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Radiology Partners investing over $5M to build new headquarters in downtown Nashville
The practice and its technology services division have inked a lease to become a key piece of Nashville Yards, a massive mixed-use development in the “heart of the nation’s healthcare capital."
FDA upgrades recall of frozen blueberries sold at Publix to highest health risk level
Recalled frozen blueberries and mixed berries that could be contaminated with E. coli pose the most severe category of health risk, according to the FDA.
Mt. Lebanon sees mixed-use future for business district parking garage
A multi-level parking garage next to Mt. Lebanon’s historical municipal building could have a new life as a mixed-use development, according to the community’s municipal planner. Mt. Lebanon is seeking proposals for a public-private partnership to redevelop the structure, which is nearing the end of its functional life, said Ian
Robinhood Road ER proposal in Winston-Salem draws mixed support and concern at public hearing
Community resistance towards a proposed freestanding emergency room is growing, while proponents of the project say it will eliviate wait time pressure at major hospitals.
Business split over whether SBTi’s new net-zero standard will boost action or dilute ambition
Five years since its initial launch, the Science Based Targets initiative’s (SBTi) flagship Net Zero Standard has undergone its first major update, prompting a mixed response from the climate community.
What is Medetomidine? The latest threat in the street drug supply
Medetomidine is a veterinary tranquilizer increasingly found in the illicit drug supply, where it is often mixed with fentanyl and can cause dangerous sedation and withdrawal.
Bills' new grass field draws mixed reviews
The Bills have dumped artificial turf for grass in their new stadium.
Politics: With no end in sight, Iran war draws mixed opinions from tri-state congresspeople
After Vice President J.D. Vance said on Friday that lowering oil prices has become the new goal for the United States in its ongoing war with Iran, oil prices rose
White Sox Minor League Update: August 14, 2026
It’s a mixed bag across the farm, but we can always count on Roch Cholowsky to dazzle — and the DSL to surrender runs
Turning science students into problem solvers
BELIEVE Academy science teacher Seyi Akoko can trace his love of science back to a seventh-grade classroom. Curious about a lesson on evaporation, he went home and mixed salt with water in an attempt to recreate the experiment for himself. His experiment may have gotten him into trouble at home, but it also ignited a […]
The drug lenacapavir is a mighty weapon against HIV. Its rollout gets mixed reviews
It's a twice-a-year injection that is remarkably effective in preventing an HIV infection. Distribution is starting. But questions are being raised about getting it to the areas that need it most.
Wisconsin primary offers mixed signals for Democrats, and other election takeaways
David Crowley’s win by less than a percentage point over state Rep. Francesca Hong, a democratic socialist, showed neither side of the party debate was winning the argument convincingly.
This week in Santa Cruz County business: Workbench files pre-application for new housing on site of Seabright business plaza; Joby makes moves in Texas
In her weekly look at local business, Jessica M. Pasko reports on a proposed six-story mixed-use development in Santa Cruz, Joby Aviation's latest maneuvers and names, numbers and dates to know.
Tax increment financing approved for Louisville Entertainment District near Slugger Field
The $250 million mixed-use development project was announced in 2024, and it's been a waiting game for construction to start.
Bromley 1-1 Reading (4-5 Pens): A Scattergun Start
A mixed performance but good result as Reading make it through to the second round of the League Cup.
Can Gluesenkamp Perez win over the Democrats who voted against her in Washington’s primary?
Unofficial results present a mixed picture heading toward the November general election.
Penguins make strange signing, sparking mixed reactions from fans
This is a very puzzling contract.
Pokémon Developer Game Freak Promises Fixes 'Within a Week' To Its Big Budget RPG Beast of Reincarnation, Following Mixed Response at Launch
Game Freak has promised a series of quick fixes after a mixed response to the launch of its big budget RPG Beast of Reincarnation.
‘We take your feedback to heart’: Game Freak is planning regular Beast of Reincarnation updates, starting next week
Reviews for the game have been mixed so far…
The Bull Case For Sphere Entertainment (SPHR) Could Change Following Mixed Q2 Results And Aggressive Expansion Plans
Sphere Entertainment Co. has reported past second-quarter 2026 results showing sales of US$313.64 million versus US$282.68 million a year earlier, alongside a shift from net income of US$151.82 million to a net loss of US$38.79 million. Despite reporting a loss, the company highlighted growing Sphere-driven revenue, venue expansion plans in Abu Dhabi and National Harbor, and a broader content slate including future Wizard of Oz and Rocky Horror Picture Show experiences. We will now examine...
Good Communication Is Good Business by Geoffrey Losee
The following column was contributed by J.D. Fisher. Mixed-use communities are increasingly common. Restaurants, breweries, retail stores, entertainment venues, and professional offices often operate within walking distance of established neighborhoods. That proximity creates tremendous opportunity, but it also means that a business's decisions may affect more than just its customers. Many business owners understandably focus on obtaining the permits necessary to open their doors. However, municipal approval is rarely the end of the conversation. As a business evolves, whether by adding outdoor seating, live entertainment, extended operating hours, or other new amenities, the applicable zoning ordinance may require additional approvals or impose operational standards designed to balance commercial activity with nearby residential uses. From a business perspective, the question should not simply be, "Can we do this?" It should also be, "Have we communicated with everyone who may be affected?" Recent local news coverage highlighted how differing interpretations of a municipal ordinance can quickly become the subject of public hearings, legal arguments, and significant uncertainty for a business. While every situation turns on its own facts, one common theme emerged: practical solutions are more difficult to achieve if communication breaks down. Businesses can often reduce that risk by engaging early with the relevant stakeholders. That begins with municipal staff. Planning departments are oftentimes willing to discuss how an ordinance applies before substantial investments are made. Seeking clarification in advance may identify permitting requirements or operational limitations that can be addressed proactively rather than after enforcement action. Communication should not stop with local government. Nearby property owners and neighborhood representatives frequently appreciate being informed about proposed changes before they occur. A brief meeting, an informational email, or an invitation to discuss concerns can foster goodwill and reveal potential issues while there is still flexibility to adjust operations. That’s why such meetings often required for substantial projects and may be a good idea even if not required. Perhaps most importantly, businesses should view compliance as an ongoing process rather than a one-time event. Operational changes that seem minor from a business standpoint may have regulatory implications under local development ordinances. Periodically reviewing proposed changes with experienced land-use counsel or planning professionals can help identify issues before they become disputes. No ordinance can eliminate every conflict between commercial activity and residential expectations. Nor should every disagreement become a legal controversy. But businesses that invest in transparent, proactive communication place themselves in the strongest position to protect both their operations and their relationships within the community. In today's regulatory environment, good communication is more than good public relations, it is good risk management. If your business is planning to expand its operations, introduce a new use, or simply wants to better understand how local land development regulations apply, the attorneys at Rountree Losee LLP are available to help. Our land use and local government practice works with businesses throughout southeastern North Carolina to navigate municipal approval processes, identify potential issues before they become disputes, and keep projects moving forward with confidence. Read more at rountreelosee.com.
Can Mamdani plan for city-owned stores deliver cheap food for New Yorkers?
Food costs have soared but existing businesses fear unfair competition and programs elsewhere yielded mixed results
Maine’s Democratic Senate candidate touts his rural appeal. His hometown has mixed feelings.
In Allagash, a hamlet of some 200 people near Canada, residents are sharply divided over Troy Jackson.
He bought a fitness supplement online to bulk up, but ended up losing his mind
Daniel Murphy's mental health spiralled after he took missold drugs which had been mixed with steroids.
Salem Health-Santiam emergency merger request draws mixed feedback from Regence, lawmakers and patients
During a two-week public comment period, the Oregon Health Authority gathered almost 300 public responses from Oregon’s largest health insurer, local lawmakers, hospital employees and several patients weighing in on a recent emergency merger request.
A look at new construction projects and property deals in Ascension Parish
Ascension Parish recently announced new construction projects, property transactions and upcoming business events, Ascension Business Report writes. The parish issued permits for two major projects, including a $3 million, 10,483-square-foot building at The Church International on La. 42 in Prairieville, with Living Solutions Construction as the contractor, and a $400,000, 11,840-square-foot pre-engineered mixed-use metal building […]
LIVE! UFC Belgrade Early Weigh Ins Results!
Ultimate Fighting Championship (UFC) is just over 24 hours away from the upcoming UFC Belgrade mixed martial arts (MMA) event, which is set to go down this Sat. (Aug. 1, 2026) on Paramount+ from inside Belgrade Arena in Belgrade, Serbia. UFC Belgrade will be headlined by a Welterweight clash between hometown boy Uros Medic and […]
Chemical mix-up leads to hazmat response at Huntington Beach business
A hazardous materials team responded to what appeared to be a chemical mix-up that caused a reaction Wednesday morning at a business in Huntington Beach. The business in the 15200 block of News Boy Circle was evacuated after firefighters and hazardous materials experts responded to the property. Authorities said a chemical was mixed into another chemical in a 55-gallon drum,…
Arizona Cardinals camp notes. Mixed day for Marvin Harrison Jr.
Arizona Cardinals WR Marvin Harrison Jr. had a mixed day of training camp on Tuesday, hauling in three intermediate catches but dropping an easy one.
Caesars Entertainment (NASDAQ:CZR) Breakout Setup on Fertitta Acquisition Overrides Mixed Q2 Earnings
Caesars Q2 earnings mixed: revenue in-line, EPS miss, but stock jumps 21% on Fertitta Entertainment acquisition deal.
What’s being built, bought and planned in Ascension Parish
Here are the latest property transactions, issued permits and upcoming business-related events in Ascension Parish. Issued permits New construction for a 10,483-square-foot building at The Church International on La. 42 in Prairieville. The project is valued at $3 million, with Living Solutions Construction as the listed contractor. New construction permit for an 11,840-square-foot PEMB mixed-use […]
Armored combat draws Madison students to a ‘Cream City clash’
Two college students commute to practice with the Milwaukee Iron Stags, a weapon-wielding mixed martial arts team that fights in suits of medieval armor.
Halo: Campaign Evolved glitch makes its hardest Xbox achievements super easy
Halo: Campaign Evolved's LASO and Remixed Xbox achievements are currently ridiculously easy to unlock, thanks to a glitch that lets you turn down difficulty.
Cyclospora outbreak has many changing eating habits, CBS News poll finds; mixed and partisan confidence in FDA
Has Oscar Health (OSCR) Run Too Far After Its 68% 90 Day Rally?
Oscar Health (OSCR) has been drawing attention after a strong share price run, with investors weighing that performance against mixed valuation signals that suggest the stock is not an obvious bargain. See our latest analysis for Oscar Health. Recent trading has cooled slightly, with the share price down around 3% over the past month and 7 days. That comes after a strong 90 day share price return of about 68% and a very large 3 year total shareholder return, suggesting momentum has been...
Government Contracting Surges, But Not for All
New report reveals federal small business contracting meets targets amid policy shifts. Discover mixed results and procurement changes affecting contractors.
New Michigan budget delivers mixed results for business community
The 2026-27 budget expands community college scholarships and a child care program while reducing funding for workforce training, business attraction and tourism.
Braves vs. Rangers series recap: Bats embiggened after Break
June was a bad offensive month for the Braves. The first 12 games of July were a mixed bag: some good outputs, but questionable inputs. Still, it got the Braves to a 6-6 record. Then the All-Star Break came and went, and the Braves started the “second half” with a home series against the Rangers. […]
Is Tencent Music Entertainment Group (TME) Undervalued After Its CTF Life Awards Deal?
Tencent Music Entertainment Group (TME) is back in focus after CTF Life agreed to become the exclusive title sponsor of the 2026 TMElive International Music Awards, bringing the event to Hong Kong for the first time. See our latest analysis for Tencent Music Entertainment Group. Despite the CTF Life partnership putting Tencent Music Entertainment Group back in the headlines, the stock’s recent performance has been mixed, with a 1 month share price return of 4.95% contrasting with a year to...
Alabama students show significant gains in science proficiency; reading, math results mixed
By Andrea Tinker, Alabama Reflector Alabama students made significant improvements in science proficiency on this year’s Alabama Comprehensive Assessment Program (ACAP) standardized test, while the picture was somewhat more mixed on reading and math scores. According to data released by the Alabama State Department of Education on Tuesday, science proficiency went up for fourth, sixth […]
Hochul's order of a data center moratorium draws mixed reactions from N.Y.
Community groups have pressed data center developers on issues such as water use, air quality and rising utility costs for nearby residents.
Eureka Springs, Ark., begins trial run of permanent entertainment district
The trial period started on July 1, and it’s coming in for mixed reviews.
Wall Street mixed and oil prices jump after Iran and U.S. trade attacks
Brent crude, the international standard, climbed as much as nearly 5% early Monday before falling back
Metaverse Market Surge: Entertainment Industry Set to Quadruple by 2032
The global metaverse in entertainment market is experiencing rapid growth, with its market size expected to soar from over USD 30.6 billion in 2026 to more than USD 121.9 billion by 2032. This expansion is driven by increasing demand for interactive digital experiences and technological investments from gaming, media, and tech sectors. Mixed Reality (MR) devices are predicted to grow the fastest, enhancing digital interactions in gaming, concerts, and sports. North America is a key player, leadi
Six Flags Entertainment (FUN) Launches Tormenta, Is The Stock Still Undervalued?
Six Flags Entertainment (FUN) is in focus after Six Flags Over Texas opened Tormenta: Rampaging Run, a record-setting giga dive coaster, paired with the new Rancho de la Tormenta themed village and festival. See our latest analysis for Six Flags Entertainment. Despite the fanfare around Tormenta: Rampaging Run and a new COO appointment, Six Flags Entertainment’s recent momentum has been mixed, with a 1 day share price return of 4.34% at US$19.46, but a year to date share price return of...
ServiceTitan (TTAN) Wins TrussPoint Business, Is The Stock Still Below Fair Value?
ServiceTitan (TTAN) is back in focus after TrussPoint Roofing & Exterior Renovations chose its cloud platform as the operational backbone for an expanding portfolio of roofing brands, highlighting the software’s role in multi-brand growth. See our latest analysis for ServiceTitan. ServiceTitan’s recent customer wins, including TrussPoint and the June rollout data for its Max software, come against a mixed backdrop where the share price closed at US$77.69 and is up 35.47% over 90 days, but the...
Rochester sports teams eager for ‘One Rochester’ multi-use district concept near Silver Lake
A Wisconsin developer has unveiled a concept for a large mixed-use district near Silver Lake in Rochester, with plans that could include a ballpark, retail space and housing on the site of the power plant.
Joe Klein: At 80, Here’s What I’ve Learned About Politics—and Life
I am 80 years old, this year of our 250th anniversary, and I find myself a cliché. My life has been a common political journey, from left to center. I recently took the Pew Research Center’s “political typology” test and found that I was a “pragmatic and polite conservative,” which seemed a rather abstruse basket: A politically mixed (though Republican-tilting) group, they lean conservative on economics and the role of government, while tilting more liberal on issues related to race and foreign policy. They prize civility and cooperation in politics. Well, that sounds pretty mushy—and I find it hard to square with the strong opinions I have on many issues. I’ve voted for Democrats in federal elections, but I grow more Republican the closer I get to local politics. Democrats, I’ve found, simply aren’t very good at running things, especially school systems, where they are in the thrall of the teachers unions. My friends joke about my obsession with the unions. They know all my lines. If industrial unions are organized against the power of capital, who are the public employees organized against? But enough of that. I’ve ranted that rant too often, and my political journey has been more complicated than that one issue. It has been empirical, based on actual experience—on a lifetime of reporting and a lot of reading. An early example: I was a journalist with the underground press in Boston at the turn of the 1970s and considered myself a member of the antiwar and civil rights movements. The first big issue I covered was busing to achieve school integration. Yes, the white bigots were disgusting. But I couldn’t find any black parents who favored the plan to bus their children to schools outside their neighborhoods either. Black activists and politicians—and white liberals—were gung ho, but not actual parents of black kids in school. Busing was a form of social engineering imposed from on high, by a judge—W. Arthur Garrity—who lived in a wealthy liberal suburb. Wealthy liberal suburbs were not affected by his plan, of course. I began to see that there were limits to what government could do, especially when it came to changing a society’s culture.
Opinion: Conor McGregor's return exposes the UFC's biggest failure
Conor McGregor's long-awaited return to the UFC has reignited excitement around one of mixed martial arts' biggest stars, but it also highlights a lingering problem for the promotion, writes Dayne Fox.
Assassin's Creed Black Flag Resynced Launches To Mixed Reviews: Controversial Microtransactions Spark Outrage
The hype has been building for the launch of Assassin's Creed Black Flag Resynced for a good long while, and it seems as though sales have been strong, with SteamDB reporting a peak of 99,451 concurrent players in the first 12 hours after launch on Steam alone. However, it seems as though player...
Caesars Entertainment (CZR) Following Lake Tahoe Opening Has Investors Weighing Its Valuation
Caesars Entertainment (CZR) is in focus after officially opening Caesars Republic Lake Tahoe Hotel & Casino, completing a multi phase renovation of the former Harveys Lake Tahoe and expanding its luxury resort and gaming footprint in the region. See our latest analysis for Caesars Entertainment. Caesars Entertainment’s recent Lake Tahoe opening comes as the stock shows mixed momentum, with a 26.57% year to date share price return but a 68.45% decline in five year total shareholder return...
Here Are Thursday’s Best Wall Street Analyst Research Calls: Align Technology, American Tower, Caesars Entertainment, Cohu, Five Below, Intuitive Surgical, Salesforce, Toast, and More
Pre-Market Stock Futures: Futures are trading mixed after another tough day across Wall Street, with all the major indices crushed early on, before the Nasdaq made a late-afternoon push to wind up just modestly higher at 25,870, up 0.20%. The S&P 500 also rallied in the afternoon, erasing a big deficit, to finish the session ... Here Are Thursday’s Best Wall Street Analyst Research Calls: Align Technology, American Tower, Caesars Entertainment, Cohu, Five Below, Intuitive Surgical, Salesforce, Toast, and More
Oil prices jump after US strikes on Iran, while shares in Asia are mixed
Asian shares are mixed and oil prices have surged more than 2% after the U.S. launched strikes on Iran.
National report: Oregon great for giving kids health insurance, bad for teaching them how to read
A new national report finds mixed outcomes for child well-being in Oregon and Washington.
Zlatan Delivers Honest Take After USA Falls To Belgium: 'It Was A Reality Check'
FOX Sports soccer analysts Zlatan Ibrahimović and Thierry Henry offered mixed but candid reactions after the United State's World Cup loss to Belgium.
Economic Development Committee to weigh two planning options for downtown and business campus sites
By Shereen Siewert | Wausau Pilot & Review Wausau's Economic Development Committee will consider planning agreements for a downtown mixed-use
US futures and Asian shares are mixed while oil prices decline as some exporters opt to raise output
Asian shares and U.S. futures are mixed following a long weekend on Wall Street.
Letters: Mixed emotions over LeBron james leaving Lakers
Readers of the Los Angeles Times Sports section give their thought on LeBron James parting ways with the Lakers, Kawhi Leonard, Dave Roberts and the Sparks.
Letters to Sports: Mixed emotions over LeBron James leaving Lakers
Readers of the Los Angeles Times Sports section give their thought on LeBron James parting ways with the Lakers, Kawhi Leonard, Dave Roberts and the Sparks.
Mixed emotions as England face Mexico
England take on co-hosts Mexico in the round of 16 at 01:00 BST on Monday morning.
Mamdani’s politics of joy: What can Arkansas politicians learn from New York’s jubilant mayor?
Zohran Mamdani’s first half-year in office has been a mixed bag when it comes to policy outcomes. There is, however, one area of unquestioned success for the NY mayor: the forging of a sustained politics of joy unmatched by that of any major American politician in recent decades.
"Am I going back to PS4 days?" - Former PlayStation leader Shuhei Yoshida has tried the Steam Machine, and he doesn't sound very impressed
Yoshida has a mixed opinion of Valve's new Steam Machine, which he has shared online.
Accel Entertainment (ACEL) After Russell 2000 Exit Has Undervaluation Back In Focus
Index removal puts Accel Entertainment back in focus Accel Entertainment (ACEL) was recently removed from the Russell 2000 Dynamic Index, an event that can influence institutional ownership patterns, index tracking fund flows, and short term trading activity around the stock. See our latest analysis for Accel Entertainment. Against that backdrop, Accel Entertainment’s recent share price moves have been mixed, with a 1-day share price return of 1.27% but a 7-day share price return that...
ArtBeat: Spotlight on the local arts events and entertainment
Here’s a closer look at what you can expect from the area’s events: July 3 First Friday Reception: The Downtown Art Market Gallery in Knoxville invites the community to its First Friday Reception from 5:30 to 9:00 p.m. July’s featured artist is Lynnda Tennpenny, who will showcase a collection of mixed-media artwork. Admission is free, […]
Politics complicate push for year-round E15, Iowa Farm Bureau president says
Questions loom over the status of E15 legislation in the U.S. Senate. “Mixed signals is very accurate.” Iowa Farm Bureau president Brent Johnson says he’s heard members of Congress say E15 can’t pass on its own, while others say it can. “So when you look at the makeup of the Senate, I do think we […]
How urban design leads to better wellness
A new big-data analysis of the U.S. shows how urban design aids the health of city residents — especially when cities provide walking opportunities, greenery, and mixed-use streets with a blend of commercial and residential activity.
Mayor Mamdani, NYC Health + Hospitals break ground on $255M River Commons, bringing 328 affordable affordable homes to the South Bronx
The city has broken ground on River Commons, a mixed-use development in Morrisania that will bring 328 affordable and supportive apartments, an expanded
KFF Tracking Poll on Health Information and Trust: Update on Common Vaccine Myths
This poll looks at exposure to and belief in several vaccine myths and finds that people without a trusted health care provider, and those who regularly use social media or AI for health information, are generally more likely than others to belief the false claims. It also analyzes belief across vaccine myths, showing the share of the public that are consistent myth believers, consistent myth deniers, and those who land in the "mixed middle."
Scientists say creatine may help fight depression
Creatine is best known as a muscle-building supplement, but scientists are now investigating whether it could also help treat depression by boosting the brain's energy supply. A new review examined five randomized clinical trials involving 238 participants and found mixed results. Two studies, both involving women with major depressive disorder, reported that adding creatine to standard treatment improved symptoms, while three others found no meaningful benefit.
From mail voting to firings, SCOTUS verdict on Trump agenda is mixed
The Supreme Court dealt the Trump agenda major blows on economic regulation and mail-in voting, but also expanded Trump's power over federal agencies.
US Oilfield Business Activity Strengthens, Though Oil Price Uncertainty Remains
The Federal Reserve Bank of Dallas’ second-quarter energy survey reports improved business conditions, despite a mixed outlook on oil prices and input costs.
This Week's 10 Must-Read Stories on Women in Politics: Title IX Anniversary, AI's Anti-Women Bias and Ranked-Choice Voting Victories
Weekend Reading on Women’s Representation is a weekly compilation of stories about women’s representation in politics, on boards, in sports and entertainment, in judicial offices and in the private sector in the U.S. and around the world—with a little gardening and goodwill mixed in for refreshment! Published every Friday. —This week marked the 54th anniversary of Title IX. —As the Taliban approaches the five-year mark of its return to power this August, a rare protest in western Afghanistan last week laid bare both the brutality of its rule and the resilience of those living under it. —A woman will replace Eric Swalwell in California … but for not two more months. —A study of 133 AI systems found that 44 percent demonstrated gender bias, and more than a quarter showed both gender and racial bias. ... and more.
‘The Hot Zone’ led me to work with Ebola patients. Now I have mixed feelings about the book
“The reality of Ebola is simultaneously less sensational and far more challenging than most people imagine,” writes Krutika Kuppalli.
UFC Baku early weigh ins results
Ultimate Fighting Championship (UFC) will stage its early and official weigh ins at 9 a.m. local time for this weekend’s UFC Baku mixed martial arts (MMA) event on Paramount+. Unfortunately for stateside fight fans, Baku is eight hours ahead of Eastern Standard Time, so most of us will be asleep by the time the first […]
Flutter Entertainment (NYSE:FLUT) To Leave London And Trade Only In New York
Flutter Entertainment plans to delist from the London Stock Exchange and keep its ordinary shares trading only on the New York Stock Exchange. The company expects its stock to remain listed under ticker NYSE:FLUT, concentrating liquidity in the US market. The change alters how existing London holders access the stock and could reshape the shareholder base over time. Flutter Entertainment enters this shift with its stock trading at $97.85 and a mixed recent performance profile. The share...
Partnership to Launch $280 Million Mixed-Use Entertainment District Surrounding Neyland Stadium in Knoxville
Knoxville, Tenn. — A public-private partnership between the University of Tennessee and a newly formed development platform comprising Arctos, RVX - Development, Entertainment, Mixed-use, News, Tennessee
New sports facility could be coming to Franklin
The new mixed-use sports facility, “The Banks at Brownland,” is all about improving access for youth sports.
Silicon Valley spent big in California's primary election. Did tech money influence the results?
California's June primary delivered a mixed verdict on Silicon Valley's growing political influence.
Analysis | Republicans are meddling in Democratic primaries. Their record is mixed.
This practice is not entirely unusual as the midterms approach.
USA Cycling Pro Road Championships bring crowds and mixed impact for Charleston businesses
How Seattleites are grappling with USA soccer fandom in Trump's America
Some Seattle soccer fans have mixed feelings about patriotically backing the U.S. team during the FIFA Men's World Cup, given the actions of President Donald Trump.
Georgia Republicans choose Collins for Senate and Jackson for governor, a mixed result for Trump
Georgia Republicans delivered a split decision for Donald Trump in Tuesday runoffs, opting for the president’s preferred U.S. Senate candidate but rejecting his choice for governor in favor of a billionaire first-time candidate who spent freely from his personal fortune to win the nomination.
Climate advocacy by scientists shows mixed effects, no clear trust boost or backlash
Scientists have become more visible in climate debates, engaging in public communication, policy advice, open letters, political demonstrations and even civil disobedience. Scientists who speak out on ...
U.S. Business Applications for May 2026: Trend Remains Solid - Small Business & Entrepreneurship Council
by Raymond J. Keating – The latest business applications numbers from the U.S. Census Bureau offered a mixed story for May, with the overall trend, however, remaining healthy. Total business applications in May increased by 3.7 percent to 523,971 (seasonally adjusted). At the same time, high-propensity business applications declined slightly – by 0.3 percent to […]
Preview: UFC Vegas 119 prelims
Mixed martial arts hangover is a real thing, and don’t let anyone tell you otherwise. Here’s your Alka-Seltzer.
Plans announced for sports complex, mixed-use development near Huntsville-Decatur interchange
Synergy Sports, Limestone County, the City of Decatur, and Crossroads LLC, announced a cooperative effort to bring a mixed-use development, anchored by a southeast regional sports complex, to the Tennessee Valley.
Pizza Hut bought by private equity firm that owns 24 Hour Fitness
P.E. firms have bought up restaurant chains in recent years, but they have a mixed track record when it comes to turning them around.
UFC 6 reveals Xbox achievements for lovers of mixed martial arts
The UFC 6 Xbox achievements have been revealed, showing off a list of fun Gamerscore to earn in this popular mixed martial arts sports series.
Campaigns are embracing influencers, but internet stardom doesn't always win votes
It's becoming common for campaigns to seek out viral moments and the support of internet stars to reach new voters. But the strategy, albeit flashy, has yielded mixed results in key races this year.
The true test of Trump’s Iran agreement will come only if the fighting stops
The mixed martial arts fights at President Donald Trump’s 80th birthday party showcased the power of dominance and unequivocal victories.
Science of love: decoding signals
Columnist Medha Shah argues for communication and compromise during mixed signals and assumptions in relationships.
Why Marketing Feels Harder as Your Business Grows by Nathan Tayloe
At some point, most growing businesses hit the same moment. What used to feel straightforward starts to feel more complicated. Marketing takes more effort. Results feel less predictable. What once worked consistently begins delivering mixed outcomes. It is easy to assume something is broken. In many cases, nothing is. The business has simply reached a different stage. What Worked Before Starts to Lose Its Edge Early on, growth is often driven by a few things working well at the same time: Referrals are strong The value of the offering is clear The team is aligned Decisions are made quickly Marketing, in that stage, tends to feel easier because the business itself is easier to understand. As the company grows, that simplicity fades. The audience expands. Services evolve. New people join the team. More channels are added. More decisions are made across more touchpoints. Marketing is no longer communicating one clear story. It is trying to represent a more complex business. Complexity Creates Friction That added complexity does not always show up immediately. It builds over time. Messaging starts to drift. Different parts of the business describe what they do in slightly different ways. The website no longer reflects how the company actually operates. Sales conversations evolve faster than the brand. At the same time, more activity is introduced to try to keep growth moving: New campaigns More content Additional platforms More tools and reporting The volume increases. The clarity does not always keep pace. That is when marketing starts to feel harder. It’s Not a Lack of Effort Most teams respond to this stage by doing more. More output More meetings More adjustments More experimentation That effort is not misplaced. It is often pointed in the wrong direction. When the underlying issue is a lack of alignment, more activity tends to create more noise. Results become harder to interpret. Decisions take longer. Progress feels inconsistent. From the outside, everything looks active. From the inside, it feels less certain. The Real Shift As businesses grow, marketing becomes less about execution and more about alignment. The companies that navigate this transition well tend to refocus on a few fundamentals: A clearly defined audience A strong, consistent position in the market Messaging that reflects how the business actually operates Alignment between leadership, marketing, and sales When those elements are in place, execution becomes more effective again. Marketing does not necessarily become easier, but it becomes more consistent. A Different Kind of Discipline Growth introduces more opportunity, but it also demands more discipline. What worked when the business was smaller often cannot be scaled without adjustment. The systems, messaging, and decision-making that once felt intuitive need to become more intentional. That is not a sign of failure. It is a normal part of growth. Marketing feels harder because the business has become more complex. The solution is not to outwork that complexity. It is to bring clarity to it. The companies that do that well tend to regain momentum quickly. Those who do not often stay busy without seeing the same level of progress. — Learn more about how we help organizations align strategy, brand, and execution. Visit tayloegray.com, or reach out directly at nathan@tayloegray.com.
Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?
Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. 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Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.
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