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Padres Snap 8-Game Losing Streak With Win Over Dodgers
Manny Machado’s three-run blast and dominant pitching from JP Sears propelled the San Diego Padres past the Los Angeles Dodgers.
GentleBrook to operate mobile Snapology franchise
GentleBrook has entered a franchise agreement with Unleased Brands to launch a mobile, Snapology-branded education program.
GentleBrook to operate mobile Snapology franchise
GentleBrook has entered a franchise agreement with Unleased Brands to launch a mobile, Snapology-branded education program.
Yordan Alvarez blasts walk-off homer on July 4 for second time in career as Astros snap Rays' 9-game win streak
Just as he did in 2022, Alvarez brought the holiday fireworks, this time with a swing that capped a two-dinger, six-RBI performance.
Huntsville gaming business making a big splash in the hobby industry
One of the most popular gaming businesses in north Alabama is Mastermind Gaming.
Importance of firework safety with CHI Health
Eric Jensen with CHI Health's Burn Unit shares important firework safety reminders ahead of holiday celebrations.
Rieder Meat Market in Delano closing after more than 110 years of business
Decatur Square businesses thrive during 2026 FIFA Men's World Cup and WatchFest: "...beyond our wildest imagination"
Local restaurants and bars in Decatur Square are reporting record crowds and sales as soccer fans flock to the area for World Cup matches and WatchFest events.
Schumer pushes to delay SNAP cuts, warns of costs falling on county budgets
Schumer appeared in Wyoming County Thursday.
Feds pull Iowa's 'healthy food' SNAP waiver
A federal waiver allowing Iowa to restrict the types of food that can be purchased with SNAP has been vacated.
Millennials Are Buying Blue Collar Small Businesses To AI-Proof Their Future
Young entrepreneurs are snapping up baby boomer-owned plumbing, construction, manufacturing and HVAC companies. Plus: Tips for would-be buyers and sellers.
Heritage Valley Health System merges with Allegheny Health Network
A major healthcare merger is now official.
Victoria Aveyard’s ‘Tempest’ In The Works As TV Series
Chernin Entertainment has snapped up the television rights for The Red Queen author Aveyard’s move into adult fantasy.
Rumor: Metroid Ravenous leaked for Nintendo Switch 2
Metroid Ravenous has apparently been leaked for Nintendo Switch 2. A listing for the game supposedly surfaced within Brazil’s Ministry of Justice and Public Security system. The page has already been removed, but not before a screenshot was taken. Here’s a snapshot of the classification: The listing doesn’t provide any specific details about the game. However, the classification indicates 2026...
Bundesliga Soccer Rights in India Snapped Up by Zee Entertainment
Zee Entertainment secures exclusive Bundesliga soccer rights in India for five years, starting with the 2026-27 season.
Civalli strikes out 13, Nationals snap Red Sox's 5-game win streak with 8-1 rout
Cade Civalli gave up one hit in seven innings and had a career-high 13 strikeouts in the Washington Nationals' 8-1 victory over the Red Sox on Tuesday night, snapping Boston's five-game winning streak.
Affordable Healthcare Emerges as a Voter Priority in Purple Nevada
The Trump administration’s cuts to Medicaid and SNAP may complicate Republican Gov. Joe Lombardo’s reelection chances.
NC’s first full budget since 2023 reflects transformed health policy landscape
North Carolina's first full budget since 2023 reflects Medicaid expansion, Healthy Opportunities Pilot funding, SNAP changes and new federal health policies.
US Flag & Signal a true ‘red, white and blue’ business
PORTSMOUTH, Va. (WAVY) — When you first step into U.S. Flag & Signal, you can’t help but notice a theme going on, but then again, red, white and blue have been the team colors here for mo…
Strengthening Collaboration between Workforce, Health, and Human Services to Meet New Federal Requirements
Human Services Policy Advisors Institute | June 24th, 2026 H.R. 1, or “The One Big Beautiful Bill”, introduced significant changes to work requirements across major health and human services programs. including expanding the populations subject to SNAP time limits, reducing state/territory SNAP waiver flexibility, and creating new work requirements in Medicaid. These changes accelerate the […]
Mpls council member cites 'mass shootings, federal occupation' for mental health leave
Minneapolis City Council member Aisha Chughtai said on Monday that she plans to take a month-long break from city activities to seek care for her mental health, citing stressors such as an election, mass shootings and a federal occupation as stressors for her condition.
NM U.S. Rep. Vasquez, a Democrat, urges state Health Care Authority to bring down SNAP error rate
U.S. Rep. Vasquez (D-N.M.) sent a letter Friday chiding NM leaders for errors administering the Supplemental Nutrition Assistance Program.
White Sox Minor League Update: June 28, 2026
The Barons get the W and snap a losing streak thanks to a four-hit, five-RBI day from Caleb Bonemer
RedMagic officially confirms global launch of flagship OLED tablet
RedMagic has confirmed the Astra 2 as its next flagship gaming tablet. The device will arrive as the international version of the China-bound RedMagic Gaming Tablet 5 Pro, which is confirmed to feature a 185Hz OLED display and the Snapdragon 8 Elite Gen 5 chipset.
Washington Nationals vs Baltimore Orioles Game Thread
Follow along as the Nats look to snap their 4 game losing streak and get back to .500
The weekend of Andy Burnham’s life - Live Updates
If England wins the World Cup, one pollster says the new prime minister should call a snap election.
Private Equity Firms Are Snapping up Portugal’s Family Businesses
As a generation of entrepreneurs hits retirement age, they’re preparing to sell up to overseas investors.
‘Snapdragon 8 Elite Gen 6 Pro’ needed more words to prove its power, three other flagship chips coming
Qualcomm’s Snapdragon chipset lineup is eternally confusing, with slight variations generating new names and options that aren’t all that different....
Professor Willow’s Birthday Research
Starts Tuesday, July 21, 2026, at 10:00 AM Local Time Ends Tuesday, July 21, 2026, at 8:00 PM Local Time Wish Professor Willow a very happy birthday with Professor Willow’s assistant Pikachu! This adorable Pikachu makes their Pokémon GO debut as part of the Willow’s Birthday Research event along with GO Snapshots, raids and more […]
Growing sinkhole in Houston's Third Ward raising safety concerns for business owner, neighbor
A growing sinkhole behind a property on Scott Street in Houston’s Third Ward is raising concerns for a longtime business owner and her neighbor.
Two NC lawmakers, a Democrat and a Republican, push Congress to delay SNAP changes
Above the federal penalty threshold, NC could owe $140M a year, putting at risk a program that helps over 1.2 million North Carolinians.
Largo to launch open-container entertainment district near new City Hall
The city of Largo is establishing a specialized entertainment district that allows visitors to carry alcoholic beverages outdoors by the end of the summer.
Griffin Jax Leads Rays Past Royals 5-3 as Tampa Bay Snaps Two-Game Skid
The Rays snapped their two-game skid with a 5-3 win over the Royals as Griffin Jax continued to shine in the rotation. Tampa Bay also got key contributions from Jonathan Aranda, Yandy Díaz, and Jonny DeLuca, while Bryan Baker locked down his 20th save of the season.
Amherst Chamber of Commerce hosts annual Business Expo
The 5th annual Amherst Area Chamber of Commerce Business Expo was held tonight in the Amherst area, providing a venue for businesses to connect with community members.
Travis Kelce's Journey: From Rookie to NFL Superstar and His Life with Taylor Swift
Travis Kelce is entering his 14th season in the NFL, all of which have been with the Kansas City Chiefs. After being selected No. 63 overall in the third round of the 2013 NFL Draft by Kansas City, Kelce played only a single special teams snap as a rookie, in a Week 2 game against the Dallas Cowboys. The seven-time All-Pro has set all-time marks for the Chiefs, such as surpassing Hall of Fame tight end Tony Gonzalez's 10,940 career receiving yards (13,002) and passing three-time first-team All-Pro Priest Holmes' 83 total career touchdowns (85).
Game #80: A’s at Giants Game Thread
A’s Look to Snap Losing Streak
Upstate NY youth sports coach accused of sending indecent material to children through Snapchat
The 21-year-old faces six charges after allegedly sending inappropriate content to two minors over several weeks.
US: Google's YouTube settles teen mental health lawsuit
A Florida teenager said YouTube's addictive design contributed to depression, anxiety and sleep loss. Instagram, Snapchat and TikTok are also facing similar allegations about their impact on young users.
Microsoft releases smaller Surface Pro with cheaper price and 90 Hz display
Microsoft has released a new Surface Pro 2-in-1. Smaller than the new Surface Pro 12 that features a 13-inch display, the updated Surface Pro 12-inch features a 90 Hz display and a Snapdragon X Plus chipset, but only 8 GB of RAM.
Hot chicken is OK, but soda isn’t? Battle over SNAP scrambles red-blue politics.
Both parties have been enacting state-level bans on using SNAP benefits for soda and candy. On Monday, a federal judge said the new rules violate federal laws governing the food program.
Judge strikes down SNAP restrictions on soda and other items in 5 states
The judge said that her order applied to the programs in Colorado, Iowa, Nebraska, Tennessee and West Virginia
Obama-appointed judge torpedoes Trump’s bid to fight obesity as White House warns it won’t be ‘final say’
Obama-appointed judge strikes down Trump administration's SNAP soda ban, ruling USDA cannot redefine what Congress has already defined as food.
Samsung’s UFS 5.0 Doubles Read Speeds To 10.8 GB/s, And Qualcomm’s Snapdragon 8 Elite Gen 6 Has Already Locked In Support
Samsung's UFS 5.0 storage solution offers read and write speeds that are over twice as fast as those of the previous UFS 4.1 standard.
God of War Laufey Star Deborah Ann Woll Breaks Silence on a Massive 10-Year Secret: “I Still Pinch Myself”
Renowned actress Deborah Ann Woll, best known as Jessica Hamby in True Blood and Karen Page in Daredevil, has spoken with CGMagazine about her lead role in God of War Laufey as the titular character. In an interview conducted during Game Con Canada, Woll confirmed what Game Director Ariel Lawrence had revealed earlier this month: Head of Creative Cory Barlog had this game in mind even before the launch of God of War 2018, and there was already a poster featuring Laufey and Phranque (the cosmic cube). Related Story Unlocking the Snapdragon 8 Elite Gen 6 Pro’s Real Performance Will […]
When school’s out, who will feed the kids?
Eastern NC summer meal programs and pantries strive to keep hunger at bay for food-insecure children when school’s out as new federal restrictions have sent SNAP enrollment numbers plummeting.
RedMagic reveals new Lenovo Legion Tab Gen 5 rival with OLED display
The RedMagic Gaming Tablet 5 Pro has been revealed, and it's the company's answer to the Lenovo Legion Tab Gen 5. This Snapdragon 8 Elite Gen 5 pad with OLED display is set to launch in China on June 30, 2026.
Boyle Heights warehouse fire causing health concerns
Air quality remains unhealthy in areas surrounding the warehouse burning in Boyle Heights, five days after the cold storage facility caught fire. Los Angeles County Public Health officials have iss…
James Webb telescope finds a cosmic cloud of creation buried in the Sword of Orion — Space photo of the week
A new James Webb telescope snap shows off the glowing gas, sculpted jets and newborn stars lurking within the giant cosmic cloud OMC-2, located in the Sword of Orion.
Fernando Mendoza getting more comfortable taking snaps under center
"It's a great offense. I really believe in coach Kubak's offense," Mendoza said.
Minnesota man walks 1,776 miles for youth mental health awareness, resources
A Minnesota man is about to take on a 1,776-mile journey with a mission to help kids struggling with their mental health.
Citizen Science Lab brings hands-on STEM to Pittsburgh's Hill District
A state-of-the-art science and technology center opened in Pittsburgh's Hill District.
Snap gets a reality check as premium AR glasses drive stock slump
Snap unveils costly AR glasses amid inflation concerns and tough competition. Read more.
Are Snap's $2,195 smart glasses the next big thing in tech?
NPR's Steve Inskeep speaks with tech journalist Joanna Stern about the release of new augmented reality glasses from Snap and the future of wearable technology.
Discover Oshkosh showcases arts, entertainment and Lake Winnebago activities
(WFRV)- From music festivals to the world’s greatest aviation celebration, there are so many reasons to visit this area of Wisconsin. In this segment, Amy Albright and Anna Murphy-Pociask fro…
Qualcomm Is Copying Samsung Exynos 2600’s Heat Path Block For Snapdragon 8 Elite Gen 6 Pro, But Has Botched The Implementation
If imitation is the highest form of flattery, Qualcomm is certainly out to flatter Samsung by copying Exynos 2600's thermal tech.
Large fire tears through multiple businesses on Chicago's West Side
Thick smoke could be seen for miles as firefighters battled a large building fire on Chicago's West Side Friday morning.
Snap’s Specs look good on nobody
On The Vergecast: Snap Specs, Fox / Roku, and Facebook AI Mode.
Early-career scientists build national infrastructure to bridge science and policy
A new Special Report in the journal BioScience introduces the Scientist Network for Advancing Policy (SNAP), a student-led, nonpartisan, grassroots coalition founded in 2025 to empower early-career researchers ...
Snap's $2,195 AR glasses may have cost an insane amount to develop, analyst estimates
Snap stock has had a down week following the hyped reveal of its latest AR glasses.
The Knicks snapped their 53-year title drought. For the NYC area's other teams, the anguish continues.
The Knicks' NBA championship was vitally important because it marked the first title for a major North American sports league franchise based in the New York City area in 14 years.
Nashville mayor finalizing plans for Legacy Business Fund Program
O’Connell announced plans for his Legacy Business Fund Program in his State of Metro address in April. The program honors, elevates and supports longtime Nashville businesses that are loved b…
Troy businesses frustrated with road closures due to construction: "This is going to affect us"
Science fiction research conference underway at MSU
The Science Fiction Research Association Conference is now underway on Michigan State University’s campus.
Little Rock business owner warns others after alleged vendor event scam
A small business owner says she lost $305 after applying to what she now believes was a fake food truck festival advertised in an Arkansas Facebook group.
'Relief' for small businesses after St. Petersburg city council rejects parking changes
Parking continues to be a problem in St. Petersburg, especially in neighborhoods with popular restaurants and businesses. City leaders voted down a proposal that would have allowed specific neighborhoods outside of downtown to establish resident-only parking zones.
STCC breaks ground on $55M health school move
Springfield Technical Community College held a celebration this afternoon for a groundbreaking ceremony to mark the relocation of its School of Health and Patient Simulation.
Pittsburgh plans to expand co-response program, pairing police with mental health clinicians
After unveiling ridiculously expensive AR glasses, Snap's stock takes a dive
Snap's long awaited smart glasses debut hasn't exactly done wonders for the company's stock.
Sony unveils the Lytia 910, its first LOFIC sensor, and it boasts 100dB dynamic range
With Triple Conversion Gain, this sensor will snap HDR photos in one exposure - and it will record 4K 60fps HDR videos too.
Samsung phones are getting a new feature for checking the health of your pets.
During the VivaTech 2026 conference in Paris, Samsung announced a new feature for its mobile devices created through a collaboration with the pet health management platform, Lifet. You’ll be able to snap a photo of your dog or cat which will be analyzed by AI to alert you to conditions like periodontal disease and obesity. [Image: https://platform.theverge.com/wp-content/uploads/sites/2/2026/06/samsung.jpg?quality=90&strip=all]
Why the Vikings Quarterback Competition Could Backfire
The Minnesota Vikings concluded their mandatory minicamp last week, but Kevin O’Connell said the starting quarterback competition between Kyler Murray and J.J. McCarthy would continue into training camp. Just how long into training camp it would continue was a little vague. Equally ambiguous was O’Connell’s explanation about how snaps may be divided between the two […]
SNAP Stock Drops — Snap Launches AR Smart Glasses, But Retail Is ‘Skeptical’ On Over $2,000 Price Tag
Snap Inc. has officially opened preorders for Specs, a pair of standalone augmented reality glasses that blend digital content with the real world without requiring a smartphone.
5 New Apple Music Features Coming In iOS 27
iOS 27 isn't bringing any major changes to Apple Music, but as with the rest of the software, there are some improvements coming to make it feel snappier.
2026 Governors’ Health and Human Services Policy Advisors Institute
Health and human services policy advisors from states and territories across the country gathered in New Orleans for NGA’s annual HHS Policy Advisors Institute. Over one and a half days, advisors shared priorities, surfaced common challenges, and learned from peers on topics ranging from healthcare affordability to child welfare, SNAP administration, and the use of […]
Snap finally debuts its long awaited AR glasses, Specs, and, oof, they aren't cheap
After many years, Snap is finally launching its next consumer-focused smart glasses line.
Qualcomm Announces Snapdragon Reality Elite, Its New Flagship XR Chipset
Qualcomm just announced Snapdragon Reality Elite, its new flagship XR chipset, and it will debut in the compute puck of Xreal's Aura Android XR device this fall.
Snap unveils $2,195 AR glasses as CEO Evan Spiegel bets on post-smartphone future
Snap is launching its first AR glasses geared toward the broader public instead of developers.
Snap’s first consumer AR glasses are coming this fall for $2,195
Snap is finally launching augmented glasses for the public
Snap Opens Preorders For Specs, True AR Glasses Shipping This Fall For $2195
Snap just officially revealed and opened preorders for Specs, fully standalone true AR glasses shipping this fall in the US, UK, and France for $2195.
Whoopi Goldberg melts down, snaps on Ana Navarro during JD Vance's 'View' interview: 'Ana, God, please!'
Whoopi Goldberg snapped on 'The View' cohost Ana Navarro during a tense JD Vance interview. 'Ana, God, please!' Goldberg shouted, scolding Navarro in the process: 'Don't do that!'
Microsoft’s new Surface Laptop and Surface Pro upgrade to Snapdragon X2 and start at $1,499
Roughly two years after the last generation debuted, Microsoft is today unveiling its new Surface Laptop and Surface Pro models,...
The Microsoft Surface Laptop 8 and Surface Pro 12 now come with Snapdragon X2 chips
New colors and high prices.
Flat PopSockets Are Here (and I Like It Better Than OhSnap's Flat Grip)
The iconic phone grip has been redesigned and goes on sale today at Apple Stores.
Tornado destroys Urbana business, owner says they plan to rebuild
URBANA, Ill. (WCIA) — The National Weather Service confirmed a tornado touched down Thursday evening in front of Becks Country Shoppe in Urbana. The main building was destroyed. Winds r…
Samsung Expands Its Galaxy Book 6 Lineup With A Snapdragon X2 Elite-Powered Model
The Samsung Galaxy Book 6 Edge comes with 1TB of storage and 16GB of RAM, and it costs $2,100.
Samsung Galaxy Book 6 Edge with Snapdragon X2 Elite is $2,100, only 16GB of RAM
Samsung has just announced its first Galaxy Book laptop powered by Qualcomm’s Snapdragon X2 Elite and, while it looks great,...
Local Business Owners Replace Stolen SNAP Benefits After EBT Scam Leaves Mother With Nothing
A Connecticut mother who lost a month of food benefits to an EBT scam is getting help from two local business owners after stolen SNAP ... Read More
Pedestrians Prefer to Veer Left—and Scientists Have No Idea Why
The bias certainly appears to exist, but scientists still have no idea why it exists.
Pre-Snap Reads 6/15: Seahawks entering their Barner Era
If all goes according to plan, A.J. and the TE room will be eating this year.
Scientists Finally Discover How Venus Flytraps Snap Shut So Fast
Exceeding the plant 'speed limit'.
Keir Starmer set to announce under-16s social media ban
Prime minister expected to unveil ‘Australia plus’ ban for under-16s on apps such as TikTok, Instagram and Snapchat
Pacifica business owners turn negative rating into a positive initiative
After WalletHub ranked Pacifica as the worst small city nationwide to start a business, community members and entrepreneurs are turning this into something positive.
Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?
Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.
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