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Did bucket-list trip for partner's 50th birthday, including a safari
To celebrate my partner's 50th birthday, I planned a bucket-list trip around the world that included our first African safari and wildlife sightings.
Colorado Commission prioritizes feelings over science
The Colorado Parks and Wildlife Commission voted Thursday and prioritized feelings over science-based management. Meanwhile, Rancher X is the beneficiary of those feelings-driven decisions. Well played, governor. The newest appointees to the CPW Commission are...
A Week of Smoky Skies Across North America
Brown carbon, emitted by wildland fires and tracked over the span of a week in July 2026, worsened air quality in parts of the U.S. and Canada.
The CPW Commission’s act of courage
By Eric Washburn Winston Churchill once said: “Courage is rightly esteemed the first of human qualities because, as has been said, it is the quality which guarantees all others.” Until this year, Colorado Parks & Wildlife has allowed hunters to kill as many so-called furbearers, including beavers, foxes and pine martens, as they liked, with […]
Business, boaters, and wildlife hit by Erewash Canal closures
Part of the canal shut at the end of June due to low water levels, and remains closed.
Shaky political "science": breakdown of the peer review process
[This article is the latest in our “Shaky Political Science” series. In our 38 page report, “Shaky political ‘science’ misses mark on ranked choice voting,” released in December 2025, we examined over 40 studies focused on ranked choice voting (RCV). Many of these studies suffered from puzzling research methodologies, poorly constructed surveys, unrealistic simulated elections, cherry picked data and faulty analyses that often were contradicted by results from real-world elections (a link to our full paper is here). Here are links to the first four articles in our series: the first one summarizing the overall results of our report; the second one analyzed a study co-authored by University of Minnesota academic Larry Jacobs, which was one of the most error-prone of all the research we reviewed in our report; a third article showing an admirable example of two political scientists holding two other political scientists accountable for their flawed, sloppy research; and a fourth article that analyzed seven studies sponsored by New America’s political reform program that deployed flawed methodology based on “simulated” elections instead of real-world elections, which when combined with some basic misunderstandings of RCV, produced odd and misleading results]. In this fifth article in our “Shaky Political Science” series, we examine two flawed studies on the impact of RCV on voter turnout authored by San Francisco State University professor Jason McDaniel. McDaniel’s research in these two papers stands out for its puzzling methodology, inadequate and cherry-picked data, and faulty analyses that not only misunderstands ranked choice voting but reflects a basic misunderstanding of politics in general. The first of the McDaniel studies actually passed through a peer review process and then was subsequently published by the Journal of Urban Affairs, despite its obvious errors. It is perplexing that a jury of peer political scientists did not catch the errors and send it back to McDaniel for a rewrite or outright rejection. This calls into question the credibility of the peer review process itself. The peer review process is supposed to represent the intellectual pinnacle of the profession – a way for academics to certify the quality of each other’s work, and to act as a check against sloppy research. In the case of the McDaniel study, the peer review process failed. Yet his flawed study has been cited dozens of times by other political scientists in their own flawed works — an unvirtuous circle of academic research. Here is the first Jason McDaniel study that we analyzed: “Writing the Rules to Rank the Candidates: Examining the Impact of Instant-Runoff Voting on Racial Group Turnout in San Francisco Mayoral Elections,” by Jason McDaniel, 2016, Journal of Urban Affairs. This study covered San Francisco’s use of ranked choice voting (RCV) in mayoral elections, purporting to show that RCV reduces voter turnout overall, increases voter errors, and has a negative impact on “marginal populations,” i.e. racial minorities, mainly as the result of the alleged complexity of RCV asking voters to rank candidates and having to be familiar with multiple candidates and related dynamics. McDaniel reached these conclusions by examining five San Francisco mayoral elections taking place in odd years (i.e. where there are no federal or state races on the ballot) from 1995 to 2011, comparing three earlier non-RCV races (in 1995, 1999 and 2003) with the later two RCV races (in 2007 and 2011). Only two RCV races were studied, and as McDaniel acknowledged, only the contest in 2011 was “competitive” (that contest in 2007 was the first mayoral election using RCV, and incumbent mayor Gavin Newsom won easily in the first round of counting, earning 74% of first choices and far ahead of the second place candidate who had just 6.3% of first choices). Yet even the allegedly competitive contest in 2011was won by an incumbent with a landslide margin of nearly 20 points. No other elections were studied by McDaniel, even though San Francisco elects 17 other offices besides mayor with RCV, including the 11 seats on the Board of Supervisors (the name for the city council) in even years, and six other citywide offices in odd years. Previous academic research has found that competitive elections can stimulate greater voter involvement and higher turnout. For unexplained reasons, this study ignored at least 34 other RCV races between the years 2004 to 2011, many of which were very competitive and had high voter turnout. Instead, McDaniel’s analysis based its conclusions on data from only a single, marginally-competitive mayor’s race using RCV. These 2007 and 2011 mayoral elections were the only two RCV elections that McDaniel used as the sole basis for his small data set to determine the impact of RCV on voter turnout. Despite having no meaningful data to inform his study, McDaniel nonetheless concluded that RCV lowered turnout when compared to the previous three mayoral non-RCV elections using two-round runoffs. Then, using the same inadequate database of San Francisco elections, McDaniel also found that “Instant-runoff voting is associated with a significant decline in Black voter turnout and White voter turnout…On average, Black voter turnout decreases by 18 points and White voter turnout decreases by 16 points …” But how could he credibly arrive at that conclusion when his study was based on voter turnout in two RCV contests that were not even remotely competitive? Beyond that, McDaniel tacitly admits that the key determining factor driving Black voter turnout was not RCV vs non-RCV elections, but the presence of a viable Black candidate. McDaniel wrote, “Black voter turnout was about 17 percentage points higher for the two elections that featured an African American candidate compared to the three elections that did not” — but one of those three elections did not use RCV. The same dynamic was present for White voter turnout, in which higher turnout was not correlated with RCV vs non-RCV elections, but the presence of a viable White candidate. Beyond that, McDaniel’s voter turnout results, whether correlated with the race of the candidates or RCV vs non-RCV elections, showed no clear patterns. In his Figure 1, he shows low Asian voter turnout in the non-RCV elections in 1999 and 2003 when there was no viable Asian candidate running, but in the 2007 mayoral election using RCV, there is still no viable Asian candidate, yet Asian turnout increases dramatically. For Latinos, voter turnout is virtually the same in 1999 (no viable Latino candidate, non-RCV elections), 2003 (leading Latino candidate, non-RCV elections), 2007 (no viable Latino candidate, RCV elections) and 2011 (leading Latino candidate, RCV elections). Meanwhile White voter turnout increased dramatically from a low in the 2007 mayoral election, in which the leading candidate was a white incumbent, to the 2011 election in which there were no leading white candidates that finished any higher than sixth place with 5.6% of the vote. Clearly other factors were determining voter turnout than either the race of the candidates or RCV vs non-RCV elections. Despite these inconsistent findings, McDaniel boldly marches forth to render conclusions about the impact of RCV on different groups of racial voters, even though his conclusions are not remotely supported by his data. This looks like the worst kind of “data cherry picking” to cover up a puzzling conclusion based on a poor data set involving only two RCV elections, neither of which were remotely competitive. McDaniel’s cherry picking didn’t stop there. In calculating voter turnout for the three non-RCV mayoral elections in 1995, 1999 and 2003, he failed to mention that in each of these years there was a two-round runoff election, with a first round election in November in which no candidate garnered a winning majority of the vote, followed by the decisive runoff in December. So there were two non-RCV elections in each election year. But McDaniel only decided to include one of the two elections in his data set, apparently the December runoff in each year (which had higher turnout in two out of the three mayor’s races, and lower turnout in the third). So he ignored the November 1995 election, the November 1999 election when turnout was only 45 percent, and the November 2003 election when turnout was only 45.7 percent. This is flawed methodology based on blatant cherry picking, since McDaniel simply omitted three elections worth of data that did not fit within his frame. His study should never have made it through a peer review process, and it is an embarrassment to political science that not only was it approved for publication, but it has been uncritically cited by dozens of other political scientists. Share A “study” without wider context or credible data Lacking a data set that included even a single competitive RCV mayoral race, McDaniel declared that RCV lowered voter turnout in 2011, when turnout was 42.5 percent. But he also ignored -- or did not realize -- that voter turnout in mayoral elections during 2011 had sharply declined in all big cities, including far more steeply in nearby Los Angeles and other cities. In fact, San Francisco’s election in 2011 had the second highest turnout of any mayoral election in the nation’s 22 largest cities from 2008-2011. Was 2011 just a particularly low turnout year all across the country, perhaps because the country was still reeling from the aftermath of the housing market collapse in 2008-2010? McDaniel ignored this factor and did not search for alternative explanations beyond his flawed thesis. Furthermore, while McDaniel suggested that RCV leads to more “overvotes” – which is an invalidated ballot in which a voter, in either a non-RCV or RCV race, makes a mistake and selects two candidates for a single choice – he failed to address that in the June 2012 US Senate primary contest, which used the typical “one-choice” plurality method and did not use RCV, there was more than five times as many overvotes in San Francisco and Oakland than in the RCV mayoral elections in those cities. Additionally, turnout had been significantly higher and more representative in RCV elections for the San Francisco Board of Supervisors races -- that McDaniel didn’t even bother to study -- as compared to previous “delayed two-round runoffs” for those offices, often higher by as much as 40% in the RCV races. Perhaps the most surprising irony was that an earlier study co-authored by McDaniel (Overvoting and the Equality of Voice under Instant-Runoff Voting in San Francisco by Francis Neely and Jason McDaniel, 2015, California Journal of Politics and Policy) found that overvotes are often more common in lower-income precincts, but that the pattern of overvoting is similar in both RCV and non-RCV contests. Wrote Neely and McDaniel: “[Overvote] errors appear to be a function of complexity in general and not IRV per se…. the pattern of overvoting is similar in both IRV and non-IRV contests…Even among votes cast in a top-of-the-ticket race like U.S. Senate, overvoting occurs in an uneven fashion” (IRV, or ‘instant runoff voting,’ is another name for ranked choice voting in single-winner contests). So McDaniel not only contradicted his own conclusion in his earlier study with Neely, but the earlier study had been an important corrective for one of the most frequently made mistakes made by anti-RCV political scientists – a continual failure to provide crucial context by pairing a comparative analysis of real world RCV elections with an analysis of real world plurality or other electoral methods. Unfortunately McDaniel’s earlier study does not get cited much by other researchers, and McDaniel did not even cite it in his own flawed study analyzed above. Incredibly, McDaniel cherrypicked McDaniel, even as his flawed study has been cited dozens of times. Despite being a textbook example of poor political “science,” featuring both inadequate as well as cherrypicked data, the shelf life of McDaniel’s study has been extended endlessly by other political scientists and media outlets who have cited it uncritically. Equally troubling, the Journal of Urban Affairs put this paper through its peer review process and published it despite its numerous flaws. McDaniel gets it wrong, Part II Not content with producing one shoddy, confused paper, McDaniel produced another one a few years later, here is the link: Electoral Rules and Voter Turnout in Mayoral Elections: An Analysis of Ranked-Choice Voting by Jason McDaniel. San Francisco State Univ. (McDaniel, 2019). In this paper, McDaniel extended his previous flawed research focused on San Francisco, about voter turnout and voter impact, to multiple RCV cities through the 2018 elections. In his data set he included San Francisco, Minneapolis, St Paul, Oakland, Berkeley, San Leandro and Santa Fe. He then compared their turnout in mayoral elections to non-RCV cities, and to mayoral elections in those cities held before first RCV usage, and concluded “a significant decrease in voter turnout of approximately 3–5 percentage points in RCV cities after the implementation of RCV.” But he replicated many of the same mistakes as his first study presented above. While in this study McDaniel attempted to distinguish between various factors, such as odd year vs. even year elections, competitive races vs. noncompetitive, contests with open seats and other factors, the analysis is superficial and inadequate. He attempts to incorporate so many often-conflicting variables that his conclusions are once again unsupported by the actual data, and ultimately unconvincing (this second study never underwent a peer review process). For example, McDaniel declared that for RCV cities “in elections that are more competitive than average (margin of victory less than 20%), there is no significant RCV effect on voter turnout.” Yet McDaniel is a professor in a city, San Francisco, in which the 2018 special election using RCV to fill a mayoral vacancy was exceedingly close, decided by a margin of only one percentage point, and resulted in the second highest turnout in San Francisco history for a mayoral election. Illustrating the complexity involved in assessing the critical factors in turnout, that special election was held on the same election day as federal and state offices, which tends to boost turnout. Yet more voters participated in that RCV mayoral election than voted on the same day in the non-RCV primary for governor in which former San Francisco mayor Gavin Newsom was running. Even more puzzling, in this study McDaniel inaccurately cited his own previous study from 2015 with Neely. McDaniel wrote, “Neely and McDaniel (2015) examine individual ballot image files within a natural experiment, and find higher rates of ballot errors in RCV elections compared to non-RCV elections” (emphasis added). However, we quoted from that 2015 study several paragraphs above, and in actual fact Neely and McDaniel actually concluded the opposite -- that the pattern of overvoting – which is the most common form of ballot error – is similar in both RCV and non-RCV contests. McDaniel also ignored the fact that in Bay Area RCV elections held in even years – at the same time as federal and state elections, when turnout is highest -- the “undervote” (that is, the dropoff in ballots cast for governor or mayor) has declined, which contradicts his thesis that the act of ranking ballots in RCV elections is too complex and presents a barrier for certain demographics of voters. To his credit, McDaniel actually acknowledged another contradiction in his own paper, which found a negative RCV turnout effect in some odd-year elections but not others, admitting that “may present a challenge to the theory that increased complexity [from RCV] will have a marginal negative effect on voter turnout.” But he tried to wallpaper over that contradiction by blaming it on an unlikely source -- bad election administration. McDaniels wrote, “This would suggest that the negative impact of RCV on voter participation may be alleviated by high quality election administration,” without presenting any data or even anecdotes to support such an unfounded theory. While competent election administration of any election, whether RCV or non-RCV, is crucially important, there is no credible research that supports the far-fetched notion that the quality of election administration has much of an impact on voter turnout in US elections, whether using RCV or otherwise. Upgrade to a $5 subscription The unvirtuous circle of academic research It is puzzling how McDaniel’s first study could have survived the peer review process for the Journal of Urban Affairs. The mistakes in McDaniel’s first study above should have been obvious to anyone with a basic understanding of ranked choice voting as well as elections in general, and elections in San Francisco specifically. It undermines faith in the credibility of the peer review process to think that a jury of peer political scientists did not catch the egregious errors and reject McDaniel’s sloppy research and paper. And it remains a black mark on political science that this thoroughly discredited study has been cited dozens of times by other researchers. Indeed, in our research paper it became apparent that many political scientists cite each other’s flawed research to pad their list of citations and to legitimize their own flawed research, creating an unvirtuous circle of political science. More broadly, McDaniel’s voter turnout studies, like other studies evaluating RCV’s impact on turnout, lacked a recognition that no credible opinion or research can claim that RCV increases voter turnout merely because so many voters are excited to vote for their favorite candidates instead of “lesser evil” candidates without worrying about spoilers. Instead, with respect to turnout, the advantage of RCV has always been that, in most places where it has been used, it has eliminated a pre-November primary or post-November runoff, which usually saw about half the turnout of the November general election. This is especially true during even years when there are state and federal elections on the ballot which substantially drive turnout more than local contests. Any study that does not adequately account for this non-November primary/runoff vs November general election dynamic, or odd year vs even year election factors, is simply not credible. Both of McDaniel’s studies largely failed on those grounds. Steven Hill and Paul Haughey Share Upgrade to a $5 subscription Thanks for reading DemocracySOS…your digital portal for the pro-democracy movement. Subscribe for only $5 per month to receive full benefits and to support our work. Subscribe
Xbox Store Quietly Leaks 'Major' Upgrade For Ghost Recon Wildlands
4K, 60FPS seemingly inbound
How Nashville's country music talent helps shape Big Sky's music scene
Carrie Underwood, Riley Green and more lead Wildlands as a Montana luxury resort town turns Nashville connections into a music tourism opportunity.
Colorado Commission prioritizes feelings over science
The Colorado Parks and Wildlife Commission voted Thursday and prioritized feelings over science-based management. Meanwhile, Rancher X is the beneficiary of those feelings-driven decisions. Well played, Governor. The newest appointees to the CPW Commission are just the parting gift you had in mind for rural Colorado. The Commission voted Thursday 6-5 to reject CPW staff […]
Colorado Commission prioritizes feelings over science
The Colorado Parks and Wildlife Commission voted Thursday and prioritized feelings over science-based management. Meanwhile, Rancher X is the beneficiary of those feelings-driven decisions. Well played, Governor. The newest appointees to the CPW Commission are just the parting gift you had in mind for rural Colorado. The Commission voted Thursday 6-5 to reject CPW staff […]
Rookie Hannes Steinbach Gets Honest on Role With Hornets
Charlotte Hornets rookie big man Hannes Steinbach shared what he will bring to the team in his rookie season.
New Official Ghost Recon Release Confirmed For PS5 and Xbox Series X
Ubisoft’s latest Ghost Recon Wildlands release could be the first sign of a long-awaited current-gen revival for the beloved 2017 shooter.
Sharks, sutures & science
From learning how to do surgical sutures on a silicone mat to exploring the anatomy of sharks, frogs and other animals, students are diving into hands-on wildlife science this summer during the Clinic for the Rehabilitation of Wildlife's Conservation Summer Camp. With various camps designed for students in kindergarten through 12th grade, CROW's annual camp combines wildlife conservation, veterinary medicine and outdoor discovery through
In pictures: How forensic science is helping tackle wildlife poaching
Advances in forensic science are disrupting the illegal wildlife trade – and are documented in a new photo series
Zendaya goes full Greek goddess on 'The Odyssey' press tour: An otherworldly winged gown, a gilded Zuhair Murad look and more
Zendaya's recent dresses, with their ethereal silhouettes, shield-like details and nods to classic Greek sculpture, have been nothing short of divine.
Op-Ed: The Forgotten Key to Wildlife Management: Values
Science alone won’t get the politics out of wildlife management. We shouldn’t want it to.
FDA approves first cholesterol pill of its kind
Enlicitide, the new oral PCSK9 inhibitor from Merck, will be sold under the brand name Lipfendra. It is approved to reduce LDL-C in patients with hypercholesterolemia, including HeFH.
Stewardship beyond politics
What does Public Lands Rule repeal mean for wildlife professionals and conservation?
Why Robert Irwin prefers deadly challenge over 'Dancing with the Stars'
NEW YORK – Robert Irwin is both a "Dancing with the Stars" champion and a wildlife conservationist. Faced with a "Would you rather?"
New Transfer Agreement Established for Fisheries Students
Under the agreement, Carteret Community College graduates will be eligible to transfer into NC State’s Bachelor of Science in Fisheries, Wildlife and Conservation Biology program.
FOX Business anchors reveal wildly overpriced popular products
FOX Business anchors discuss products they believe are widely overpriced. Answers include bottled water, Dyson hair dryers, luxury handbags, and McDonald's value meals, sparking a lively debate about quality versus cost among the panel.
When regulation is good for business
By now, I think I have established both my view that I am a fan of ESG investing and the benefits of regulating what is and isn’t a sustainable investment, and my view that in Europe, ESG regulation has gone too far and become too costly. It almost feels like the old Aristotelian maxim of doing things in moderation that leads to the best outcomes is valid in regulatory efforts as well. To give you an example, let’s look at a study by the National Bank of Belgium on the impact of the EU’s Sustainable Finance Disclosure Regulation (SFDR) on fund flows of conventional and ESG funds. The SFDR was announced on 27 November 2019 and came into effect on 10 March 2021. It was implemented in several stages and split funds marketed in the EU into three broad categories: (i) Art. 6 funds that are basically conventional funds without any specific ESG integration, (ii) Art. 8 funds that ‘promote environmental or social characteristics’, which must provide additional reporting how they do that, and (iii) Art. 9 funds that are impact funds. The gaps between the announcement and the phased implementation give us an idea of how fund flows were affected by the regulation. It is clearly visible in the figure below that once the new regulation was announced and when it was initially implemented, fund flows in Art. 8 and Art. 9 funds increased significantly. Conventional Art. 6 funds also saw more inflows, but the increase was not statistically significant. I should add that the data below is pure fund flow, cleaned of performance effects and of any reclassified funds that moved from one classification to another. Note also that once the initial rush in ESG funds was over, additional, stricter regulatory requirements didn’t create that many new flows. This implies that with additional regulation, the funds incurred higher costs to comply but didn’t benefit in terms of new inflows and higher assets under management. Fund flows as the SFDR regulation was implemented in the EU Source: Emiris et al. (2026) When examining the drivers of these flows, the authors of the study found that institutional investors were more likely to switch to ESG funds and particularly so in countries where concerns about sustainability are culturally more accepted. In a society where buy-in into environmental and social risks is higher, private investors were shifting more of their assets into ESG funds as the regulation made it clear which funds are really green and which ones are not. And institutional investors in these countries did so as well, given the societal pressures and reputational risks of sticking with conventional funds. Meanwhile, fund managers reacted to the changing regulatory environment as well. Many funds that were mildly green before the regulation was announced became greener and more sustainable as the regulation was introduced to attract new assets and new investors. Cleverly, and unsurprisingly, these ESG funds also charge on average higher fees, which means that not only did fund managers gather fresh assets, but their profitability increased as well.
MyFlyYatra is expanding its business class flight travel to Australia, Africa, Japan, Europe, Dubai by introducing enhanced coverage for global destinations as part of its ongoing growth strategy.
MyFlyYatra announces expanded business class flight booking options from the United States to Australia, Africa, Japan, Europe and Dubai.Germant...
Two giant Asian praying mantis species are spreading across Europe, helped by climate change and urbanisation, and scientists warn they are threatening pollinators, frogs and lizards
Two giant Asian praying mantis species are rapidly spreading across Europe, leading scientists to officially classify them as invasive threats to native wildlife.
Potter Center announces 2026-27 entertainment lineup with country, rock and circus acts
Jackson College's Potter Center has unveiled its 2026-27 entertainment season, featuring 11 shows spanning country music, rock tributes, circus performances and wildlife education.
New Details On What Was Cut From Ghost Recon Project OVR
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Scientists warn invasive Asian mantises are threatening Europe's wildlife
Two striking Asian praying mantis species that have rapidly spread across Europe have now been officially classified as invasive, raising new concerns about their impact on native wildlife. Boosted by climate change and urban environments, these fast-breeding predators are expanding northward, where they prey on native insects, pollinators, and even small vertebrates while also reducing native mantis populations through deadly mating interactions.
DDA’s Poultry and Animal Health Section monitors impact of New World Screwworm within U.S.
New World Screwworm is a serious pest that affects livestock, pets, wildlife, and less commonly, people and birds.
Chernobyl’s Wildlife Cameras Reveal How War Affects Wild Animals
A rare camera-trap study logged the effects of armed conflict on wild animals in real time.
How Spartans and citizen scientists team up to protect Michigan’s natural spaces
Through MSU Extension and community science initiatives, Michiganders across the state are stepping up to contribute directly to scientific research that helps protect Michigan’s lakes, waterways, forests, wildlife and biodiversity.
Rabid bat found in Marion County prompts county health warning
Marion County officials warn after a bat in the Marion area tested positive for rabies. Residents should avoid bats and other wildlife, keep kids and pets away, and ensure dogs and cats are up to date on rabies shots.
Broncos head coach Sean Payton reportedly considered pitching Bill Belichick a temporary takeover as head coach
FORT Updates: From Plains to Peaks
This issue highlights recent FORT efforts to provide streamlined, robust science for natural resource management, including science in support of invasive species management, wildfire risk mitigation, and wildlife health. It also features ongoing research on state-of-the-art technology for wildlife monitoring, traffic estimation, and more.
Rogers agrees to take 100% ownership of Maple Leaf Sports & Entertainment
Rogers Communications Inc. is moving to take full control of Maple Leaf Sports & Entertainment after reaching a $4.35 billion agreement to buy the remaining 25% stake held by Kilmer...
Can citizen science save the world’s wildlife?
Can smartphones save the planet? Learn how citizen science and AI-powered apps are providing crucial data to protect global biodiversity.
Millions may be getting the wrong cholesterol test
A new study suggests that apoB, a blood test that measures harmful cholesterol particles, is better than standard LDL cholesterol testing for deciding who needs more intensive treatment. Researchers found it could prevent more heart attacks and strokes while remaining cost-effective for the U.S. healthcare system.
This toad exists only in Canada—and scientists have finally discovered why
Scientists have identified something that may be even more uniquely Canadian than the beaver or moose: a genetically distinct western toad population found only in Canada. The discovery, made by researchers from the University of Ottawa, points to a rare and previously unrecognized group of toads living in the Canadian Rockies and raises fresh questions about conservation, biodiversity, and how much wildlife still remains to be fully understood.
ESPN boldly predicts Dak Prescott to join exclusive NFL club
Do you think Dak Prescott can throw for 5K?
Caleb Williams is wildly respected by his peers
The Bears now have a quarterback who commands respect not only from all opponents, but from NFL greats such as Matthew Stafford
A Wildlife Regulator’s Family Business Had a Permit to Renew. She Stepped In.
Jenifer Chatfield, a top official at the Interior Department, faces scrutiny from ethics experts for actions that could help her family’s business.
How Wisconsin Used Foxes And Deer To Revamp Science Education
Public input identifying over 100 million trail cameras photos of Wisconsin’s animals has transformed science education and state wildlife management.
Cornell Yang Center for Wildlife Health awards seed funding to five conservation efforts around the globe
The CCF provides catalytic seed funding to spark pioneering applied research to advance wildlife conservation solutions. The fund prioritizes initiatives that improve the health of free-ranging wildlife and/or solve environmental problems via a One Health lens.
Conservation efforts emphasize the lesser prairie chicken
Reid DeWalt, deputy director of Colorado Parks and Wildlife, spoke to the Water Resources and Agriculture Review Committee about the Lesser Prairie Chicken and moving conservation forward. He said in 2026, CPW staff counted 77 males on 13 leks, a number that has dropped year over year since 2024. There are fewer than 1,000 chickens […]
16 gorgeous images from the 1839 Awards’ Color Photography Contest
All the beautiful shades of our planet and its creatures.
Scratching that bug bite might feel good at first but science explains why it's a bad idea
Now researchers better understand why even a mildly annoying itch could put you on an itch-and-scratch cycle if you give in.
CDFW News | Monterey Bay Northern Anchovy and Pacific Sardine Commercial Take Restrictions and Recreational Advisory in Place Due to Public Health Hazard
State health agencies determined that northern anchovy and Pacific sardine recently sampled from Monterey Bay contained elevated levels of domoic acid and recommended a commercial fishery restriction and recreational health advisory in the bay for the take of anchovy and sardine for human consumption in the area.
Monkey Business: Wild rhesus macaque spotted at Mount Dora hotel
A wild rhesus macaque was spotted at the historic Lakeside Inn in Mount Dora, Florida, spending about 45 minutes roaming the property and attracting attention from guests and staff. The hotel and local businesses responded with humorous, monkey-themed social media content, engaging the community. Wildlife officials cautioned the public not to approach or feed wild monkeys due to potential health risks and encouraged reporting sightings to authorities. The monkey has not returned to the hotel but has been seen elsewhere in downtown Mount Dora.
This is the real reason your cat purrs—and it’s not what you think - Futura-Sciences
The Genetic Mystery Behind the Purr If you thought your cat’s purr was just an automatic sound of happiness—like you sighing with satisfaction after a good meal—science begs to differ. Researchers from Kyoto University’s Wildlife Research Center in Japan have identified, for the first time, genetic underpinnings to this ancient...
9 of the best technology conspiracy theories
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Scientists open a million-year-old time capsule hidden beneath New Zealand
A cave in New Zealand has yielded fossils from a lost ecosystem that existed about 1 million years ago, including a possible flying ancestor of the kākāpō. The discovery reveals that volcanoes and climate upheaval were reshaping the country’s wildlife and driving extinctions long before humans arrived.
Citizen science in Japan’s Ogasawara Islands spotlights ties between ships and birds
A recent study has shed new light on seabirds’ tendencies to follow ships near the island chain and highlights the role wildlife enthusiasts can play in research.
Weekend PC Game Deals: Cyberpunk 2077, Split Fiction, Sonic Racing, and more
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Einstein’s “biggest blunder” may finally have an explanation
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Wildlife inside Chernobyl exclusion zone acted differently during Russia's invasion, camera traps reveal
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Viewpoint: Our wild places aren't worth sacrificing to politics
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How sports betting became Colorado’s ticket to funding $140 million in water conservation projects
Supporters say the gambling money is a godsend. Critics say legalized sports betting has come at a cost — fueling an addiction crisis that Colorado is unprepared for.
Raccoon in Anne Arundel County tests positive for rabies; health officials seek anyone exposed
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With Trump, science and health in the US are in a horrifying place
'Albert Einstein said it best: "One thing I have learned in a long life: that all our science, measured against reality, is primitive and childlike — and yet it is the most precious thing we have,"' writes an L.A. Times reader.
With Trump, science and health in the US are in a horrifying place
'Albert Einstein said it best: "One thing I have learned in a long life: that all our science, measured against reality, is primitive and childlike — and yet it is the most precious thing we have,"' writes an L.A. Times reader.
JD Vance addresses controversial 'childless cat ladies' comment on 'The View'
JD Vance attempted to explain his controversial 'childless cat ladies' comment on 'The View,' after Joy Behar pressed him on the 'boneheaded' remark that even drew a response from Taylor Swift.
Takeaways From JD Vance’s New Book ‘Communion,’ on Faith and His Political Ambitions
In a new memoir, Mr. Vance recalls an “unsettling” meeting with Vatican officials on immigration policy and disavows his infamous disparagement of some Democrats as “childless cat ladies.”
Takeaways from JD Vance’s new book, ‘Communion’
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Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?
Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.
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