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Sony Pictures Invests in Cosm Dome Venues in Major Deal

Cosm venues feature a unique dome shape, delivering a fresh experience for live events and theatrical screenings.

Jun 24 • 2:00 PM EDT • Entertainment • hollywoodreporter.com

Sony Pictures Invests in Cosm Dome Venues in Major Deal

Cosm venues feature a unique dome shape, delivering a fresh experience for live events and theatrical screenings.

Jun 24 • 2:00 PM EDT • Business • hollywoodreporter.com

Financing the Future: Leaders Make the Investment Case for Women's, Children's and Adolescents' Health

With development assistance declining and health systems under growing strain, leaders at Africa Health ExCon called for a shift from fragmented financing to integrated, sustainable investment in women’s, children’s and adolescents’ health. Discussions highlighted domestic financing, private sector engagement, service integration and climate-resilient health systems as pathways to greater impact.

Jun 24 • 8:00 AM EDT • Health • pmnch.who.int

Automakers could halt car sales in California without delay in vehicle tracking law

A group representing major automakers warned on Tuesday ​that car companies may be ‌forced to halt sales of both new and used vehicles ​in California on July ​1 unless the state delays ⁠vehicle technology rules that ​aim to prevent perpetrators of ​domestic violence from tracking survivors.

Jun 23 • 7:39 PM EDT • Business • reuters.com

Earth’s oldest asteroid impact struck 3 billion years ago

While scientists are revising the timeline at Australia's North Pole Dome, it's still our oldest known crater.

Jun 23 • 6:00 PM EDT • Science • popsci.com

Tandy's Wales prepare for challenging summer of travel

Welsh domestic rugby might have finished at the end of May but there is very little rest for the Welsh national men's side this summer.

Jun 21 • 11:33 PM EDT • Sports • sports.yahoo.com

'Toy Story 5' crushes the box office on opening weekend

"Toy Story 5" grossed an estimated $160 million domestically and $152 million internationally after debuting in theaters on Friday.

Jun 21 • 1:05 PM EDT • Business • businessinsider.com

\'Toy Story 5\' rakes in the biggest box-office debut of the year with a franchise-best $160 million

“Toy Story” still has a friend in moviegoers. The fifth installment in the Pixar series debuted with $160 million in domestic ticket sales, according to studio estimates Sunday. That easily

Jun 21 • 1:03 PM EDT • Entertainment • lancasteronline.com

How Vancouver's instantly iconic Science World soccer ball came to be

But one of the biggest stars of the World Cup in Vancouver isn't an athlete or even a person. It's a 41-year-old, 17-storey geodesic dome.

Jun 21 • 11:00 AM EDT • Science • vancouversun.com

Driver fleeing from police crashes into South Side business

A man wanted for robbery and domestic violence fled from police Saturday evening, crashed his vehicle into a business and then escaped pursuing officers...

Jun 21 • 8:37 AM EDT • Business • post-gazette.com

Opinion: Trump's 'Drill, baby, drill' serves himself, oil companies

“Drill, Baby Drill” domestic oil production was supposed to protect us from international price fixing, bad behavior in the Middle East. It hasn't.

Jun 21 • 5:04 AM EDT • Health • citizen-times.com

Suspect fleeing officers crashes into Pittsburgh business & gets away on foot, police say

The man was wanted on felony charges of robbery and domestic violence.

Jun 20 • 10:38 PM EDT • Business • wpxi.com

Bell County sheriff’s deputies shoot man while responding to mental health crisis call

The Bell County Sheriff’s Office says deputies shot and injured a suspect Friday afternoon while responding to a reported violent domestic disturbance east of Holland.

Jun 19 • 4:50 PM EDT • Health • kwtx.com

Teti identified as Milan’s latest option for sporting director

Milan’s hunt for a senior management team continues and the latest reports claim that Domenico Teti is the latest name under consideration for the role of sporting director in San Siro.Teti the late...

Jun 19 • 12:45 PM EDT • Sports • sports.yahoo.com

Mood darkens among German auto suppliers as investment, hiring fall, survey shows

German automotive suppliers expecting ​business conditions to worsen over the next year now outnumber the industry's ‌optimists, a survey showed on Wednesday, as domestic hiring sinks to a new low and investment in the sector moves overseas.

Jun 17 • 12:02 AM EDT • Business • reuters.com

Aderholt bill funding health, education includes millions for Alabama hospitals

A U.S. House Committee passed a bill to fund domestic spending on health and education programs, including millions for Alabama hospitals.

Jun 15 • 8:44 AM EDT • Health • aldailynews.com

“Disclosure Day ”lands out-of-this-world opening weekend with $93 million at global box office

While Steven Spielberg's extraterrestrial drama invades the world, 24-year-old Curry Barker's low-budget horror "Obsession" achieves a rare domestic feat.

Jun 14 • 5:15 PM EDT • Entertainment • yahoo.com

Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?

Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.

Jun 14 • 3:14 PM EDT • Technology • newsletter.semianalysis.com

Steven Spielberg's 'Disclosure Day' opens No. 1, while 'Obsession' sensation continues

Steven Spielberg’s “Disclosure Day,” billed as his first popcorn movie in years, launched with $44 million in domestic theaters. “Disclosure Day” opened largely as expected, collecting $92.9 million worldwide over

Jun 14 • 12:46 PM EDT • Entertainment • messenger-inquirer.com

Steven Spielberg’s ‘Disclosure Day’ opens No. 1, while ‘Obsession’ sensation continues

NEW YORK (AP) — Steven Spielberg’s “Disclosure Day,” billed as his first popcorn movie in years, launched with $44 million in domestic theaters, according to studio estimates Sunday. “Disclosure Da…

Jun 14 • 12:46 PM EDT • Entertainment • kark.com

Steven Spielberg's 'Disclosure Day' opens No. 1, while 'Obsession' sensation continues

Steven Spielberg’s “Disclosure Day,” billed as his first popcorn movie in years, launched with $44 million in domestic theaters.

Jun 14 • 12:46 PM EDT • Entertainment • news4jax.com

Steven Spielberg's 'Disclosure Day' opens No. 1, while 'Obsession' sensation continues

NEW YORK — Steven Spielberg’s “Disclosure Day,” billed as his first popcorn movie in years, launched with $44 million in domestic theaters, according to studio estimates Sunday.

Jun 14 • 12:46 PM EDT • Entertainment • indianagazette.com

Opinion | This Conservative Insider Is Skeptical That the G.O.P. Can ‘Buck Historical Trends’ in the Midterms

Why “top Republicans should actually be more concerned.”

Jun 12 • 11:00 AM EDT • Politics • nytimes.com

NFL reportedly will not punish Chiefs DB coach Dave Merritt after offseason arrest for domestic battery

Dave Merritt has coached Chiefs' defensive backs since 2019.

Jun 12 • 8:26 AM EDT • Sports • sports.yahoo.com

Marketing genius or own goal? Science World soccer ball free advertising for Adidas, FIFA

The giant soccer ball installed over the Science World dome in Vancouver has prominent Adidas and FIFA branding on it, even though neither organization paid into the project.

Jun 11 • 8:00 AM EDT • Science • cbc.ca

Social Security is Facing a Political Crisis

On Tuesday the Social Security Trustees released their latest report on the system’s finances. The numbers didn’t change much: Unless something is done, the Old Age Survivors and Disability Insurance (OASDI) program, Social Security’s official name, will be unable to pay full benefits starting in either 2032 or 2034, depending on some technical issues. That’s not far away: If the Trustees are right, the prospect of a Social Security crisis will loom over the next presidential administration. It’s important to understand, however, the nature of the looming crisis. It won’t be an economic crisis. It won’t even be a serious fiscal crisis. Whatever you may have heard, Social Security isn’t in danger of going bankrupt. What we’re facing, instead, is potential political crisis. Congress and the White House could easily take action to sustain America’s retirement system. But given the current state of our politics, there’s no guarantee that they will. There is a widespread misunderstanding of how Social Security works. While Social Security was designed to look like a pension fund, it isn’t. A pension fund pays benefits out of a stock of assets it has accumulated over time. In contrast, Social Security operates as a government transfer program, like food stamps or Medicaid. Now, unlike food stamps — but like the highway trust fund — Social Security is on paper supported by a dedicated tax, the payroll tax, that is assigned to that program. But I say “on paper” because from an economic point of view assigning the payroll tax to Social Security is just an accounting convention. What matters for the U.S. economy is the overall balance between government spending and government revenue, not the difference between one type of spending and one source of revenue. So there’s no inherent economic significance to the fact that by 2034 payroll tax receipts will be insufficient to cover promised benefits. There is, however, a legislative issue. As long as the Social Security Administration can pay benefits out of payroll taxes and its cash reserve, there’s no need for Congress to vote each year to authorize benefits — they just keep going out until further notice. However, once those resources become insufficient, benefits will fall —by 17 percent according to the Trustees — unless Congress passes new legislation that “tops up” Social Security’s finances. Yet the current administration and Republican party are such extremists that there is a real risk that Social Security will be held hostage on behalf of their goals. If this should come to pass, the hostage-takers will claim that shoring up Social Security is unaffordable. Right on cue, Mike Johnson, the Trump-sycophant Speaker of the House, declared on Monday that “entitlement programs” like Social Security “have to be adjusted and fixed,” and that Republicans will introduce a plan to that effect next year. But this is a ploy, because while the cost of maintaining Social Security benefits at their promised level isn’t trivial, it is in fact affordable. According to the Trustees’ report, the actuarial balance of OASDI up through 2050 — the amount of additional funds it would need to keep paying full benefits for the next 25 years — is 1.06 percent of GDP. To put that number in perspective, the Trump administration proposes increasing military spending next year by $420 billion, equivalent to about 1.4 percent of GDP – without any discussion of whether that’s affordable Yet how did we get to the point where Social Security will need to be topped up? The main answer is that we have an aging population, with a growing ratio of retirees collecting benefits to workers paying into the system: Trump’s anti-immigration policies are making this problem worse. According to the Trustees’ report, lower immigration will deepen Social Security’s financial hole because many immigrants are working-age adults who will pay into the system for decades before they collect benefits. In fact, this problem may be much bigger than the report acknowledges: The report’s baseline assumption is that we’ll have net immigration of almost 1.2 million people a year, and even the pessimistic case assumes 750,000 a year. Meanwhile actual net immigration has already been cut far below that — and may now be negative. Moreover, Social Security is being financially damaged by growing income inequality in America. Payroll taxes are levied only on wages up to $184,500, and they don’t touch capital income. With the distribution of income increasingly shifting from labor to capital, as well as becoming more unequal among wage-earners, revenue from the Social Security payroll tax has been falling as a share of national income. From 1990 to 2024, it fell from 5.02 percent of gross domestic income to 4.46 percent. Which brings me to the question that, these days, we ask about everything: How might Social Security be affected by the advent of AI? A short answer: If, as many of us fear, AI accelerates rising income inequality, it will further reduce the payroll tax receipts that currently pay for Social Security and further endanger its finances. On the other hand, if AI, as its advocates promise, leads to faster economic growth, it will increase the potential tax base that could and should be used to support Social Security and other social insurance programs. But to take advantage of that larger base, we’ll have to get serious about taxing wealth and capital income. Is Social Security in trouble? Yes, but only because of the way its financing is currently structured — a structure that no longer works well because our society and economy have become so unequal. Moreover, Trump’s immigration policies are further endangering its already deteriorating financial condition. So don’t believe Republicans’ gaslighting that it will be necessary to cut Social Security benefits. All that is necessary to preserve Social Security is political will to raise taxes on the wealthy and a sensible immigration policy. MUSICAL CODA Actually 67 under current law.

Jun 11 • 6:34 AM EDT • Politics • paulkrugman.substack.com

Visceral fat loss associated with better long-term cardiometabolic, cognitive health | Harvard T.H. Chan School of Public Health

Irrespective of weight loss, maintaining a lower level of visceral fat—fat stored deep within the abdomen, wrapping around vital organs—may lead to better long-term cardiometabolic and cognitive health, according to two new Harvard Chan School studies.

Jun 10 • 12:01 PM EDT • Health • hsph.harvard.edu

NYC congressional candidate laments ‘obsession’ with Israel in politics

Micah Lasher says he is 'exhausted' with incessant discourse surrounding Jewish state, urges more focus on domestic issues

Jun 9 • 9:06 PM EDT • Politics • timesofisrael.com

Rams OT Alaric Jackson reportedly arrested for felony domestic battery

Jun 9 • 11:57 AM EDT • Sports • sports.yahoo.com

Small Businesses Outgrow Domestic Payments as Global Sourcing Spreads

An entire generation of American small- to medium-sized businesses (SMBs) have been conducting multinational operations without multinational

Jun 9 • 4:00 AM EDT • Business • pymnts.com

DA Larry Krasner publicly criticized Mayor Cherelle Parker as he flirts with running for her office

Krasner took a letter to Parker's office saying that he needs an additional $5.6 million from the city to bolster shootings investigations, domestic violence prosecutions, and victim services.

Jun 8 • 4:20 PM EDT • Politics • inquirer.com

Ex of “Bad Boys” actress Theresa Randle claims she broke into his home, assaulted him

Randle was previously detained on suspicion of felony domestic violence in March.

Jun 7 • 8:30 PM EDT • Entertainment • yahoo.com

‘Backrooms’ Projected To Drop 67% In Business At Weekend 2 Box Office

The reboot of the Wayans Bros.’ horror spoof "Scary Movie" is scaring away "Backrooms" after one week at the top of the domestic box office.

Jun 5 • 7:12 PM EDT • Business • forbes.com

Phoebe Bridgers announces no-phone tour, concerts at Intuit Dome

Phoebe Bridgers will set out on the international Lost Tour in September, with two dates over Halloween weekend at Inglewood's Intuit Dome.

Jun 5 • 5:22 PM EDT • Entertainment • latimes.com

Chrome Sets Browser Speed Records on M5 MacBook Pro

Google's Chrome browser hit new records on browser benchmarking tools Speedometer 3.1 and JetStream 3, Google said today. Chrome earned a score of 61 on Speedometer, a five percent improvement since last year. It earned a 469 on JetStream 3, a 10 percent improvement since the beginning of 2026. Tests were done on an M5 MacBook Pro running macOS 26.0.1. Google says it holds a dual record across all browsers, beating every other Mac browser, including Safari.

Jun 5 • 1:38 PM EDT • Technology • macrumors.com

Sheinbaum’s Cool-Headed Tone Takes Fiery Turn Against US Meddling

President Claudia Sheinbaum, who won praise for her cool-headed approach to dealing with Donald Trump, is adopting a more aggressive tone against what she describes as US attempts to interfere in Mexican domestic politics.

Jun 5 • 1:20 PM EDT • Politics • bloomberg.com

Science is HERE All Summer at The Tech Interactive

San Jose’s Science Center Announces Packed Lineup Headlined by Summer Camp, Tech Topple, DOME Series, Workshops, and Tech at Nite The Tech Interactive is bringing a summer full of hands-on science experiences to downtown San Jose, featuring STEM camps, immersive dome shows, interactive exhibits, workshops, and family-friendly activities designed for visitors of all ages. Learn more at https://www.thetech.org San Jose, CA, June 04, 2026 (GLOBE NEWSWIRE) -- Summer is HERE at The Tech Interactive,

Jun 4 • 6:35 PM EDT • Science • finance.yahoo.com

NC House Democrats propose 3 judicial constitutional amendments

Subscribe to Under the Dome to get North Carolina politics news in your inbox daily.

Jun 4 • 5:00 AM EDT • Politics • newsobserver.com

National Security Without Consensus: Taiwan’s Domestic Politics Through 2028

As Taiwan faces mounting military pressure from Beijing, Simona Grano argues that the greatest security risk is not military pressure but the domestic political fragmentation undermining its defense strategy ahead of the 2028 elections.

Jun 3 • 6:19 PM EDT • Politics • asiasociety.org

The Texas Business Court - A New Forum for Complex Disputes

By Byron F. Egan A key driver behind the DExit movement is Texas’s investment in a specialized forum for complex business disputes. The Texas Business Court represents a significant shift in how commercial litigation is handled in the state.

Jun 3 • 10:00 AM EDT • Business • jw.com

South African rand slips on renewed Gulf hostilities, sour business PMI

The South African rand weakened in early trading on Wednesday as renewed tensions in the Gulf ​rattled sentiment after U.S.-Iran talks stalled, while domestic ‌investors also digested a business survey pointing to a contraction in activity.

Jun 3 • 3:51 AM EDT • Business • reuters.com

Bologna announce Tedesco as new coach, replacing Italiano

Serie A side Bologna announced on Tuesday Domenico Tedesco would take over as coach to replace Vincenzo Italiano, who left last week."Bologna announces that it has appointed Domenico Tedesco as first team technical director," the club said in a statement, adding the coach had signed a two-year contract with an option for a further year.

Jun 2 • 8:11 AM EDT • Sports • sports.yahoo.com

FIFA introduces new rule that could affect Arsenal

FIFA has introduced several new rules ahead of the 2026 World Cup, with some of the proposed changes expected to be adopted by domestic leagues around the world from next season. If implemented, one o...

Jun 2 • 7:00 AM EDT • Sports • sports.yahoo.com

Immersive theater upgrade: Orlando Science Center’s Dome reopens

Experience the fully revamped Dome by Dr. Phillips Charities at the Orlando Science Center, featuring 8K laser projection, enhanced sound, and more.

Jun 1 • 3:59 PM EDT • Science • wftv.com

Howard Stern's longtime cohost Robin Quivers is cancer-free after 14 years: 'I never gave up hope'

Robin Quivers, Howard Stern's longtime cohost, announced on Monday that she is cancer-free after struggling with endometrial cancer since 2012.

Jun 1 • 1:53 PM EDT • Entertainment • ew.com

Gravity Circuit 2 announced for PS5, Switch, and PC

Publisher Dear Villagers and developer Domesticated Ant Games have announced side-scrolling action platformer sequel Gravity Circuit 2. It will launch for PlayStation 5, Switch, and PC via Steam an…

Jun 1 • 1:00 PM EDT • Technology • gematsu.com

AMC Entertainment Records Its Highest Domestic and Global May Attendance Since 2019

AMC Entertainment welcomed more than 4.2 million moviegoers to its U.S. AMC Theatres and internationally at its ODEON Cinemas this past weekend, from Thursday through Sunday. Combined with totals from prior weeks, AMC saw 25.5 million guests at their domestic and global locations in the month of May, making the month the highest-attended month of […]

Jun 1 • 11:47 AM EDT • Entertainment • boxofficepro.com

Happy Harry's RibFest brings heat to summer entertainment lineup

“It’s probably our strongest four nights of entertainment," said Fargodome Director of Marketing & Sales Sarah Dykema.

Jun 1 • 8:53 AM EDT • Entertainment • inforum.com

25.5M people visited AMC theaters in May, the most since 2019

Six films topped $75M openings as AMC drew 25.5M guests in May, its strongest May since 2019, with 4.2M last weekend and more releases coming.

Jun 1 • 8:00 AM EDT • Entertainment • stocktitan.net

AMC Entertainment Records Its Highest Domestic and Global May Attendance Since 2019

LEAWOOD, Kan., June 01, 2026--AMC Entertainment (NYSE: AMC), the largest theatrical exhibitor in the United States and the world, welcomed more than 4.2 million moviegoers to its U.S. AMC Theatres and internationally at its ODEON Cinemas this past weekend, from Thursday through Sunday. After yet another strong weekend at the box office in May, both domestically and globally AMC Entertainment received 25.5 million guests at our theatres, recording the highest-attended month of May since 2019.

Jun 1 • 8:00 AM EDT • Entertainment • finance.yahoo.com

Transition to electric vehicles in Brazil and Mexico driven by domestic politics and global pressures, study shows

The transition to electric vehicles in Brazil and Mexico has been driven by domestic politics and global pressures, a new study says. Decisions have been made in both countries shaped by factors beyond ...

Jun 1 • 7:00 AM EDT • Politics • techxplore.com

Flannery O’Connor book probes how mother grew author’s legacy on family farm

Flannery O'Connor is a central figure in Southern fiction whose work has been oft dissected. But “Flannery and Regina” focuses on a novel angle: her Andalusia domestic life.

Jun 1 • 6:00 AM EDT • Entertainment • ajc.com

AMC Entertainment Records Its Highest Domestic and Global May Attendance Since 2019

More Than 25 Million Moviegoers Attend AMC Theatres and ODEON Cinemas in the month of May 2026, the highest May attendance since 2019 More Than…...

Jun 1 • 4:00 AM EDT • Entertainment • investor.amctheatres.com

Sheinbaum Accuses US of Interfering in Mexico’s Politics

Mexican President Claudia Sheinbaum launched her strongest criticism to date against what she says are blunt US attempts to interfere in Mexican domestic politics.

May 31 • 3:32 PM EDT • Politics • bloomberg.com

Bears $5B Domed Stadium Plan Hits Make-or-Break Day in Illinois

Political negotiations are going down to the final hours in Illinois.

May 31 • 3:25 PM EDT • Sports • sports.yahoo.com

Atlanta airport parking is getting a big boost

The seven-level, $441 million Domestic Terminal South Parking Deck is a far cry from its over-40-years-old predecessor.

May 30 • 6:00 AM EDT • Business • ajc.com

Best Buy Ups Quarterly Entertainment Sales 38%

Best Buy May 28 reported a 38.1% surge in first-quarter (ended May 2) same-store entertainment sales, compared with a 15.2% decline in the previous-year period. The entertainment segment, which includes video game hardware and software, books, music CDs and computer software, saw revenue of $577.4 million, or 7% of Best Buy’s domestic revenue of $8.2 … Continue reading "Best Buy Ups Quarterly Entertainment Sales 38%"

May 28 • 9:29 AM EDT • Entertainment • mediaplaynews.com

Sterling drops as Middle East tensions, domestic politics weigh

Sterling slipped for a third straight day against both the euro and the dollar, as investors focused on Middle East tensions and lingering domestic political ​concerns.

May 28 • 5:28 AM EDT • Politics • reuters.com

Hip-hop and EDM stars to perform alongside first-ever X Games League championship. See who.

The first-ever X Games League championships includes three days of events at the Superdome and two nights of concerts at the Smoothie King Center.

May 27 • 5:01 PM EDT • Entertainment • nola.com

The world’s largest domestic sporting union announces first-of-its-kind fertility care

The Athletic explores the intersection of professional soccer and motherhood.

May 27 • 1:00 AM EDT • Sports • nytimes.com

Packers' Josh Jacobs arrested on domestic violence charges, denies allegations

Jacobs faces five charges after turning himself into police

May 26 • 6:55 PM EDT • Sports • cbssports.com

Gov. DeSantis signs HAVEN Act, expanding protections for domestic, dating violence

Under the soon-to-be effective measure, Florida will study a first-in-the-nation silent alert system for victims unable to safely call 911.

May 26 • 6:23 PM EDT • Politics • floridapolitics.com

Unsung hero? Biggest disappointment? Fans rate your club's season

BBC Sport's Premier League club fan writers assess their team's performance as the domestic season comes to an end.

May 26 • 2:14 PM EDT • Sports • sports.yahoo.com

$140,000 E.V.s and Heritage Gold: The Rise of China’s Homegrown Luxury Market

As China’s economy slows, consumers are increasingly turning to domestic luxury products, challenging the dominance of long-established European brands.

May 25 • 12:01 AM EDT • Business • nytimes.com

Hidden in bubbles: Scientists discover how sneaky seals dodge tourists

"These wet, less accessible and inconspicuous domes may not only provide refuge against human disturbance but also play a role as resting sites."

May 23 • 10:40 PM EDT • Science • yahoo.com

Nottingham Forest v Bournemouth: Key stats and talking points

Bournemouth visit Nottingham Forest on Sunday knowing they are already assured of a first European adventure next season – but they need a number of results to go their way to land a place in the Champions League. It was Forest who enjoyed their own continental quest this year, with an impressive run to the Europa League semi-finals providing a welcome distraction to their domestic woes. Vitor Pereira took over from Sean Dyche in February and has steered the Tricky Trees to safety thanks in no small part to an eight-game unbeaten run that ended with a 3-2 defeat by Manchester United last week.

May 23 • 8:25 AM EDT • Sports • sports.yahoo.com

Black Women, Beauty Politics and the Power of Rage in 'Is God Is'

In one of the film’s most surreal scenes, the twins at the center of *Is God Is*—Racine, “the Rough One,” and Anaia, “the Quiet One”—pretend to be strippers for a room full of men. But while Racine is welcomed, Anaia is rejected because her scarred face disrupts the men’s fantasies. That moment crystallizes one of the film’s central questions: What happens when Black women refuse to shrink themselves for the comfort of others? In Aleshea Harris’ Gothic revenge thriller, ugliness becomes both a burden and a source of power, as the film transforms into a stereotype-busting meditation on misogynoir, beauty politics and righteous rage. As the twins travel cross-country seeking vengeance against the father who burned their mother alive, Harris layers the conventions of the revenge genre with distinctly Black feminist aesthetics. The film moves between absurd comedy, trap music, intimate sisterhood and brutal violence while interrogating the ways Black women are expected to manage their pain, suppress their anger and perform acceptability. Anaia’s scarred face and Racine’s consuming rage become mirrors of the same misogynoir that shapes Black women’s lives—whether through beauty standards, domestic violence or the demand to remain silent. What makes *Is God Is* so striking is its refusal to look away from the “ugly.” Harris insists that Black women marked by violence, scars and fury still deserve visibility, complexity and even divinity. The film embraces the “angry Black woman” and the “ugly” Black woman as figures worthy of space, power and humanity. In doing so, it expands the tradition of Black feminist filmmaking by asking viewers to confront the realities dominant culture would rather ignore—and to recognize the beauty, dignity and selfhood that exist beyond respectability.

May 23 • 7:57 AM EDT • Politics • msmagazine.com

French Business Confidence Languishes Below Long-Term Average

French business confidence remained weak in May, adding to evidence that the fallout from the Iran war is weighing on domestic demand in the euro area’s second-largest economy.

May 22 • 2:45 AM EDT • Business • bloomberg.com

Could the secret to diagnosing endometriosis be hiding in plain sight?

Although menstrual blood is typically discarded, researchers are beginning to use it to reveal new clues about women’s health.

May 21 • 8:00 PM EDT • Health • nationalgeographic.com

India's domestic politics a 'bottleneck' to China+1 ambitions: Analyst

Abhijnan Rej, Designated Partner at Tarqeq Research says India and China’s relationship has both a "ceiling" and a "floor". He adds that there's 'strategic distrust' between the two countries which limits how far ties can go, but economic complementarities and shared support for a multipolar world ensure continued cooperation in some sectors.

May 21 • 4:03 AM EDT • Politics • cnbc.com

Cows can tell humans apart, new study finds

Domestic bovines watching videos of humans will stare at unfamiliar faces longer than faces they know.

May 20 • 2:00 PM EDT • Science • popsci.com

Iowa State scientists have helped pinpoint the origin of cotton

Scientists, including Iowa State researchers, pinpointed where upland cotton was first domesticated in Mexico thousands of years ago.

May 20 • 7:02 AM EDT • Science • desmoinesregister.com

New drug approach offers hope for patients with recurrent aggressive cancers

Merck announces that sac-TMT, a new cancer drug, demonstrated strong results in phase 3 trials for advanced or recurrent endometrial cancer patients.

May 19 • 11:52 PM EDT • Health • foxnews.com

A hidden barrier to starting a family

Endometriosis is a widespread disease affecting at least one in eight women, often leading to infertility, which can be prevented with earlier diagnosis and treatment.

May 18 • 1:30 PM EDT • Health • thehill.com

Dominican Republic: Global leadership in health requires domestic consistency and an end to racial discrimination

As it assumes the presidency of the world’s leading global health forum, President Abinader’s government has the responsibility to demonstrate that its international leadership translates into real guarantees, without racial discrimination.

May 18 • 12:01 PM EDT • Health • amnesty.org

View: Why we need to domesticate Africa’s health algorithm

As AI transforms medicine, African countries risk becoming the raw material for a revolution whose benefits flow elsewhere.

May 18 • 6:56 AM EDT • Health • semafor.com

Guardiola's final farewell?

It's the beginning of a defining week for Manchester City and Pep Guardiola, with Monday and Tuesday deciding whether the Premier League title race goes to the wire or comes to an abrupt halt. Arsenal face already-relegated Burnley later and City know they are likely to need to collect three points at Bournemouth on Tuesday, otherwise it will all be over. City have already won the FA Cup and Carabao Cup this season, but can they make it a domestic treble?

May 18 • 6:45 AM EDT • Sports • sports.yahoo.com

Ronda Rousey entered Gina Carano fight injured

Former UFC women's bantamweight champion Ronda Rousey only needed 17 seconds to finish women's mixed marital arts pioneer Gina Carano at the Intuit Dome in Inglewood, Calif. on Saturday. The two met in the featured fight of Most Valuable Promotions and Netflix's debut MMA event. It ...

May 18 • 1:50 AM EDT • Sports • sports.yahoo.com

“Michael ”won't stop 'til it gets enough, as it rockets back to No. 1 at domestic and global box office

The King of Pop became the king of the big screen again after a month in theaters, raising an additional $83 million in week 4.

May 17 • 6:40 PM EDT • Entertainment • yahoo.com

'City keep going from strength to strength'

"Just when you count them out, they still win two domestic trophies and are challenging for the Premier League," the former England international said. Another Wembley victory for City sees Guardiola's trophy tally at the club reach a massive 20 in his 10 years at the club. Speaking on BBC One after the final whistle, former Newcastle United striker Alan Shearer said: "It might not have been a vintage performance, but Manchester City have had to work incredibly hard for it."

May 17 • 8:23 AM EDT • Sports • sports.yahoo.com

Sooo ... About Last Night

Last night (Sat., May 16, 2026), Netflix hosted its first-ever MMA event, the MVP MMA 1 card from Intuit Dome in Inglewood, California. It was great to have another player in the MMA scene! MVP MMA’s inaugural event brought an exciting mix of legendary names from years past as well as some truly excellent up-and-coming […]

May 17 • 3:00 AM EDT • Sports • sports.yahoo.com

Rousey vs. Carano Start Time, Full Fight Card Details!

Ronda Rousey and Gina Carano will headline Jake Paul’s debut mixed martial arts (MMA) event, as MVP MMA 1 is set to go down later tonight (Sat., May 16, 2026) inside Intuit Dome in Los Angeles, California (full results here). In the co-main event of the evening — which will be streaming live on Netflix […]

May 16 • 7:45 AM EDT • Sports • sports.yahoo.com

Britain's pound, stocks and bonds fall on political uncertainty, global inflation angst

British government bonds, stocks and sterling fell on Friday, ​as domestic political uncertainty clashed with global worries about an inflationary shock, leaving UK ‌assets in the mire.

May 15 • 4:01 AM EDT • Politics • reuters.com

Colorado legislators pass bill to strengthen sex crime victim protections

A Colorado bill that supporters say would strengthen victim protections and mandate law enforcement training on how trauma can affect survivors of sex crimes and domestic violence is on its way to Gov. Jared Polis’ desk for signing. Senate Bill 26-095 recently passed unanimously in the Senate and was mostly unopposed in the House, where […]

May 14 • 6:58 PM EDT • Politics • coloradopolitics.com

907 Sports: Spring Sports Teams That Stand Unbeaten

More than halfway through the spring sports seasons, there are just a few unbeaten teams remaining in soccer and baseball. Plus, we check an a growing activity called ‘air pitch soccer’ that took over Anchorage’s Dome over the weekend.

May 14 • 1:44 AM EDT • Sports • alaskasnewssource.com

Museum of Science Fulldome Show Remixed: The Unexpected Side of Science Wins Best Science Film at 2026 Dome Fest West

BOSTON, May 13, 2026--The Museum of Science has been awarded the Best Science Film Award at the 2026 Dome Fest West, a leading international festival celebrating fulldome cinema and immersive media, for its original fulldome production Remixed: The Unexpected Side of Science.

May 13 • 3:26 PM EDT • Science • finance.yahoo.com

Trump picks Daniel Domenico for 10th Circuit vacancy

President Donald Trump announced on Monday that U.S. District Court Chief Judge Daniel D. Domenico is his choice to fill an upcoming vacancy on the Denver-based federal appeals court. Domenico, who is 54 this year, is Trump’s only appointee to Colorado’s federal trial court. He became its chief judge in March, after seven years on […]

May 11 • 7:44 PM EDT • Politics • coloradopolitics.com

House ethics panel pledges ‘full and thorough’ investigation of Rep. Cory Mills

The Republican, whom President Donald Trump has endorsed for another term, has denied domestic violence and other allegations and sought to portray them as politically motivated.

May 11 • 5:19 PM EDT • Politics • washingtonpost.com

Briarcliff Closes Domestic On ‘Christmas At The Kringles’ For Holiday Wide Release

EXCLUSIVE: Briarcliff Entertainment CEO Tom Ortenberg has acquired domestic distribution rights to Christmas At The Kringles, a genre-bending holiday comedy currently in production in Los Angeles. Pic...

May 11 • 12:53 PM EDT • Entertainment • yahoo.com

Biggest VAR call ever?

The most consequential decision in the history of the video assistant referee in the Premier League was played out over four minutes 11 seconds of nerve-shredding drama inside London Stadium. Darren England had to pore over the most significant domestic VAR decision since its inception in 2019 before sending referee Chris Kavanagh to the screen. VAR decisions have been important before - but none have been quite so heavy, with the consequences potentially giving Arsenal a decisive push towards their first Premier League title in 22 years, while at the same time sending West Ham towards the Championship.

May 11 • 3:22 AM EDT • Sports • sports.yahoo.com