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I’ve tested TVs and tracked Prime Day deals for 11 years. Here are the 10 best early sales
Our tech reviewer and TV tester has picked his favorite TV, soundbar and streaming device sales that arrived early for this year’s October Prime Day.
It’s “Mean Girls” Day! See 13 Rarely Seen Photos from the Making of “Mean Girls”, from Lindsay and Lizzy to the Iconic Mall Scene
Go behind-the-scenes and back to 2004 with these photos from the set of the forever-favorite film
Not Completely Out Of The Blue: Introducing The Longines Spirit Pilot And Spirit Pilot Flyback With Blue Dials
✓ Not completely out of the blue ✓ Introducing the Longines Spirit Pilot and Spirit Pilot Flyback with blue dials in fan-favorite sizes ✓
Oklahoma drunk driver at center of 'political favoritism' scandal back in prison
Admitted drunk driver Sara Polston, whose case has spurred protest and policy changes around Oklahoma’s GPS ankle monitoring program, is back in prison and facing charges of illegal voting.
Steam's 2026 Autumn Sale 2026 Is Live With Up to 90% Off AAA and Indie Favorites, Plus Even More Major Price Drops for the Biggest Games of the Year So Far
The Steam Autumn Sale 2026 is officially live. What games are you picking up?
We Fest announces 2027 summer lineup
MINNEAPOLIS — One longtime Nashville favorite, one newly famous TV star and one of country music’s hottest outlier bands top the decidedly mixed lineup for We Fest 2027. Tim McGraw,
Dodgers to start playoffs still as World Series favorites
The Dodgers are still the World Series favorites as they get ready to start the postseason.
Coastal forces shape building sciences practice
When Built Environments relocated to Wilmington, the firm’s partners weren’t looking for the lazy tranquility one hopes for when on vacation. Instead, they sought sultry heat. They wanted to understand whipping coastal winds and punishing precipitation – the kind that tropical storms produce. That’s because how materials degrade can reveal a lot about how they can be improved. “We specifically chose the Wilmington market because it does fall within Climate Zone 3A, which is a coastal warm-humid climate,” said Jarrett Davis, who joined Built Environments in 2023 to lead the company’s building science practice. “There’s not a lot of product research in that climate zone, but there are a lot of structures here that get weatherized pretty severely.” Built Environments has provided building science, material testing and code compliance consulting for 25 years, ever since principal materials scientist Steve Doggett founded the company in Minnesota. “There are very few manufacturers that understand fully how their own materials and products work, whereas we know their shortfalls and their benefits out in the real world on jobsites,” Doggett said. “That’s why the original Built Environments was formed, to make buildings better.” He said the 15-employee company is just as comfortable on a jobsite, retrofitting a high-end beachside property, for example, as it is recreating some of the coast’s most intense weather conditions in the great indoors. The company operates an A2LA-accredited ISO/IEC 17025 mechanical testing laboratory on Wright Street. The year-old facility has expanded Built Environments’ in-house capabilities, Doggett said. “We’re able to simulate that hurricane wind (and) rain and perform structural and impact testing on wall assemblies, roof assemblies and glazing assemblies,” he said. “There are certain requirements that those windows and doors need to meet as far as wind ratings and pressure ratings and things of that nature.” Standard Glass Co.-Glass Depots, of Wilmington, is currently testing a new glazing system using Built Environments’ stress testing, the partners said. One method involves what’s called a “large missile cannon.” “We take 8-foot two-by-fours, and we shoot them at assemblies, so they have to withstand that impact,” Davis said. “It’s pretty cool to see, I’m not going to lie.” In many cases, the lab can run a full, wall-scale test of a product in a matter of weeks or months, whereas “it might take midrange manufacturers years,” Doggett said. “We’re nimble. We can cut that time in half.” The lab also develops intellectual property. Doggett, for example, shares a patent with Sustant LLC, of Minnesota, on a fastener patch to increase the air and water tightness within building envelopes. “We have too many ideas and not enough time,” he said. But the partners noted that they or their fellow principals – of which the company has four total, including a principal engineer and a principal codes and standards expert – could be anywhere on a given day, including in the courtroom providing expert testimony in contentious insurance cases. “Let’s say there is a fire on a structure,” Davis said. “We can analyze all the specific materials within that assembly – an exterior wall or something like that – because there are loads that require certain heat release. And so, we can measure each one of those materials, if need be, to say if this was likely or not a code-approved assembly.” Despite what can be inferred in a lab, the partners said nothing beats learning from how materials change over time under real-world strain. Take, for instance, the curious case of the creaking condo. “We recently had a customer that came to us trying to assess a sound issue of a roof. It was making noises that no one could explain or account for. How do you tackle something like that?” Doggett asked rhetorically. “There’s really no generally agreed-upon methodologies.” The problem turned out to be a faulty installation of a commercial roof system. “The building in this particular case was not local,” he said. “In the initial installation, the commercial roofing contractor installed the wrong fasteners in the wrong locations into the deck, and essentially the solar radiation was causing the building to move quite substantially early in the morning when the sun initially hit that assembly after a quite cool evening, causing the threads on the fasteners to kind of jump within the material, within the metal.” Built Environments designed an effective repair methodology that was within budget, the partners said. “We get the bizarre,” Doggett said. “I will say that’s something that has stayed the same over 25 years.” The partners said they are hiring, and that Cape Fear Community College is one of their main recruiting grounds. Davis and Doggett look for talented people who can understand traditional methodologies yet are open to on-the-job training and new understandings, they said. After all, it’s not just weather that can ruin a building. “My favorite saying is,” Davis said, “‘What are the eight most expensive words in construction? That’s how my daddy used to do it.’”
Coastal forces shape building sciences practice
When Built Environments relocated to Wilmington, the firm’s partners weren’t looking for the lazy tranquility one hopes for when on vacation. Instead, they sought sultry heat. They wanted to understand whipping coastal winds and punishing precipitation – the kind that tropical storms produce. That’s because how materials degrade can reveal a lot about how they can be improved. “We specifically chose the Wilmington market because it does fall within Climate Zone 3A, which is a coastal warm-humid climate,” said Jarrett Davis, who joined Built Environments in 2023 to lead the company’s building science practice. “There’s not a lot of product research in that climate zone, but there are a lot of structures here that get weatherized pretty severely.” Built Environments has provided building science, material testing and code compliance consulting for 25 years, ever since principal materials scientist Steve Doggett founded the company in Minnesota. “There are very few manufacturers that understand fully how their own materials and products work, whereas we know their shortfalls and their benefits out in the real world on jobsites,” Doggett said. “That’s why the original Built Environments was formed, to make buildings better.” He said the 15-employee company is just as comfortable on a jobsite, retrofitting a high-end beachside property, for example, as it is recreating some of the coast’s most intense weather conditions in the great indoors. The company operates an A2LA-accredited ISO/IEC 17025 mechanical testing laboratory on Wright Street. The year-old facility has expanded Built Environments’ in-house capabilities, Doggett said. “We’re able to simulate that hurricane wind (and) rain and perform structural and impact testing on wall assemblies, roof assemblies and glazing assemblies,” he said. “There are certain requirements that those windows and doors need to meet as far as wind ratings and pressure ratings and things of that nature.” Standard Glass Co.-Glass Depots, of Wilmington, is currently testing a new glazing system using Built Environments’ stress testing, the partners said. One method involves what’s called a “large missile cannon.” “We take 8-foot two-by-fours, and we shoot them at assemblies, so they have to withstand that impact,” Davis said. “It’s pretty cool to see, I’m not going to lie.” In many cases, the lab can run a full, wall-scale test of a product in a matter of weeks or months, whereas “it might take midrange manufacturers years,” Doggett said. “We’re nimble. We can cut that time in half.” The lab also develops intellectual property. Doggett, for example, shares a patent with Sustant LLC, of Minnesota, on a fastener patch to increase the air and water tightness within building envelopes. “We have too many ideas and not enough time,” he said. But the partners noted that they or their fellow principals – of which the company has four total, including a principal engineer and a principal codes and standards expert – could be anywhere on a given day, including in the courtroom providing expert testimony in contentious insurance cases. “Let’s say there is a fire on a structure,” Davis said. “We can analyze all the specific materials within that assembly – an exterior wall or something like that – because there are loads that require certain heat release. And so, we can measure each one of those materials, if need be, to say if this was likely or not a code-approved assembly.” Despite what can be inferred in a lab, the partners said nothing beats learning from how materials change over time under real-world strain. Take, for instance, the curious case of the creaking condo. “We recently had a customer that came to us trying to assess a sound issue of a roof. It was making noises that no one could explain or account for. How do you tackle something like that?” Doggett asked rhetorically. “There’s really no generally agreed-upon methodologies.” The problem turned out to be a faulty installation of a commercial roof system. “The building in this particular case was not local,” he said. “In the initial installation, the commercial roofing contractor installed the wrong fasteners in the wrong locations into the deck, and essentially the solar radiation was causing the building to move quite substantially early in the morning when the sun initially hit that assembly after a quite cool evening, causing the threads on the fasteners to kind of jump within the material, within the metal.” Built Environments designed an effective repair methodology that was within budget, the partners said. “We get the bizarre,” Doggett said. “I will say that’s something that has stayed the same over 25 years.” The partners said they are hiring, and that Cape Fear Community College is one of their main recruiting grounds. Davis and Doggett look for talented people who can understand traditional methodologies yet are open to on-the-job training and new understandings, they said. After all, it’s not just weather that can ruin a building. “My favorite saying is,” Davis said, “‘What are the eight most expensive words in construction? That’s how my daddy used to do it.’”
The Pocket Advance nearly perfects my favorite Nintendo handheld
This modernized GBA is an excellent upgrade to Nintendo’s classic handheld.
In brief: 'Reacher' spinoff gets a second season and more
We’ve got an official trailer for NBC’s Newlyweds, the new sitcom starring real-life married couple Tim Daly and Téa Leoni. The show, co-created by Jamie Lee Curtis, follows a later-in-life love story between a free-spirited woman and a professor who marry after a quick courtship. It premieres on Oct. 23 …The Reacher spinoff Neagley is getting a second season, just two weeks after the first season debuted on Prime Video. Maria Sten stars as the fan-favorite character Frances Neagley, a private investigator from Chicago and the former protégé of Jack Reacher, in the action series. The original Reacher series, starring Alan Ritchson, was picked up for a sixth season earlier this week … TNCMS.AdManager.render({region: 'fixed-big-ad-top-asset', slot: 1, fold: "above"}); Bradley Cooper is gearing up to star in Paramount’s new G.I. Joe film. He’ll be playing Duke, the leader of the Joes. Danny McBride is on board to direct. Further details on the project have not yet been revealed …Copyright © 2026, ABC Audio. All rights reserved. Thank you for reading kmaland.comAt KMA, we attempt to be accurate in our reporting. If you see a typo or mistake in a story, please contact us by emailing kmaradio@kmaland.com.
New Postseason Projections Favor Carolina Panthers
The latest postseason projections are favorable for the Carolina Panthers in terms of the NFC South.
The science behind ‘fairy rings’: Why mushrooms grow in circles
Folklore once blamed dancing fairies for rings of mushrooms appearing in fields and forests; a new Swedish study suggests fungi spread outward to escape temporarily unfavorable conditions underground
Enjoy Appalachian food favorites at the Valle Country Fair
VALLE CRUCIS — When outdoor festival season rolls around, one question inevitably comes up: “How many fair goodies shall we allow ourselves to consume?” At the Valle Country Fair, there’s
Fan Favorite Headlines Steelers Inactives vs. Browns
CLEVELAND, Ohio — Ahead of Thursday night’s road game against the Cleveland Browns, the Pittsburgh Steelers announced their inactives, headlined […]
99th Maui County Fair entertainment schedule
The 99th Maui County Fair, happening Oct. 1–4, 2026at the County’s War Memorial Complex, will bring four days of live entertainment to the main stage, featuring a mix of Hawaiian music, hula, local favorites and island contemporary performers for fairgoers of all ages.
ChatGPT can now virtually try on clothes for you
OpenAI is rolling out new shopping features for ChatGPT that let users virtually try on clothing and accessories using their own photos and save products they like to a Favorites library.
One Of My Favorite Block Pushers Is Finally Coming To Switch
Isles of Sea and Sky is a fantastic little sokoban that it's time everyone stopped sleeping on
Wild New Hulu Series Pulls Back the Curtain on a Controversial 2000s Reality Show
A nostalgic reality TV favorite is getting a candid look back, with the women at its center revisiting their experiences and what really happened behind the scenes. Get all the details here.
Gears of War: E-Day ditches faux platinum achievement in favor of Xbox Mythic
With Mythic achievements out in the wild, The Coalition has announced it is removing a faux platinum achievement from the shooter's Xbox achievement list.
Global Health & WASH: October 2026 Funding Opportunities (26 new opportunities)
41 opportunities on the Global Health & WASH page this cycle, 26 of them new. The health money on this page is mostly research money, and much of it is aimed at people early in their careers. Funder after funder, from the TANGO2 Research Foundation’s Research Pathways grants to the South African Medical Research Council’s Early Investigators Programme to the National Ataxia Foundation and Alex’s Lemonade Stand Foundation, is funding early-career investigators and the institutions that host them, with a clear tilt toward researchers based in or from the Global South, from AMBSO in Uganda to Kenya’s CONNECT-VAX network to Ersilia’s AI Incubator for African drug discovery. The money is organized by disease as much as by need: narrow foundations, the Parkinson’s Foundation, NTAP for neurofibromatosis, the RUNX1 Research Program for an inherited blood disorder, each run their own grant, so the question for an applicant is less which health problem you work on than which foundation owns your disease. The largest European cheques go to consortia only, with the European Innovation Council putting up to EUR €4 million behind a single healthy-ageing project and UNITE up to EUR €1 million behind each cross-border digital health team. Water sits apart, almost entirely in applied utility research: the Water Research Foundation’s cluster of USD $250,000 to $500,000 projects, each built around a utility problem from sewer laterals to reuse treatment. And the biggest single pot is public: HRSA is renewing community health center service areas with awards of up to USD $10 million each. This post is for paid subscribers. This helps support the time and effort it takes to curate and organize these opportunities. Subscribe To keep this accessible to everyone who needs it, we’re happy to offer pay what you can rates. You can find more details here. Open Opportunities 2027 Building the Field of Health Advocacy Grant, Georgia Health Initiative. *New!* *Closing soon!* Georgia Health Initiative, a nonprofit private foundation focused on health equity, is opening its 2027 Building the Field of Health Advocacy Grant to strengthen the organizations that push for healthier systems across the state. The Initiative treats advocacy as infrastructure, backing one-year projects that range from urgent responses to shifting federal policy to longer arc campaigns on housing, behavioral health, care access, and food security. It wants coalitions that elevate community voice, apply an equity lens, and arrive ready to deploy concrete strategies, and it deliberately seeks variety in issues, communities, and organizational size. The optional webinar and required lobbying training signal a funder investing in a durable field, not one grant cycle. The strongest fits are Georgia nonprofits and public agencies ready to turn advocacy readiness into systems change. Geographies: United States. Who can apply: Tax-exempt 501(c)(3) public charities, state or local government agencies, or coalitions/collaboratives using a 501(c)(3) fiscal sponsor, that work in Georgia on behalf of Georgians and align with the mission, vision, and values of Georgia Health Initiative. Only one application per organization, though an organization may be listed as a partner or subcontractor on multiple applications. Funding amount: Organizations can apply for up to USD $80,000 per project; the Initiative anticipates investing a total of USD $1.36 million. Targeted Sectors / SDGs: Governance, Policy & Advocacy · SDG3; SDG10. Deadline: October 2, 2026. Learn more and apply here. TDD Research Pathways Grant, TANGO2 Research Foundation. *New!* *Closing soon!* The TANGO2 Research Foundation, working with a founding gift from Tango2UK, is opening its TDD Research Pathways Grant to fund early-career investigators anywhere in the world who study TANGO2 Deficiency Disorder. The foundation is using this money to seed pilot work and to build a research community around a rare disorder that few labs currently study. It wants to back emerging scientists, clinicians, and trainees who will stay with this field, not one-off projects, which is why it requires a committed mentor and real institutional support and asks each applicant for a plan for future contributions. The design rewards promise and persistence over track record. The strongest fits are students, residents, postdoctoral fellows, and new investigators ready to commit to TANGO2 research. Geographies: Global. Who can apply: Early-career investigators worldwide, including undergraduate, graduate, and medical trainees, postdoctoral fellows, residents, and clinical or research fellows. Early-career investigators must hold a PhD, MD, or equivalent doctoral degree and be within 10 years of that degree or within 5 years of initiating rare disease research, engaged in postdoctoral research at an academic institution, teaching hospital, or nonprofit research institute. Currently enrolled trainees and transitional PhD candidates beginning a postdoctoral appointment at a nonprofit institution by July 1, 2026 are also eligible. All applicants must identify a qualified mentor with relevant TDD or rare disease research experience and demonstrate institutional support. Funding amount: Up to USD $15,000. Targeted Sectors / SDGs: Innovation, Science & Technology. Deadline: October 2, 2026. Learn more and apply here. Call for Expression of Interest (EOI): AMBSO Impact Research Initiative, Africa Medical and Behavioral Sciences Organization (AMBSO). *Closing soon!* The Africa Medical and Behavioral Sciences Organization is inviting expressions of interest for its Impact Research Initiative, which funds early-stage pilot studies and proof of concept work on priority health challenges. AMBSO is a Ugandan research organization backing bold ideas that can grow into larger studies, and its tracks span antimicrobial resistance, epidemic preparedness, artificial intelligence for diagnostics, HIV prevention, climate and health, cancer, maternal and child health, and non-communicable diseases. The small award size and direct-cost-only rule point to a funder that wants evidence rather than overhead, and that favors projects able to attract follow-on money or use AMBSO’s own research infrastructure. Eligibility runs worldwide, welcoming researchers and institutions inside and outside Africa. The strongest fits are researchers with a feasible pilot that generates policy-ready evidence. Geographies: Global. Who can apply: Open worldwide to researchers, academic institutions, and research organizations whose work aligns with generating high-impact health evidence. Independent researchers are eligible if affiliated with an academic or research institution. Doctoral students are encouraged to apply as part of a research team led by a faculty Principal Investigator. Community-based organizations and other eligible entities may apply. Projects may be implemented inside or outside Uganda. Funding amount: Up to USD $10,000 per project, with no minimum funding threshold. Targeted Sectors / SDGs: SDG3. Deadline: October 2, 2026. Learn more and apply here. Entrepreneurs for Resilience 2027 (E4R27), Swiss Re Foundation. *Closing soon!* Swiss Re Foundation is opening the tenth edition of Entrepreneurs for Resilience, which backs healthcare social enterprises expanding affordable, quality primary care for low-income communities across low- and middle-income countries. The Foundation is using catalytic, blended funding plus multi-year advisory to take risk out of scaling, helping proven models reach more people sustainably rather than stay stuck at pilot size. It looks to back brick-and-click enterprises that pair physical care with digital tools and build affordability through savings, payments, or microinsurance, ideally integrated with public health systems. Requiring earned revenue, real customer scale, and gender-inclusive teams signals that this is growth capital for commercially serious ventures, not seed money. The strongest fits are established, revenue-generating healthcare enterprises ready to scale access for underserved populations. Geographies: Global. Who can apply: For-profit and hybrid healthcare social enterprises serving low-income and underserved populations in low- and middle-income countries, using combined physical and digital (brick-and-click) healthcare delivery models. Applicants must demonstrate measurable social impact, generate at least 50% of income through earned revenue, have been established no later than December 2023, already serve at least 50,000 people with potential to scale, and have at least 30% low-income customers. Preference for gender-inclusive enterprises with at least one female founder or at least 30% women in management. Funding amount: Pilot funding of up to USD $45,000 for the 6-8 shortlisted social enterprises; up to USD $1 million in blended funding (up to USD $600,000 unconditional plus up to USD $400,000 conditional) shared among 3-4 finalists over a two-year implementation period; total programme funding approximately USD $1.3 million. Targeted Sectors / SDGs: Innovation, Science & Technology · SDG3; SDG5. Deadline: October 4, 2026. Learn more and apply here. Horizon HealthTech 2026, IIITD Innovation & Incubation Center. *Closing soon!* IIITD Innovation and Incubation Center is opening Horizon HealthTech 2026, a nine-month MedTech incubation cohort run under the aegis of BIRAC EDGE for founders building medical devices, diagnostics, surgical and interventional tools, or remote monitoring. The center is backing teams that already hold a validated proof of concept and want to reach a tested prototype, pairing each founder with a named expert and clinical validation through a hospital partner. What they seek to back is Indian health technology that can survive real clinical scrutiny and regulatory review, not slideware. The structure, with lab access, CDSCO guidance, IP support, and investor connects, signals a program built to make startups ready for follow-on capital. The strongest fits are early-stage MedTech teams with defensible IP and a working path from bench to bedside. Geographies: India. Who can apply: Early-stage teams/startups with a validated idea/proof of concept (TRL 3 onwards) working on medical devices, diagnostics, surgical/interventional technologies, or remote monitoring, holding IP or with potential to generate IP. Funding amount: No cash award amount is stated on the official program page. Benefits are in-kind: prototyping lab and equipment access, clinical/hospital validation (Max Healthcare), expert mentorship, CDSCO regulatory guidance, IP filing support, workspace, cloud credits and tools, and investor connects. Run under the aegis of BIRAC EDGE and builds a path to follow-on Government/VC/Angel funding. Targeted Sectors / SDGs: Innovation, Science & Technology · SDG3; SDG9. Deadline: October 5, 2026. Learn more and apply here. OpenAI AI and Teen Development Research Grant Program, OpenAI. *New!* *Closing soon!* OpenAI is opening its AI and Teen Development Research Grant Program to fund independent studies of how generative AI shapes the lives of young people ages 13 to 17. OpenAI wants a stronger evidence base on how teens actually use these tools and what that use does to their social and emotional development, so that product teams, policymakers, and regulators can act on findings rather than assumptions. It seeks work on emotion regulation, relationships, belonging, and the safeguards that keep teens safer, welcoming interdisciplinary teams and any methodology. That it will fund research whose conclusions may not favor AI providers, and prioritizes studies touching ChatGPT, signals a genuine appetite for credible outside scrutiny. The strongest fits are research groups grounded in adolescent development, well-being, and AI safety. Geographies: Global. Who can apply: Researchers aged 18 or older who are affiliated with a research institution or organization, and/or have significant experience relevant to child or adolescent development, well-being, human-computer interaction, AI impacts, or a closely related field. Multiple institutions may collaborate. OpenAI is seeking to fund research rather than for-profit initiatives and will not prioritize for-profit organizations. Funding amount: Individual research grants up to USD $1 million, totaling up to USD $5 million; maximum 10% of each grant for overhead or indirect costs. Targeted Sectors / SDGs: Social Inclusion & Community Wellbeing; Innovation, Science & Technology. Deadline: October 6, 2026. Learn more and apply here.
Hometown’s Best: Nominate your favorite local live music, entertainment, or sports venue in Southwest Virginia
What’s your favorite local live music, entertainment, or sports venue in Southwest Virginia?
Hometown’s Best: Nominate your favorite local live music, entertainment, or sports venue in Southwest Virginia
What’s your favorite local live music, entertainment, or sports venue in Southwest Virginia?
Hometown’s Best: Nominate your favorite place to watch sports in 2026
What’s your favorite place to watch sports in Southwest Virginia?
Picanha, prices and politics: What Brazil's favorite steak says about the election
Lula promised Brazilians four years ago they'd be able to afford picanha again. Now, as he seeks another term, the price of the country's favorite cut of beef is telling a different story.
Picanha, prices and politics: What Brazil's favorite steak says about the election
Lula promised Brazilians four years ago they'd be able to afford picanha again. Now, as he seeks another term, the price of the country's favorite cut of beef is telling a different story.
Trump loses favor with crypto fans who call him out for cashing in
The president’s 2024 campaign leaned into crypto to attract young men, a demographic that is deserting Republicans in the midterms.
Netflix's 11 best new movies and shows in October, including Halloween favorites
Florence Pugh's "East of Eden" and Ben Affleck's "Animals" lead a month packed with new releases and horror classics.
Politics, Religion Experts Argue in Favor of Creativity Amid AI Employment Anxieties
Panelists looked to Catholic social teachings on how to find dignity and purpose in work amid the rise of AI in the workplace
Takeaways from CNN’s California governor debate
Xavier Becerra, the Democratic favorite in California’s race for governor, sought to tie his Republican opponent Steve Hilton to the policies of President Donald Trump as the two debated Wednesday night on CNN.
AI safety measures widely backed by most Americans, poll finds
WASHINGTON — A vast majority of Americans favor requiring artificial intelligence companies to meet independent safety benchmarks for their models, even if those standards mean slowing development of the technology,
Looking at the Ugly Side of the Paramount-Skydance Merger...And How I’d Fix It
A Message from Our Sponsor Certified Fresh with 100% on Rotten Tomatoes, FX’s Adults is an ensemble comedy series about a group of twenty-somethings in New York leaning on each other to navigate love, work, friendship and family. Don’t sleep on “The Sitcom of the Moment” - Awards Buzz All Episodes now streaming on Hulu on Disney+. Watch The Teaser Trailer... (Welcome to the Entertainment Strategy Guy, a newsletter on the entertainment industr(Welcome to the “Most Important Story of the Week”, my bi-weekly strategy column analyzing the most important (but often not buzziest) news story of the last two weeks. I’m the Entertainment Strategy Guy, a former streaming executive who now analyzes business strategy in the entertainment industry. Please subscribe.) Before we dive in, I wanted to congratulate Broadcast Now for being the first to report that Netflix’s How to Get to Heaven from Belfast has been cancelled. (I saw this in a write-up by Kasey Moore of Whats-On-Netflix.) More importantly, I wanted to note that, as of yesterday, none of the other trades had reported the news yet. I have half a guess that eventually one of them will report this. Anyways, it’s time to take a break from my deluge of streaming ratings reports to continue my analysis of the Paramount Skydance Warner Bros. Discovery (PSWbD) saga. As I noted last week, a lot of times when folks use the (sometimes cliched) “the good, the bad and the ugly” framing for an article, “the ugly” section is just more bad. Or very, very bad. In this case, yeah, I do think it’s ugly. In more than one way. Unfortunately, we’re only going to have time to tackle one of those ways today: the ugly pile of debt to finance this deal. (In a future article, I may cover the entire process for how it went down, which was very, very ugly.) Last issue, I explained why I liked this deal in a vacuum. Unfortunately, “vacuums” don’t exist outside of space. Let’s dive in. Subscribe Most Important Story of the Week - The Ugliness of the Paramount/Warner Bros. Merger More than one person sent me a note speculating that the big problem with Paramount Skydance buying Warner Bros. Discovery is the “Warner Bros.” portion of the deal. In fact, that’s a take I read a lot about Warner Bros., ever since they caught Netflix’s, and then Paramount-Skydance’s, eye. In short, multiple companies (Time, AOL, AT&T, Discovery) have bought and then regretted buying Warner Bros. Since it’s nearing Halloween, you could almost say it’s like the folks think WB is cursed! It’s a haunted studio—like the town of Derry in movie studio form—and whoever takes possession of it will fall into misery! Yet...I just don’t like that story, because it doesn’t explain the “why” behind why those deals fell through. Especially when Warner Bros. has continued to succeed as a TV and film studio in the intervening two decades. Lord of the Rings? Harry Potter? Game of Thrones? Everything HBO? Considering it never fully owned a broadcast TV channel, this media company has done pretty well. So what went wrong? Well, in recent years, companies bought Warner Bros. instead of the other, smarter option. Explaining POCD (And Applying It to Mergers & Acquisitions) As I explained last issue, one of my favorite frameworks is the POCD tool for evaluating venture capital investments: People Opportunity Context Deal The bar to invest as a VC is high. (Or I might say “was” since cheap interest rates made life easier last decade.) You review a thousand prospectuses, get pitched by a hundred, and invest in the ten best, with the hopes that one of those ten would pay for the rest. That means every element of a deal needed to pay off: you needed the right people running the companies, who could capitalize on the right opportunity, in the context of an industry that was ripe for disruption. If you could then not overpay, you could make some money in a smart deal. The analogy isn’t perfect here, but close enough. For a merger or acquisition to work, you need the combined company (which is the opportunity) to make more than the price you need to pay (which is the deal). Note: the people and context still matter, but with M&A, it’s a little more straightforward: does the opportunity exceed the cost? And usually with Warner Bros., it hasn’t. If you want to find out the single biggest mistake made by the Warner Bros. suitors over the last few years (and my simple fix) become a paid subscriber. I’ll also touch on who I think Paramount-Skydance could (shockingly) consider buying next, TBD, and more. Sign up here.
Favorite European cities to visit, from American living in Europe
As an American living in the Netherlands, I love traveling around Europe. Some of my favorite European cities to visit include Budapest and Bath.
iOS 27.2 adds new Messages feature that’s already a favorite
iOS 27.2 is coming soon with several new features for iPhone users, including a Messages addition: Suggestions.
Comic Fans Flock to Ninth Annual IV Entertainment Convention
Heroes and villains came to life at the ninth annual Imperial Valley Entertainment Convention, as attendees got the chance to meet artists and voice actors and have fun dressing up like their favorite fictional characters.
Fed's favored inflation gauge cooled in August but remained elevated
The Commerce Department reported that PCE inflation remained elevated in August at a level well above the Federal Reserve's 2% target.
Nearly half of Americans favor candidates who support trans sports bans
As more candidates campaign on restricting trans athletes, The 19th and YouGov asked whether that makes a difference to voters.
How to Listen to Your Favorite Music, Online or Off the Grid
Streaming services can introduce you to a wonderland of nearly unlimited audio, but downloading your digital collection has advantages.
The 11 best new Netflix shows and movies in October, including Halloween favorites
Florence Pugh's "East of Eden" and Ben Affleck's "Animals" lead a month packed with new releases and horror classics.
NBC Curbs One of Fans’ Biggest MLB Playoffs Issues
Boston Red Sox and New York Yankees fans will hear friendly TV voices call their team’s Wild-Card matchup this week. In the playoffs, that’s not always the case. Year after year, MLB followers grumble about losing the local announcing booths they’ve spent their summers with in favor of national voices brought in for postseason action. …
Indie rock band Dream Syndicate to debut at Codfish Hollow
The Dream Syndicate, the critically acclaimed indie rock band fronted by singer-songwriter Steve Wynn, makes its Codfish Hollow debut Friday in Maquoketa. Wynn considers Codfish Hollow his favorite American venue.
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SCOTUS rules in Trump's favor, allowing an expanded online screening tool to purge some voters
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Dawg Sports on the Radio
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Did your favorite local Starbucks just close? These 36 SoCal locations are likely shuttered
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Seattle Mariners Manager Dan Wilson Out After Failed Season
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Misiorowski Guides Brewers to 103rd Win in Regular Season Finale
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Protect College Sports Act favors universities over players
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Intel Panther Lake Teardown, 18A, BSPD, GAAFET, SemiAnalysis STEEL
Panther Lake debuts the first commercial implementation of backside power delivery (BSPDN), introduces Intel’s first iteration of gate-all-around (GAA) transistors, and showcases their advanced packaging capabilities with its Foveros-S assembly. With Panther Lake, Intel’s manufacturing arc has shifted from nebulous roadmaps to shipped silicon, a significant milestone on their long road back to competitive semiconductor manufacturing. To evaluate the extent of Intel’s comeback, we tore down Panther Lake. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Our teardown traces 18A from its four-sheet RibbonFETs (Intel’s marketing name for GAAFETs) and gate stacks through contacts, frontside and backside wiring, and the bonded carrier. We explain how these material and integration choices improve gate control and reduce resistance, while adding capacitance, thermal resistance, and process complexity. Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. However, 18A does not lead TSMC N3P, N2 or Samsung SF2 in peak density. Panther Lake’s CPU cores are incremental updates, and the high-end GPU still uses TSMC N3E. Panther Lake assembles one compute tile, one GPU tile, and one I/O tile atop a passive base tile using Intel’s Foveros-S advanced packaging. Both compute tile variants use Intel 18A. The Xe3 GPU options are a 4-core GT1 tile on Intel 3 and a larger 12-core GT2 tile on TSMC N3E. Both I/O tile variants use TSMC N6. [1], [2] Our analysis centers on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery (BSPD) moves the main power network behind the transistor layer, to the backside, separating it from frontside signal routing. We covered BSPD and its impacts in 2024. [3], [4], [5] Intel’s BSPD implementation, branded as “PowerVia”, routes power through dedicated backside metals to nano-TSVs, which connect those rails to local source/drain (S/D) contacts. Implementing that separation requires Intel to build the interconnect stacks from both sides of the wafer. The frontside comprises the M0-M14 signal stack, while the backside comprises the BM0-BM5 power stack. M0 and BM0 are closest to the transistors. The nano-TSVs connect the two sides, but Intel patterns and etches each via from the front after forming the contacts. A narrow via runs from the side of the contact deep into the silicon substrate. Intel then completes the frontside signal metal stack, bonds the wafer to a carrier, flips it and removes the original substrate until the buried via tips are exposed. The backside metal stack is then deposited directly on the revealed vias. The nano-TSV and backside-via profiles taper in opposite directions because Intel forms them from opposite sides of the wafer. The transistor structures form the FEOL. Local contacts and nano-TSVs connect them to the wiring. M0 begins the frontside interconnect stack. The silicon carrier remains attached above the frontside interconnects. It supports the device wafer during substrate removal and backside processing and remains part of the finished chip’s thermal path. PowerVia removes the main power distribution from the congested frontside metals, routing supply through shorter and wider backside wires. Its lateral landing still occupies area in the standard cell, so it recovers less cell area than a direct backside contact. [3] Nano-TSVs beside the logic devices carry VDD or VSS from the backside power network, while signal connections continue upward through the frontside metals. Backside Interconnects Samsung SF2 data is included for comparison to Panther Lake’s within this article. SF2 is the incumbent GAA foundry node but lacks BSPD, serving as a useful reference to evaluate 18A. A full teardown of Samsung’s S26 products, processed on SF2, will be shared soon.Nanosheet-cut EDS comparison. The PowerVia supply path runs from the backside Cu rails through Mo-lined W nano-TSVs to the local transistor contacts. In this cross section, the tapered connection spans roughly 150 nm from the contact level to BM0. The Ta liner confines Cu and promotes adhesion to the surrounding stack; the AlOₓ etch stop controls the next dielectric etch above the rail. Dielectric beneath the ribbons electrically separates the devices from the backside wiring and removes the conducting silicon body below the channel. [6] AlOₓ serves as an etchstop (ES), enabling endpointing and protecting the underlying layers. Low-volatility aluminum fluoride reaction products resist the fluorinated plasma, allowing a thin AlOₓ film to protect the metal while the surrounding low-k dielectric is removed. [6], [7]. While the BM0 and layers above the M1 lines show double AlOx layers, Our SMIC N+3 teardown showed single AlOₓ layers. SMIC uses a simpler local AlOₓ substack, while the remaining cap and etch sequence provide the required landing protection. So why double layers? The closely spaced AlOₓ doublets provide two protected endpoints in the etch sequence. Intel documents an AlOₓ/SiN/AlOₓ stack that explains the benefit. The main dielectric plasma etch stops on the first AlOₓ film; a selective wet clear opens that film; a second plasma etch removes the intermediate SiN and stops on the second AlOₓ film. The final wet clear exposes the metal landing surface. SiN is the intermediate dielectric in Intel’s published example. [8] The second stop protects the metal through a cap breakthrough. Wide openings can etch faster than narrow ones, and etch depth varies across the wafer. Metal under an early-clearing opening would otherwise be exposed while other openings still need more etching. Staged protection widens the process window and reduces metal erosion, corrosion and void formation. [8] TSMC documents AlN/AlOₓ/SiOC/AlOₓ above Cu, with AlN blocking Cu diffusion, and a simpler AlN/SiOC/AlOₓ variant that omits one AlOx film. [9] Levels with different opening sizes, aspect ratios, pattern densities and cap materials need different etch margins. A double AlOx stop is useful where another protected endpoint justifies the added processing. The extra film adds formation, selective opening and cleaning steps, plus another set of interfaces to control adhesion, moisture, and stress. These blanket films are opened through the existing via pattern, so each film does not require another lithography mask. AlOₓ adds parasitic capacitance when it replaces lower-k dielectric; two thin AlOₓ films can nevertheless contain less AlOₓ than one thick film. Total thickness, placement, and theintermediate dielectric determine the electrical cost. Deposition chemistry also changes AlOx permittivity and residual hydroxyl content, which can oxidize the underlying metal. [7], [8], [10], [11] The backside stack separates into relatively fine BM0-BM2 wiring near the devices and coarser BM3-BM5 power distribution. The largest pitch increase occurs between BM2 and BM3. BM0’s pitch closely matches the logic-row height, fitting local power delivery to the cell rows. Higher levels aggregate current through larger conductors: routing density becomes less important than low resistance and current capacity as the network approaches the package. This hierarchy provides wide power wiring for the power delivery network without consuming scarce frontside signal-routing resources. [3] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Frontside Interconnects Intel 18A combines Mo-lined W contacts and nano-TSVs with a separate backside Cu power network. Samsung SF2 keeps power on the frontside, using Ti-based contact interfaces and Ta-based barriers and Co liners around Cu wiring. In 18A standard-cell rows, backside power rails supply the devices through nano-TSVs within the cells, freeing frontside routing resources. Samsung’s M0 accommodates both power and signal connections. From the device toward M0, the connection runs through a Ti-based S/D interface, W contact fill, a Mo-lined W via, and the Cu M0 wire. Mo supplies a conductive nucleation and adhesion layer for W, replacing the resistive TiN liner used in conventional W integration. This increases the effective conduction volume within the feature while retaining W fill and its established polishing, cleaning and etching processes. Intel’s Mo/W patent describes this integration tradeoff. The nano-TSV uses the same Mo-lined W construction in the backside supply path. [12] The move from TiN to Mo is an incremental change. While a full Co or Mo fill can also reduce the volume lost to liners in very small features, it requires new integration schemes that increase complexity and risk. Cu remains attractive for wider wires due to its low resistance. As wires and vias shrink, the diffusion barrier consumes an increasing fraction of their cross-section. [12], [12], [14] Intel uses Co/Ru liners at M0-M1, Co at M2-M4, and Nb at M5-M9. The lower-level liners help Cu adhere and reduce void formation during trench fills. Applied Materials’ Endura has new thermal control that facilitate wetting process, so the thin film continuity is good enough that good capillary pressure will drive Cu atoms to the via bottom without voiding. Intel’s choice to use Nb is particularly interesting. Intel’s Nb patent describes a conductive diffusion barrier intended to reduce the barrier’s contribution to resistance relative to conventional Ta-based barriers, particularly at via bottoms where all current crosses the barrier. The patent pairs Nb in coarser levels with the option of lower-cost PVD processing. [15], [16] The upper metal layers support thicker barriers formed through physical vapor deposition (PVD) despite its worse coverage and uniformity. Meanwhile, the lower metal layers require thinner barriers deposited through conformal atomic layer deposition (ALD). Co/Ru adds another material interface and requires controlled deposition and Cu fill. Changing liners and barriers by metal layer allows Intel to optimize interconnect resistance, process complexity, and reliability. [15, 16] RibbonFET, Intel’s name for its gate-all-around FETs (GAAFETs), replaces the FinFET’s vertical fins with four stacked horizontal silicon nanosheets, allowing the gate to surround the channel on every side. The path to GAAFET begins with the planar transistor. A planar MOSFET places the gate above the channel between its source and drain. Pairing an NMOS with a PMOS transistor creates a CMOS inverter, in which the NMOS pulls the output low for a high input, and the PMOS pulls it high for a low input. The gate must retain electrostatic control of the channel to ensure clean switching. As gate lengths shrank, the drain began to compete with the gate for that control, increasing off-state leakage. Electrostatic control was restored through an architectural evolution that raised the channel into a vertical fin and wrapping the gate around three sides. Called “FinFET”, this new architecture packed more effective channel width into a smaller footprint. Further scaling made it harder to maintain both drive current and leakage within smaller cells, and reintroduced the same problems planar MOSFETs faced. Nanosheet GAAFETs close the fourth side by replacing the vertical fin with a stack of horizontal nanosheets, each surrounded by the gate. The tighter electrostatic control suppresses leakage at shorter gate lengths while stacking adds effective channel width within the cell footprint. In a FinFET process, channel width changes in discrete steps as designers must add or remove whole fins. Nanosheet width can instead be adjusted continuously within the process’s design rules. Wider sheets increase drive current, while narrower sheets reduce capacitance at the cost of drive current. Intel 18A uses stacks of four nanosheets each and varies their widths across logic and SRAM. At the process level, adding more sheets to each stack increases effective channel width and drive current, but complicates fabrication. RibbonFET vs MBCFET Samsung began GAAFET production in 2022 with SF3E, following with SF3 and now SF2. Its ‘MBCFET’ provides a useful structural comparison with Intel’s first RibbonFET implementation. [17] STEEL is digging deeper into SF2, used in the Exynos 2600, and TSMC’s GAAFET N2, used in Apple’s A20 Pro, in upcoming newsletter articles. We’re throwing some teasers on X. Let’s compare Samsung SF2’s MBCFET with Intel 18A’s RibbonFET. Subscribe Even to the untrained eye, Intel’s extra nanosheet is obvious. Intel stacks four ribbons to Samsung’s three. Samsung’s sheets are much wider in these fields, so both sheet count and width matter to the available channel perimeter. Sheet width also changes which silicon surfaces carry current. On conventional (001) silicon, wide nanosheets emphasize the broad top and bottom surfaces, favoring electron transport; the larger sidewall contribution in a narrow sheet favors hole transport. Thinner sheets improve gate control but increase confinement and scattering. This makes width and thickness part of the NMOS/PMOS balance, alongside strain and threshold voltage. [18], [19] GAAFET designs like 18A use different work-function-metal (WFM) stacks for NMOS and PMOS. Around each ribbon, a thin SiOx interfacial layer separates the silicon channel from the HfOx high-k dielectric, with La providing dipole tuning and the WFM wrapping the dielectric. NMOS uses a TiAl-based stack, while PMOS uses TiN WFM. W fills the remaining gate trench, providing a lower-resistivity path where the work-function layers are no longer needed. In this field, the PMOS stacks leave room for W between ribbons, while the NMOS stacks occupy more of those gaps. A silicon-based dielectric marks the P/N boundary, allowing the PMOS and NMOS gates, sharing the same gate trench, to be processed sequentially. Fast logic paths, retention circuits, and SRAM need a family of threshold options. Changing threshold without substantially changing device dimensions, capacitance or fabrication complexity is valuable. FinFET processes typically use different work-function-metal stacks. In a four-ribbon GAA stack, the narrow sheet-to-sheet gap limits how much WFM can fit around each channel. La in the gate dielectric creates interfacial dipoles at the SiOx/HfOx boundary, shifting effective work function and tuning threshold voltage. This gives Intel another control alongside its NMOS and PMOS WFM stacks. Low-threshold devices improve critical-path drive; higher thresholds reduce leakage elsewhere. Dipole tuning is especially useful in GAA because it changes threshold without consuming the narrow intersheet gap with thicker WFM. Precise control of La incorporation, diffusion and interface quality has long been a challenge, limiting viability in high volume production but is now seen from every leading-edge foundry. Intel’s patent describes depositing a dipole-forming oxide above HfOx and annealing it toward the interfacial oxide before completing the work-function and fill metals. This separates threshold tuning from the space available for metal. Newer research addresses the thermal cost: imec’s 2026 dipole-middle research inserts the shifter between two HfOx depositions, shortening the diffusion path while protecting SiOx during patterning. [20], [21]Matched-cut EDS, Intel 18A (left) vs. Samsung SF2 (right). Intel retains raised source/drain epi beneath its contacts, while Samsung recesses W deep into the epi to form a V-shaped Ti-lined interface. The deeper contact increases metal-to-semiconductor area and shortens the current path from the lower sheets, reducing contact and spreading resistance. It also removes epi volume and brings the contact etch closer to the channel ends. Retaining more epi preserves the material available for strain transfer, especially from SiGe into PMOS. These geometries balance contact access against stress engineering and etch margin. [22], [23] Samsung stacks three sheets to Intel’s four ribbons, and both processes use sheet width to tune drive strength. In our Samsung cross-sections, widths range roughly from 19 to 30 nm in the NPU rows and 37 to 50 nm in the CU cell. The Samsung nanosheets taper, with the widest sheet at the bottom and the narrowest at the top. Both processes use HfOx gate dielectric and Ti-based work-function stacks, with Al in the NMOS stack. In the Samsung devices shown here, the dielectric and WFM occupy the intersheet gaps, leaving W above the top sheet. Intel’s PMOS stack leaves more room between ribbons, and W fills those gaps while the thicker NMOS stack leaves W mainly in the upper trench. Gate-stack EDS maps. The W between Intel’s PMOS ribbons provides a conductive path close to the lower gates. Where WFM fills the entire gap, the gate still surrounds the channel, but voltage reaches it through the more resistive work-function films. Thinner WFM and dipole tuning preserve room for low-resistivity fill; Mo and Ru are alternative fill metals being developed for further scaling. [24] A masked, sequential WFM flow explains the different gate heights and inter-nanosheet fill. The proposed sequence below shows how separate NMOS and PMOS work-function steps produce that geometry. Enabled by the BSPDN process, Intel replaces the dense-logic silicon subfin with dielectric, removing the parasitic conduction path below the ribbons and reducing substrate-related capacitance. A retained silicon body as in classical, non-SOI, planar and FinFET designs needs junction and punchthrough-stop engineering to suppress leakage. Dielectric isolation makes that leakage less sensitive to the subfin doping profile but adds removal and fill steps. It also weakens the direct thermal path through silicon, making the contacts, metal stacks and package more important for heat extraction. [24], [26] Fluorine is concentrated around selected Intel device structures in the maps. WF6 is a standard precursor for W nucleation and fill, while barrier films protect adjacent dielectrics from fluorine attack. Low-fluorine W processes reduce the residual-F burden. Chloride-based precursors avoid introducing F during W deposition, but require control of chlorine attack, nucleation and fill quality. The integration target is a continuous, low-resistance W path with a thin protective liner and minimal chemical damage to the surrounding stack. [20], [27], [28] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. We measured cell height, gate pitch, metal geometry, and ribbon dimensions at the XTEM sites shown below. The tables group these dimensions by site and device polarity. Our “sheet cuts” cross the silicon channel and show the ribbons end-on. “gate cuts” run along the channel through successive gates. The 18A logic cell dimensions point to a five-track logic library while the N3E and Intel 3 cell dimensions evidence a seven-track logic library. The DDR-PHY uses wider M0 wires and much larger spacing than core logic. That trades routing density for lower wire resistance and weaker coupling between neighboring nets. The geometry suits the current delivery and coupling requirements of analog, clock, and I/O circuitry. PowerVia lets 18A combine a compact cell height with wider M0 geometry by moving the main power rails off the signal-routing tracks. That relaxes local wire scaling while preserving a small cell footprint. Cell height and gate pitch set the geometric density; pin access and routability determine how much of it a real block can use. [29] The biggest takeaway from our gate-pitch measurements is that Intel 18A compute logic and TSMC N3E GPU logic have similar density in the Bohr representative-cell model. The 18A example is 18.6% denser than the Intel 3 GPU example. Gate pitches are nearly identical across the three sites, so cell height drives most of the difference. The Bohr model combines a four-transistor NAND2 spanning three gate pitches and a 32-transistor scan flip-flop (SFF) spanning nineteen pitches, weighting their densities 60:40. The sensitivity column shows how independently changing cell height and gate pitch by ±1 nm changes the result. This compares representative cell geometries; whole-die density also depends on cell mix and placement. The 18A P-core gives M0 substantially more metal cross section than the N3E vector engine. Treating each profile as a trapezoid gives 2.63 times the area per line and 1.84 times the area after normalization by routing pitch. The larger section reduces the geometric contribution to line resistance and lowers current density for a given current. Taller and wider wires also add capacitance, so circuit delay depends on the balance of resistance and capacitance. The DDR-PHY has less metal area per routing width than the 18A core fields, while remaining above N3E. [30] Area = height × (top CD + bottom CD) / 2, including liners. Area/pitch normalizes by routing width. Taper is the symmetric sidewall angle from vertical, with the largest angle belonging to the DDR-PHY. Compute tile The measurements show how ribbon dimensions and gate-stack geometry vary across the compute tile and between NMOS and PMOS to balance channel drive, gate load and the space needed for the dielectric/WFM stack across logic, SRAM and the DDR-PHY. Width mainly changes available channel perimeter; thickness also changes electrostatic control and carrier confinement. Gate-stack thickness then determines the space left for low-resistivity fill P-core and LP E-core logic Both the P-core and LP E-core use multiple nanosheet widths. Widths are measured on high-magnification XTEMs while wider-field images demonstrate additional width choices within the LP E-core. Multiple widths are expected even within an LP E-core. Timing-critical paths, buffers and cells with different fanout need different drive strengths. The lower-magnification fields show this width diversity beyond the sites quantified in the table. L2 and L3 SRAM GAA gives SRAM designers another way to balance the pull-up (PU), pass-gate (PG), and pull-down (PD) transistors. FinFET bitcells set device strength through fin count while GAA adds nanosheet width as a sizing knob. In a 6T SRAM cell, a strong pull-down relative to the pass-gate limits read disturbance, while a strong pass-gate relative to the pull-up improves writability. During a write, the pass-gate and write driver pull the node storing “1” below the inverter trip point. During a read, the pull-down holds the node storing “0” low. Bias, threshold voltage, mismatch and assist circuitry set the remaining margin. FinFET high-current cells commonly use a PU:PG:PD fin-count pattern of 1:2:2, a device-sizing ratio rather than a current ratio. Ribbon width lets Intel balance SRAM strengths without adding whole fins. The L2 cell uses its narrowest ribbons for PU and widest for PD, improving writability and read stability respectively. Intel’s disclosed HCC operates without assist; its denser HDC uses negative-bitline write assist. Pulling the selected bitline briefly below ground increases pass-gate overdrive so it can overpower the pull-up at lower supply voltage. That buys density and low voltage writability at the cost of boosting circuitry, switching energy, and additional voltage stress that must be controlled. [31], [32] Four rectangular ribbons give the perimeter = 8 × (width + thickness), before corner rounding. PG/PU is 1.49 and PD/PG is 1.16. The L3 structures closely resemble L2 in layout and cell height. Fewer L3 nanosheet widths are tabulated because fewer high-magnification images were available. DDR PHY The DDR-PHY trades density for controlled analog behavior and reliable off-chip signaling. It contains drivers, receivers, delay circuits, and calibration logic that set drive strength, sampling time, and voltage margin. Repeated four-sheet devices with similar widths fit the use of regular transistor units for matching and programmable drive. Its wider local wiring provides room for current delivery and separation of sensitive signals, while consuming more area than a dense core-logic grid. The layout serves the memory channel’s electrical requirements as well as digital logic density. [33] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Intel 3 GPU devices Vector engine logic Intel 3’s XVE logic uses two-fin PMOS and NMOS devices with power rails in M0. Its cell height and M0 pitch give a seven-track geometry, two tracks more than the 18A logic. One-fin groups also appear among the two-fin devices. Intel 3 L2 SRAM The Intel 3 L2 SRAM uses the familiar HCC sizing pattern: one PU fin, two PG fins, and two PD fins. N3E GPU devices Vector engine logic The N3E XVE field contains repeated two-fin devices with seven-track cell geometry. N3E remains a FinFET process, giving Panther Lake a direct FinFET-to-RibbonFET comparison. N3E L2 SRAM The N3E L2 SRAM uses the same PU:PG:PD fin-count pattern of 1:2:2. Panther Lake-U follows Lunar Lake’s floorplan quite closely. Both pair 4 P-cores with 4 LP E-cores and NPU, media and display engines in similar locations. Lunar Lake also uses Xe2, the direct predecessor to Panther Lake’s Xe3 GPU. This makes Lunar Lake the most direct basis for our comparisons. Arrow Lake differs in core count and uses the older Xe-LPG GPU architecture, so we only use it where it offers a more direct component-level comparison. Compute tile Panther Lake compute-tile floorplans remain sparse even months after launch. Intel 18A’s backside metal and dielectric stack must be removed without damaging the underlying structures before a clean transistor-level floorplan can be imaged. Most published die shots hide or heavily process the background, but we are quite proud of the die shot we achieved and are excited to show the work we have done. We measured the areas of the key components on the compute tile and compared them with their Lunar Lake predecessors on TSMC N3B. These help us to capture changes in block area and compare the two chips across process nodes and designs. Our total tile areas exclude the scribe-line area. The compute-plus-GPU subtotal below uses the PTL-U compute tile and GT1 GPU; it excludes the I/O tile and passive base. Individual block areas use the boundaries marked on the floorplans The compute-plus-GPU row is recomputed from the displayed PTL-U and GT1 areas. Component rows use their stated per-region counts and are not an additive partition of the whole tile. The P-core area remains almost unchanged between Lunar Lake and Panther Lake, despite L2 capacity increasing from 2.5 MiB to 3 MiB. Arrow Lake uses the same Lion Cove core as Lunar Lake but also has a 3 MiB L2. Cougar Cove fits 20% more L2 into the same P-core area. The larger private cache keeps more of each core’s working set close to its execution units, reducing access to shared L3 and DRAM. Extra capacity adds storage leakage and lookup energy, so designers balance it against avoided lower-level accesses. The shared P-core L3 cache also shrank by 14.8%. [2] Cougar Cove combines a similar footprint with Intel’s reported power-efficiency improvements. RibbonFET’s tighter channel control reduces leakage, while PowerVia reduces supply droop and allows tighter voltage guardbands. [1] Darkmont’s four-core LP E-core cluster is 5.0% smaller than Skymont’s on Lunar Lake, with most of the reduction in its L2 regions. The 1 MiB region shrank by 8.4% and the 1.5 MiB region by 14.9%. The tag arrays also use one fewer visible row. Tags identify which memory addresses the data array holds, so rearranging them changes the cache’s layout and wiring without requiring less data capacity. [2] The LP E-cores share one L2. This pools capacity and avoids duplicating all the cache machinery, but the four cores contend for its banks and bandwidth. Their separate cluster also keeps light work away from the performance cluster and its L3, allowing that larger domain to sleep. [1], [2] Cache area includes more than the storage cells. Tags identify each line, decoders select rows, sense amplifiers read the small bitline signal, and wires connect to the banks. Splitting an array into smaller sections shortens wordlines and bitlines, improving access speed, but duplicates peripheral circuits. Panther Lake’s smaller cache regions therefore reflect the complete memory implementation, including how much of each region is devoted to storage. [34] Unlike Meteor Lake and Arrow Lake, Panther Lake has no separate SoC tile. The NPU, LP E-cores, memory controllers, PHYs, media and display engines now share the compute tile. This removes an active die and keeps CPU memory traffic on one die. The cost is moving PHY and I/O-related circuitry onto 18A: drivers, receivers and analog circuits must still meet external voltage, loading and signal-integrity requirements, so their area does not shrink like dense digital logic. [1], [2] The biggest shrink comes from the NPU, which occupies 36.9% less area. NPU 5 consolidates the same total INT8 MAC count into half as many neural compute engines. Each of the three NCEs has a larger MAC array to make the complete NCE envelope 22.6% larger than an NPU 4 engine. Consolidation also halves the number of scratchpads and SHAVE DSPs, from 12 to 6. The MAC array handles matrix multiplication and convolution, while SHAVE executes vector and custom operations that fit the array poorly. [1], [2], [35] The paired floorplans identify each NCE envelope and its scratchpad, MAC, and SHAVE regions. Each measured MAC polygon is counted once per NCE in the area accounting below. The scratchpads store weights, activations, and intermediate results near the MAC arrays, allowing repeated use without fetching them again from DRAM. Halving their number delivers the largest measured area saving but leaves less local storage for the same total MAC count. Layers that no longer fit locally require smaller working tiles or more transfers of intermediate data. The benefit depends on keeping the enlarged arrays busy while managing that tighter storage budget. [36] NPU 5 also adds native FP8. Using half the operand width of FP16 reduces storage and transfer demand, helping workloads fit the smaller local memory budget. Lower precision and format-dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile with 4 Xe3 cores on Intel 3 and a larger GT2 tile with 12 Xe3 cores on TSMC N3E. Panther Lake allows us to compare the same GPU architecture across both Intel 3 and TSMC N3E. Wildcat Lake adds a third Xe3 implementation on Intel 18A. A future newsletter will detail Xe3 and its implementation differences across all three process nodes. GT2 scales Xe3 to a different physical layout, with render slices arranged vertically instead of GT1’s horizontal arrangement. Slice placement sets the distances to shared cache banks and the D2D interface. Those wires consume area and add delay, so scaling the number of Xe cores also requires a new balance of cache placement, routing and timing. [1] What’s immediately obvious is that the GT2 tile on TSMC N3E has much smaller Xe cores than GT1. These block areas include logic, caches, and routing. An Xe core on the GT1 tile is ~69% larger than one on Lunar Lake, and ~55% larger than one on GT2. Intel 3 therefore uses substantially more area per Xe core. The block-area gap exceeds the measured logic and SRAM density gaps, bringing routing, timing targets, cell mix, and floorplan allocation into the comparison. The measured vector/matrix engine region is almost unchanged between Lunar Lake and Panther Lake’s GT2 tile. Xe3 retains eight 512-bit vector engines and eight 2048-bit XMX engines per core. Its gains also come from feeding those engines more effectively: more resident threads hide stalls, and variable register allocation lets shaders trade registers per thread against the number of threads kept active. [1] The shared L1/SLM capacity increased by 33% from 192 KiB to 256 KiB, while its area increased only 5%, raising effective density by 27%. L1 retains reused cache lines, while software-managed SLM lets a thread group share data locally. Both reduce traffic to more distant memory. Allocating more SLM per group can also limit how many groups reside on a core at once. [1], [37] The GT1 tile carries 4 MiB of L2 against 16 MiB on the GT2 tile. GT1 divides its L2 cache into four 1 MiB banks, while GT2 uses eight 2 MiB banks. Each bank contains 128 macros, but each N3E macro stores 16 KiB, twice the Intel 3 macro’s 8 KiB capacity. The N3E macro is only 54% larger while holding twice as many bits, giving it 30% higher density: ~23.7 Mbit/mm² versus 18.3 Mbit/mm². Including bank-level circuitry, the gap widens to ~16.9 Mbit/mm² on GT2 versus ~10.4 Mbit/mm² on GT1. GT2 gains density with its macros storing more bits per unit area, and those macros occupy more of each cache bank. Larger macros spread decoder and sense-amplifier overhead across more storage, while a more compact bank layout reduces the share spent on control and routing. The compromise is longer wordlines and bitlines that carry more capacitance. [34] I/O tile Panther Lake uses two I/O tile variants, both fabricated on TSMC N6. The smaller one provides 4 PCIe 5.0 and 8 PCIe 4.0 lanes and serves lower-tier systems as well as those without a discrete GPU, while the larger one adds 8 PCIe 5.0 lanes, bringing the total to 20 lanes, for discrete-GPU connectivity. Panther Lake SKUs with the larger 10- or 12-Xe GPUs use the smaller I/O tile. [38] The smaller I/O tile adds a PCIe 4.0 block and a Thunderbolt block to Lunar Lake’s I/O layout, providing four additional PCIe 4.0 lanes and another Thunderbolt 4 port. Its repeated N6 blocks retain nearly identical areas and layouts. Reusing these proven PHYs and controllers avoids porting and requalifying external interfaces on 18A, where faster digital logic offers less benefit to circuits constrained by the off-chip link. [38] SemiAnalysis’s teardown lab (STEEL) dives deep into the world’s advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. We’re hiring technical experts from system to transistor and everywhere in between. Check out our Careers page. Panther Lake offers scalability and modularity through its disaggregated packaging that partition compute, GPU, and I/O silicon into separate tiles allowing for a suite of tile configurations. This partitioning makes the package part of Intel’s node economics as it determines how much leading-edge wafer area each product consumes, which functions can remain on other processes, and how much configuration freedom Intel can offer from a shared set of tiles. Furthermore, fabricating the compute and GPU tiles separately confines the new 18A process to the compute tile and allows graphics and I/O to use other, more established, and more cost-effective processes. For Panther Lake, the GPU and I/O tiles are assembled alongside the compute tile on a passive silicon base using Foveros-S. Intel’s current technology brief lists a nominal 36 µm pitch for Foveros-S. Through-silicon vias (TSVs) in the base connect the fine wiring above to the larger package connections below. The functional tiles sit side by side on that passive base in a 2.5D configuration. [39] Our cross-section through the compute and GPU tiles shows the package’s wiring hierarchy. Microbumps connect each active tile to the passive silicon base; its fine redistribution layer (RDL) carries the short, dense tile-to-tile links. TSVs carry connections through the base to the package substrate, which fans them out to the much coarser motherboard solder joints. The base supplies interconnect, while computation remains in the active tiles above it. [39] At the compute-tile edge, the higher-magnification inset shows a local microbump spacing of approximately 25.24 µm and a feature width of 12.33 µm. These local spacings are finer than Intel’s nominal Foveros-S value. The X-ray fields further confirm tighter neighboring bumps, consistent across every die-to-die area found on each tile. Additional X-ray analysis is offered after the paywall. Putting the memory controller beside the CPU removes the D2D transfer that CPU memory requests required in Meteor Lake and Arrow Lake. This avoids the extra transmitter, receiver, and link traversal, saving interface energy and latency. Panther Lake’s separate GPU still crosses a D2D link to reach DRAM, so its larger local caches also help contain package traffic. [1], [40] Smaller dies are less likely to contain a random fatal defect, and screening them before assembly prevents one bad tile from consuming a complete package of good silicon. Reuse also spreads design and qualification work across more products. Against those gains, Intel pays for the passive base, D2D circuits, extra bonding and test steps, and losses during assembly. Cost per working product across the portfolio captures the combined effect of wafer yield, reuse, test, and assembly. [29] Wildcat Lake packaging Intel launched Core Series 3, formerly Wildcat Lake, on 16 April 2026 for value mobile and edge systems. Wildcat Lake keeps 18A but removes the passive base and combines more functions on one die to simplify the package. The two products therefore reveal two distinct ways to commercialize the same leading-edge process. [41] Wildcat Lake’s 18A die combines up to two Cougar Cove P-cores, four Darkmont LP E-cores, two Xe3 cores and a smaller NPU. A separate platform-controller die supplies I/O, connected through UCIe, Intel’s first processor implementation of the standard. Consolidating graphics remove a tile boundary and the passive base, reducing assembly complexity for a modest-bandwidth value product. It also ties CPU and graphics scaling to the same die, giving up Panther Lake’s ability to swap in a much larger GPU. [42], [43] In July 2021, Intel CEO Pat Gelsinger set out an ambitious process roadmap aimed at regaining performance leadership by 2025, later described as five nodes in four years. Five years and one CEO later, Intel’s comeback story is not as unambiguously positive as Pat may have hoped. [44], [45] Intel once set the pace for process technology, bringing high-k metal gate technology and FinFETs into volume production years ahead of the rest of the industry. Its 22 nm FinFET process reached consumers with Ivy Bridge in 2012. [46] Intel’s integrated device manufacturing (IDM) model allowed its architects and process engineers to co-optimize products and processes. Starting with Sandy Bridge, Intel dominated x86, while AMD struggled with Bulldozer. That lead faltered at 14 nm and broke at 10 nm. Intel targeted a massive 2.7× density increase, but the node arrived years late and required several revisions before it could support Intel’s full lineup. This delay forced Intel to stretch 14 nm across six generations, while TSMC moved ahead in process technology and AMD recovered in x86. By 2019, Intel was still shipping 14 nm across most of its product stack, with its 10 nm client ramp focused on Ice Lake mobile processors. Meanwhile, TSMC was shipping N7 and N7+, and AMD’s Zen 2 compute chiplets used N7 to raise core counts and improve efficiency. Intel’s process failures were central to its decline, but unsound business decisions furthered their downward slide. Product delays compounded product mistakes, pushing client, server, and FPGA roadmaps off schedule. Several attempts to enter AI (Nervana and Gaudi) and networking (Tofino) also failed to establish lasting businesses. Intel’s recovery has focused on consumer CPUs and advanced packaging. Tiger Lake, Alder Lake, Lunar Lake and now Panther Lake have restored Intel’s consumer roadmap. On the process side, Intel 4 shipped with Meteor Lake, Intel 3 with Granite Rapids and Sierra Forest, and Intel 18A with Panther Lake. Intel has also made advanced packaging part of its foundry offering. However, Intel is still playing catch-up in servers. Several Xeon generations arrived years late and trailed contemporary AMD and Arm server CPUs in performance, efficiency, and core count. The process roadmap is back, but Intel does not hold the same process-technology leadership position it held prior to 10 nm. The introduction of gate-all-around nanosheets and backside power delivery are two of the biggest changes to transistor integration in a decade. Intel took on both changes at once: 18A paired its first RibbonFET with PowerVia in Panther Lake. Panther Lake is a substantial manufacturing milestone. Our cross-sections show how RibbonFET and PowerVia reshape local contacts and wiring, while the floorplans show where architectural consolidation and process choices save area. A sustained competitive lead depends on product performance, cost, yield, and the next implementation. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page.. [1] Intel, “Intel Tech Tour 2025 Panther Lake recap,” Doc. 866361, 2025. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/866361/ITT_2025_Panther_Lake_Recap1.pdf [2] Intel, “Core Ultra processors Series 3 datasheet, volume 1,” Doc. 872188-001, Jan. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/872188/872188-001.pdf [3] N. Horiguchi and E. Beyne, “Backside power delivery: How to power chips from the backside,” imec Reading Room, Nov. 25, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://www.imec-int.com/en/articles/how-power-chips-backside [4] W. Hafez et al., “Intel PowerVia technology: Backside power delivery for high density and high-performance computing,” in Proc. IEEE Symp. VLSI Technol. Circuits, Kyoto, Japan, Jun. 2023, pp. 1–2, doi: 10.23919/vlsitechnologyandcir57934.2023.10185208. [5] K. Fischer et al., “Intel 18A platform technology featuring RibbonFET (GAA) and PowerVia for advanced high-performance computing,” in Proc. Symp. VLSI Technol. Circuits, Kyoto, Japan, Jun. 2025, pp. 1–3, doi: 10.23919/vlsitechnologyandcir65189.2025.11075006. [6] K.-F. Cheng, C.-L. Teng, H.-Y. Huang, and H.-C. Chen, “Metal oxide composite as etch stop layer,” U.S. Patent 12 176 247 B2, Dec. 24, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US12176247B2/en [7] S. W. King, “Dielectric barrier, etch stop, and metal capping materials for state of the art and beyond metal interconnects,” ECS J. Solid State Sci. Technol., vol. 4, no. 1, pp. N3029–N3047, 2015, doi: 10.1149/2.0051501jss. [8] A. V. Mule’, D. J. Towner, D. Seghete, C. R. Ryder, and A. A. Gonzalez, “Multi-layer etch stop layers for advanced integrated circuit structure fabrication,” U.S. Patent Appl. 20220102343 A1, Mar. 31, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20220102343A1/en [9] C.-C. Wang and J. H. Wang, “Interconnect structure with dielectric cap layer and etch stop layer stack,” U.S. Patent Appl. 20230253247 A1, Aug. 10, 2023. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20230253247A1/en [10] Y. J. Wu, K.-F. Cheng, C.-C. Lee, H.-K. Chang, and H.-Y. Huang, “Etch stop layer for interconnect structures,” U.S. Patent Appl. 20240332070 A1, Oct. 3, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20240332070A1/en [11] M. G. Rainville, N. Shankar, K. S. Reddy, and D. M. Hausmann, “Deposition of aluminum oxide etch stop layers,” U.S. Patent Appl. 20180197770 A1, Jul. 12, 2018. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.justia.com/patent/20180197770 [12] J. S. Leib et al., “Conductive lines having molybdenum liner and tungsten fill for advanced integrated circuit structure fabrication,” U.S. Patent Appl. 20240429126 A1, Dec. 26, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.justia.com/patent/20240429126 [13] M. Naik, “Cobalt enables power and performance scaling at single-digit logic nodes,” Applied Materials, Dec. 17, 2018. Accessed: Sep. 14, 2026. [Online]. Available: https://www.appliedmaterials.com/us/en/blog/blog-posts/cobalt-enables-power-and-performance-scaling-at-single-digit-logic-nodes.html [14] Lam Research, “Breaking through AI’s invisible barrier with molybdenum,” Lam Research Newsroom, May 6, 2025. Accessed: Sep. 14, 2026. [Online]. Available: https://newsroom.lamresearch.com/molybdenum-metallization-ai-revolution [15] P. Yashar, G. Malyavanatham, and H. Vijwani, “Integrated circuit interconnect structures with niobium barrier materials,” U.S. Patent Appl. 20240112951 A1, Apr. 4, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20240112951A1/en [16] Applied Materials, “Applied Materials unveils chip wiring innovations for more energy-efficient computing,” Applied Materials Investor Relations, Jul. 8, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-unveils-chip-wiring-innovations-more-energy [17] Samsung, “Samsung showcases AI-era vision and latest foundry technologies at SFF 2024,” Samsung Semiconductor, Jun. 13, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://semiconductor.samsung.com/news-events/news/samsung-showcases-ai-era-vision-and-latest-foundry-technologies-at-sff-2024/ [18] C. W. Yeung et al., “Channel geometry impact and narrow sheet effect of stacked nanosheet,” in Proc. IEEE Int. Electron Devices Meeting (IEDM), Dec. 2018, pp. 28.6.1–28.6.4, doi: 10.1109/iedm.2018.8614608. [19] S. Mochizuki et al., “Evaluation of (110) versus (001) channel orientation for improved nFET/pFET device performance trade-off in gate-all-around nanosheet technology,” in Proc. Int. Electron Devices Meeting (IEDM), Dec. 2023, pp. 1–4, doi: 10.1109/iedm45741.2023.10413854. [20] D. G. Ouellette et al., “Fabrication of gate-all-around integrated circuit structures having molybdenum nitride metal gates and gate dielectrics with a dipole layer,” U.S. Patent 12 051 698 B2, Jul. 30, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US12051698B2/en [21] imec, “Advancing the CFET-based device roadmap with novel integration modules and standard-cell architectures,” imec, 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.imec-int.com/en/articles/advancing-cfet-based-device-roadmap-novel-integration-modules-and-standard-cell [22] A. Reznicek, X. Miao, C. Lee, and J. Zhang, “Wrap around contact for nanosheet source drain epitaxy,” U.S. Patent 11 302 813 B2, Apr. 12, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US11302813B2/en [23] J. A. Kittl, J. G. Hong, D. R. Palle, and M. S. Rodder, “Methods for varied strain on nano-scale field effect transistor devices,” U.S. Patent 9 978 833 B2, May 22, 2018. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US9978833B2/en [24] S. Gandikota et al., “Method of reducing metal gate resistance for next generation NMOS device application,” Int. Patent Appl. WO 2024/137272 A1, Jun. 27, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/WO2024137272A1/en [25] J. Zhang et al., “Full bottom dielectric isolation to enable stacked nanosheet transistor for low power and high performance applications,” in Proc. IEEE Int. Electron Devices Meeting (IEDM), Dec. 2019, pp. 11.6.1–11.6.4, doi: 10.1109/iedm19573.2019.8993490. [26] C. Yoo, J. Chang, Y. Seon, H. Kim, and J. Jeon, “Analysis of self-heating effects in multi-nanosheet FET considering bottom isolation and package options,” IEEE Trans. Electron Devices, vol. 69, no. 3, pp. 1524–1531, Mar. 2022, doi: 10.1109/ted.2022.3141327. [27] S. S. Pradhan, D. B. Bergstrom, J.-S. Chun, and J. Chiu, “Tungsten gates for non-planar transistors,” European Patent Appl. EP 3 506 367 A1, Jul. 3, 2019. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/EP3506367A1/en [28] L. Schloss and X. Ba, “Tungsten films having low fluorine content,” U.S. Patent 9 754 824 B2, Sep. 5, 2017. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US9754824B2/en [29] Intel Foundry, “Accelerating AI and HPC with advanced process and packaging technologies,” Doc. 367370-001US, Jun. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/dam/www/central-libraries/us/en/documents/2025-11/intel-foundry-hpc-ai-brief.pdf [30] M. Lofrano, X. Chang, H. Oprins, and Z. Tokei, “Mitigating the thermal bottleneck in advanced interconnects,” imec, Sep. 28, 2023. Accessed: Sep. 14, 2026. [Online]. Available: https://www.imec-int.com/en/articles/mitigating-thermal-bottleneck-advanced-interconnects [31] S. Bair, “Intel at ISSCC 2025: Navid Shahriari invited talk, eight papers, forums, panelist & product details,” Intel Community, Feb. 19, 2025. Accessed: Sep. 14, 2026. [Online]. Available: https://community.intel.com/t5/Blogs/Tech-Innovation/Edge-5G/Intel-at-ISSCC-2025-Navid-Shahriari-Invited-Talk-Eight-Papers/post/1667592 [32] D. Chandra, E. Potladhurthi, D. R. S. Reddy, and K. S. Rengarajan, “Tunable negative bitline write assist and boost attenuation circuit,” U.S. Patent Appl. 20160203857 A1, Jul. 14, 2016. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20160203857A1/en [33] Synopsys, “Advantages of firmware-based training in high-speed DDR IP,” Synopsys IP Technical Bulletin. Accessed: Sep. 14, 2026. [Online]. Available: https://www.synopsys.com/articles/firmware-based-training-ddr-ip.html [34] N. Muralimanohar, R. Balasubramonian, and N. P. Jouppi, “CACTI 6.0: A tool to understand large caches,” Hewlett-Packard Laboratories, 2009. Accessed: Sep. 14, 2026. [Online]. Available: https://users.cs.utah.edu/~rajeev/cacti6/cacti6-tr.pdf [35] Intel, “Intel Tech Tour 2024 Lunar Lake AI hardware accelerators,” Doc. 824436, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/824436/2024_Intel_Tech%20Tour%20TW_Lunar%20Lake%20AI%20Hardware%20Accelerators.pdf [36] Y.-H. Chen, J. Emer, and V. Sze, “Eyeriss: A spatial architecture for energy-efficient dataflow for convolutional neural networks,” in Proc. 43rd ACM/IEEE Annu. Int. Symp. Comput. Archit. (ISCA), Jun. 2016, pp. 367–379, doi: 10.1109/isca.2016.40. [37] Intel, “Introduction to the Xe-HPG architecture,” Doc. 758306, Nov. 4, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/www/us/en/developer/articles/technical/introduction-to-the-xe-hpg-architecture.html [38] Intel, “Core Ultra processors Series 3 for the edge,” Doc. 855291. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/855291/Intel%C2%AE%20Core%E2%84%A2%20Ultra%20Processors%20Series%203%20for%20Edge%20Overview_2.pdf [39] Intel Foundry, “Foveros technology brief,” Doc. 366411-001US, Feb. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/dam/www/central-libraries/us/en/documents/2025-07/foveros-25d-product-brief.pdf [40] D. Das Sharma, “UCIe: Building an open chiplet ecosystem,” UCIe Consortium, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://www.uciexpress.org/_files/ugd/0c1418_c5970a68ab214ffc97fab16d11581449.pdf [41] Intel, “Intel launches Intel Core Series 3 processors,” Intel Newsroom, Apr. 16, 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/www/us/en/newsroom/news/client-computing/intel-launches-intel-core-series-3-processors-changing-the-game-for-everyday-computing.html [42] Intel, “Core Series 3 launch press deck,” Apr. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://download.intel.com/newsroom/2026/Intel-Core-Series-3/Intel-Core-Series-3-Launch-Press-Deck.pdf [43] Intel, “Intel outlines architectures for agentic AI at Hot Chips 2026,” Intel Newsroom, Aug. 24, 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/www/us/en/newsroom/news/client-computing/intel-outlines-architectures-for-agentic-ai-at-hot-chips-2026.html [44] Intel, “Intel accelerates process and packaging innovations,” Intel Investor Relations, Jul. 26, 2021. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intc.com/filings-reports/all-sec-filings/content/0001193125-21-224438/d199788dex991.htm [45] Intel, “Intel reports third-quarter 2021 financial results,” Intel Investor Relations, Oct. 21, 2021. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intc.com/news-events/press-releases/detail/1505/intel-reports-third-quarter-2021-financial-results [46] Intel, “3rd generation Intel Core processors bring exciting new experiences and fun to the PC,” Intel Investor Relations, Apr. 23, 2012. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intc.com/news-events/press-releases/detail/577/3rd-generation-intel-core-processors-bring-exciting
My favorite Pixel 11 Pro feature is something no other Android phone can match
It's been about 3 years since Google revamped Face Unlock on Pixel phones, and the Pixel 11 Pro reminded me just how magical it is.
The Cask of Amontillado
Edgar Allen Poe was a master of the horror genre, and one of my favorite short stories of his is “The Cask of Amontillado.” The story, which takes place in
New Business: Lithermans Limited Brewery adds pinball; NH Doughnuts coming to Londonderry
A brewery in Concord has a new offering for those of all ages: pinball machines. For those 21-plus, the machines are equipped with cup holders for a pint of favorites
Judge temporarily blocks Boone Health from interfering with PulsePoint Cardiovascular
A Boone County judge granted a temporary restraining order Wednesday in favor of PulsePoint Cardiovascular amid an ongoing legal dispute with Boone Health.
White House has not acted on RFK Jr.’s push for proof ultra-processed foods are safe
A draft letter obtained by The Post shows Kennedy’s favorable response to a petition that food experts said could lead to significant changes for the industry.
For third time, Supreme Court rejects Missouri's bid for another GOP-leaning House district
The GOP wanted to redraw a district in Kansas City that had elected a Black Democrat. Six of the state's eight congressional districts favor Republicans.
Supreme Court blocks Missouri congressional map favoring GOP for third time
The ruling ends a complicated legal fight that has injected uncertainty into November’s midterm elections in the state.
Key City to host science and beer fusion night
Key City to host science and beer fusion night at Science on Tap. Enjoy engaging discussions with experts while savoring your favorite brews
Tulsa Health Department's Food Safety Measures Protect More than One Million People at the Tulsa State Fair
TULSA, OKLA.– [September 25, 2026] – The Tulsa Health Department (THD) is preparing to protect the health of more than one million attendees at the Tulsa State Fair, ensuring fairgoers can enjoy their favorite foods without fear of contracting a foodborne illness. With more than 200 food booths to inspect, THD’s dedicated team is working […]
My Top 3 Lions Touchdown Bets Against the Jets
The Lions’ offense has already produced plenty of touchdowns, and I’m going back to the well. Here are my three favorite anytime TD bets for Detroit’s matchup with the Jets.
Judge temporarily blocks Boone Health from interfering with PulsePoint Cardiovascular
A Boone County judge granted a temporary restraining order Wednesday in favor of PulsePoint Cardiovascular amid an ongoing legal dispute with Boone Health.
“Big Brother ”host Julie Chen Moonves weighs in on Devens, Drew, and Taylor’s finale chances (exclusive)
The Chenbot also gives her America’s Favorite Houseguest prediction.
Julie Chen Moonves weighs in on Devens, Drew, and Taylor’s ‘Big Brother’ finale chances
Big Brother host Julie Chen Moonves weighs in on Devens, Drew, and Taylor’s finale chances and predicts who she thinks will win America’s Favorite Houseguest.
Jaguars expect a favorable response against the Patriots
Trevor Lawrence and the Jacksonville Jaguars are counting on one thing following their worst offensive performance in 11 months: a favorable response against New England.
Grizzlies' Most Realistic 2026-27 Outcome Could Be Ideal
The Grizzlies may hover around the Western Conference play-in race in 2026-27, an outcome that could balance development with favorable lottery positioning.
Texas A&M Week 4 expert picks for matchup vs. LSU
Experts favor LSU as Texas A&M heads to Baton Rouge looking to rebound from its loss to Kentucky and get a steadier performance from Marcel Reed.
Taylor Swift releases 'The Life of a Showgirl: The Encore' with 4 new songs after Swifties try to decode her mysterious zeros
Our favorite pop star has dropped new music, including the single "Patient Zero."
Donny Osmond keeps the music going with Vegas residency extension
Donny Osmond is staying in Las Vegas a little longer. The entertainer has extended his Harrah's residency through June of next year and says it's "probably my favorite show I've ever done."
Donny Osmond keeps the music going with Vegas residency extension
Donny Osmond is staying in Las Vegas a little longer. The entertainer has extended his Harrah's residency through June of next year and says it's "probably my favorite show I've ever done."
Debating Just How Disappointing Phoenix Suns' Last Era Was
From championship favorites to a first-round sweep, Phoenix’s star-studded experiment backfired spectacularly. High costs and chemistry issues now cement this era as a historic cautionary tale.
Nick Robinson talks new film ‘Charlie Harper,’ favorite romantic movies
Seattle actor Nick Robinson shares how his new film, "Charlie Harper" (out Thursday) was impacted by the Netflix Western series "The Abandons."
Collins leads Jackson in new Maine poll
On the favorability front, 49% said they have a very or somewhat unfavorable opinion of Democrat Troy Jackson, with 41% saying very or somewhat favorable.
Nintendo Wins $4.5M In Switch Pirate Lawsuit
The court entered a default judgement in favor of Nintendo
Former South Jersey transit official enters plea deal in political revenge case
Bryan Bush pleaded guilty to obstruction in relation to a case where payment was denied to a contractor who had allegedly fallen out of favor with George E. Norcross III.
Columbia, Maryland ranks as No. 1 city for women due to good job, health outcomes
Columbia, Maryland has been ranked the No. 1 city in the nation for women due to its favorable conditions for good job prospects and positive health outcomes, according to a new survey released by the financial website WalletHub.
Aidan Hutchinson Is a Defensive Player of the Year Favorite
Aidan Hutchinson has forced his way into a national award race two weeks into the season. #Lions