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Cancer Health: HIV raises hepatitis C liver disease risk in women more than men

Women with HIV and HCV face higher odds of cirrhosis and liver decompensation but not liver cancer.

Jul 5 • 7:27 PM EDT • Health • eatg.org

AMC CEO shares play-by-play of Taylor Swift and Travis Kelce’s wedding

AMC CEO Adam Aron shared a very detailed recap of Taylor Swift and Travis Kelce’s wedding at Madison Square Garden, from the decor to the vows.

Jul 4 • 8:11 AM EDT • Entertainment • ew.com

TP-Link Deco BE77 Review: Great Mesh Wi-Fi for the Eero-Weary

TP-Link’s mesh Wi-Fi system is super fast, stable, and probably way more than my apartment needs.

Jul 4 • 8:00 AM EDT • Technology • gizmodo.com

As World Cup fever grips Brazil, scrutiny mounts over its sports betting industry

RIO DE JANEIRO (AP) — When World Cup season descends upon soccer-mad Brazil, green and yellow banners decorate restaurants, bars and apartment buildings, streets are painted with flags and soccer balls, and discussions of the beloved national team's games are ubiquitous.

Jul 3 • 1:28 PM EDT • Sports • wral.com

As World Cup fever grips Brazil, scrutiny mounts over its sports betting industry

When World Cup season descends upon soccer-mad Brazil, green and yellow banners decorate restaurants, bars and apartment buildings, streets are painted with flags and soccer balls, and discussions of the beloved Seleção’s games are ubiquitous

Jul 3 • 1:26 PM EDT • Sports • abcnews.com

UH to cease science operations at Maunakea’s UKIRT telescope this fall

The United Kingdom Infrared Telescope is one of thirteen working telescopes on the mountain’s summit and the third to be decommissioned.

Jul 2 • 10:30 PM EDT • Science • hawaiinewsnow.com

UH to cease science operations at Maunakea’s UKIRT telescope this fall

The United Kingdom Infrared Telescope is one of thirteen working telescopes on the mountain’s summit and the third to be decommissioned.

Jul 2 • 5:30 PM EDT • Science • hawaiinewsnow.com

UH continues UKIRT decommissioning; science operations to end this fall | University of Hawaiʻi System News

UKIRT will become the third Maunakea telescope to be decommissioned. Science operations at UKIRT will conclude on September 15.

Jul 1 • 8:00 PM EDT • Science • hawaii.edu

Nancy Pelosi to establish new democracy institute at UC-Berkeley

The former House speaker is preparing to leave Congress after a nearly four-decade decorated career.

Jun 29 • 8:00 AM EDT • Politics • washingtonpost.com

Citing construction, downtown Noblesville business will close

The Velvet Plum Vintage & Consignment, a home decor and furniture consignment shop at 894 Logan St. in Noblesville, has announced it will close July 15, citing Embrace Downtown construction as the driving factor. The Embrace Downtown project began earlier this year to provide infrastructure a

Jun 27 • 3:41 PM EDT • Business • youarecurrent.com

Citing construction, downtown Noblesville business will close

The Velvet Plum Vintage & Consignment, a home decor and furniture consignment shop at 894 Logan St. in Noblesville, has announced it will close July 15, citing Embrace Downtown construction as the driving factor. The Embrace Downtown project began earlier this year to provide infrastructure a

Jun 27 • 3:41 PM EDT • Business • youarecurrent.com

Eat, Sip, Shop: New businesses bring unique products, services to Bethlehem’s Main Street

Whether you’re shopping for toys, games and puzzles or jewelry, home decor and pet treats and accessories, a variety of new retailers on downtown Bethlehem’s Main Street have you covered.

Jun 27 • 11:05 AM EDT • Business • wfmz.com

Famous Pink Planet Mystery Decoded: JWST Says Salt Clouds are the Culprit

This Magenta world's strange atmosphere made no sense until JWST found intriguing clouds made of salt.

Jun 22 • 1:46 PM EDT • Science • zmescience.com

Technological Decolonization in the Shadow of Algorithmic Hegemony

With every crisis originating from a tech company, we see a fresh batch of dirty laundry aired & we fail to grasp the scale of the issue.

Jun 22 • 3:25 AM EDT • Politics • politicstoday.org

Researchers receive funding to launch USC’s first clinical study of psilocybin for mental health

Related News NIH investment totaling 30.7M will expand USC-led AI effort to decode Alzheimer’s disease April 2, 2026 USC study maps brain network changes linked to bipolar disorder severity and […]

Jun 16 • 9:00 AM EDT • Health • keck.usc.edu

Science of love: decoding signals

Columnist Medha Shah argues for communication and compromise during mixed signals and assumptions in relationships.

Jun 14 • 10:36 PM EDT • Science • thedailytexan.com

Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?

Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.

Jun 14 • 3:14 PM EDT • Technology • newsletter.semianalysis.com

Scientists crack a decades-old CO2 problem and triple fuel production

A new catalyst design could significantly improve the conversion of CO2 into methanol, an important fuel and chemical feedstock. Researchers separated key reaction steps across different catalyst sites, avoiding a long-standing trade-off between speed and efficiency. The result was about three times more methanol production than standard commercial catalysts.

Jun 14 • 8:00 AM EDT • Science • sciencedaily.com

Richard Feynman’s 50-Year-Old 'Restaurant Problem' Finally Decoded. It Shows Why People Settle for Good Enough

The restaurant problem reveals why human shortcuts can work surprisingly well.

Jun 10 • 1:22 PM EDT • Science • zmescience.com

'This is actually taking a page out of the Communist Party playbook': New White House proposal could deny scientists funding based on their political opinions

"It replaces expertise with political appointees, globally decouples the U.S. and completely guts our scientific ecosystem."

Jun 9 • 11:00 AM EDT • Science • space.com

Electric Ladyland announces closure after nearly 50 years on Bardstown Road

The smoke shop, record and metaphysical supply store opened in 1978 and is known for its bright Bardstown Road storefront, counterculture roots, and hippie-inspired decor and exterior.

Jun 9 • 10:10 AM EDT • Business • wdrb.com

Alaskans Reel From the Loss of National Science Foundation Ocean-Monitoring Instruments

In the nation’s fastest-warming state with a multi-billion-dollar fishing industry and storm-threatened coastal communities, scientists say the federal government’s decommission of a deepwater sensor system is ill-timed and wrong-headed.

Jun 9 • 5:00 AM EDT • Science • insideclimatenews.org

Decoding AI: Oklahoma Gov. Kevin Stitt on regulating AI in political ads: ‘We want to make sure voters aren’t confused’

Jun 8 • 2:36 PM EDT • Politics • cnn.com

Men’s Health Month shines spotlight on mental health and suicide prevention

As Men’s Health Awareness Month begins, the death of one of the NHL’s most decorated players is renewing attention on men’s mental health and suicide.

Jun 7 • 11:55 PM EDT • Health • news3lv.com

Simone Biles recovering from health scare she described as ‘scariest experience’ of her life

While she didn’t divulge many details, decorated U.S. gymnast Simone Biles shared that she was resting in bed following a terrifying health scare.

Jun 7 • 1:45 PM EDT • Health • fox8.com

4-star WR Demare Dezeurn decommits from Oklahoma

Four-star Westlake (Calif.) wide receiver Demare Dezeurn has decommitted from Oklahoma, he tells Rivals. Dezeurn had been pledged to the Sooners since September, when he chose them over offers from USC, Nebraska, Michigan, Texas Tech and a host of other programs. However, other schools have remained in contact with him since that initial commitment, pushing […]

Jun 6 • 11:34 AM EDT • Sports • sports.yahoo.com

World Cup anticipation reaches the center of the Brazilian rainforest

In the heart of the Brazilian rainforest, residents and shop owners are feeling the World Cup anticipation. As residents decorate Rua 3, a street in downtown Manaus, an open-air party sends the sounds of Brazilian music wafting through the air. Oversized flags representing the 48 qualifying nations in the soccer tournament are painted on the surface of the street, while the same flags, crafted of paper and string, form a canopy overhead.

Jun 5 • 3:01 AM EDT • Sports • sports.yahoo.com

Decoding the Complex Science of Obesity

GLP-1. GIP. Amylin. Incretins. Peptides. NuSH. It’s not hard to see why the language surrounding modern obesity research sometimes feels like an alphabet soup of scientific terms. But behind each is a growing understanding of how the body regulates hunger, metabolism, energy use, and weight. It’s shaping what we know about how those systems might contribute to obesity.

Jun 4 • 1:07 PM EDT • Science • pfizer.com

NASA Says Goodbye to its Longtime Mars MAVEN Mission

The space agency announced that the MAVEN spacecraft, which has circled Mars for more than a decade, is being decommissioned.

Jun 3 • 6:45 PM EDT • Science • nytimes.com

Researchers decode hidden patterns in World Cup data

Northeastern’s Network Science Institute is using data to decode the 2026 World Cup, from passing networks to predictive models.

Jun 3 • 3:45 PM EDT • Science • news.northeastern.edu

Decoding AI: How the political ad campaign world is being shaped by artificial intelligence

Jun 1 • 3:06 PM EDT • Politics • cnn.com

Scientists Find Cosmic 'Rosetta Stone' To Decode Baffling Signals From Deep Space

A tempestuous relationship.

Jun 1 • 5:00 AM EDT • Science • sciencealert.com

Longtime retailer closes, entertainment center expansion coming soon at Wind Creek outlets

General Store, offering a wide array of gifts, greeting cards, holiday decor and more, closed this past weekend at The Outlets at Wind Creek Bethlehem.

May 27 • 12:48 PM EDT • Entertainment • wfmz.com

Scientists found a dead whale 1,288m deep in the Pacific. They filmed it for 20 years – and discovered this

Researchers studied a whale decomposing at the bottom of the ocean and found that its body sustains deep-sea creatures for decades.

May 26 • 8:41 AM EDT • Science • discoverwildlife.com

Top Links 1112 Semiconductor decoupling. Powell's politics. Industrializing Ogaden. Free trade and the Magna Carta.

Thank you for your support of Chartbook. Your generosity keeps this show on the road. Feliks Topolski, 1907-1989 8th Army’s Front, Italy 1944 Semiconductor decoupling

May 25 • 6:21 AM EDT • Politics • adamtooze.substack.com

Kings, popes and the power to impress in a political world

When a powerful leader won't give his elected counterparts from other nations their due, sometimes it pays to pull out the pageantry.

May 24 • 8:00 PM EDT • Politics • news-decoder.com

Global Health Watch: Ebola exposes gaps; WHA79 debates future of WHO; continued dismantling of US health leadership

The hantavirus outbreak and now emerging Ebola crisis are exposing major gaps in pandemic preparedness and global health cooperation; the future of the World Health Organization (WHO), multilateralism and the HIV response is being debated at this week’s World Health Assembly (WHA); while the US government continues to deconstruct its public health leadership. Emerging Ebola […]

May 22 • 9:23 AM EDT • Health • avac.org

Britain Politics

View at flats decorated with the St George's Cross flag in Ashton-in-Makerfield where Andy Burnham will stand as Labour's candidate for the by-election in Makerfield, England, Friday, May 22, 2026.(AP

May 22 • 8:16 AM EDT • Politics • journal-news.com

Russia putting anti-jam antennas on foam decoys for Shaheds: Ukraine

Ukrainians have been finding 12-element Kometa antennas, which provide stronger jamming resistance, on their cheap Gerberas, a top analyst said.

May 19 • 12:27 AM EDT • Business • businessinsider.com

Decoding chirality at the nanoscale with momentum-space polarimetry

Light: Science & Applications - Schematic illustration of Fourier-domain Mueller matrix polarimetry probing light-matter interactions in gammadion nanostructures, and enabling extraction of...

May 17 • 8:00 PM EDT • Science • nature.com

Elite Georgia WR decommit decides on top three schools

Three-star wide receiver Aden Starling, who decommitted from the Georgia Bulldogs, has listed his top three schools

May 16 • 12:33 PM EDT • Sports • sports.yahoo.com

Scientists Decode Giant Venus Cloud, Say "Hydraulic Jump" Is Behind It

This happens when a fast-moving, shallow flow suddenly slows down and becomes deeper.

May 16 • 12:33 PM EDT • Science • ndtv.com

Joao Pedro transfer news: Barcelona sporting director Deco meets with Chelsea striker's agent

May 15 • 7:00 PM EDT • Sports • skysports.com

First-of-its-kind drainage device helps limit heart failure rehospitalizations

This new catheter-based device for lymphatic drainage showed early potential to be a new treatment option for acute decompensated heart failure.

May 12 • 4:57 PM EDT • Business • cardiovascularbusiness.com

How 'Seabird Sue' Blends Art and Science to Attract Birds Back to Lost Habitat

For the past decade, Sue Schubel has been making detailed decoys of terns, puffins and other seabirds to entice real ones to restored or new homes

May 12 • 1:38 PM EDT • Science • smithsonianmag.com

A rare cancer-fighting plant compound has been decoded

Scientists at UBC Okanagan have uncovered how plants produce mitraphylline, a rare natural compound with promising anti cancer potential. The team identified two enzymes that work together to build the molecule’s unusual twisted structure, solving a mystery that had puzzled researchers for years. Because mitraphylline appears only in tiny amounts in tropical plants like kratom and cat’s claw, the discovery could make it far easier to produce sustainably in the future.

May 12 • 8:00 AM EDT • Science • sciencedaily.com

CNN Exclusive: Fired former acting FBI chief says Patel tied job security to purging agents linked to Trump probes

A week before Donald Trump’s inauguration last year, Brian Driscoll, a decorated FBI special agent, received a series of calls that alarmed him. He was being offered the No. 2 job at the FBI and was told that if he didn’t take it, a political appointee would likely get the role. Driscoll didn’t think that was an acceptable alternative, so he hesitantly agreed.

May 12 • 6:00 AM EDT • Politics • cnn.com

DeepAFM: A deep learning method to decode protein motion

Proteins change shape as they function, and these changes are essential for processes such as drug interactions and cellular activity. Researchers from the Tokyo University of Science developed an AI-based method called DeepAFM that is trained on millions of simulated images representing different protein states, accurately identifying transitions between closed and open states in a protein called SecA. This approach highlights the growing potential of AI to solve complex challenges in biology and medicine.

May 11 • 8:00 PM EDT • Science • eurekalert.org

Ravens GM recalls early days working beside Ozzie Newsome

Ravens GM Eric DeCosta reflects on his humble beginnings, starting in a tiny scouting department nearly 30 years ago.

May 10 • 11:54 PM EDT • Sports • sports.yahoo.com

Eric DeCosta details emotional NFL Draft phone calls

Ravens GM Eric DeCosta describes the 'special feeling' of calling NFL Draft picks and hearing their families erupt.

May 10 • 8:49 PM EDT • Sports • sports.yahoo.com

Eric DeCosta says Lamar Jackson elevated the Ravens' coaching vacancy

Ravens GM Eric DeCosta says Lamar Jackson made the team's coaching opening one of the NFL's most attractive jobs.

May 10 • 4:32 PM EDT • Sports • sports.yahoo.com

5-star Georgia football commit flips to Miami

Five-star cornerback recruit Donte Wright has been expected to decommit from Georgia football for a while

May 9 • 5:25 PM EDT • Sports • sports.yahoo.com

Nature’s giant vacuum cleaner: Scientists reveal how the Sun is secretly cleaning Earth’s space junk

Science News: As Earth’s orbit becomes increasingly crowded with decommissioned satellites and fragments from the 1960s, however, researchers have identified a natu.

May 7 • 2:00 PM EDT • Science • timesofindia.indiatimes.com

Rubio’s Rome mission balances diplomacy and Republican politics

As global affairs expert Ian Lesser argues, Marco Rubio’s visit to Rome is unlikely to fully repair recent tensions between Washington, Italy and the Vatican, but it could still help ease the political climate. According to Lesser, Rubio embodies a more diplomatic and moderate Republican voice, yet remains constrained by the broader posture of the [...]

May 7 • 6:12 AM EDT • Politics • decode39.com

Women in Business hosts spring self-care event highlighting local wellness vendors

Members of the Cherokee Chamber of Commerce held its Women in Business Spring Event on Tuesday, offering locals tools to decompress.

May 6 • 10:40 PM EDT • Business • ktiv.com

Google's Gemma 4 open AI models use "speculative decoding" to get up to 3x faster

Up to 3x the speed with no loss of quality—is it too good to be true?

May 6 • 11:44 AM EDT • Technology • arstechnica.com

The business behind the Baton Rouge Zydeco’s sudden closure

The Baton Rouge Zydeco are shutting down after just three seasons, marking an abrupt end to the city’s experiment with professional hockey and raising new questions about the future of sports entertainment downtown, WAFB-TV reports. Raising Cane’s River Center officials say team ownership chose not to renew its lease despite efforts to keep the franchise […]

May 6 • 10:29 AM EDT • Business • businessreport.com

A Security Researcher Decompiled The White House App, & What They Found Is Pretty Alarming

Recently, The White House launched its own official app on iOS and Android, claiming that it gives users "unparalleled access to the Trump

May 5 • 8:45 AM EDT • Technology • androidheadlines.com

Decoding boys, girls playoff scenarios

As usual, there is plenty of confusion over how the playoffs work.

May 3 • 12:55 AM EDT • Sports • santafenewmexican.com

Eric DeCosta details Ravens' response to Maxx Crosby setback

Jesse Minter reveals how the Baltimore Ravens navigate adversity and tough decisions, emphasizing adaptation and moving forward.

Apr 30 • 8:43 AM EDT • Sports • sports.yahoo.com

J. Craig Venter, Scientist Who Decoded the Human Genome, Dies at 79

A risk-taking outsider, he brought speed, competition and controversy to one of science’s biggest races.

Apr 30 • 12:29 AM EDT • Science • nytimes.com

Allyson Felix attempting Olympic comeback at 40: Most decorated women's track athlete eyes 2028 Games

Felix would be 42 when the 2028 Los Angeles Olympics begin

Apr 27 • 4:00 PM EDT • Sports • cbssports.com

‘But I’m lasting like 40 seconds or something’: Nikhil Kamath shares health hacks he swears by to stay in shape

From sleep to cold showers, expert decodes whether these popular wellness habits actually work.

Apr 25 • 8:30 PM EDT • Health • indianexpress.com

‘Cold feet’: Deal to buy historic Idaho 55 business called off

A deal to sell Cougar Mountain Lodge fell apart on Wednesday night amid the buyers’ concerns about plans to convert the property into an event venue. Treasured antiques that have decorated the historic lodge in Smiths Ferry were set to be sold this Saturday, April 25, as part of a separate sale at the property, but that, […]

Apr 23 • 5:23 PM EDT • Business • valleylookout.com

Why the Supreme Court Justices Are Suddenly Casting Shade on Each Other

The breach of decorum says a lot about the crisis of the court—and that’s a good thing.

Apr 23 • 8:06 AM EDT • Politics • thenation.com

The fiery effects of political memes

Despite their simplicity, memes can both inspire new political voices and reinforce false narratives and are affecting online discourse around the globe.

Apr 22 • 8:00 PM EDT • Politics • news-decoder.com

Kiln Spring 2026 Roadmap Revealed

Kiln launches tomorrow, but the team a Double Fine can’t wait to give you more to look forward to in this post-launch roadmap. See what maps and decor Spring 2026 has in store!

Apr 22 • 11:00 AM EDT • Technology • news.xbox.com

Volcanoes Send Tiny Warning Signals Before Eruptions. These Scientists Are Decoding Them

The team behind "Jerk," a novel tool that predicted eruptions with 92% accuracy for a French volcano, discusses its work and implications.

Apr 21 • 6:00 AM EDT • Science • gizmodo.com

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Schematic illustration of overpotential deconvolution in anion exchange membrane water electrolysis using electrochemical impedance spectroscopy (EIS) and distribution of relaxation times (DRT) analysis.

Apr 20 • 12:28 AM EDT • Science • eurekalert.org

Barcelona to beat Chelsea to signing of highly-rated midfielder

Barcelona are set for a big summer of transfers, as they plan to add extra quality to Hansi Flick’s squad for next season. Sporting director Deco will also oversee more La Masia additions, and the l...

Apr 19 • 11:40 AM EDT • Sports • sports.yahoo.com

Eric DeCosta credits coordinator input in Ravens draft success

Ravens GM Eric DeCosta says strong alignment between personnel and coaching staff is key to the team's success.

Apr 17 • 11:06 PM EDT • Sports • sports.yahoo.com

‘Iran has to come’ to the US for the World Cup, FIFA’s Infantino says

FIFA chief reasserts his views on Iran's participation, saying 'the players want to play' in the tournament.

Apr 16 • 5:50 AM EDT • Sports • aljazeera.com

Md. vaccine policy ‘will be led by science’: New law decouples guidance from federal agencies

As of July 1, Maryland will determine which vaccines should be administered, severing its reliance on federal agencies, including the U.S. Centers for Disease Control and Prevention.

Apr 15 • 3:22 PM EDT • Science • wtop.com

Tudor Monarch – Watches and Wonders 2026

For its 100-year anniversary, Tudor debuts an entirely new model – the Tudor Monarch – with an integrated design and more decorated calibre.

Apr 14 • 3:19 AM EDT • Technology • timeandtidewatches.com

Scientists decode the dynamic heart of elephant grass chromosomes

Centromeres act as the control centers of chromosomes, ensuring accurate genetic inheritance during cell division, yet they remain among the least understood genomic regions due to their repetitive structure.

Apr 13 • 12:22 PM EDT • Science • eurekalert.org

Inside a decommissioned nuclear silo from the Cold War

Nik Halik, an entrepreneur and venture capitalist, bought a decommissioned nuclear silo for more than $10 million. He plans to turn it into a data center.

Apr 12 • 11:01 AM EDT • Business • businessinsider.com

110,000-year-old discovery rewrites human history: Neanderthals and Homo sapiens worked together

The first-ever published research on Tinshemet Cave reveals that Neanderthals and Homo sapiens in the mid-Middle Paleolithic Levant not only coexisted but actively interacted, sharing technology, lifestyles, and burial customs. These interactions fostered cultural exchange, social complexity, and behavioral innovations, such as formal burial practices and the symbolic use of ochre for decoration. The findings suggest that human connections, rather than isolation, were key drivers of technological and cultural advancements, highlighting the Levant as a crucial crossroads in early human history.

Apr 11 • 8:00 PM EDT • Science • sciencedaily.com

Seniors: Carol Watson, 72

Owner of Carol Watson Greenhouse and Landscaping in LaFayette enjoys her growing business — still puts in six-, seven-day weeks By Mary Beth Roach Carol Watson, the owner of Carol Watson Greenhouse and Landscaping, has been in gardens since she could walk. Literally. She said she learned to walk in her grandfather’s garden, which was next door to her current home and business in LaFayette. Today, at 72, she is running the business that her mother, Claire, opened in 1981 as Watson Greenhouse. Watson worked part-time for her mom until 1990, when she joined her full time. While she may not have had any formal horticultural experience, she said she learned so much about growing and raising plants from her mom, who had an abundance of energy and talent. Now, after 35 years in the business full time, Watson has no plans to retire, although she joked that she’d like a couple of days off a week. On her seven-acre site, complete with four greenhouses, Watson said her favorite parts of the job are working with and educating her customers; helping some of her young customers build terrariums; conducting occasional class field trips; and supporting local art by decorating the shop with an eclectic mix of pottery from at least four area craftspeople. A one-time employee of the former Dey Bros. department store in Syracuse, Watson said she loves merchandising and enjoys displaying unique pieces of art on shelves and even suspending from ceilings. “We’re creative. We also had top quality plants. We got a reputation of quality plants and unusual products,” she said. It’s tending to her customers and her plants, showcasing the unusual products, and hosting special events to benefit the community that keep her motivated to work six to seven days a week. “I just love it. I love taking care of the plants. I’m one of the few people that really enjoys watering,” she said. And while she has cultivated a solid customer base over the years, she remains savvy in her marketing efforts to draw in new customers. For example, she does a gardening segment on CNY Central television; her active Facebook page has thousands of followers; and she hosts a number of unique events and classes that not only introduce her shop to potential new clients, but some benefit nonprofits as well. About 13 years ago, when the local symphony orchestra was struggling, she said she wanted to help. So, partnering with the group, she began offering concerts, called Soirees, featuring the Syracuse Orchestra’s string quartet. Following up on a suggestion from a customer whose brother is a deejay in retirement, specializing in sock hops, she hosted the greenhouse’s first sock hop. Plants got moved back toward the walls to make room for dancing; a caterer was brought in, offering diner-like food; guests came in period outfits; and proceeds went to the Food Bank of CNY. She is excited about doing it again in October. Via her website, she promotes the greenhouse as an “oasis in the snow,” offering visitors the opportunity to pick up some decorating and gift ideas while taking in the floral and citrus scents. And she also caters to her four-legged friends. Over this past winter, she said, she came up with a “brilliant idea,” although at the time she didn’t appreciate just how brilliant it would become. Feeling it too cold outside to take her dog for a walk, she opted to bring it into the greenhouse. And before long, she was inviting people to bring their dogs into the big greenhouse as well. She looks forward to extending that invitation again this upcoming winter season. For Watson and her customers, the greenhouse is always in season.

Apr 11 • 4:39 PM EDT • Business • oswegocountybusiness.com

Health Physicists: The Quiet Experts Keeping Radiation Risks in Check

When radioactive materials are involved, whether at a former nuclear weapons site, a decommissioned reactor, or a legacy industrial facility, the goal is simple: protect workers, safeguard communities and reduce potential radiation risks to levels that are demonstrably safe. At the U.S. Army Corps of Engineers (USACE), health physicists are the professionals responsible for making that happen. Their work is often behind the scenes but always with consequences that matter deeply to the public.

Apr 9 • 11:59 AM EDT • Health • dvidshub.net

County supervisors fielding complaints about controversial Winneshiek County Fair entertainment

The Winneshiek County Board of Supervisors is receiving complaints from the public regarding a musical group scheduled to perform at this year’s Winneshiek County Fair. The fair announced late last month the southern country-rock band Confederate Railroad would be part of this year’s musical lineup, along with Kayley Green and headliner Travis Denning. Online responses

Apr 8 • 11:26 AM EDT • Entertainment • decorahleader.com

Down to Business: Naperville biz a one-stop shop for party planning, entertainment, decor

Q&A with Stacie Chase, who has owned Funtime Events in Naperville for 30 years.

Apr 7 • 3:05 PM EDT • Entertainment • chicagotribune.com

TH Athlete of the Week finalists

Caitlyn Cyze (Dubuque Hempstead soccer) – The freshman scored three goals and assisted on another in her varsity debut to lead the Mustangs to a 9-1 victory Thursday at Decorah.

Apr 6 • 1:30 AM EDT • Sports • telegraphherald.com

Michigan, historic UConn fight to be last team standing Monday

INDIANAPOLIS -- For the third time in his decorated college career, Alex Karaban and UConn are in the Final Four. As tipoff for the 2026 national championship game approaches, Karaban knows only one way to leave the court on Monday night when the Huskies play Michigan in the main event of the NCAA Tournament.

Apr 5 • 5:02 PM EDT • Sports • cbssports.com

Ollama Now Runs Faster on Macs Thanks to Apple's MLX Framework

Ollama, the popular app for running AI models locally on a computer, has released an update that takes advantage of Apple's own machine learning framework, MLX. The result is a hefty speed boost on Macs with Apple silicon. According to Ollama, the new version processes prompts around 1.6 times faster (prefill speed) and nearly doubles the speed at which it generates responses (decode speed).

Mar 31 • 6:22 AM EDT • Technology • macrumors.com

German firms trapped between U.S. and China, study finds

German companies are so deeply tied to both the United States ​and China that they cannot decouple from either without ‌severe economic costs, according to a study by the University of Sussex and King's College London seen by Reuters on Monday.

Mar 30 • 12:04 AM EDT • Business • reuters.com

Live: Duke dominates UConn in first half with Final Four berth on the line

Top-seeded Duke and second-seeded UConn, the two most decorated men's college basketball programs over the last 35 years, are playing for a spot in the Final Four.

Mar 29 • 6:02 PM EDT • Sports • wral.com

University Park officials say SMU crosswalk doesn't violate state order

University Park officials say an intersection featuring the Southern Methodist University mascot is not in violation of Texas Gov. Greg Abbott’s order prohibiting decorative markings on state roads.

Mar 27 • 11:35 AM EDT • Politics • spectrumlocalnews.com

Mexican hotspot ‘Canta Corazon’ brings entertainment, unique drinks to Wynwood - WSVN 7News | Miami News, Weather, Sports

Deco people are the kind of people looking to turn a regular night out into something way more fun. Good thing Wynwood’s got a newRead More

Mar 26 • 7:52 PM EDT • Entertainment • wsvn.com