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Best Entertainment Stocks To Add to Your Watchlist
Warner Bros. Discovery, Walt Disney, Roblox, Verizon Communications, and Spotify Technology are the five Entertainment stocks to watch today, according to MarketBeat's stock screener tool. Entertainment stocks are shares of publicly traded companies involved in producing, distributing, or deliverin
Iowa's opportunities to expand digital infrastructure
The Technology Association of Iowa brought developers, energy companies, and business leaders together to discuss digital infrastructure in Iowa, highlighting an opportunity for the state to lead in the industry. Brian Waller, president of TAI, delivered the keynote speech during the Iowa Digital Infrastructure Summit on Sept. 29. He argued that data centers support a…
Florida Museum welcomes visitors back Nov. 23
Following a large-scale construction project, the Florida Museum of Natural History is delighted to reopen the Ken and Linda McGurn Exhibition Hall to the public on Monday, Nov. 23.
$300 bats, bleacher gossip and 'the drip': 4 baseball moms reality-check 'Team Moms: Baseball'
We asked four baseball moms to watch Kim Kardashian's "Team Moms: Baseball." The sideline drama felt familiar. The moms toting Chanel bags and boys wearing Balenciaga sandals? Not so much.
Don’t Stand Still: A CEO on 3 Directions the Healthcare Business Is Moving
These days, “if you’re standing still and you think that hospitals are going to be the way to deliver care for the next 20 years, then the system will move on beyond you,” says Eduardo Conrado, president and CEO of Ascension, a St. Louis-headquartered health system that has sites of care in 36 ...
Health Foundation of South Florida Awards $300,000 to Bring Vision Care to Low-Income Schoolchildren in Miami-Dade and Broward
Grant will support mobile optometric clinics delivering free eye exams and prescription eyeglasses through Miami Lighthouse for the Blind’s Florida Heiken Children’s Vision Program Sept. 3, 2026 — The Health Foundation of South Florida has awarded a $300,000 grant over two years to Miami Lighthouse for the Blind to support its Florida Heiken Children’s Vision […]
American Cancer Society adds Guardant Health's Shield blood test to colorectal cancer screening guideline
'By making colorectal cancer screening more accessible with a blood-based option in conjunction with other established methodologies, we can get people screened.'
Samsung Galaxy Tab S12 series goes official from $1,199 with Photoshop pre-installed
Samsung is today officially launching its new Galaxy Tab S12 series with the Tab S12+ and Tab S12 Ultra delivering...
Universe Entertainment And Culture Group (SEHK:1046) Stock Confronts Revenue Collapse And Rich P S Multiple
The market has been treating Universe Entertainment and Culture Group like a high‑beta punt, with the stock almost doubling over the past month. However, today’s full year release tells a tougher story. The business delivered only HK$120.096 million in trailing twelve month revenue while still posting a loss of HK$10.938 million from ongoing operations. Set that against a P/S ratio of 10.1x, well above the Hong Kong entertainment pack, and the headline is clear: rich sales multiples now meet...
Will his health allow Dodgers' Freddie Freeman to deliver another postseason signature moment?
Because of an ailing right knee, the Dodgers don’t really know what you might see out of Freddie Freeman this postseason.
Newsom and Harris continue circling, may finally collide
The two San Francisco Democrats have spent decades in tacit competition. Newsom said he would defer to Harris in the presidential race. Did he just give her the upper hand?
New Quantum Algorithm Targets Bottleneck in Fluid-Flow Modeling
Oak Ridge National Laboratory researchers developed LuGo, a quantum algorithm that reduced quantum gate requirements by more than 95%.
El Niño is strengthening. Is your business ready?
Manual and Guideline in English on World about Climate Change and Environment and Disaster Management; published on 13 Aug 2026 by UNDRR
Your feed is political: Social media changes how candidates reach young voters
In 2026, politicians no longer need a press conference, television interview or newspaper story to reach voters. With one post, they can deliver a message directly to millions of people — including young voters who increasingly encounter news online.
Live on the Lawn and 2026 Oktoberfest brings lakeside entertainment to Kuttawa
KUTTAWA — Organizers said the 2026 Oktoberfest and Live on the Lawn concert in Kuttawa had a record-breaking weekend, chock full of delicious food, craft beer and live entertainment on
Astros deliver dud in bullpen game battle vs. White Sox
Rookie left hander Hagen Smith helped the Chicago White Sox prevail in Game 1 of their AL wild-card series against the Houston Astros.
Britain Politics Labour
Britain's Prime Minister Andy Burnham delivers his Leader's Speech during the Labour Party Conference in Liverpool, England, Tuesday, Sept. 29, 2026. (AP Photo/Jon Super)
Health experts warn of addiction risks as nicotine pouch use grows
Nicole Bassounas, a nurse practitioner and certified cessation counselor at Jefferson Hospital, said the pouches deliver nicotine and can lead to addiction.
MLB On FOX Delivers Dramatic Viewership Increases For 2026
MLB on FOX saw significant viewership gains for the 2026 regular season, All-Star Game, and World Baseball Classic. Here's the details.
Clemson Rural Health launches diabetes management program in Midlands South Carolina
Clemson Rural Health is delivering a new diabetes management program in Orangeburg, South Carolina, and surrounding counties through $600,000 in funding
USA SPORTS DELIVERS VIEWERSHIP RECORDS AND MILESTONES IN INAUGURAL SEASON OF WNBA COVERAGE AHEAD OF WNBA FINALS ON USA NETWORK THIS OCTOBER
A global media and technology company.
Dartmouth Health announces at-home program to address rural challenges after $20M gift
Dartmouth Health and the Geisel School of Medicine at Dartmouth College announced Tuesday they’re launching a new at-home health care program, an effort to address healthcare delivery challenges in rural New Hampshire and Vermont where patients often live far from doctors and health facilities.
Chris Mason: Andy Burnham delivers deeply political speech with a personal core
The key thing to understand about Andy Burnham's speech is these were the words and the delivery of both a new prime minister and a grieving son, the BBC's political editor writes.
Timeline of the Premier League vs. Manchester City
The verdict has been delivered in the seismic case between the Premier League and Manchester City. City was found guilty of nearly all of the 115 financial charges laid by the Premier League, the competition said Tuesday in an explosive statement. City faces a severe punishment, potentially even expulsion from the world's most popular league, but has vowed to appeal.
Opinion | Trump’s Deliberate Blurring of Foreign and Domestic Politics
In the final week of September 2026, the American political landscape appeared more complicated than the headlines suggested. Much of the attention focused on President Donald Trump’s September 22 …
Dungeons II Co-op
Minecraft Dungeons II is out! Learn all there is to know about the game's different multiplayer, co-op modes, and how the team worked to deliver a new type of shared experience!
Andy Burnham pledges a big shakeup for Britain in a high-risk political speech
LONDON (AP) — Prime Minister Andy Burnham pledged Tuesday to give Britain “a new social contract for the 21st century," reform the country's electoral system and reset its relationship with its European neighbors. But he acknowledged that economic constraints make delivering his sweeping plans a ...
Darren Soto showcases bipartisan support in 6-figure ad buy
A conservative supporter makes a case for the Democratic incumbent — and delivers barbs at Dan Green.
2. entertainment.jpeg
At right, a display tells the story of Club My-O-My on the lakefront. Buses would deliver tourists here during the 1940s and 1950s to partake in floor shows performed by
Healthcare author, leader in contemplative science to deliver URI College of Nursing’s Fall Distinguished Lecture
KINGSTON, R.I. — Sept. 29, 2026 — Susan Bauer-Wu, an internationally respected author and leader in healthcare and contemplative science will discuss mindful leadership in healthcare in the latest installment of the University of Rhode Island College of Nursing’s Distinguished Lecture series on Wednesday, Oct. 21, 6 p.m. at the Rhode Island Nursing Education Center […]
Healthcare author, leader in contemplative science to deliver URI College of Nursing’s Fall Distinguished Lecture
KINGSTON, R.I. — Sept. 29, 2026 — Susan Bauer-Wu, an internationally respected author and leader in healthcare and contemplative science will discuss mindful leadership in healthcare in the latest installment of the University of Rhode Island College of Nursing’s Distinguished Lecture series on Wednesday, Oct. 21, 6 p.m. at the Rhode Island Nursing Education Center […]
Astrana Health Notifies SEC About Social Engineering Incident
Astrana Health, a managed services organization that helps healthcare providers deliver value-based, coordinated care to patients, has notified the U.S. Astrana Health, a managed services organization that helps healthcare providers deliver value-based, coordinated care to patients, has notified the U.S. Securities and Exchange Commission about a social engineering incident that exposed patient, employee, and provider information.
Britain Politics Labour
Britain's Prime Minister Andy Burnham delivers his Leader's Speech during the Labour Party Conference in Liverpool, England, Tuesday, Sept. 29, 2026. (AP Photo/Jon Super)
Mark Rober’s mission to support science classrooms
Former NASA engineer and YouTube creator Mark Rober shares how Class CrunchLabs delivers free, hands-on physics and engineering lessons designed to help educators engage students.
Ukraine’s Academy of Sciences warns against Russian cooperation after attack
The National Academy of Sciences of Ukraine has urged the international scientific community not to “restore or legitimise institutional cooperation with Russian state scientific and educational structures,” after a Russian drone hit its Presidium building in central Kyiv, killing at least two people and injuring several others. The drone strike took place in the early afternoon on September 28 while staff were working.The academy called the strike, one of several Russian attacks on Ukraine’s capital using jet-powered drones in recent days, an act of terrorism. “It is a strike [. . .] on the very idea that knowledge, research, and the search for truth should serve life, not its destruction,” it said in a statement.The academy thanked the global scientific community for its solidarity following the attack and warned against any temptation to normalise scientific relations with Russia.“Science cannot exist outside of moral responsibility. There can be no ‘ordinary scientific cooperation’ with a state that kills people and destroys scientific institutions of another country,” it said.“We urge not to create opportunities for Russian state institutions to return to the international scientific community as if nothing happened. There can be no ‘science beyond politics’ when science is attacked with weapons.”After the full-scale invasion of Ukraine in 2022, Europe almost entirely cut institutional ties and joint programmes with Russian science, although personal academic contacts are still ongoing.Related articlesRussia widens targeting of European research centresHow geopolitical rifts cut scientific collaborationThe European Federation of Academies of Sciences and Humanities (ALLEA), for instance, continues to exclude the Russian Academy of Sciences from its network.ALLEA condemned the latest attack as a “barbaric act” and part of a broader “systematic targeting of Ukraine’s scientific and cultural infrastructure.” This is a “deliberate attempt to erase the conditions under which free inquiry, knowledge, and democratic life are possible,” it said in a statement.Since Russia’s full-scale invasion, more than 4,650 educational institutions across Ukraine have been damaged, and a further 423 have been destroyed, according to ALLEA.National academies across Europe joined ALLEA in condemning the attack. “Science is about the pursuit of knowledge for the benefit of humanity, so this is an attack on civilisation itself,” said Paul Nurse, president of the UK’s Royal Society.Attacks on scientific, university and cultural institutions “are attacks on the foundations of society and constitute a clear violation of international law,” wrote the German National Academy of Sciences Leopoldina.The presidents of the US National Academies of Sciences, Engineering and Medicine also released a joint statement condemning the attack and pledging to continue to support the Ukrainian research community.The targeting of the Ukrainian academy prompted outcry from European leaders. “Today, science became a target for Russia,” European Commission President Ursula von der Leyen wrote on social media.“These strikes are the latest illustration of the Russian regime’s hostile contempt for science and truth,” said French President Emmanuel Macron.
How Palliative Care Works within Home Health
Palliative care as delivered by home health agencies can look very different that that provided by a hospice. Earlier this year, the U.S. Centers for
Optimi Health Appoints Melanie Pump to Board of Directors
Seasoned finance executive brings more than 25 years of leadership experience across technology, digital infrastructure, software, fintech and emerging growth companiesVANCOUVER, British Columbia, Sept. 29, 2026 (GLOBE NEWSWIRE) -- Optimi Health Corp. (NASDAQ: OPTH) (CSE: OPTI) (FSE: 8BN) ("Optimi" or the “Company"), a commercial-stage manufacturer and clinical-stage developer of regulated psychedelic drug products, today announced the appointment of Melanie Pump to its Board of Directors (the "
Commanders' Win vs. Seahawks Delivered Early-Season Statement Win
After an 0-2 start, the Washington Commanders needed a spark. They found it against the defending Super Bowl champions, forcing turnovers, capitalizing on Seattle's mistakes and pulling off a 33-31 statement win in their home opener.
What the CDC chose to highlight — and omit — in its 2025 teen health report
The CDC’s latest youth survey highlights wellness gains but quietly sidelines long‑tracked risks.
Liverpool star Jeremy Jacquet delivers honest verdict on France debut
Liverpool centre-back Jeremy Jacquet was not satisfied with his performance in France’s 1-0 victory at Belgium in the UEFA Nations League on Monday.The 21-year-old enjoyed a solid debut performance ...
China’s Wang Yi delivers high-level warning to Japanese business delegation
The top diplomat urged Tokyo to learn from historical lessons, in highest-ranking official reception since bilateral relations soured in November.
4 Auburn Standouts Who Made the Difference Against Vanderbilt
Auburn football earned its first SEC home win in nearly two years with a 21-15 victory over Vanderbilt. Keshaun Singleton, Chas Nimrod, Xavier Atkins and Omar Mabson delivered crucial plays as Alex Golesh's Tigers improved to 3-1 ahead of a road test at Tennessee.
Case Keenum Shines as Bears Dominate Eagles in Statement Win!
The Chicago Bears delivered one of their biggest performances of the young season Monday night, taking down the Philadelphia Eagles 27-7 at Soldier Field. With starting quarterback Caleb Williams sidelined by a hamstring injury, Chicago turned to veteran Case Keenum, and the longtime NFL quarterback delivered when his team needed him most. Keenum threw for…
Case Keenum puts on masterful performance with on Caleb Williams sidelines for MNF
Case Keenum put on one of his career's more masterful performances in the Chicago Bears' "Monday Night Football" win over the Philadelphia Eagles.
Senate passes the Protect College Sports Act
Report says there's a "0.0 percent chance" the House passes it before election day in November.
U.S. Bank Launches Cards to Meet Small Business Rewards Demand
U.S. Bank has launched two new small business credit cards that are designed to deliver “straight-forward rewards” on everyday business purchases, the
Could psychedelic therapy become NHS treatment for mental health?
Could hallucinogenic drugs become part of mainstream NHS care to treat depression?
Mat3ra and the University of Tsukuba’s Center for Computational Sciences Sign MoU to Expand Access to Cloud-Based Materials Modeling in Japan
Mat3ra Japan K.K., the Japan entity of Exabyte Inc., the developers of Mat3ra.com, and the Center for Computational Sciences (CCS) of the University of Tsukuba today announced the signing of a Memorandum of Understanding (MoU) that establishes a framework for the use and dissemination of the Mat3ra.com computational materials platform within CCS and associated academic institutions in Japan. Under the MoU, Mat3ra provides CCS with free access to the platform for research and educational p...
Allegheny County’s paid parental leave approved by health board, moves to council
Allegheny County's Board of Health voted to approve a county-wide paid parental leave mandate Monday. The matter now heads back to County Council for deliberation.
FanDuel’s Parent Flutter Entertainment Loses Brazil After India
Brazil's about-face around online betting delivers the second blow to Flutter in a major market in two years.
Baker Mayfield expected to miss several weeks
Bucs head coach Todd Bowles expects QB Baker Mayfield to be sidelined three weeks
City Council majority warns Johnson: No head tax in 2027 budget
Mayor Brandon Johnson is expected to deliver his 2027 budget plan in mid-October.
Review: Silent Hill: Townfall Largely Delivers on PS5 and Pro, Falls Short on PC
This unique setting deserves better.
Financial Boost For Global Health On Sidelines Of UN General Assembly
Several significant pledges for global health – covering reproductive health, 'transition' and Ebola – were made on the fringes of last week’s United Nations
Jarell Quansah Ahead Of Alexander-Arnold In Tuchel’s England Hierarchy
Thomas Tuchel prioritizes physical presence and versatility, leaving the Real Madrid star sidelined while the Leverkusen defender cements his unexpected status as England’s preferred right-back.
A Delightful New Way to Flip a Deep-Red District
Bobby Pulido isn’t your typical Democrat.
Apple and Nvidia Just Delivered a Major Boost for TSMC Chip Business
TSMC Stock Gets a Fresh AI Catalyst as 2nm Orders Surge
'The right diagnosis is unbelievably powerful': It can take years to diagnose rare diseases, and scientists are trying to fix that
Tens of millions of Americans live with rare or undiagnosed diseases. These scientists are working to deliver them better diagnostics and treatments.
SEC Football Power Rankings Week 5
With one-third of the regular season officially in the books, the SEC delivered another wild weekend.
High Tide Named to Report on Business Ranking of Canada's Top Growing Companies for Sixth Consecutive Year
High Tide Inc. ("High Tide" or the "Company") (Nasdaq: HITI) (TSXV: HITI) (FSE: 2LYA), the high-impact, retail-forward enterprise built to deliver real-world value across every component of cannabis, announced today that it placed No. 315 out of 375 companies listed on the 2026 Report on Business ranking of Canada's Top Growing Companies, with a verified three-year revenue growth rate of 66% over the 2022 to 2025 measurement period. Highlighting the Company's increasing profitability profile, Ad
HEALTH AND FITNESS: This is your brain on football
Football season is underway, much to the delight of professional, college and high school fans. Football has also been in the news for another more serious reason – the association with brain injury. Over the years, it has been reported that several former NFL players suffered from brain injury because of concussions sustained over years of playing. Some players have even retired early in their careers to avoid such injury. Recently reported research suggests that this brain damage may start earlier and be the result of cumulative “minor” injuries rather than a single major trauma.
China unveils sweeping higher education reform
New guidelines urge universities to specialise as demographic change and a tougher job market reshape talent demand.
Madonna opens MTV VMAs with provocative performance and celebrity cameos
The woman responsible for two of the most indelible moments in MTV Video Music Awards history returned with her usual grandiose flair.
Former 1st-Round Pick Delivers Huge TD for Commanders
Washington Commanders WR & Former 1st-Round Pick Scores TD Against Seahawks. The post Former 1st-Round Pick Delivers Huge TD for Commanders appeared first on HEAVY.
Panther Lake teardown reveals Intel 18A in detail — TSMC still leads in density
SemiAnalysis has taken Intel’s Panther Lake apart, showing how the company’s 18A process combines RibbonFET gate-all-around transistors with PowerVia backside power delivery. The analysis finds that 18A delivers logic density similar to TSMC’s N3E, but does not yet give Intel a clear manufacturing lead over TSMC’s newer nodes.
Steelers QB Aaron Rodgers Reached Major NFL Milestone Against Bengals
The Pittsburgh Steelers and quarterback Aaron Rodgers came into Week 3 against the Cincinnati Bengals badly needing a win. After a brutal offensive showing last week that resulted in a loss to the New England Patriots, a bounce-back performance was needed. Rodgers was able to deliver that bounce-back performance for the Steelers. When all was […] The post Steelers QB Aaron Rodgers Reached Major NFL Milestone Against Bengals appeared first on Gridiron Heroics.
Amazon slashes $900 off Apple's M5 Max MacBook Pro, lowest price ever
The staggering $900 discount delivers the lowest price on record for the M5 Max MacBook Pro 16-inch.
England win series as Banton delivers on potential
Tom Banton delivers on all of his potential by crashing a brilliant first international century as England wrapped up their summer with an ODI series win over Sri Lanka.
Laramie County health and food inspections (9/18/26–9/24/26)
CHEYENNE, Wyo. — The Cheyenne-Laramie County Health Department inspects restaurants, bars, convenience stores, delis, grocery stores, bed and breakfasts
What Was Brent Venables Thinking?
You know the scene. You’ve seen it a thousand times. A college football coach stands alone on the sidelines, his players and assistants looking to him for answers that he doesn’t have. They’ve lost this football game, and lost it badly. “Charley Pell’s off-the-books slush fund!” you think, “what must that guy be thinking in […]
This wireless eGPU claims to deliver RTX 5090-like performance over Wi-Fi
WiCi recently began inviting interested parties to sign up for updates about the WiCi One, which aims to become the first successful wireless external graphics card. The...
Saturn’s icy moon Enceladus may make alien life easier to find than scientists thought
Two studies suggest Saturn’s moon could both support methane-producing microbes and deliver concentrated traces of biology into space.
Oscar Health (OSCR) Stock Looks Cheap Relative To Its Earnings Path
Oscar Health has been on a powerful run in recent years, yet the real question for you today is whether the current share price lines up with what its earnings story can reasonably support. The stock has also seen shorter term pullbacks, which makes the earnings backdrop even more important for anyone trying to judge what they are actually paying for. Over the past 3 years the stock has delivered a very large gain of about 4.3x, which puts a lot of weight on whether the underlying earnings...
Bears QB Caleb Williams reportedly has Grade 2 hamstring injury and could be sidelined for a month
Vikings Offensive Solution Identified for Matching Productive Defense
With the running game sidelined by injuries, quarterback Kyler Murray must lean on red zone threat Jauan Jennings to finally unlock a stagnant offense against Tampa Bay.
FUTURE-HEALTH
Future Health – A Global Initiative by Abu Dhabi convened Ministers, senior government representatives, and global health leaders in New York on the sidelines of the 81st Session of the
Flutter Entertainment (FLUT) Could Be 40% Undervalued On Revenue Beat And EPS Miss
Flutter Entertainment (FLUT) just delivered a mixed earnings update that drew a sharp response from the market, with revenue ahead of analyst expectations but earnings per share falling well short of forecasts. That miss on profitability lands on top of a weak stretch for Flutter Entertainment, with the share price down 18.23% over the past 30 days and falling 61.87% year to date. The 1-year total shareholder return has declined 70.29%, suggesting momentum has been fading as investors...
Hims And Hers Health (HIMS) Stock Looks Discounted After Its 368% Three Year Run
Hims & Hers Health has been a volatile ride, with long term shareholders seeing very large gains while more recent buyers have faced sharp pullbacks. That puts fresh attention on whether the current price lines up with what the business is actually generating in sales. With that backdrop, the question for anyone looking at Hims & Hers Health today is how much of those expectations are already built into the share price. Over the past 3 years, Hims & Hers Health has delivered a share price...
Bills Elevate One Player from Practice Squad for Week 3
With Jordan Hancock sidelined by a hamstring injury, undrafted rookie Te’Cory Couch joins the active roster to bolster a depleted secondary ahead of Sunday’s clash with the Chargers.
Guardant Health (GH) Stock Could Be Undervalued Despite Its 5x Run
Guardant Health has turned into one of the stronger movers in U.S. healthcare, with the share price now reflecting very optimistic expectations in the eyes of many investors. With that backdrop, the central question is whether the current valuation is properly supported by the cash flows the business can generate over time. The stock has delivered a very large 3 year return of about 5x, which puts real pressure on the cash flow story to support such a move. Recent coverage gains for Guardant...
Oscar Health (OSCR) Stock May Be Undervalued Following Its AI Marketplace Launch
Oscar Health has delivered very strong long term gains for shareholders, yet the recent pullback raises a simple question for anyone looking at the stock today: is the current price still in line with what its earnings can support? Over the past 3 years, Oscar Health has produced a very large share price return, which puts extra focus on whether its earnings can justify that kind of move. Management is talking about higher future earnings per share and better medical loss ratios, which can...
Ohio State's Jeremiah Smith Delivers Heisman-Worthy Masterpiece vs. Illinois
Ohio State wide receiver Jeremiah Smith put together a historic, record-setting game in the Buckeyes' win over Illinois.
What's the Most Overrated Business Advice?
Let us know the most overrated business advice you've gotten in the comments.Subscribe to The Hustle:🔗 https://clickhubspot.com/vu3lGet the 5-minute newsletter keeping 2M+ innovators in the loop🔗 https://clickhubspot.com/3klnAbout HubSpot: HubSpot is a customer platform that provides education, software, and support to help businesses grow better. The platform includes marketing, sales, service, commerce, operations, and website management products that start free and scale to meet our customers’ needs at any stage of growth. Today, thousands of customers around the world use HubSpot’s powerful and easy-to-use tools and apps to attract, engage, and delight customers.#TheHustle #HubSpot
Georgia still tops for business following nationwide survey
Georgia’s political leaders are celebrating the state’s ranking as the top location for corporate expansions for the 13th year in a row.
Best Entertainment Stocks Worth Watching
Walt Disney, Warner Bros. Discovery, Verizon Communications, Roblox, and DraftKings are the five Entertainment stocks to watch today, according to MarketBeat's stock screener tool. Entertainment stocks are shares of publicly traded companies involved in creating, producing, distributing, or deliver
‘I can deliver’: Burnham pledges radical change on eve of Labour conference
Exclusive: UK prime minister says delivering fiscal stability would be ‘crucial’ to be able to fix bigger problems
What's a pumpkin concierge? Meet the southern Indiana business delivering fall magic
"Hello Pumpkin LLC" is a luxury pumpkin concierge service that delivers pumpkins to your front porch, creates a porch display for you and removes them at the end of the season.
Jonah Coleman ruled out for Week 3
Jonah Coleman sidelined due to ankle injury
Reap the health benefits of fermented foods with these 9 recipes
How to eat more kimchi, yogurt and other fermented ingredients in fun and delicious ways.
Reap the health benefits of fermented foods with these 9 recipes
How to eat more kimchi, yogurt and other fermented ingredients in fun and delicious ways.
Intel Panther Lake Teardown, 18A, BSPD, GAAFET, SemiAnalysis STEEL
Panther Lake debuts the first commercial implementation of backside power delivery (BSPDN), introduces Intel’s first iteration of gate-all-around (GAA) transistors, and showcases their advanced packaging capabilities with its Foveros-S assembly. With Panther Lake, Intel’s manufacturing arc has shifted from nebulous roadmaps to shipped silicon, a significant milestone on their long road back to competitive semiconductor manufacturing. To evaluate the extent of Intel’s comeback, we tore down Panther Lake. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Our teardown traces 18A from its four-sheet RibbonFETs (Intel’s marketing name for GAAFETs) and gate stacks through contacts, frontside and backside wiring, and the bonded carrier. We explain how these material and integration choices improve gate control and reduce resistance, while adding capacitance, thermal resistance, and process complexity. Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. However, 18A does not lead TSMC N3P, N2 or Samsung SF2 in peak density. Panther Lake’s CPU cores are incremental updates, and the high-end GPU still uses TSMC N3E. Panther Lake assembles one compute tile, one GPU tile, and one I/O tile atop a passive base tile using Intel’s Foveros-S advanced packaging. Both compute tile variants use Intel 18A. The Xe3 GPU options are a 4-core GT1 tile on Intel 3 and a larger 12-core GT2 tile on TSMC N3E. Both I/O tile variants use TSMC N6. [1], [2] Our analysis centers on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery (BSPD) moves the main power network behind the transistor layer, to the backside, separating it from frontside signal routing. We covered BSPD and its impacts in 2024. [3], [4], [5] Intel’s BSPD implementation, branded as “PowerVia”, routes power through dedicated backside metals to nano-TSVs, which connect those rails to local source/drain (S/D) contacts. Implementing that separation requires Intel to build the interconnect stacks from both sides of the wafer. The frontside comprises the M0-M14 signal stack, while the backside comprises the BM0-BM5 power stack. M0 and BM0 are closest to the transistors. The nano-TSVs connect the two sides, but Intel patterns and etches each via from the front after forming the contacts. A narrow via runs from the side of the contact deep into the silicon substrate. Intel then completes the frontside signal metal stack, bonds the wafer to a carrier, flips it and removes the original substrate until the buried via tips are exposed. The backside metal stack is then deposited directly on the revealed vias. The nano-TSV and backside-via profiles taper in opposite directions because Intel forms them from opposite sides of the wafer. The transistor structures form the FEOL. Local contacts and nano-TSVs connect them to the wiring. M0 begins the frontside interconnect stack. The silicon carrier remains attached above the frontside interconnects. It supports the device wafer during substrate removal and backside processing and remains part of the finished chip’s thermal path. PowerVia removes the main power distribution from the congested frontside metals, routing supply through shorter and wider backside wires. Its lateral landing still occupies area in the standard cell, so it recovers less cell area than a direct backside contact. [3] Nano-TSVs beside the logic devices carry VDD or VSS from the backside power network, while signal connections continue upward through the frontside metals. Backside Interconnects Samsung SF2 data is included for comparison to Panther Lake’s within this article. SF2 is the incumbent GAA foundry node but lacks BSPD, serving as a useful reference to evaluate 18A. A full teardown of Samsung’s S26 products, processed on SF2, will be shared soon.Nanosheet-cut EDS comparison. The PowerVia supply path runs from the backside Cu rails through Mo-lined W nano-TSVs to the local transistor contacts. In this cross section, the tapered connection spans roughly 150 nm from the contact level to BM0. The Ta liner confines Cu and promotes adhesion to the surrounding stack; the AlOₓ etch stop controls the next dielectric etch above the rail. Dielectric beneath the ribbons electrically separates the devices from the backside wiring and removes the conducting silicon body below the channel. [6] AlOₓ serves as an etchstop (ES), enabling endpointing and protecting the underlying layers. Low-volatility aluminum fluoride reaction products resist the fluorinated plasma, allowing a thin AlOₓ film to protect the metal while the surrounding low-k dielectric is removed. [6], [7]. While the BM0 and layers above the M1 lines show double AlOx layers, Our SMIC N+3 teardown showed single AlOₓ layers. SMIC uses a simpler local AlOₓ substack, while the remaining cap and etch sequence provide the required landing protection. So why double layers? The closely spaced AlOₓ doublets provide two protected endpoints in the etch sequence. Intel documents an AlOₓ/SiN/AlOₓ stack that explains the benefit. The main dielectric plasma etch stops on the first AlOₓ film; a selective wet clear opens that film; a second plasma etch removes the intermediate SiN and stops on the second AlOₓ film. The final wet clear exposes the metal landing surface. SiN is the intermediate dielectric in Intel’s published example. [8] The second stop protects the metal through a cap breakthrough. Wide openings can etch faster than narrow ones, and etch depth varies across the wafer. Metal under an early-clearing opening would otherwise be exposed while other openings still need more etching. Staged protection widens the process window and reduces metal erosion, corrosion and void formation. [8] TSMC documents AlN/AlOₓ/SiOC/AlOₓ above Cu, with AlN blocking Cu diffusion, and a simpler AlN/SiOC/AlOₓ variant that omits one AlOx film. [9] Levels with different opening sizes, aspect ratios, pattern densities and cap materials need different etch margins. A double AlOx stop is useful where another protected endpoint justifies the added processing. The extra film adds formation, selective opening and cleaning steps, plus another set of interfaces to control adhesion, moisture, and stress. These blanket films are opened through the existing via pattern, so each film does not require another lithography mask. AlOₓ adds parasitic capacitance when it replaces lower-k dielectric; two thin AlOₓ films can nevertheless contain less AlOₓ than one thick film. Total thickness, placement, and theintermediate dielectric determine the electrical cost. Deposition chemistry also changes AlOx permittivity and residual hydroxyl content, which can oxidize the underlying metal. [7], [8], [10], [11] The backside stack separates into relatively fine BM0-BM2 wiring near the devices and coarser BM3-BM5 power distribution. The largest pitch increase occurs between BM2 and BM3. BM0’s pitch closely matches the logic-row height, fitting local power delivery to the cell rows. Higher levels aggregate current through larger conductors: routing density becomes less important than low resistance and current capacity as the network approaches the package. This hierarchy provides wide power wiring for the power delivery network without consuming scarce frontside signal-routing resources. [3] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Frontside Interconnects Intel 18A combines Mo-lined W contacts and nano-TSVs with a separate backside Cu power network. Samsung SF2 keeps power on the frontside, using Ti-based contact interfaces and Ta-based barriers and Co liners around Cu wiring. In 18A standard-cell rows, backside power rails supply the devices through nano-TSVs within the cells, freeing frontside routing resources. Samsung’s M0 accommodates both power and signal connections. From the device toward M0, the connection runs through a Ti-based S/D interface, W contact fill, a Mo-lined W via, and the Cu M0 wire. Mo supplies a conductive nucleation and adhesion layer for W, replacing the resistive TiN liner used in conventional W integration. This increases the effective conduction volume within the feature while retaining W fill and its established polishing, cleaning and etching processes. Intel’s Mo/W patent describes this integration tradeoff. The nano-TSV uses the same Mo-lined W construction in the backside supply path. [12] The move from TiN to Mo is an incremental change. While a full Co or Mo fill can also reduce the volume lost to liners in very small features, it requires new integration schemes that increase complexity and risk. Cu remains attractive for wider wires due to its low resistance. As wires and vias shrink, the diffusion barrier consumes an increasing fraction of their cross-section. [12], [12], [14] Intel uses Co/Ru liners at M0-M1, Co at M2-M4, and Nb at M5-M9. The lower-level liners help Cu adhere and reduce void formation during trench fills. Applied Materials’ Endura has new thermal control that facilitate wetting process, so the thin film continuity is good enough that good capillary pressure will drive Cu atoms to the via bottom without voiding. Intel’s choice to use Nb is particularly interesting. Intel’s Nb patent describes a conductive diffusion barrier intended to reduce the barrier’s contribution to resistance relative to conventional Ta-based barriers, particularly at via bottoms where all current crosses the barrier. The patent pairs Nb in coarser levels with the option of lower-cost PVD processing. [15], [16] The upper metal layers support thicker barriers formed through physical vapor deposition (PVD) despite its worse coverage and uniformity. Meanwhile, the lower metal layers require thinner barriers deposited through conformal atomic layer deposition (ALD). Co/Ru adds another material interface and requires controlled deposition and Cu fill. Changing liners and barriers by metal layer allows Intel to optimize interconnect resistance, process complexity, and reliability. [15, 16] RibbonFET, Intel’s name for its gate-all-around FETs (GAAFETs), replaces the FinFET’s vertical fins with four stacked horizontal silicon nanosheets, allowing the gate to surround the channel on every side. The path to GAAFET begins with the planar transistor. A planar MOSFET places the gate above the channel between its source and drain. Pairing an NMOS with a PMOS transistor creates a CMOS inverter, in which the NMOS pulls the output low for a high input, and the PMOS pulls it high for a low input. The gate must retain electrostatic control of the channel to ensure clean switching. As gate lengths shrank, the drain began to compete with the gate for that control, increasing off-state leakage. Electrostatic control was restored through an architectural evolution that raised the channel into a vertical fin and wrapping the gate around three sides. Called “FinFET”, this new architecture packed more effective channel width into a smaller footprint. Further scaling made it harder to maintain both drive current and leakage within smaller cells, and reintroduced the same problems planar MOSFETs faced. Nanosheet GAAFETs close the fourth side by replacing the vertical fin with a stack of horizontal nanosheets, each surrounded by the gate. The tighter electrostatic control suppresses leakage at shorter gate lengths while stacking adds effective channel width within the cell footprint. In a FinFET process, channel width changes in discrete steps as designers must add or remove whole fins. Nanosheet width can instead be adjusted continuously within the process’s design rules. Wider sheets increase drive current, while narrower sheets reduce capacitance at the cost of drive current. Intel 18A uses stacks of four nanosheets each and varies their widths across logic and SRAM. At the process level, adding more sheets to each stack increases effective channel width and drive current, but complicates fabrication. RibbonFET vs MBCFET Samsung began GAAFET production in 2022 with SF3E, following with SF3 and now SF2. Its ‘MBCFET’ provides a useful structural comparison with Intel’s first RibbonFET implementation. [17] STEEL is digging deeper into SF2, used in the Exynos 2600, and TSMC’s GAAFET N2, used in Apple’s A20 Pro, in upcoming newsletter articles. We’re throwing some teasers on X. Let’s compare Samsung SF2’s MBCFET with Intel 18A’s RibbonFET. Subscribe Even to the untrained eye, Intel’s extra nanosheet is obvious. Intel stacks four ribbons to Samsung’s three. Samsung’s sheets are much wider in these fields, so both sheet count and width matter to the available channel perimeter. Sheet width also changes which silicon surfaces carry current. On conventional (001) silicon, wide nanosheets emphasize the broad top and bottom surfaces, favoring electron transport; the larger sidewall contribution in a narrow sheet favors hole transport. Thinner sheets improve gate control but increase confinement and scattering. This makes width and thickness part of the NMOS/PMOS balance, alongside strain and threshold voltage. [18], [19] GAAFET designs like 18A use different work-function-metal (WFM) stacks for NMOS and PMOS. Around each ribbon, a thin SiOx interfacial layer separates the silicon channel from the HfOx high-k dielectric, with La providing dipole tuning and the WFM wrapping the dielectric. NMOS uses a TiAl-based stack, while PMOS uses TiN WFM. W fills the remaining gate trench, providing a lower-resistivity path where the work-function layers are no longer needed. In this field, the PMOS stacks leave room for W between ribbons, while the NMOS stacks occupy more of those gaps. A silicon-based dielectric marks the P/N boundary, allowing the PMOS and NMOS gates, sharing the same gate trench, to be processed sequentially. Fast logic paths, retention circuits, and SRAM need a family of threshold options. Changing threshold without substantially changing device dimensions, capacitance or fabrication complexity is valuable. FinFET processes typically use different work-function-metal stacks. In a four-ribbon GAA stack, the narrow sheet-to-sheet gap limits how much WFM can fit around each channel. La in the gate dielectric creates interfacial dipoles at the SiOx/HfOx boundary, shifting effective work function and tuning threshold voltage. This gives Intel another control alongside its NMOS and PMOS WFM stacks. Low-threshold devices improve critical-path drive; higher thresholds reduce leakage elsewhere. Dipole tuning is especially useful in GAA because it changes threshold without consuming the narrow intersheet gap with thicker WFM. Precise control of La incorporation, diffusion and interface quality has long been a challenge, limiting viability in high volume production but is now seen from every leading-edge foundry. Intel’s patent describes depositing a dipole-forming oxide above HfOx and annealing it toward the interfacial oxide before completing the work-function and fill metals. This separates threshold tuning from the space available for metal. Newer research addresses the thermal cost: imec’s 2026 dipole-middle research inserts the shifter between two HfOx depositions, shortening the diffusion path while protecting SiOx during patterning. [20], [21]Matched-cut EDS, Intel 18A (left) vs. Samsung SF2 (right). Intel retains raised source/drain epi beneath its contacts, while Samsung recesses W deep into the epi to form a V-shaped Ti-lined interface. The deeper contact increases metal-to-semiconductor area and shortens the current path from the lower sheets, reducing contact and spreading resistance. It also removes epi volume and brings the contact etch closer to the channel ends. Retaining more epi preserves the material available for strain transfer, especially from SiGe into PMOS. These geometries balance contact access against stress engineering and etch margin. [22], [23] Samsung stacks three sheets to Intel’s four ribbons, and both processes use sheet width to tune drive strength. In our Samsung cross-sections, widths range roughly from 19 to 30 nm in the NPU rows and 37 to 50 nm in the CU cell. The Samsung nanosheets taper, with the widest sheet at the bottom and the narrowest at the top. Both processes use HfOx gate dielectric and Ti-based work-function stacks, with Al in the NMOS stack. In the Samsung devices shown here, the dielectric and WFM occupy the intersheet gaps, leaving W above the top sheet. Intel’s PMOS stack leaves more room between ribbons, and W fills those gaps while the thicker NMOS stack leaves W mainly in the upper trench. Gate-stack EDS maps. The W between Intel’s PMOS ribbons provides a conductive path close to the lower gates. Where WFM fills the entire gap, the gate still surrounds the channel, but voltage reaches it through the more resistive work-function films. Thinner WFM and dipole tuning preserve room for low-resistivity fill; Mo and Ru are alternative fill metals being developed for further scaling. [24] A masked, sequential WFM flow explains the different gate heights and inter-nanosheet fill. The proposed sequence below shows how separate NMOS and PMOS work-function steps produce that geometry. Enabled by the BSPDN process, Intel replaces the dense-logic silicon subfin with dielectric, removing the parasitic conduction path below the ribbons and reducing substrate-related capacitance. A retained silicon body as in classical, non-SOI, planar and FinFET designs needs junction and punchthrough-stop engineering to suppress leakage. Dielectric isolation makes that leakage less sensitive to the subfin doping profile but adds removal and fill steps. It also weakens the direct thermal path through silicon, making the contacts, metal stacks and package more important for heat extraction. [24], [26] Fluorine is concentrated around selected Intel device structures in the maps. WF6 is a standard precursor for W nucleation and fill, while barrier films protect adjacent dielectrics from fluorine attack. Low-fluorine W processes reduce the residual-F burden. Chloride-based precursors avoid introducing F during W deposition, but require control of chlorine attack, nucleation and fill quality. The integration target is a continuous, low-resistance W path with a thin protective liner and minimal chemical damage to the surrounding stack. [20], [27], [28] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. We measured cell height, gate pitch, metal geometry, and ribbon dimensions at the XTEM sites shown below. The tables group these dimensions by site and device polarity. Our “sheet cuts” cross the silicon channel and show the ribbons end-on. “gate cuts” run along the channel through successive gates. The 18A logic cell dimensions point to a five-track logic library while the N3E and Intel 3 cell dimensions evidence a seven-track logic library. The DDR-PHY uses wider M0 wires and much larger spacing than core logic. That trades routing density for lower wire resistance and weaker coupling between neighboring nets. The geometry suits the current delivery and coupling requirements of analog, clock, and I/O circuitry. PowerVia lets 18A combine a compact cell height with wider M0 geometry by moving the main power rails off the signal-routing tracks. That relaxes local wire scaling while preserving a small cell footprint. Cell height and gate pitch set the geometric density; pin access and routability determine how much of it a real block can use. [29] The biggest takeaway from our gate-pitch measurements is that Intel 18A compute logic and TSMC N3E GPU logic have similar density in the Bohr representative-cell model. The 18A example is 18.6% denser than the Intel 3 GPU example. Gate pitches are nearly identical across the three sites, so cell height drives most of the difference. The Bohr model combines a four-transistor NAND2 spanning three gate pitches and a 32-transistor scan flip-flop (SFF) spanning nineteen pitches, weighting their densities 60:40. The sensitivity column shows how independently changing cell height and gate pitch by ±1 nm changes the result. This compares representative cell geometries; whole-die density also depends on cell mix and placement. The 18A P-core gives M0 substantially more metal cross section than the N3E vector engine. Treating each profile as a trapezoid gives 2.63 times the area per line and 1.84 times the area after normalization by routing pitch. The larger section reduces the geometric contribution to line resistance and lowers current density for a given current. Taller and wider wires also add capacitance, so circuit delay depends on the balance of resistance and capacitance. The DDR-PHY has less metal area per routing width than the 18A core fields, while remaining above N3E. [30] Area = height × (top CD + bottom CD) / 2, including liners. Area/pitch normalizes by routing width. Taper is the symmetric sidewall angle from vertical, with the largest angle belonging to the DDR-PHY. Compute tile The measurements show how ribbon dimensions and gate-stack geometry vary across the compute tile and between NMOS and PMOS to balance channel drive, gate load and the space needed for the dielectric/WFM stack across logic, SRAM and the DDR-PHY. Width mainly changes available channel perimeter; thickness also changes electrostatic control and carrier confinement. Gate-stack thickness then determines the space left for low-resistivity fill P-core and LP E-core logic Both the P-core and LP E-core use multiple nanosheet widths. Widths are measured on high-magnification XTEMs while wider-field images demonstrate additional width choices within the LP E-core. Multiple widths are expected even within an LP E-core. Timing-critical paths, buffers and cells with different fanout need different drive strengths. The lower-magnification fields show this width diversity beyond the sites quantified in the table. L2 and L3 SRAM GAA gives SRAM designers another way to balance the pull-up (PU), pass-gate (PG), and pull-down (PD) transistors. FinFET bitcells set device strength through fin count while GAA adds nanosheet width as a sizing knob. In a 6T SRAM cell, a strong pull-down relative to the pass-gate limits read disturbance, while a strong pass-gate relative to the pull-up improves writability. During a write, the pass-gate and write driver pull the node storing “1” below the inverter trip point. During a read, the pull-down holds the node storing “0” low. Bias, threshold voltage, mismatch and assist circuitry set the remaining margin. FinFET high-current cells commonly use a PU:PG:PD fin-count pattern of 1:2:2, a device-sizing ratio rather than a current ratio. Ribbon width lets Intel balance SRAM strengths without adding whole fins. The L2 cell uses its narrowest ribbons for PU and widest for PD, improving writability and read stability respectively. Intel’s disclosed HCC operates without assist; its denser HDC uses negative-bitline write assist. Pulling the selected bitline briefly below ground increases pass-gate overdrive so it can overpower the pull-up at lower supply voltage. That buys density and low voltage writability at the cost of boosting circuitry, switching energy, and additional voltage stress that must be controlled. [31], [32] Four rectangular ribbons give the perimeter = 8 × (width + thickness), before corner rounding. PG/PU is 1.49 and PD/PG is 1.16. The L3 structures closely resemble L2 in layout and cell height. Fewer L3 nanosheet widths are tabulated because fewer high-magnification images were available. DDR PHY The DDR-PHY trades density for controlled analog behavior and reliable off-chip signaling. It contains drivers, receivers, delay circuits, and calibration logic that set drive strength, sampling time, and voltage margin. Repeated four-sheet devices with similar widths fit the use of regular transistor units for matching and programmable drive. Its wider local wiring provides room for current delivery and separation of sensitive signals, while consuming more area than a dense core-logic grid. The layout serves the memory channel’s electrical requirements as well as digital logic density. [33] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Intel 3 GPU devices Vector engine logic Intel 3’s XVE logic uses two-fin PMOS and NMOS devices with power rails in M0. Its cell height and M0 pitch give a seven-track geometry, two tracks more than the 18A logic. One-fin groups also appear among the two-fin devices. Intel 3 L2 SRAM The Intel 3 L2 SRAM uses the familiar HCC sizing pattern: one PU fin, two PG fins, and two PD fins. N3E GPU devices Vector engine logic The N3E XVE field contains repeated two-fin devices with seven-track cell geometry. N3E remains a FinFET process, giving Panther Lake a direct FinFET-to-RibbonFET comparison. N3E L2 SRAM The N3E L2 SRAM uses the same PU:PG:PD fin-count pattern of 1:2:2. Panther Lake-U follows Lunar Lake’s floorplan quite closely. Both pair 4 P-cores with 4 LP E-cores and NPU, media and display engines in similar locations. Lunar Lake also uses Xe2, the direct predecessor to Panther Lake’s Xe3 GPU. This makes Lunar Lake the most direct basis for our comparisons. Arrow Lake differs in core count and uses the older Xe-LPG GPU architecture, so we only use it where it offers a more direct component-level comparison. Compute tile Panther Lake compute-tile floorplans remain sparse even months after launch. Intel 18A’s backside metal and dielectric stack must be removed without damaging the underlying structures before a clean transistor-level floorplan can be imaged. Most published die shots hide or heavily process the background, but we are quite proud of the die shot we achieved and are excited to show the work we have done. We measured the areas of the key components on the compute tile and compared them with their Lunar Lake predecessors on TSMC N3B. These help us to capture changes in block area and compare the two chips across process nodes and designs. Our total tile areas exclude the scribe-line area. The compute-plus-GPU subtotal below uses the PTL-U compute tile and GT1 GPU; it excludes the I/O tile and passive base. Individual block areas use the boundaries marked on the floorplans The compute-plus-GPU row is recomputed from the displayed PTL-U and GT1 areas. Component rows use their stated per-region counts and are not an additive partition of the whole tile. The P-core area remains almost unchanged between Lunar Lake and Panther Lake, despite L2 capacity increasing from 2.5 MiB to 3 MiB. Arrow Lake uses the same Lion Cove core as Lunar Lake but also has a 3 MiB L2. Cougar Cove fits 20% more L2 into the same P-core area. The larger private cache keeps more of each core’s working set close to its execution units, reducing access to shared L3 and DRAM. Extra capacity adds storage leakage and lookup energy, so designers balance it against avoided lower-level accesses. The shared P-core L3 cache also shrank by 14.8%. [2] Cougar Cove combines a similar footprint with Intel’s reported power-efficiency improvements. RibbonFET’s tighter channel control reduces leakage, while PowerVia reduces supply droop and allows tighter voltage guardbands. [1] Darkmont’s four-core LP E-core cluster is 5.0% smaller than Skymont’s on Lunar Lake, with most of the reduction in its L2 regions. The 1 MiB region shrank by 8.4% and the 1.5 MiB region by 14.9%. The tag arrays also use one fewer visible row. Tags identify which memory addresses the data array holds, so rearranging them changes the cache’s layout and wiring without requiring less data capacity. [2] The LP E-cores share one L2. This pools capacity and avoids duplicating all the cache machinery, but the four cores contend for its banks and bandwidth. Their separate cluster also keeps light work away from the performance cluster and its L3, allowing that larger domain to sleep. [1], [2] Cache area includes more than the storage cells. Tags identify each line, decoders select rows, sense amplifiers read the small bitline signal, and wires connect to the banks. Splitting an array into smaller sections shortens wordlines and bitlines, improving access speed, but duplicates peripheral circuits. Panther Lake’s smaller cache regions therefore reflect the complete memory implementation, including how much of each region is devoted to storage. [34] Unlike Meteor Lake and Arrow Lake, Panther Lake has no separate SoC tile. The NPU, LP E-cores, memory controllers, PHYs, media and display engines now share the compute tile. This removes an active die and keeps CPU memory traffic on one die. The cost is moving PHY and I/O-related circuitry onto 18A: drivers, receivers and analog circuits must still meet external voltage, loading and signal-integrity requirements, so their area does not shrink like dense digital logic. [1], [2] The biggest shrink comes from the NPU, which occupies 36.9% less area. NPU 5 consolidates the same total INT8 MAC count into half as many neural compute engines. Each of the three NCEs has a larger MAC array to make the complete NCE envelope 22.6% larger than an NPU 4 engine. Consolidation also halves the number of scratchpads and SHAVE DSPs, from 12 to 6. The MAC array handles matrix multiplication and convolution, while SHAVE executes vector and custom operations that fit the array poorly. [1], [2], [35] The paired floorplans identify each NCE envelope and its scratchpad, MAC, and SHAVE regions. Each measured MAC polygon is counted once per NCE in the area accounting below. The scratchpads store weights, activations, and intermediate results near the MAC arrays, allowing repeated use without fetching them again from DRAM. Halving their number delivers the largest measured area saving but leaves less local storage for the same total MAC count. Layers that no longer fit locally require smaller working tiles or more transfers of intermediate data. The benefit depends on keeping the enlarged arrays busy while managing that tighter storage budget. [36] NPU 5 also adds native FP8. Using half the operand width of FP16 reduces storage and transfer demand, helping workloads fit the smaller local memory budget. Lower precision and format-dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile with 4 Xe3 cores on Intel 3 and a larger GT2 tile with 12 Xe3 cores on TSMC N3E. Panther Lake allows us to compare the same GPU architecture across both Intel 3 and TSMC N3E. Wildcat Lake adds a third Xe3 implementation on Intel 18A. A future newsletter will detail Xe3 and its implementation differences across all three process nodes. GT2 scales Xe3 to a different physical layout, with render slices arranged vertically instead of GT1’s horizontal arrangement. Slice placement sets the distances to shared cache banks and the D2D interface. Those wires consume area and add delay, so scaling the number of Xe cores also requires a new balance of cache placement, routing and timing. [1] What’s immediately obvious is that the GT2 tile on TSMC N3E has much smaller Xe cores than GT1. These block areas include logic, caches, and routing. An Xe core on the GT1 tile is ~69% larger than one on Lunar Lake, and ~55% larger than one on GT2. Intel 3 therefore uses substantially more area per Xe core. The block-area gap exceeds the measured logic and SRAM density gaps, bringing routing, timing targets, cell mix, and floorplan allocation into the comparison. The measured vector/matrix engine region is almost unchanged between Lunar Lake and Panther Lake’s GT2 tile. Xe3 retains eight 512-bit vector engines and eight 2048-bit XMX engines per core. Its gains also come from feeding those engines more effectively: more resident threads hide stalls, and variable register allocation lets shaders trade registers per thread against the number of threads kept active. [1] The shared L1/SLM capacity increased by 33% from 192 KiB to 256 KiB, while its area increased only 5%, raising effective density by 27%. L1 retains reused cache lines, while software-managed SLM lets a thread group share data locally. Both reduce traffic to more distant memory. Allocating more SLM per group can also limit how many groups reside on a core at once. [1], [37] The GT1 tile carries 4 MiB of L2 against 16 MiB on the GT2 tile. GT1 divides its L2 cache into four 1 MiB banks, while GT2 uses eight 2 MiB banks. Each bank contains 128 macros, but each N3E macro stores 16 KiB, twice the Intel 3 macro’s 8 KiB capacity. The N3E macro is only 54% larger while holding twice as many bits, giving it 30% higher density: ~23.7 Mbit/mm² versus 18.3 Mbit/mm². Including bank-level circuitry, the gap widens to ~16.9 Mbit/mm² on GT2 versus ~10.4 Mbit/mm² on GT1. GT2 gains density with its macros storing more bits per unit area, and those macros occupy more of each cache bank. Larger macros spread decoder and sense-amplifier overhead across more storage, while a more compact bank layout reduces the share spent on control and routing. The compromise is longer wordlines and bitlines that carry more capacitance. [34] I/O tile Panther Lake uses two I/O tile variants, both fabricated on TSMC N6. The smaller one provides 4 PCIe 5.0 and 8 PCIe 4.0 lanes and serves lower-tier systems as well as those without a discrete GPU, while the larger one adds 8 PCIe 5.0 lanes, bringing the total to 20 lanes, for discrete-GPU connectivity. Panther Lake SKUs with the larger 10- or 12-Xe GPUs use the smaller I/O tile. [38] The smaller I/O tile adds a PCIe 4.0 block and a Thunderbolt block to Lunar Lake’s I/O layout, providing four additional PCIe 4.0 lanes and another Thunderbolt 4 port. Its repeated N6 blocks retain nearly identical areas and layouts. Reusing these proven PHYs and controllers avoids porting and requalifying external interfaces on 18A, where faster digital logic offers less benefit to circuits constrained by the off-chip link. [38] SemiAnalysis’s teardown lab (STEEL) dives deep into the world’s advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. We’re hiring technical experts from system to transistor and everywhere in between. Check out our Careers page. Panther Lake offers scalability and modularity through its disaggregated packaging that partition compute, GPU, and I/O silicon into separate tiles allowing for a suite of tile configurations. This partitioning makes the package part of Intel’s node economics as it determines how much leading-edge wafer area each product consumes, which functions can remain on other processes, and how much configuration freedom Intel can offer from a shared set of tiles. Furthermore, fabricating the compute and GPU tiles separately confines the new 18A process to the compute tile and allows graphics and I/O to use other, more established, and more cost-effective processes. For Panther Lake, the GPU and I/O tiles are assembled alongside the compute tile on a passive silicon base using Foveros-S. Intel’s current technology brief lists a nominal 36 µm pitch for Foveros-S. Through-silicon vias (TSVs) in the base connect the fine wiring above to the larger package connections below. The functional tiles sit side by side on that passive base in a 2.5D configuration. [39] Our cross-section through the compute and GPU tiles shows the package’s wiring hierarchy. Microbumps connect each active tile to the passive silicon base; its fine redistribution layer (RDL) carries the short, dense tile-to-tile links. TSVs carry connections through the base to the package substrate, which fans them out to the much coarser motherboard solder joints. The base supplies interconnect, while computation remains in the active tiles above it. [39] At the compute-tile edge, the higher-magnification inset shows a local microbump spacing of approximately 25.24 µm and a feature width of 12.33 µm. These local spacings are finer than Intel’s nominal Foveros-S value. The X-ray fields further confirm tighter neighboring bumps, consistent across every die-to-die area found on each tile. Additional X-ray analysis is offered after the paywall. Putting the memory controller beside the CPU removes the D2D transfer that CPU memory requests required in Meteor Lake and Arrow Lake. This avoids the extra transmitter, receiver, and link traversal, saving interface energy and latency. Panther Lake’s separate GPU still crosses a D2D link to reach DRAM, so its larger local caches also help contain package traffic. [1], [40] Smaller dies are less likely to contain a random fatal defect, and screening them before assembly prevents one bad tile from consuming a complete package of good silicon. Reuse also spreads design and qualification work across more products. Against those gains, Intel pays for the passive base, D2D circuits, extra bonding and test steps, and losses during assembly. Cost per working product across the portfolio captures the combined effect of wafer yield, reuse, test, and assembly. [29] Wildcat Lake packaging Intel launched Core Series 3, formerly Wildcat Lake, on 16 April 2026 for value mobile and edge systems. Wildcat Lake keeps 18A but removes the passive base and combines more functions on one die to simplify the package. The two products therefore reveal two distinct ways to commercialize the same leading-edge process. [41] Wildcat Lake’s 18A die combines up to two Cougar Cove P-cores, four Darkmont LP E-cores, two Xe3 cores and a smaller NPU. A separate platform-controller die supplies I/O, connected through UCIe, Intel’s first processor implementation of the standard. Consolidating graphics remove a tile boundary and the passive base, reducing assembly complexity for a modest-bandwidth value product. It also ties CPU and graphics scaling to the same die, giving up Panther Lake’s ability to swap in a much larger GPU. [42], [43] In July 2021, Intel CEO Pat Gelsinger set out an ambitious process roadmap aimed at regaining performance leadership by 2025, later described as five nodes in four years. Five years and one CEO later, Intel’s comeback story is not as unambiguously positive as Pat may have hoped. [44], [45] Intel once set the pace for process technology, bringing high-k metal gate technology and FinFETs into volume production years ahead of the rest of the industry. Its 22 nm FinFET process reached consumers with Ivy Bridge in 2012. [46] Intel’s integrated device manufacturing (IDM) model allowed its architects and process engineers to co-optimize products and processes. Starting with Sandy Bridge, Intel dominated x86, while AMD struggled with Bulldozer. That lead faltered at 14 nm and broke at 10 nm. Intel targeted a massive 2.7× density increase, but the node arrived years late and required several revisions before it could support Intel’s full lineup. This delay forced Intel to stretch 14 nm across six generations, while TSMC moved ahead in process technology and AMD recovered in x86. By 2019, Intel was still shipping 14 nm across most of its product stack, with its 10 nm client ramp focused on Ice Lake mobile processors. Meanwhile, TSMC was shipping N7 and N7+, and AMD’s Zen 2 compute chiplets used N7 to raise core counts and improve efficiency. Intel’s process failures were central to its decline, but unsound business decisions furthered their downward slide. Product delays compounded product mistakes, pushing client, server, and FPGA roadmaps off schedule. Several attempts to enter AI (Nervana and Gaudi) and networking (Tofino) also failed to establish lasting businesses. Intel’s recovery has focused on consumer CPUs and advanced packaging. Tiger Lake, Alder Lake, Lunar Lake and now Panther Lake have restored Intel’s consumer roadmap. On the process side, Intel 4 shipped with Meteor Lake, Intel 3 with Granite Rapids and Sierra Forest, and Intel 18A with Panther Lake. Intel has also made advanced packaging part of its foundry offering. However, Intel is still playing catch-up in servers. Several Xeon generations arrived years late and trailed contemporary AMD and Arm server CPUs in performance, efficiency, and core count. The process roadmap is back, but Intel does not hold the same process-technology leadership position it held prior to 10 nm. The introduction of gate-all-around nanosheets and backside power delivery are two of the biggest changes to transistor integration in a decade. Intel took on both changes at once: 18A paired its first RibbonFET with PowerVia in Panther Lake. Panther Lake is a substantial manufacturing milestone. Our cross-sections show how RibbonFET and PowerVia reshape local contacts and wiring, while the floorplans show where architectural consolidation and process choices save area. A sustained competitive lead depends on product performance, cost, yield, and the next implementation. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page.. 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