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Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?
Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.
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New OMB rule could break science in the United States
The drug that saved your mother. The treatment your doctor recommended. The clinical trial that bought someone you love more time. None of it was inevitable. It required a system built to operate outside politics and sustained over decades, because science doesn’t operate on the timeline of a politician. That system is now under direct threat. The Office of Management and Budget (OMB) has proposed a new rule to regulate all federal grants, not just science, but housing, education, defense, NASA and everything in between, that would fundamentally change how research is conducted in the United States. There have been a lot of fires in the past 16 months, and if everything is an emergency, nothing is an emergency. But this is a very big deal. These rules would strip away the independence that has kept science from becoming a political tool. The good news is there’s still something we can all do. How the grant system was designed to work When I was a new faculty member, I was full of millions of ideas, so I sat down and wrote an NIH proposal. I worked on it for months and thought it was so good. Then I sent it to my mentor. It came back covered in comments. Places where my reasoning wasn’t as airtight as I’d thought, methods that could be stronger, gaps in my thinking that I had been too close to the work to see. It stung, as honest feedback always does, but peer review almost always makes the work better. In fact, it’s the backbone of how American science has functioned for generations. At NIH, submitted proposals go to a panel of scientists who have experience in the field. These are the people who can read research methods and spot their weaknesses, who understand when an experiment is designed well and when it isn’t. Applications are scored rigorously, and often only the top 3-20% of proposals receive funding. The people making funding decisions are required to justify them based on these reviews. To be clear: this is not a perfect system, and good science still goes unfunded more often than any of us would like due to limited resources. There is also criticism that peer review may undervalue bold ideas that are risky but could have high payoffs. But the peer review system is nonetheless a meaningful part of the grant selection process. While thoughtful and careful changes could improve the system, the changes being proposed by OMB will not make things better. The rule that could change everything Through this OMB proposal, the system that helps decide what gets funded is being dismantled. There are many troubling elements buried in this proposal, but three provisions stand out in particular. Each would be damaging alone. Together, they would change what kind of science gets done in America, and who it serves. 1. Political appointees would decide which science gets funded, and peer review would be explicitly sidelined or ignored. The guidelines your doctor follows, the standards that determine what’s in your air and water, the drugs that get approved for your family: all of it starts with a funding decision. Right now, that decision is made by scientists who can evaluate whether the work is actually sound and whether it could move the needle forward. Under this proposal, funding decisions could be made by political appointees. The careful, expertise-driven review process that shapes grant funding would be effectively sidelined. That means that a poorly designed study could get funded simply because someone in a political office liked the sound of it, while rigorous, important work doesn’t get funded because it no longer aligns with the administration’s priorities. In other words, critical work that benefits all of us could now be missed just because it has become politically inconvenient. 2. Grants could be canceled at any point, without warning, in the middle of ongoing work. Say your tax dollars have been paying for a cancer study for two years. The grant was awarded for five years, so the team is mid-experiment. There are three additional years’ worth of answers that could change how the disease is treated for hundreds of thousands of people. With this new rule, the federal government could cancel the remaining funding tomorrow, walk away from the commitment it made with your money, and have no legal obligation to finish what it started. This is a huge waste of money. There are rarely other sources of funding for this work, which means the team, the graduate students, postdocs, and research staff who have dedicated years of their careers to this project could lose their jobs. Patients who have contributed their time to studies may not see it turn into useful learnings for others. Every hour of work already completed could result in nothing useful. Science can take decades to get to tangible outcomes. It needs a stable funding system to flourish. 3. Researchers would have a harder time communicating their findings without pre-approval from the federal government. There is a saying from Sir Mark Walport: “Science isn’t finished until it’s communicated.” Science is no use to anyone if it is kept locked away in the labs that produced the data. The proposed rule could make communicating research findings harder in a number of ways: Make it harder for scientists to widely share their findings in scientific journals. Publication costs, including journal fees that allow for broad public access, could not be paid for by federal funds which is often how scientists pay these costs. Restrict researchers from engaging publicly about how their findings should inform policy or public health guidelines. This would restrict scientists from doing the work that transforms years of lab work into decisions that actually affect people’s lives. Make it harder for scientists to attend conferences. Conferences would now need to be approved by the federal agency at the time of grant award. This disadvantages conferences or publications that are not politically aligned. Conferences are a key way in which scientists learn about work happening in their field so they can collaborate and build on each other’s findings. What good is science with a muzzle? The long-term impact These changes could (and hopefully would) be reversed under the next administration. But by then, damage has been done. Once projects are halted or denied funding by political appointees, people leave their science careers for other paths or even leave the country to do their amazing science elsewhere. You cannot pause a scientific study the way you pause a subscription you decided isn’t useful anymore. You cannot freeze a research team that depends on salaries to feed their families, causing a scramble for replacement funding that, in most cases, simply does not exist. When the money stops, everything stops, and all the work in progress and its potential are lost. Despite all of the language about reducing waste, fraud, and abuse, this new proposed rule increases the administrative burden tremendously. Every researcher watching this unfold will make a rational decision: don’t start anything that will take a decade to finish. This includes not building a team around funding that could vanish, or asking the big questions that need patience and stability to answer. The most consequential science, the kind that produces the treatments and the breakthroughs that reach your doctor’s office twenty years from now, is exactly the science that would be abandoned first. This is still a proposal, so we can all do something Some worry this rule is already a done deal. But by law, OMB is required to open a public comment period. Those comments matter because they inform members of Congress, they can be used in litigation, and they create a public record. So here’s what you can do: Submit a public comment. The public comment period on this proposed change is open until July 13. Anyone can submit a comment, and OMB is required to respond to substantial ones. Each comment must be different to count as distinct; identical comments will be counted only once. Comment as an individual, not on behalf of your organization. Here’s a full resource to help you, with useful examples, but in general: Share a story about how science or federal funding has benefitted you or is involved in your work. Are you or someone you loved a cancer survivor? Do you know someone with Alzheimer’s? Have you received NIH/NSF or other federal funding? All of these can be stories you use to highlight why you care. Explain why you’re worried about these proposed changes. You can use the wording found here or in other resources to help you. Ask them to withdraw this proposed rule. Contact your elected representatives. Congress allocates money to federal agencies to spend, and it has oversight of how that process works. You can let your representatives know this proposed change concerns you and ask them to intervene. There are levers they can push that can help at this moment. Let others know why federal funding matters. This isn’t just about science, but ALL federal grants, including for education systems, defense projects, and more. The process, including the importance of federal funding, is invisible to many. We can all make it more visible by sharing how science benefits us and why we value it. You can also share this article, or any of the resources linked here, to help spread awareness! Bottom line We are quickly losing ground in scientific research in the U.S. More changes, like the proposed rule by OMB, would decimate our ability to conduct research here, leaving us all worse off: fewer treatments for pancreatic cancer, less research on pollution impacts, fewer answers for patients with rare disease, and more unaddressed health needs. The impact will be very real for all of us, regardless of where we stand politically. Using our voices for science is more important than ever. Love, LM Big thanks to Dr. Megan Ranney for reading this over and providing brilliant insights, as always. Dr. Liz Marnik, PhD, is Executive Director of The Evidence Collective at YLE and a science communicator and immunologist working at the intersection of public trust, science, and public health. You can find her on Substack, LinkedIn, Instagram and Threads. Your Local Epidemiologist (YLE) comprises a team of experts, ranging from physicians to immunologists to epidemiologists to nutritionists, working together with one goal: to “Translate” ever-evolving public health science so that people are well-equipped to make evidence-based decisions. The YLE suite of newsletters reaches over 475,000 people across more than 132 countries. This newsletter is free to everyone, thanks to the generous support of fellow YLE community members. To support the effort, subscribe or upgrade below: Subscribe
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Local sports loses ‘heart, soul, voice’ and a friend
Old-timers called him the “heart, soul and voice” of Hazleton-area sports, and they weren’t wrong. I called Ron Marchetti my friend. Separated by a generation but bonded by an unabashed, unwavering love of faith, family, friends, com…
Controversial Gene Therapy for Alzheimer’s Disease
Glial-to-neuron conversion therapy decreases inflammation and restores the brain-blood barrier in Alzheimer’s disease model macaques.
Scientists found the hidden switch fueling alzheimer’s brain inflammation
Scientists at Scripps Research have uncovered a molecular “switch” that appears to fuel the damaging brain inflammation seen in Alzheimer’s disease. They found that a protein called STING becomes chemically altered in a way that keeps the brain’s immune system stuck in overdrive, harming the connections between nerve cells.
Protein traffic jams may explain aging, memory loss, and Alzheimer’s
Scientists at Stanford may have uncovered a hidden reason our brains decline with age. Studying the ultra-short-lived turquoise killifish, researchers discovered that the cellular machinery responsible for building proteins begins to jam and malfunction over time. Tiny structures called ribosomes start colliding and stalling while reading genetic instructions, triggering a chain reaction that leads to faulty proteins and harmful clumps linked to diseases like Alzheimer’s.
Ozempic may be reshaping the brain, scientists say
The research has implications for addictive behaviors and diseases of aging such as Alzheimer’s.
Ozempic may be reshaping the brain, scientists say
The research has implications for addictive behaviors and diseases of aging such as Alzheimer’s.
Cowboys HC Schottenheimer looking to 4th dimension to gain advantage
In order to gain any advantage, Brian Schottenheimer is making a major change.
Montevideo Wanderers vs. Danubio - Live Score
View the Montevideo Wanderers vs. Danubio game played on June 05, 2026. Box score, stats, play-by-play timeline, highlights, odds & more
Scientists create supercharged vitamin K that helps the brain heal itself
Scientists in Japan have created powerful new vitamin K-based compounds that may help the brain regenerate lost neurons — a breakthrough that could one day change how diseases like Alzheimer’s and Parkinson’s are treated. By combining vitamin K with components related to vitamin A, the researchers developed compounds that were about three times more effective at turning neural stem cells into neurons than natural vitamin K alone.
Advancing CAR-T Cell Science in Lupus: Meet the First Recipients of the Lupus Research Alliance–Genentech Fund
The inaugural recipients of the Lupus Research Alliance (LRA)– Genentech Award on Immune Resetting Therapies for Lupus (LGA-IRT) are… Anne Davidson, MBBS, The Feinstein Institutes for Medical Research Chimeric antigen receptor (CAR)-T cell therapy can lead to long-lasting remission in lupus, but it is not yet clear how it works at a cellular level or […]
Banner Health report shows Arizona research driving national medical innovation
Milestones in Research details 1,300 clinical and translational research studies, FDA-approved heart device, landmark Alzheimer's prevention work Dr Wilber Su Wilber Su, MD, cardiologist for Banner Health, in the operating room. Phoenix, May 26, 2026 (GLOBE NEWSWIRE) -- Banner Health's $80.5 million research enterprise delivered breakthrough treatments to Arizona patients in 2025 while advancing wide-ranging therapies toward FDA approval, according to the organization's annual Milestones in Rese
USC scientists discover a hidden Alzheimer’s trigger and a possible way to shut it down
USC researchers have identified potential new drug compounds that may reduce the brain inflammation linked to Alzheimer’s disease, especially in people with the high-risk APOE4 gene. The compounds target cPLA2, an enzyme that seems to fuel harmful inflammation while also being important for normal brain activity.
Experimental Alzheimer’s drug could reduce alcohol withdrawal damage, researchers say
Researchers say an experimental Alzheimer's drug may calm brain inflammation linked to alcohol withdrawal, potentially reducing relapse and neural damage.
Lawmakers discuss rising antisemitic threats in political campaigns
Rep. Byron Donalds, R-Fla., and Rep. Josh Gottheimer, D-N.J., address the rise of antisemitism permeating 2026 political campaigns.
Astros vs. Cubs Series Primer with Ryan Sweeney of Marquee Sports Network
Former Major Leaguer Ryan Sweeney, who serves as studio analyst on Chicago’s Marquee Sports Network, sits down to preview the Astros upcoming series with the Cubs at historic Wrigley Field. Q: When it’s all said and done, could the Cubs have the best rotation in all of baseball this season? A: Cubs have had a […]
Novartis says Avidity's science could apply beyond muscular dystrophies
Novartis eyes Alzheimer's and Parkinson's as it looks to expand the AOC platform acquired in its $12 billion Avidity Biosciences buyout.
4 takeaways from the DNC's long-awaited 2024 election autopsy report
It's never a good sign when a report comes with a big red disclaimer at the top of each page, but that's what happened on Thursday when the Democratic National Committee belatedly released its controversial autopsy report on the 2024 election.
Take-Two rallies after confirming Grand Theft Auto 6 will be released on November 19
Take-Two confirms GTA 6 launches Nov 19; Oppenheimer projects 40M units and $3.45 FY27 non-GAAP EPS. See winners like TTWO, SONY, MSFT.
Takeaways From the Democratic National Committee's Long-Awaited Autopsy Report on 2024 Election
WASHINGTON (AP) — It's never a good sign when a report comes with a big red disclaimer at the top of each page, but that's what happened on Thursday when the Democratic National Committee belatedly released its controversial autopsy report on the 2024 election. “This document reflects the views of ...
Scientists discover hidden weakness shared by hundreds of cancer mutations
Scientists have unveiled a powerful new tool called PerturbFate that could change how researchers tackle diseases driven by huge numbers of genetic mutations, including cancer and Alzheimer’s. Instead of trying to target every faulty gene individually, the system tracks how different mutations reshape cells over time and identifies the hidden “control hubs” where those pathways converge.
Apple Executive Eddy Cue Named Cannes Lions Entertainment Person Year
The veteran Apple executive will accept the honor in Cannes next month and deliver a keynote address alongside producer Jerry Bruckheimer.
Scientists found a hidden Alzheimer’s trigger and shut it down
A newly identified enzyme called IDOL could become a major new target in the fight against Alzheimer’s disease. Researchers found that removing it from neurons sharply reduced amyloid plaques and improved key brain processes linked to resilience and communication between cells. The discovery may lead to future treatments that go beyond slowing Alzheimer’s — potentially helping protect the brain from further decline.
Scientists discover why Alzheimer’s risk hits women so much harder
Women may be especially sensitive to the effects of common dementia risk factors, according to a new UC San Diego study of over 17,000 adults. Researchers say tailoring prevention strategies specifically for women could be key to reducing Alzheimer’s risk.
Primer Raises $100M Series C to Bring AI to Every Payment and Accelerate US Expansion
Primer raises $100M Series C led by Sofina to scale its AI-enabled payments infrastructure platform and accelerate US expansion.
'A hidden blood pump': How chewing more boosts your brain
While it's widely known that chewing more improves digestion, research suggests it can also boost our brains and even help fend off Alzheimer's.
Scientists reverse Alzheimer’s in mice with breakthrough nanotechnology
A new nanotechnology treatment reversed Alzheimer’s symptoms in mice by restoring the brain’s natural cleanup system. The specially engineered nanoparticles helped clear toxic amyloid proteins from the brain and repair the blood-brain barrier, which normally protects and regulates the brain’s environment. In one striking experiment, elderly mice treated with the therapy later behaved like healthy younger mice.
Scientists reversed memory loss by recharging the brain’s tiny engines
Researchers have shown for the first time that malfunctioning mitochondria — the cell’s energy generators — may directly cause cognitive decline in neurodegenerative diseases. By creating a new tool that temporarily boosts mitochondrial activity in the brain, scientists restored memory performance in mouse models of dementia. The discovery hints that energy failure inside neurons could happen before brain cells die, potentially offering a new target for future Alzheimer’s treatments.
Colorado county Republican chair arrested in sting on allegations he tried to pay for sex with a child
Hunter Rivera, the 24-year-old chairman of the Weld County Republican Party, was one of two men arrested Thursday on suspicion of trying to buy sex from Larimer County Sheriff’s Office investigators who posed as minors as part of an operation targeting child predators. After news of Rivera’s arrest broke late Friday, multiple prominent Republicans denounced […]
The Lancia 037 Tribute Just Got A 1,000 HP V8 From Koenigsegg
Kimera's K39 swaps the brand's twin-charged four-cylinder for a Koenigsegg-sourced twin-turbo V8 making 1,000 hp
Better brain health linked to resilience against early Alzheimer's in adults 65 to 80
A healthy brain may help protect thinking and memory skills from the early effects of Alzheimer's disease, a new study has found. Dementia is currently the leading cause of death in Australia and Alzheimer's ...
Challenging your mind can help maintain brain health. Here are steps the Alzheimer's Association recommends.
How does diet impact brain health? Alzheimer's Association shares nutrition tips with cognitive function in mind.
This daily habit could lower dementia risk by 35%, scientists say
A huge long-term study found that drinking two to three cups of coffee a day was linked to a much lower risk of dementia, especially before age 75. Researchers say caffeine may help keep brain cells active while reducing inflammation and harmful plaque buildup associated with Alzheimer’s disease. But more coffee wasn’t better — the protective effect appeared to level off after moderate intake.
iOS 27 to Bring Customizable Camera App, Tweaks to Weather, Safari and Liquid Glass
Apple plans to make the Camera app more customizable in iOS 27, reports Bloomberg. Users will be able to select the features they want to see in the Camera app, like flash, exposure, timer, depth of field, photo styles, and resolution. Camera controls, labeled as widgets, will be able to be placed at the top of the Camera interface in any order. Users will be able to select widgets from a transparent widget tray that comes up from the bottom of the app.
How can movement boost your brain health? Alzheimer's Association unveils new daily challenge
Medicare’s miss on Alzheimer’s drug spending
Far fewer seniors than expected are taking costly Alzheimer's drugs.
Power & Politics: One-on-one with Sen. Cory Booker; Congressman Josh Gottheimer discusses latest resolution; AI data center protests continue
Senator Cory Booker and Congressman Josh Gottheimer join the show.
Are Tokens The New Currency? A Primer For Business
How CEOs can effectively harness token use for business success, while managing practices such as tokenmaxxing.
New infusion therapies can put cognitive decline on pause. What Louisianans should know about brain health.
Learn about the five pillars of healthy brain aging and the latest research on cognitive decline, Alzheimer's disease, and strategies for maintaining brain health through lifestyle changes.
Women’s Health Watch: Maria Shriver explains the gender disparity in Alzheimer’s research
Science diplomacy lessons from a North Korean volcano
Mount Paektu, a mythic, active volcano on the border between North Korea and China, is almost the epitome of a scientific challenge that crosses political lines. In 946 CE, it erupted in one of the five biggest volcanic events of the past 10,000 years, kicking up huge quantities of ash and sending destructive mud flows down river channels for hundreds of kilometres. Should this happen again, the entire region, including easternmost Russia, South Korea and even Japan could be hit. “It’s definitely got the potential to be big,” said James Hammond, a professor of geophysics at Birkbeck, University of London. An eruption on the scale of 946 would have “huge regional impact.” For the past 15 years, Hammond has helped lead a groundbreaking collaboration with North Korean scientists to study the volcano, navigating scientific sanctions, tough export controls on scientific equipment and a long, pandemic-enforced exodus from the country. Although he seems more at home on far-flung research expeditions – before speaking to Science|Business, Hammond was camping out on a Greenland ice sheet – he has also advised the European Commission on its changing science diplomacy strategy. His long experience with North Korea has made Hammond sceptical of blanket bans on science collaboration, no matter the country.This is a live question in Europe, where in the wake of Russia’s 2022 invasion of Ukraine, institutional ties with Russian universities were almost entirely severed, although some scientists fear this could undermine our understanding of climate change’s impact on the Arctic. Here, Hammond tells the story of the Mount Paektu mission and the policy lessons he takes from it. Ominous rumblingsThe genesis of Hammond’s collaboration came in 2002, when Mount Paektu began to rumble ominously. Earthquake activity picked up and the volcano began to emit unusual gases. North Korean scientists took notice. “People felt we need to know more about this volcano,” said Hammond. In 2011, North Korean vulcanologists put out a request for international expertise to help them learn more. At the time, Hammond and his collaborator, Clive Oppenheimer, were working on a vulcanology project in another sanctioned country, Eritrea, and so decided to answer the call. Within a month, they had flown into Pyongyang. “It was pretty incredible,” recalls Hammond (left). “We were made to feel like honoured guests, and invited to official celebrations.” The scientific opportunity was huge. Paektu is unusually positioned, a thousand kilometres from where tectonic plates rub against each other in the Pacific. “It was an incredibly interesting volcano, but not much research had been done, at least not in the international community,” he said. “There was so much we felt we could do. And we had these partners that were super keen to engage.”The mission received an unusual visitor in the form of volcano-obsessed filmmaker Werner Herzog, who accompanied Hammond and Oppenheimer while directing his 2016 film Into the Inferno about volcanos across the world. Four days into the trip, the German director delivered a long speech about reunification to his North Korean hosts, recalls Hammond. “He got to the heart of the Koreans and how they felt, and how they thought, in a way that I'm not sure I ever will,” he said. UN sanctionsHowever, Hammond realised he’d been “naïve” about how difficult it would be to collaborate with North Korea, which was sanctioned far more heavily than Eritrea. “We didn’t fully appreciate the all-encompassing nature of restrictions,” he said. In 2016, as tensions escalated over Pyongyang’s nuclear tests, a United Nations resolution banned all joint scientific work with North Korea. However, the UN sanctions did allow countries to request carve outs, and the UK successfully requested an exemption for Hammond’s work. Related articlesEU pushes for joint science diplomacy, but care needed to avoid gridlock, experts sayRussia severs its last ties with German scienceAnchor Greenlanders in Arctic climate research, experts tell EU ahead of policy updateExport controls have also delayed Hammond’s work. In one case, it took 18 months to get approval from the UK government to take seismometers, which measure earthquakes, to North Korea. “It was frustrating,” he said. “But they didn’t just say no.” However, one instrument, called an induction coil, used to measure how the earth conducts electricity, was blocked entirely because it can in theory be used to detect submarines. Karaoke bondingSince the collaboration started in 2011, Hammond has visited the country around 15 times, although the pandemic closed off North Korea for more than five years. A trip last November was Hammond’s first since the outbreak. Despite this lengthy interlude, Hammond has deep bonds in the country. The North Korean scientists Hammond works with are somewhat isolated, as they struggle to access the latest research papers and travel to international conferences. That said, they are “excellent geophysicists” and are “very well trained in the field,” he said. Over karaoke and chats about their families, “we’ve made friendships, for sure,” he said. The authorities have to sign-off things like the placement of seismometers, for example, but Hammond said these requests have been approved. “Everything that we've asked for within a scientific context has been delivered.”Scientific backchannels? These kind of personal links between scientists across political lines are one purported benefit of science diplomacy. During the Cold War, some historians argue, scientific contact between the US and Soviet Union laid a groundwork of trust for other cooperation, such as on arms control. Hammond agrees that backchannel contacts to North Korean geophysicists are hardly likely to defuse a military crisis on the Korean peninsula, but the simple fact of the scientific collaboration makes contacts between diplomats that little bit easier. “It creates opportunities to understand each other a little bit better,” he said. “When maybe you have those more difficult discussions as diplomats, it's coming from a slightly better place.” Cutting tiesDrawing lessons from the Mount Paektu mission for today’s links with Russian science isn’t simple. The analogy is far from exact, Hammond said, “because one is essentially a Cold War, versus a pretty hot war in the case of Russia.” But Hammond’s broader argument is that the challenges we face, such as climate change, pandemics, biodiversity loss, pollution and so on, have globalised in an unprecedented way, making blanket shutdowns in collaboration with any country unwise.He’s somewhat critical of the UN scientific sanctions imposed on North Korea in 2016, even though they did allow for exceptions. “I think a blanket halt to some of these things, when we face big global challenges [. . .] that’s quite a risky thing to do,” he said.Institutional endorsement?European academics are still by and large free to work individually with Russian counterparts. However, official, institutional partnerships have largely ended. Shortly following the full-scale invasion of Ukraine in 2022, Russian university rectors wrote a public letter endorsing the war, meaning European universities fear official collaboration could also be seen as a kind of endorsement. Hammond acknowledges there is a risk of legitimising regimes, and state-controlled universities, through scientific cooperation. “That’s the trade off you have to make,” he said. Strategic projectsWith Russia, instead of giving a green light to restart all Arctic science, a middle ground might be firing up a few carefully selected “strategic” projects, said Hammond. After all, European countries are still collaborating with Russia on the International Thermonuclear Experimental Reactor, an experimental nuclear fusion plant in the south of France. However, even if Europe did try to revive Arctic science with Russia, there’s no guarantee Russian scientists would play ball. A series of high-profile arrests of physicists in Russia accused of sharing their findings with the outside world has made collaboration fraught. Even before the invasion of 2022, “the Russian regime made it increasingly difficult, and this sort of discouraged people,” Dag Rune Olsen, rector of the Arctic University of Norway, told Science|Business last year.
New WAM Grants Support Research on Gut-Brain Interactions, Menopause and Sarcopenia
The Women’s Alzheimer’s Movement (WAM) at Cleveland Clinic has awarded grants for promising research in sex-based differences in the disease.
RELEASE: “Josh on the Job” — Gottheimer Visits Local Buffalo Wild Wings to Meet with Small Business Owners, Employees, and Customers
Above: Gottheimer working in the kitchen with staff. FAIR LAWN, NJ — Congressman Josh Gottheimer (NJ-5) visited Buffalo Wild Wings GO in Fair Lawn to meet with local franchise owners and employees, helping prepare and serve food for Jersey customers as part of his “Josh on the Job” series highlighting small, locally owned businesses across North […]
China builds first ‘coal battery’, war on Alzheimer’s: 7 science highlights
From a zero emission ‘coal battery’ to China’s war on Alzheimer’s, here are some highlights from SCMP’s recent science reporting.
Eggs and brain health: New study cracks open Alzheimer’s link
A long-term study suggests that eating eggs regularly may be associated with a lower risk of developing Alzheimer’s disease in older adults.
Cowboys news: Brian Schottenheimer on wearing the ‘green dot’
All the Dallas Cowboys news that’s fit to print.
GUEST OPINION: What if politics practiced the spirit of aloha?
In today’s political climate, public discourse often feels more like combat than conversation. Citizens are divided, leaders trade insults instead of ideas, and the tone of our national, state and local dialogue grows increasingly harsh. It seems to me that many Americans are unconcerned with the vitriolic and polarizing behavior of our government leaders and […]
Man destined to get Alzheimer’s saved by accidental heat therapy
Doug Whitney has a genetic mutation that means he should have developed Alzheimer’s disease decades ago, but his long-term work in hot engine rooms may have protected him in a similar way to sauna therapy
This simple amino acid supplement greatly reduces Alzheimer’s damage
A new study suggests a surprisingly simple compound could help fight Alzheimer’s disease. Researchers found that arginine—an inexpensive amino acid already considered safe—can reduce the buildup of toxic amyloid proteins in the brain, a hallmark of the disease. In animal models, oral arginine not only lowered harmful protein deposits but also improved behavior and reduced brain inflammation.
Cowboys news: UDFA signing drawing praise from Brian Schottenheimer
The latest Cowboys news.
Alzheimer’s drugs may not work and could raise brain risks
Drugs designed to clear amyloid beta from the brain—once seen as a promising path to slowing Alzheimer’s—may not actually help patients in any meaningful way, according to a major review of over 20,000 participants. Even more concerning, they may increase the risk of brain swelling and bleeding, sometimes without obvious symptoms.
The weird rise of people who are their own twin | BBC Science Focus Magazine
A condition that leaves people with two sets of DNA may be on the rise – and it’s posing thorny questions for families and forensic science.
Curing U.S. Health Care, Part II
On March 23, 2010 President Barack Obama signed the Patient Protection and Affordable Care Act — usually referred to either as the Affordable Care Act or as Obamacare — into law. Joe Biden, then the vice president, could be overheard whispering “This is a big fucking deal.” And it was. The ACA, which went into full effect in 2014, created a system of subsidies and regulations designed to make health insurance available to many Americans who had previously been left out. It worked: In 2010 there were 47 million uninsured people in America, but by 2016 this number had dropped to 27 million. This still fell short of the universal health insurance that every other advanced nation has, but it was real progress. In 2017, during his first term, Donald Trump tried to destroy the ACA, replacing it with the American Health Care Act — legislation that would have eliminated most of the provisions that expanded health insurance under Obama. At the time the Congressional Budget Office projected that the G.O.P.’s replacement bill would nearly double the number of Americans without health insurance, increasing the total uninsured population by 23 million and undoing all of the progress achieved under the ACA. However, the attack on Obamacare failed by one vote in the Senate, and the ensuing public backlash against the G.O.P. delivered a large victory in the 2018 midterms to the Democrats. After these developments many observers assumed that the ACA had become a more or less permanent feature of American life. Such assessments, however, failed to take into account the deep hostility of the U.S. right toward policies that expand access to healthcare. As we’ll see, this hostility goes back generations. And the second Trump administration has taken actions that the CBO projects will add 16 million people to the rolls of the uninsured by 2034. How did we get here? And now what? Today’s primer will analyze the political economy of U.S. healthcare since the 1940s and the combination of danger and opportunity created by the current crisis. Beyond the paywall I will discuss the following: US health care on the eve of Trump II 80 years of US health politics The Obamacare story The new assault on healthcare
Boosting one protein helps the brain fight Alzheimer’s
Scientists have discovered a way to help the brain clean itself of harmful Alzheimer’s plaques by activating its own support cells. By increasing a protein called Sox9, researchers were able to boost the activity of astrocytes, star shaped cells that help maintain brain health. In mice that already showed memory problems, this approach reduced plaque buildup and preserved cognitive function over time.
From brain health to diabetes: 3 reasons to get your vitamin D levels checked
In this study roundup, Medical News Today compiles the latest evidence on the benefits of Vitamin D, focusing on the key findings from 3 studies on diabetes, IBD, Alzheimer's disease.
Horror maestro Eli Roth lists the 5 films that scared him most
When you talk with horror movie maestro Eli Roth about the films that inspired him most, and scared him most, he begins with a necessary disclaimer. “Every time you watch a horror movie, it gets le…
The Next Alzheimer’s Breakthrough Will Take More Than Just Science
At WIRED Health, pioneering Alzheimer's researcher John Hardy outlined the stakes—and next steps—of where treatment is headed next.
Scientists restore memory by blocking a single Alzheimer’s protein
Researchers have identified a new potential weapon against Alzheimer’s: blocking a protein called PTP1B. In mice, this approach boosted memory and helped brain immune cells clear harmful plaque buildup. Since PTP1B is also linked to diabetes and obesity—both risk factors for Alzheimer’s—it could offer a broader treatment strategy.
Why Christopher Nolan's 'The Odyssey' won't be longer than 'Oppenheimer'
Christopher Nolan explained why 'The Odyssey' won't be longer than his previous film, the three-hour 'Oppenheimer.'
Sony clarifies recent PlayStation DRM update
PlayStation fans and gaming preservations have been alarmed since late last week that a new 30-day timer attached attached to newly-purchased digital games for PlayStation 4 and 5 might render those games unplayable if the system they’re on is offline for longer than a month. But a rep from Sony told Game File today that new system will require only a single online check before it functions as a perpetual license for the digitally purchased game. That is consistent with a newer theory that emerged by gamers testing the 30-day timer over the last two days. “Players can continue to access and play their purchased games as usual,” a rep for PlayStation told me over email. “A one-time online check is required after purchase to confirm the game’s license, after which no further check-ins are needed.” The rep’s explanation squares with the current understanding among players about what’s happening. A multi-day mystery A post last Friday by YouTuber Lance MacDonald spread awareness over the 30-day timer. Quickly, players began stress-testing the system, removing a battery within their PlayStations and checking what would happen if their systems were offline past the timer window. They noticed that setting a PS4 or PS5 to be the “primary” console—a common Sony-authorized method to retain rights to a digital game—wasn’t overriding the 30-day limit. On Tuesday came the breakthrough: A gamer called Andshrew on the Resetera forums posted the results of some tasting. They found that digital games purchased on PS4/PS5 after some time in mid-April would get a 30-day timer that could then be removed and replaced with a perpetual license that would allow the game to be played offline. The transition to the perpetual license occurred some number of days after the digital game was purchased and the system was connected to the internet. They believed that a PlayStation’s online check-in would trigger the license change no sooner than 15 days after the user had purchased the game. This synced with the theory that Sony’s new system is related to the 14-day window that PlayStation users have to request a refund for digitally purchased games. The new timer/check-in system could be a way to defeat some exploit in that refund system, some users theorized. Game File is a reader-supported publication. To receive new posts and support my work, consider becoming a free or paid subscriber. Subscribe In a follow-up, I asked the Sony rep if the 15-day timeline is accurate or if the perpetual license can be activated sooner after purchase. If they share more, I’ll update this post. Sony has not said why they’ve introduced the timer and whether it is designed to stop people from exploiting the refund system. But their explanation suggests that this new DRM method should not result in long-term loss of access to digitally purchased games, just because a PlayStation is offline for a month or Sony’s servers are down. Xbox flashback For many some gamers, the initial reporting of the 30-day timer conjured memories of Microsoft’s disastrous May 2013 announcement of the Xbox One, which was going to require an internet-connected check-in once a day, lest your games become unplayable.1 After widespread backlash, Microsoft abandoned that plan, ahead of the Xbox One’s launch. 1 Fun fact: That 24-hour check-in detail was my scoop from an interview I had that day with then-Xbox exec Phil Harrison. I was EiC of Kotaku at the time and rushing from one Xbox One preview appointment on Microsoft’s campus to another. I phoned the news in to reporter Jason Schreier, who wrote it up for the site.
10 things you can do every day to support your brain health
Many health factors can influence brain function later in life, according to the Alzheimer's Association's annual report. Here's what to know.
UT Health San Antonio researchers awarded grant to study how circadian rhythm disruptions may contribute to Alzheimer’s - UT Health San Antonio
UT Health San Antonio researchers awarded grant to study how circadian rhythm disruptions may contribute to Alzheimer’s
UT Health San Antonio researchers awarded grant to study how circadian rhythm disruptions may contribute to Alzheimer’s - UT Health San Antonio
Environmental stressors like jet lag, high-fat foods suspected as disease risk Contact: Steven Lee, (210) 450-3823, lees22@uthscsa.edu Content provided by Claire Kowalick SAN ANTONIO, April 27, 2026 – Can jet lag cause more than just sleep loss? Do quick-grab, high-fat foods associated with late-night or rotating work shifts bring more than indigestion? Those circadian […]
Most Americans value brain health, but a new Alzheimer's report finds few know how to protect it
According to the survey released this month, 9 in 10 adults aged 40 and older said brain health is a top priority, on par with physical health. But only about 1 in 10 actually know how to maintain it.
Patients say they want Alzheimer’s blood tests. Doctors aren’t sure they help.
A survey of nearly 600 adults found that 85% would get an Alzheimer's blood test if their doctor recommended it.
Brain health: Alzheimer's 2026 new report on cognitive impairment & dementia in Tennessee
An estimated 7.4 million Americans age 65 and older are now living with clinical dementia due to Alzheimer's disease, according to a newly released report from