, sampling time, and voltage margin. Repeated four-sheet devices with similar widths fit the use of regular transistor units for matching and programmable drive. Its wider local wiring provides room for current delivery and separation of sensitive signals, while consuming more area than a dense core-logic grid. The layout serves the memory channel’s electrical requirements as well as digital logic density. [33] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Intel 3 GPU devices Vector engine logic Intel 3’s XVE logic uses two-fin PMOS and NMOS devices with power rails in M0. Its cell height and M0 pitch give a seven-track geometry, two tracks more than the 18A logic. One-fin groups also appear among the two-fin devices. Intel 3 L2 SRAM The Intel 3 L2 SRAM uses the familiar HCC sizing pattern: one PU fin, two PG fins, and two PD fins. N3E GPU devices Vector engine logic The N3E XVE field contains repeated two-fin devices with seven-track cell geometry. N3E remains a FinFET process, giving Panther Lake a direct FinFET-to-RibbonFET comparison. N3E L2 SRAM The N3E L2 SRAM uses the same PU:PG:PD fin-count pattern of 1:2:2. Panther Lake-U follows Lunar Lake’s floorplan quite closely. Both pair 4 P-cores with 4 LP E-cores and NPU, media and display engines in similar locations. Lunar Lake also uses Xe2, the direct predecessor to Panther Lake’s Xe3 GPU. This makes Lunar Lake the most direct basis for our comparisons. Arrow Lake differs in core count and uses the older Xe-LPG GPU architecture, so we only use it where it offers a more direct component-level comparison. Compute tile Panther Lake compute-tile floorplans remain sparse even months after launch. Intel 18A’s backside metal and dielectric stack must be removed without damaging the underlying structures before a clean transistor-level floorplan can be imaged. Most published die shots hide or heavily process the background, but we are quite proud of the die shot we achieved and are excited to show the work we have done. We measured the areas of the key components on the compute tile and compared them with their Lunar Lake predecessors on TSMC N3B. These help us to capture changes in block area and compare the two chips across process nodes and designs. Our total tile areas exclude the scribe-line area. The compute-plus-GPU subtotal below uses the PTL-U compute tile and GT1 GPU; it excludes the I/O tile and passive base. Individual block areas use the boundaries marked on the floorplans The compute-plus-GPU row is recomputed from the displayed PTL-U and GT1 areas. Component rows use their stated per-region counts and are not an additive partition of the whole tile. The P-core area remains almost unchanged between Lunar Lake and Panther Lake, despite L2 capacity increasing from 2.5 MiB to 3 MiB. Arrow Lake uses the same Lion Cove core as Lunar Lake but also has a 3 MiB L2. Cougar Cove fits 20% more L2 into the same P-core area. The larger private cache keeps more of each core’s working set close to its execution units, reducing access to shared L3 and DRAM. Extra capacity adds storage leakage and lookup energy, so designers balance it against avoided lower-level accesses. The shared P-core L3 cache also shrank by 14.8%. [2] Cougar Cove combines a similar footprint with Intel’s reported power-efficiency improvements. RibbonFET’s tighter channel control reduces leakage, while PowerVia reduces supply droop and allows tighter voltage guardbands. [1] Darkmont’s four-core LP E-core cluster is 5.0% smaller than Skymont’s on Lunar Lake, with most of the reduction in its L2 regions. The 1 MiB region shrank by 8.4% and the 1.5 MiB region by 14.9%. The tag arrays also use one fewer visible row. Tags identify which memory addresses the data array holds, so rearranging them changes the cache’s layout and wiring without requiring less data capacity. [2] The LP E-cores share one L2. This pools capacity and avoids duplicating all the cache machinery, but the four cores contend for its banks and bandwidth. Their separate cluster also keeps light work away from the performance cluster and its L3, allowing that larger domain to sleep. [1], [2] Cache area includes more than the storage cells. Tags identify each line, decoders select rows, sense amplifiers read the small bitline signal, and wires connect to the banks. Splitting an array into smaller sections shortens wordlines and bitlines, improving access speed, but duplicates peripheral circuits. Panther Lake’s smaller cache regions therefore reflect the complete memory implementation, including how much of each region is devoted to storage. [34] Unlike Meteor Lake and Arrow Lake, Panther Lake has no separate SoC tile. The NPU, LP E-cores, memory controllers, PHYs, media and display engines now share the compute tile. This removes an active die and keeps CPU memory traffic on one die. The cost is moving PHY and I/O-related circuitry onto 18A: drivers, receivers and analog circuits must still meet external voltage, loading and signal-integrity requirements, so their area does not shrink like dense digital logic. [1], [2] The biggest shrink comes from the NPU, which occupies 36.9% less area. NPU 5 consolidates the same total INT8 MAC count into half as many neural compute engines. Each of the three NCEs has a larger MAC array to make the complete NCE envelope 22.6% larger than an NPU 4 engine. Consolidation also halves the number of scratchpads and SHAVE DSPs, from 12 to 6. The MAC array handles matrix multiplication and convolution, while SHAVE executes vector and custom operations that fit the array poorly. [1], [2], [35] The paired floorplans identify each NCE envelope and its scratchpad, MAC, and SHAVE regions. Each measured MAC polygon is counted once per NCE in the area accounting below. The scratchpads store weights, activations, and intermediate results near the MAC arrays, allowing repeated use without fetching them again from DRAM. Halving their number delivers the largest measured area saving but leaves less local storage for the same total MAC count. Layers that no longer fit locally require smaller working tiles or more transfers of intermediate data. The benefit depends on keeping the enlarged arrays busy while managing that tighter storage budget. [36] NPU 5 also adds native FP8. Using half the operand width of FP16 reduces storage and transfer demand, helping workloads fit the smaller local memory budget. Lower precision and format-dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile with 4 Xe3 cores on Intel 3 and a larger GT2 tile with 12 Xe3 cores on TSMC N3E. Panther Lake allows us to compare the same GPU architecture across both Intel 3 and TSMC N3E. Wildcat Lake adds a third Xe3 implementation on Intel 18A. A future newsletter will detail Xe3 and its implementation differences across all three process nodes. GT2 scales Xe3 to a different physical layout, with render slices arranged vertically instead of GT1’s horizontal arrangement. Slice placement sets the distances to shared cache banks and the D2D interface. Those wires consume area and add delay, so scaling the number of Xe cores also requires a new balance of cache placement, routing and timing. [1] What’s immediately obvious is that the GT2 tile on TSMC N3E has much smaller Xe cores than GT1. These block areas include logic, caches, and routing. An Xe core on the GT1 tile is ~69% larger than one on Lunar Lake, and ~55% larger than one on GT2. Intel 3 therefore uses substantially more area per Xe core. The block-area gap exceeds the measured logic and SRAM density gaps, bringing routing, timing targets, cell mix, and floorplan allocation into the comparison. The measured vector/matrix engine region is almost unchanged between Lunar Lake and Panther Lake’s GT2 tile. Xe3 retains eight 512-bit vector engines and eight 2048-bit XMX engines per core. Its gains also come from feeding those engines more effectively: more resident threads hide stalls, and variable register allocation lets shaders trade registers per thread against the number of threads kept active. [1] The shared L1/SLM capacity increased by 33% from 192 KiB to 256 KiB, while its area increased only 5%, raising effective density by 27%. L1 retains reused cache lines, while software-managed SLM lets a thread group share data locally. Both reduce traffic to more distant memory. Allocating more SLM per group can also limit how many groups reside on a core at once. [1], [37] The GT1 tile carries 4 MiB of L2 against 16 MiB on the GT2 tile. GT1 divides its L2 cache into four 1 MiB banks, while GT2 uses eight 2 MiB banks. Each bank contains 128 macros, but each N3E macro stores 16 KiB, twice the Intel 3 macro’s 8 KiB capacity. The N3E macro is only 54% larger while holding twice as many bits, giving it 30% higher density: ~23.7 Mbit/mm² versus 18.3 Mbit/mm². Including bank-level circuitry, the gap widens to ~16.9 Mbit/mm² on GT2 versus ~10.4 Mbit/mm² on GT1. GT2 gains density with its macros storing more bits per unit area, and those macros occupy more of each cache bank. Larger macros spread decoder and sense-amplifier overhead across more storage, while a more compact bank layout reduces the share spent on control and routing. The compromise is longer wordlines and bitlines that carry more capacitance. [34] I/O tile Panther Lake uses two I/O tile variants, both fabricated on TSMC N6. The smaller one provides 4 PCIe 5.0 and 8 PCIe 4.0 lanes and serves lower-tier systems as well as those without a discrete GPU, while the larger one adds 8 PCIe 5.0 lanes, bringing the total to 20 lanes, for discrete-GPU connectivity. Panther Lake SKUs with the larger 10- or 12-Xe GPUs use the smaller I/O tile. [38] The smaller I/O tile adds a PCIe 4.0 block and a Thunderbolt block to Lunar Lake’s I/O layout, providing four additional PCIe 4.0 lanes and another Thunderbolt 4 port. Its repeated N6 blocks retain nearly identical areas and layouts. Reusing these proven PHYs and controllers avoids porting and requalifying external interfaces on 18A, where faster digital logic offers less benefit to circuits constrained by the off-chip link. [38] SemiAnalysis’s teardown lab (STEEL) dives deep into the world’s advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. We’re hiring technical experts from system to transistor and everywhere in between. Check out our Careers page. Panther Lake offers scalability and modularity through its disaggregated packaging that partition compute, GPU, and I/O silicon into separate tiles allowing for a suite of tile configurations. This partitioning makes the package part of Intel’s node economics as it determines how much leading-edge wafer area each product consumes, which functions can remain on other processes, and how much configuration freedom Intel can offer from a shared set of tiles. Furthermore, fabricating the compute and GPU tiles separately confines the new 18A process to the compute tile and allows graphics and I/O to use other, more established, and more cost-effective processes. For Panther Lake, the GPU and I/O tiles are assembled alongside the compute tile on a passive silicon base using Foveros-S. Intel’s current technology brief lists a nominal 36 µm pitch for Foveros-S. Through-silicon vias (TSVs) in the base connect the fine wiring above to the larger package connections below. The functional tiles sit side by side on that passive base in a 2.5D configuration. [39] Our cross-section through the compute and GPU tiles shows the package’s wiring hierarchy. Microbumps connect each active tile to the passive silicon base; its fine redistribution layer (RDL) carries the short, dense tile-to-tile links. TSVs carry connections through the base to the package substrate, which fans them out to the much coarser motherboard solder joints. The base supplies interconnect, while computation remains in the active tiles above it. [39] At the compute-tile edge, the higher-magnification inset shows a local microbump spacing of approximately 25.24 µm and a feature width of 12.33 µm. These local spacings are finer than Intel’s nominal Foveros-S value. The X-ray fields further confirm tighter neighboring bumps, consistent across every die-to-die area found on each tile. Additional X-ray analysis is offered after the paywall. Putting the memory controller beside the CPU removes the D2D transfer that CPU memory requests required in Meteor Lake and Arrow Lake. This avoids the extra transmitter, receiver, and link traversal, saving interface energy and latency. Panther Lake’s separate GPU still crosses a D2D link to reach DRAM, so its larger local caches also help contain package traffic. [1], [40] Smaller dies are less likely to contain a random fatal defect, and screening them before assembly prevents one bad tile from consuming a complete package of good silicon. Reuse also spreads design and qualification work across more products. Against those gains, Intel pays for the passive base, D2D circuits, extra bonding and test steps, and losses during assembly. Cost per working product across the portfolio captures the combined effect of wafer yield, reuse, test, and assembly. [29] Wildcat Lake packaging Intel launched Core Series 3, formerly Wildcat Lake, on 16 April 2026 for value mobile and edge systems. Wildcat Lake keeps 18A but removes the passive base and combines more functions on one die to simplify the package. The two products therefore reveal two distinct ways to commercialize the same leading-edge process. [41] Wildcat Lake’s 18A die combines up to two Cougar Cove P-cores, four Darkmont LP E-cores, two Xe3 cores and a smaller NPU. A separate platform-controller die supplies I/O, connected through UCIe, Intel’s first processor implementation of the standard. Consolidating graphics remove a tile boundary and the passive base, reducing assembly complexity for a modest-bandwidth value product. It also ties CPU and graphics scaling to the same die, giving up Panther Lake’s ability to swap in a much larger GPU. [42], [43] In July 2021, Intel CEO Pat Gelsinger set out an ambitious process roadmap aimed at regaining performance leadership by 2025, later described as five nodes in four years. Five years and one CEO later, Intel’s comeback story is not as unambiguously positive as Pat may have hoped. [44], [45] Intel once set the pace for process technology, bringing high-k metal gate technology and FinFETs into volume production years ahead of the rest of the industry. Its 22 nm FinFET process reached consumers with Ivy Bridge in 2012. [46] Intel’s integrated device manufacturing (IDM) model allowed its architects and process engineers to co-optimize products and processes. Starting with Sandy Bridge, Intel dominated x86, while AMD struggled with Bulldozer. That lead faltered at 14 nm and broke at 10 nm. Intel targeted a massive 2.7× density increase, but the node arrived years late and required several revisions before it could support Intel’s full lineup. This delay forced Intel to stretch 14 nm across six generations, while TSMC moved ahead in process technology and AMD recovered in x86. By 2019, Intel was still shipping 14 nm across most of its product stack, with its 10 nm client ramp focused on Ice Lake mobile processors. Meanwhile, TSMC was shipping N7 and N7+, and AMD’s Zen 2 compute chiplets used N7 to raise core counts and improve efficiency. Intel’s process failures were central to its decline, but unsound business decisions furthered their downward slide. Product delays compounded product mistakes, pushing client, server, and FPGA roadmaps off schedule. Several attempts to enter AI (Nervana and Gaudi) and networking (Tofino) also failed to establish lasting businesses. Intel’s recovery has focused on consumer CPUs and advanced packaging. Tiger Lake, Alder Lake, Lunar Lake and now Panther Lake have restored Intel’s consumer roadmap. On the process side, Intel 4 shipped with Meteor Lake, Intel 3 with Granite Rapids and Sierra Forest, and Intel 18A with Panther Lake. Intel has also made advanced packaging part of its foundry offering. However, Intel is still playing catch-up in servers. Several Xeon generations arrived years late and trailed contemporary AMD and Arm server CPUs in performance, efficiency, and core count. The process roadmap is back, but Intel does not hold the same process-technology leadership position it held prior to 10 nm. The introduction of gate-all-around nanosheets and backside power delivery are two of the biggest changes to transistor integration in a decade. Intel took on both changes at once: 18A paired its first RibbonFET with PowerVia in Panther Lake. Panther Lake is a substantial manufacturing milestone. Our cross-sections show how RibbonFET and PowerVia reshape local contacts and wiring, while the floorplans show where architectural consolidation and process choices save area. A sustained competitive lead depends on product performance, cost, yield, and the next implementation. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page.. 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La Liga giants Real Madrid have had their interest firmly piqued by the talents of a member of the defensive ranks at German outfit Stuttgart.This comes amid the understanding that those behind the sc...
Political debates were once considered essential. Has that changed?
For most of the television era, the political debate had a pretty straightforward purpose: Put candidates next to each other, take away the script, and let voters watch. But with no top-of-ticket debates scheduled to happen in Florida this year, where does the debate stand?
Homewood BBQ spot improves as 5 other eateries fall below health standards
Five Jefferson County food establishments, American Deli, Jimmy Johns, Walmart Deli, Triple S Food Store and Dollar General, scored below 85 in health inspections, while Jim N' Nicks in Homewood cleared reinspection with a 97 after months out of compliance, according to JCDH.
LSU and Texas A&M: Three Keys to Win
LSU and Texas A&M will surely feel the urgency on Saturday in a game that’s practically a must-win for both teams in terms of realistic expectations to make the playoffs. The Aggies’ standing in the college football world took more of a blow recently after a resounding loss at home to Kentucky. LSU’s loss wasn’t …
Tulsa Health Department's Food Safety Measures Protect More than One Million People at the Tulsa State Fair
TULSA, OKLA.– [September 25, 2026] – The Tulsa Health Department (THD) is preparing to protect the health of more than one million attendees at the Tulsa State Fair, ensuring fairgoers can enjoy their favorite foods without fear of contracting a foodborne illness. With more than 200 food booths to inspect, THD’s dedicated team is working […]
Southern Berkshire Chamber of Commerce celebrates Greenagers founder Conklin’s career in Business Person of the Year event
"This place can grab you in an instant and keep a hold of you forever," Will Conklin said after being named the Southern Berkshire Chamber of Commerce's 2026 Business Person of the Year.
Bladen Small Business Center to host “Funding Toolbox” Small Business RoundTable
Small business owners and aspiring entrepreneurs are invited to attend the September Small Business RoundTable at Bladen Community College, featuring a practical discussion on one of the most important challenges facing entrepreneurs: finding the right funding for a business.The September RoundTable, “The Funding Toolbox,” will be held Monday, Sept.28, from 5:30–7 p.m. in Building 14, Room 135, at Bladen Community College.Sponsored by the Bladen Community College Small Business Center (SBC) and the Elizabethtown-White Lake Area Chamber of Commerce, the event will bring together experts familiar with the Small Business Center and SSBCI programs to help participants better understand the funding resources available to entrepreneurs and small businesses.Rather than focusing on one type of financing, “The Funding Toolbox” will explore a variety of funding tools and resources that may be available depending on a business's stage, needs and goals. Participants will have an opportunity to learn about available programs, how they work, what lenders and funding organizations look for, and how business owners can prepare to seek financing.Topics will include:Funding options for startups and existing businessesLoans and other financing resourcesSSBCI-supported funding opportunitiesHow to determine which funding option may fit your businessWhat lenders and funding organizations look forPreparing financial information and documentationResources available to help businesses become funding-ready“The Funding Toolbox” is designed for both aspiring entrepreneurs and established small business owners who are considering starting, expanding or investing in their businesses.The Small Business RoundTable provides an informal setting where local entrepreneurs can learn, ask questions, share experiences and connect with business-resource partners. The program is part of the ongoing efforts of the Bladen Community College Small Business Center and the Elizabethtown-White Lake Area Chamber of Commerce to strengthen and support small businesses throughout the community.The September RoundTable is free and open to the public.For more information or to register, contact the Bladen Community College Small Business Center at 910-879-5572.Event DetailsWhat: Small Business RoundTable – The Funding ToolboxWhen: Monday, Sept.28, 2026 | 5:30–7 p.m.Where: Bladen Community College, Building 14, Room 135Cost: FreeSponsors: Bladen Community College Small Business Center and Elizabethtown-White Lake Area Chamber of Commerce
Oklahoma healthcare costs surge with premiums rising up to 75%
Oklahoma healthcare costs are rising sharply, with insurance premiums increasing up to 75% due to federal subsidy expirations and climbing medical expenses.