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Travis Kelce partners with Publicis Sports to launch NIL activation
One of the NFL’s biggest names is getting into the NIL game. Kansas City Chiefs tight end Travis Kelce is joining forces with Publicis Sports to launch a new activation, they said in a joint announcement Tuesday. Kelce and his agency, 3 Arts Sports, are partnering with Publicis to launch Tekta, which will act as […]
BTS takes over Las Vegas—in more ways than one
In addition to multiple dates by the South Korean septet at Allegiant Stadium, the city will come alive with activations, parties and more.
Mob Entertainment Expands ‘Poppy Playtime’ into Food & Beverage
Following a successful Tokyo café activation, Mob is opening new opportunities for licensees across FMCG and themed food experiences.
Museum of Life and Science Unveils Shaping Our Future Exhibit
The Museum of Life and Science in Durham, N.C., has announced the opening of its newest exhibit, “From Here On: Shaping Our Future”, an immersive and interactive experience that invites visitors to explore the possibilities of a world we might build together. With both indoor and outdoor activations, this exhibit aims to encourage conversation and collaboration with guests of all ages.
Have a small biz? Apply to be at Downtown Detroit Markets this this holiday season
Organizers of the popular holiday markets in Cadillac Square are looking for product-based Detroit businesses to feature at this year's activation.
F.6 Science Activation Corrections and Other Documents posted
The Science Mission Directorate Science Activation Program encourages all people to actively participate in science through activities and resources developed
ROSES-25: F.6 Science Activation Final Text Released
The Science Mission Directorate Science Activation Program encourages all people to actively participate in science through activities and resources developed by a collaborative network of project teams drawing on NASA SMD assets (science content, experts, data, etc.).
NASA's Universe of Learning Unveils Fresh Facilitator Guides Inspired by Community Feedback
The goal of NASA's Universe of Learning (UoL) is to connect the public to the data, discoveries, and experts that span NASA’s Astrophysics missions. To make this possible, the NASA's UoL team creates engaging STEM experiences that let people explore data and discoveries from NASA’s Astrophysics missions and learn from the experts behind them.
2025 Science Activation Opportunity
Full details on the Science Activation opportunity can be found here.
Northwest Earth and Space Science Pathways Project Celebrates Student Innovation Through ROADS from Earth to Venus National Challenge
The Northwest Earth and Space Science Pathways (NESSP) project recently concluded its 2025–2026 ROADS (Rover Observation And Discoveries in Space) from Earth
Goodbye Traditional Bathtubs & Showers – There's A New Trend Taking Over
Technology has made its way into the smallest of spaces in our homes, including the bathroom. There's one smart tech feature in particular that's trending.
Students Across New England Contribute to Climate Science Through NASA’s GLOBE Green Down
In fall 2025, more than 50 educators and over 1,500 young people across Maine and New Hampshire participated in NASA’s Global Learning and Observation to Benefit the Environment (GLOBE) Green Down, a citizen science (also known as participatory science or community science) initiative that engages students and volunteers in tracking seasonal changes in plant life. By observing and documenting leaf color change and leaf drop, participants contributed valuable data used by scientists studying how ecosystems respond to a changing climate.
How WME Sports agents are reshaping golf's business landscape at Augusta National
WME Sports agents revealed how the Masters serves as golf's biggest networking hub, driving new brand deals, activations, industry partnerships and much more off the course.
Media Buying Briefing: How Sport Beach became a big Cannes Lions destination
Sport Beach has grown into one of Cannes Lions' most popular activations -- and a standalone business unit for holdco Stagwell.
New NASA HEAT Coloring Book Blends Art, Science, and Cultural Perspectives
A new Sun-centered and science-focused coloring book produced by NASA in partnership with the University of Alaska Fairbanks (UAF) is now available for people to learn while showing their artistic side.
NASA Sea Level Science Makes Waves on World Ocean Day
Explore This SectionScienceScience Activation1,000 Museum Visitors Dive… OverviewResourcesOpportunitiesCitizen ScienceHighlightsAbout Science
Combination nucleic acid therapies: towards personalized cancer treatment
Combination strategies enable simultaneous activation and silencing of key target genes to correct molecular pathways in pancreatic cancer.
TLR/NF-κB activation in vitro as a tool in the assessment of occupational bioaerosol exposure and health risks in wastewater treatment plants
Journal of Exposure Science & Environmental Epidemiology - TLR/NF-κB activation in vitro as a tool in the assessment of occupational bioaerosol exposure and health risks in wastewater...
Happonen and Orsolini back with the group
With two days to go until the match against Torino, Raffaele Palladino’s Rossoblù went through a double training session. The morning was dedicated to activation work and small-sided technical dril...
Disney Entertainment Television Announces Panels, "Percy Jackson" Offsite, Hulu Animayhem, More
It’s the moment (at least some of us) have been waiting for. As revealed by Deadline this morning, Disney Entertainment Television is heading back to San Diego Comic-Con with a panel and activation schedule that includes Percy Jackson, Futurama, King of the Hill, and more. Up first, they’re bringing back Percy Jackson and the Olympians for another mythological adventure that begins […]
AMP Sports Joins Athletes First as Official Media Partner of "The Block" During Big Game Week in San Francisco February 5–7
AMP Sports to connect athletes, fans, and brand partners through live podcast programming and fan-forward events and activations Baltimore, MD- January 22, 2026 — AMP Sports, Sinclair’s premium sports media brand, will serve as the official media partner of Athletes First’s The Block, the premier hospitality and content destination of Big Game Week, taking place...
Chiefs to Bring Backyard Sports-Inspired Gameday to Arrowhead Stadium for Preseason Matchup Against Seattle
Fans Can Enjoy Interactive Activations, Themed Content, and a Special Appearance by Recognizable Character Pablo Sanchez
Certain bitter foods may trigger a brain response similar to working out, study finds
New sensory nutrition research reveals how bitter foods like dark chocolate may sharpen memory and attention through taste-triggered brain activation.
Central California health agencies monitoring hantavirus outbreak
The CDC has activated its Emergency Operations Center and classified a hantavirus outbreak as a Level 3 response, the agency's lowest level of emergency activation, signaling a low risk to the general public.
How Flex Pay Launch At Six Flags Entertainment (FUN) Has Changed Its Investment Story
Six Flags Entertainment introduced Flex Pay by Upgrade in September 2026, letting eligible guests buy Season Passes and other products of US$49 or more online and pay over time through fixed monthly installments, with immediate access to pass benefits after activation and no prepayment penalties. This financing option could influence how visitors budget for trips, with more spending potentially shifting toward recurring passes and planned visits rather than one off ticket purchases. This...
F.6 Science Activation Program Correction Regarding Table of Work Effort
The Science Mission Directorate Science Activation Program encourages all people to actively participate in science through activities and resources developed
Amendment 29: F.6 Science Activation Final Text and Due Date.
The Science Mission Directorate Science Activation Program encourages all people to actively participate in science through activities and resources developed
Coca-Cola and Notre Dame bring poverty alleviation efforts to host cities during the FIFA World Cup 2026
When the FIFA World Cup 2026 games kick off this week, bringing global attention to cities across North America, communities from Boston and Miami to Toronto, Dallas and Los Angeles will come together for one of the world’s largest sporting events. In these same cities, the University of Notre Dame’s Urban Poverty and Business Initiative (UPBI), a program aimed at helping underrepresented populations create and grow independent businesses, is working with local partners to strengthen small business ecosystems throughout a total of 59 cities, including a strategic activation in 13 soccer host cities.
Training two days before Bologna vs. Sassuolo
With two days to go until Matchday 3 of the Serie A season, Domenico Tedesco’s Rossoblù held a morning training session at the Niccolò Galli Training Centre, completing athletic activation work an...
Disney reveals 'Percy Jackson,' 'American Horror Story' and Hulu experiences for San Diego Comic-Con
See what's in store at Disney's San Diego Comic-Con activations, including immersive experiences, major panels and more.
Downtown partners launch cross-promotion strategy to boost business
With the Maumee River as a backdrop, city, county and tourism officials gathered Friday at Glass City Pavilion to unveil a coordinated downtown activation ...
Please Stop Conflating Sports Betting Handle With Spending On Entertainment
Editor’s note: The Cashout for paid subscribers will publish on Tuesday. Every September there’s a huge uptick in how much people bet on sports with the start of football season. Which means it’s time to get ahead of a ridiculous narrative before it picks up steam on social media or in mainstream media. Subscribe Every few months I see some version of this: [ Charlie Bilello@charliebilello Americans bet over $165 billion on sports last year, which is more than they spent on movies, books, concerts and sports tickets - combined. 1:00 PM · Jun 28, 2026 · 4.1M Views 258 Replies · 674 Reposts · 4.23K Likes ](https://x.com/charliebilello/status/2071217050328895935?s=20) Fortune published this in July. The headline and start of the story tell the same narrative (emphasis added): Gambling becomes America’s favorite pastime as Americans spend more on sports bets than movies, arts, museums, and music combined: The North American box office totaled $8.87 billion in 2025, which is still 22% below pre-pandemic levels. Recorded music revenue hit a record $11.5 billion. Live music like concerts and festivals brought in $18.51 billion. Meanwhile, book publishers tracked by the Association of American Publishers reported $14.6 billion for the year. And the U.S. museum industry generated an estimated $16.4 billion. Add it up and the total comes to roughly $70 billion, which is less than half what Americans wagered on sports. The story, to its credit, goes on to tell us why sports betting is entirely different, although people who only read headlines will miss that nuance. (The tweet above definitely skips over the nuance.) I will mostly be preaching to the choir here, but it’s worth saying out loud: Wagering money on sports is not the same thing as spending on entertainment from a financial perspective. When you spend money on a movie or concert ticket, that money is gone. You exchanged money for an experience. It’s a good trade! I get to have fun for “x” dollars. (Unless the movie sucks, I guess.) When you bet money on sports, the money is not necessarily gone every time you wager it. It could be gone, but sometimes it’s not and you actually get more money back! That’s not “spending” money or something you should try to compare directly to entertainment spend. A far better comp would be how much people lose at sports betting. That number was more like $17 billion in the US last year, at least for state-regulated sportsbooks. Why are we trying to equate handle and entertainment spending? I dunno. It makes for splashy headlines, I guess. Now, people should be betting for entertainment, and not because they expect to win in the long term; no doubt about it. Anyway, here’s hoping I don’t see people saying Americans “spent” hundreds of millions of dollars on sports betting this fall. Mindway AI and DraftKings Expand Responsible Gaming Drive with Launch of Gamalyze American Football In time for the NFL kickoff, Mindway AI has expanded its partnership with DraftKings to launch Gamalyze American Football the second title in the neuroscience-based Gamalyze Sports collection. Following the success of Gamalyze Football (soccer) during the FIFA World Cup, this gridiron-themed update replaces static questionnaires with immersive, stadium-inspired gameplay. Backed by 10+ years of Aarhus University research, Gamalyze evaluates real-time decision-making to deliver instant, unbiased player risk assessments. Integrated into DraftKings’ platform and nationwide activations, it engages fans when excitement peaks. Ready to upgrade your player protection? Contact Mindway AI to try Gamalyze Sports today. Gambling news roundup 🚨The important stuff 1st NFL Sunday of Season ‘Champagne-Popping Day for Bettors’ (Covers): “The first NFL Sunday of the season was a champagne-popping day for bettors, while the book was left cleaning up the corks,” Caesars’ head of football Joey Feazel said prior to the Sunday night game. “Caesars Sportsbook reported that Detroit’s Jahmyr Gibbs, Baltimore’s Derrick Henry, Indianapolis’ Jonathan Taylor, and Atlanta’s Bijan Robinson were among the top five most-bet players to reach the end zone, and all of them cashed tickets.” [ Ben Fawkes@BFawkes22 A @CaesarsSports oddsmaker on how Week 1 has gone so far: “The first NFL Sunday of the season was a champagne-popping day for bettors, while the book was left cleaning up the corks.” ➡️8 of 10 most popular anytime TD scorers cashed 1:31 AM · Sep 14, 2026 · 276K Views 16 Replies · 16 Reposts · 615 Likes ](https://x.com/BFawkes22/status/2099310001927995849?s=20) 🔍 Are we already getting a “customer-friendly results” narrative in Week 1? NFL Commissioner Roger Goodell spoke with CNBC about the prediction markets industry: “We think that there needs to be stronger regulations into the predictive markets,” Goodell said. “We want to see that to protect the integrity of our game. We want to make sure we’re protecting the consumers that are on those platforms for the NFL. So, we’re continuing to have conversations with them and talk to them about the things that we think they need to do to strengthen that so that they could be potential partners at some point in the future.” More on the NFL + PMs: [ Straight to the Point Quid Pro Quo The NFL has asked Kalshi and other prediction markets to remove certain easy to manipulate markets. Does a potential partnership hang in the balance… Read more 6 hours ago · 19 likes · Steve Ruddock ](https://straighttothepoint.substack.com/p/quid-pro-quo?utm_source=substack&utm_campaign=post_embed&utm_medium=web&embedding_publication_id=1472492) Kalshi was on my podcast?: Kalshi was on my podcast [ The Event Horizon Episode 32: Talking Prediction Market Enforcement With Kalshi’s Robert DeNault Kalshi? On my podcast? Yep… Listen now 5 hours ago · 6 likes · 1 comment · Dustin Gouker ](https://nexteventhorizon.substack.com/p/episode-32-talking-prediction-market-enforcement-kalshi?utm_source=substack&utm_campaign=post_embed&utm_medium=web&embedding_publication_id=1472492) DraftKings Enhances Responsible Engagement Efforts With New Customer Initiatives, Tools and Education (press release): DraftKings Inc. today announced a series of new initiatives designed to promote responsible engagement and increase awareness and use of the tools and resources to help customers make informed decisions and engage responsibly. The efforts include a new digital advertising campaign featuring Kevin Hart and Nick Jonas that promotes responsible engagement, a PGA TOUR sweepstakes that promotes customer engagement with responsible engagement features, the launch of Gamalyze American Football in collaboration with Mindway AI, and new custom cool-off options that give customers enhanced flexibility when choosing a cool-off period. The initiatives build on DraftKings’ commitment to making responsible engagement an integral part of the customer experience and providing players with accessible tools and resources that help them make informed choices about their gaming experience. “At DraftKings, responsible engagement is embedded in how we operate and is essential to building trust with our customers and our long-term sustainability,” said Lori Kalani, Chief Responsible Gaming Officer at DraftKings. “We’ve continued to invest in tools and resources that give customers enhanced access to information about their play and more choices for managing how they engage. From My Budget Builder and My Stat Sheet to player-set limits and new custom cool-offs, we’re continuing to evolve our approach while promoting awareness and use of the tools and resources available to help customers play responsibly.” … DraftKings is launching a new digital advertising campaign featuring Kevin Hart and Nick Jonas that continues the pair’s road trip and promotes responsible engagement and awareness of the tools and resources available to help customers make informed choices about their gaming experience and engage responsibly. The campaign was initially launched on Sep. 10th and will reach customers through digital channels, bringing responsible engagement messaging to fans in an engaging way. bet365 Launches “The Matchup,” a New Weekly Video Podcast Hosted by Super Bowl Champions Chris Harris Jr. and Emmanuel Sanders (press release): "bet365, a global leader in online sports betting and gaming, today announced the launch of “The Matchup,” a new weekly video podcast hosted by former Super Bowl Champions Chris Harris Jr. and Emmanuel Sanders. Featuring current and former NFL players, the original series marks a significant, intentional investment in football as bet365 works to become a go-to destination for U.S. bettors throughout the season. “The Matchup” premieres September 10, with new episodes released weekly in both video and audio formats. Full episodes will be available on YouTube, Apple Podcasts, Spotify and wherever podcasts are available, with clips and additional content rolling out across YouTube, X, Instagram, Facebook, Threads, and TikTok. The show is being produced by Last Row Digital Media. Each week, Harris and Sanders will be joined by guests from across the game to break down the biggest NFL matchups, unpack the latest league news and share perspectives that go beyond the box score. By bringing together two former players with distinct perspectives and firsthand experience, “The Matchup” will give audiences timely context and a deeper understanding of the teams, players and storylines shaping the week ahead. “Every great football conversation starts with a matchup—who has the edge, what everyone is overlooking and what could change the game,” said Chris Harris Jr. “Emmanuel and I have experienced the game from different perspectives, and we want the audience to feel like they are part of the conversation and leave every episode knowing more about the week ahead.” Today’s iGaming companies face new litigation threats as expansive consumer protection statutes spark lawsuits with sky’s-the-limit aspirations, sometimes backed by private funders. Clients of Ifrah Law have a staunch defender in Robert Ward – an agile litigator and case tactician who responds to the changing state of play with creative legal defenses and efficient case-closing strategies. Robert draws on federal clerkship experience and appellate defense work to advise iGaming clients on litigation exposure, white-collar risk, and regulatory defense across multiple jurisdictions. Read More: Robert Ward on Helping iGaming Clients Outmaneuver Lawsuit-Obsessed Adversaries 🔮 Prediction markets Update on legal action in Connecticut: [ Daniel Wallach@WALLACHLEGAL Connecticut says gaming service license holders which received subpoenas over sports prediction markets “are not under investigation” by the @CTDCP but may possess information that could assist the state “in evaluating the conduct of prediction market platforms.” 2:31 PM · Sep 13, 2026 · 844 Views 5 Likes ](https://x.com/WALLACHLEGAL/status/2099143914271670576?s=20) American Gaming Association Opposes CFTC Bid to Block New York Prediction-Market Enforcement (DeFi Rate): “The brief points to the Ninth Circuit’s Aug. 28 decision in KalshiEX LLC v. Assad, which the AGA says supports New York’s authority to regulate sports contracts as gambling. It also cites Kalshi advertising, product comparisons and reporting on Kalshi’s sports volume to argue that the economic product resembles a sportsbook wager more than a conventional financial hedge.” [ Daniel Wallach@WALLACHLEGAL AGA intervenes in CFTC v. NY case to oppose CFTC request for preliminary injunction, says the CFTC’s arguments “obfuscate a simple truth: prediction markets offer sports betting.” Highlights CA9 decision, @DustinGouker (6x), and $1.32 billion in OSB taxes for NY (0 from PMs). Daniel Wallach @WALLACHLEGAL High stakes hearing on Monday in CFTC v. New York State. If SDNY judge Lorna Schofield denies the CFTC’s motion for preliminary injunction, the New York AG would have a clearer path for securing a state court geofencing order against Kalshi, Coinbase, and Gemini Titan. 2:08 AM · Sep 13, 2026 · 4.78K Views 1 Reply · 2 Reposts · 8 Likes ](https://x.com/WALLACHLEGAL/status/2098957043474280584?s=20) Gaming Commission remains member of gambling council after questions raised over ties to Kalshi (Mass Live): “The Massachusetts Gaming Commission will not follow the leads of gaming regulators in Ohio and Michigan and drop ties with the National Council on Problem Gambling over its new association with Kalshi.” Sponsor’s messageTrusted Voices: Conversations About Betting is designed to equip adults, including parents and coaches, with tools and resources to talk to young people about gambling, including information on warning signs, risks and proxy betting. The program is led by retired professional basketball player Randy Livingston and his wife, basketball agent Anita Smith, who share their personal stories related to problem gambling, with the hope of preventing others from experiencing similar harms. Learn more and join the conversation here. 📣 Industry news Gaming M&A: Latest Mergers, Acquisitions and Deals (SBC Americas): “But what else is happening in the world of gaming mergers, acquisitions, investments, and partnerships? Here, we round up some of the news you might have missed.” BetMGM Named Official Sports Betting and Online Casino Partner of the Minnesota Vikings in Canada (press release): BetMGM, a leading iGaming and sports betting operator, announced a multi-year partnership with the Minnesota Vikings, naming it the Official Sports Betting Partner and Online Casino Partner of the team in Canada. The agreement gives BetMGM rights to use Vikings marks across approved sports betting, online casino and marketing activities in Canada. In addition, Vikings Big Kick LuckyTap™, a casino game by Design Works Gaming, is available now exclusively at BetMGM Casino in Alberta and Ontario. “Vikings fans bring a level of passion and loyalty that extends well beyond game day,” said Matt Prevost, Chief Revenue Officer at BetMGM. “As the home of one of the largest collections of sports-themed casino content in North America, BetMGM is uniquely positioned to combine sports fandom with iGaming. We are eager to start football season off strong with another fantastic partnership especially as we expand our reach in Canada to Alberta.” Martin Nance, Minnesota Vikings Chief Marketing Officer, said, “As we continue to deepen our connection with Vikings fans across Canada, we’re proud to welcome BetMGM as the team’s official sports betting and online casino partner in Canada. Their commitment to innovation and fan engagement aligns well with our organization, and we’re excited to create memorable experiences that celebrate Vikings football and connect with Canadian fans in new and meaningful ways.” Caesars Entertainment Launches Ball Rush Jackpots™ in New Jersey,the Latest Proprietary Online Title from Empire Creative™ (press release): Caesars Entertainment, Inc. (NASDAQ: CZR) (“Caesars”) today announced the launch of Ball Rush Jackpots™, a new ball-and-peg style online casino game developed by Empire Creative™, the Company’s in-house game development studio. Now live in New Jersey across Caesars Palace Online Casino, Caesars Sportsbook & Casino and Horseshoe Online Casino, Ball Rush Jackpots is expected to become available in additional jurisdictions where Caesars offers online casino gaming following regulatory approval. The title expands Caesars’ growing portfolio of proprietary online casino titles, following the successful launch of Ca$hline™ earlier this year and further diversifying the Company’s lineup beyond traditional slots and table games. Ball Rush Jackpots follows the traditional ball-drop gameplay experience where players drop a ball down a board filled with pegs to land in a prize slot. As balls navigate independently through a field of pegs, every drop creates new opportunities to collect feature symbols, unlock bonuses and pursue jackpots, delivering a different experience with every round. “Ball Rush Jackpots delivers a different kind of casino experience for our players, combining easy-to-understand gameplay with meaningful customization, exciting bonus opportunities and jackpot potential,” said Matthew Sunderland, Senior Vice President and Chief iGaming Officer at Caesars Digital. “As we continue expanding our proprietary content portfolio, we’re focused on creating games that are simple to pick up, rewarding to revisit and designed around the features players enjoy most.” Bally’s Corporation Secures New Financing to Support the Development of the Bally’s Bronx Project (press release): Bally’s Corporation (NYSE: BALY) (“Bally’s” or the “Company”) announced today that it secured new financing led by WhiteHawk Capital Partners, LP to fund further development of the Bally’s Bronx project and general corporate purposes. The new financing comprises closing date term loan commitments in an aggregate principal amount of $400 million and delayed draw term loan commitments in an aggregate principal amount of $160 million (together, the “Facilities”). … Bally’s Chairman of the Board, Soo Kim, commented, “This important financing allows us to progress the pre-construction planning process so that we are ready to complete the remainder of the capital raise and remain on schedule. Furthermore, the additional liquidity provides us greater flexibility for other capital opportunities.” WORLD JAI ALAI LEAGUE LAUNCHES CENTENNIAL SEASON AND ENTERS NEXT CHAPTER IN MIAMI (press release): The World Jai Alai League will open its 2026 fall season on Tuesday, September 15 at Miami’s JAM Arena, beginning a milestone season that marks 100 years since professional Jai Alai first arrived in Miami. Season X, the tenth season of the Battle Court team-based competition launched in 2022, will also be the first since entrepreneur and sports asset investor Rob Gough acquired the World Jai Alai League in August 2026. The acquisition marks the beginning of a new chapter for the league. World Jai Alai League will maintain the existing Battle Court competition and operating format, with Chief Operating Officer Scott Savin overseeing Season X. Gough and his team will use the coming months to listen to players and fans, evaluate opportunities across the league, and execute plans for a broader evolution of Jai Alai’s presentation, live experience, media, marketing and commercial strategy beginning in 2027. “This is a really unique moment for Jai Alai,” said Rob Gough, Owner of the World Jai Alai League. “We have a sport with more than 100 years of history in Miami, extraordinary athletes and incredible speed, but I also believe there is enormous untapped potential.” bet365 reveals most popular online slots in 3 US states in August (SBC Americas): “In its monthly Gaming Insights and Performance report, growing online casino operator bet365 tracks player trends and game performance in online slots across its North American online casino markets.” The Closing Line is a reader-supported publication. To receive new posts and support my work, consider becoming a free or paid subscriber. Subscribe
Breaking Barriers at 3rd Annual Findings from the Field Symposium
This year's Findings from the Field Student Research Symposium welcomed 106 students, grades four through eight, 29 educators, and 15 Subject Matter Experts, and it featured 68 research posters, 14 lightning talks, and 5 discussion sessions.
How WME Sports agents are reshaping golf's business landscape at Augusta National
WME Sports agents revealed how the Masters serves as golf's biggest networking hub, driving new brand deals, activations, industry partnerships and much more off the course.
Artemis Moon Tree Dedicated in Honor of Mary W. Jackson
On March 18, 2026, students, staff, and members of NASA’s Langley Research Center gathered at Mary W. Jackson Elementary School in Hampton to celebrate the
Intel Panther Lake Teardown, 18A, BSPD, GAAFET, SemiAnalysis STEEL
Panther Lake debuts the first commercial implementation of backside power delivery (BSPDN), introduces Intel’s first iteration of gate-all-around (GAA) transistors, and showcases their advanced packaging capabilities with its Foveros-S assembly. With Panther Lake, Intel’s manufacturing arc has shifted from nebulous roadmaps to shipped silicon, a significant milestone on their long road back to competitive semiconductor manufacturing. To evaluate the extent of Intel’s comeback, we tore down Panther Lake. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Our teardown traces 18A from its four-sheet RibbonFETs (Intel’s marketing name for GAAFETs) and gate stacks through contacts, frontside and backside wiring, and the bonded carrier. We explain how these material and integration choices improve gate control and reduce resistance, while adding capacitance, thermal resistance, and process complexity. Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. However, 18A does not lead TSMC N3P, N2 or Samsung SF2 in peak density. Panther Lake’s CPU cores are incremental updates, and the high-end GPU still uses TSMC N3E. Panther Lake assembles one compute tile, one GPU tile, and one I/O tile atop a passive base tile using Intel’s Foveros-S advanced packaging. Both compute tile variants use Intel 18A. The Xe3 GPU options are a 4-core GT1 tile on Intel 3 and a larger 12-core GT2 tile on TSMC N3E. Both I/O tile variants use TSMC N6. [1], [2] Our analysis centers on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery (BSPD) moves the main power network behind the transistor layer, to the backside, separating it from frontside signal routing. We covered BSPD and its impacts in 2024. [3], [4], [5] Intel’s BSPD implementation, branded as “PowerVia”, routes power through dedicated backside metals to nano-TSVs, which connect those rails to local source/drain (S/D) contacts. Implementing that separation requires Intel to build the interconnect stacks from both sides of the wafer. The frontside comprises the M0-M14 signal stack, while the backside comprises the BM0-BM5 power stack. M0 and BM0 are closest to the transistors. The nano-TSVs connect the two sides, but Intel patterns and etches each via from the front after forming the contacts. A narrow via runs from the side of the contact deep into the silicon substrate. Intel then completes the frontside signal metal stack, bonds the wafer to a carrier, flips it and removes the original substrate until the buried via tips are exposed. The backside metal stack is then deposited directly on the revealed vias. The nano-TSV and backside-via profiles taper in opposite directions because Intel forms them from opposite sides of the wafer. The transistor structures form the FEOL. Local contacts and nano-TSVs connect them to the wiring. M0 begins the frontside interconnect stack. The silicon carrier remains attached above the frontside interconnects. It supports the device wafer during substrate removal and backside processing and remains part of the finished chip’s thermal path. PowerVia removes the main power distribution from the congested frontside metals, routing supply through shorter and wider backside wires. Its lateral landing still occupies area in the standard cell, so it recovers less cell area than a direct backside contact. [3] Nano-TSVs beside the logic devices carry VDD or VSS from the backside power network, while signal connections continue upward through the frontside metals. Backside Interconnects Samsung SF2 data is included for comparison to Panther Lake’s within this article. SF2 is the incumbent GAA foundry node but lacks BSPD, serving as a useful reference to evaluate 18A. A full teardown of Samsung’s S26 products, processed on SF2, will be shared soon.Nanosheet-cut EDS comparison. The PowerVia supply path runs from the backside Cu rails through Mo-lined W nano-TSVs to the local transistor contacts. In this cross section, the tapered connection spans roughly 150 nm from the contact level to BM0. The Ta liner confines Cu and promotes adhesion to the surrounding stack; the AlOₓ etch stop controls the next dielectric etch above the rail. Dielectric beneath the ribbons electrically separates the devices from the backside wiring and removes the conducting silicon body below the channel. [6] AlOₓ serves as an etchstop (ES), enabling endpointing and protecting the underlying layers. Low-volatility aluminum fluoride reaction products resist the fluorinated plasma, allowing a thin AlOₓ film to protect the metal while the surrounding low-k dielectric is removed. [6], [7]. While the BM0 and layers above the M1 lines show double AlOx layers, Our SMIC N+3 teardown showed single AlOₓ layers. SMIC uses a simpler local AlOₓ substack, while the remaining cap and etch sequence provide the required landing protection. So why double layers? The closely spaced AlOₓ doublets provide two protected endpoints in the etch sequence. Intel documents an AlOₓ/SiN/AlOₓ stack that explains the benefit. The main dielectric plasma etch stops on the first AlOₓ film; a selective wet clear opens that film; a second plasma etch removes the intermediate SiN and stops on the second AlOₓ film. The final wet clear exposes the metal landing surface. SiN is the intermediate dielectric in Intel’s published example. [8] The second stop protects the metal through a cap breakthrough. Wide openings can etch faster than narrow ones, and etch depth varies across the wafer. Metal under an early-clearing opening would otherwise be exposed while other openings still need more etching. Staged protection widens the process window and reduces metal erosion, corrosion and void formation. [8] TSMC documents AlN/AlOₓ/SiOC/AlOₓ above Cu, with AlN blocking Cu diffusion, and a simpler AlN/SiOC/AlOₓ variant that omits one AlOx film. [9] Levels with different opening sizes, aspect ratios, pattern densities and cap materials need different etch margins. A double AlOx stop is useful where another protected endpoint justifies the added processing. The extra film adds formation, selective opening and cleaning steps, plus another set of interfaces to control adhesion, moisture, and stress. These blanket films are opened through the existing via pattern, so each film does not require another lithography mask. AlOₓ adds parasitic capacitance when it replaces lower-k dielectric; two thin AlOₓ films can nevertheless contain less AlOₓ than one thick film. Total thickness, placement, and theintermediate dielectric determine the electrical cost. Deposition chemistry also changes AlOx permittivity and residual hydroxyl content, which can oxidize the underlying metal. [7], [8], [10], [11] The backside stack separates into relatively fine BM0-BM2 wiring near the devices and coarser BM3-BM5 power distribution. The largest pitch increase occurs between BM2 and BM3. BM0’s pitch closely matches the logic-row height, fitting local power delivery to the cell rows. Higher levels aggregate current through larger conductors: routing density becomes less important than low resistance and current capacity as the network approaches the package. This hierarchy provides wide power wiring for the power delivery network without consuming scarce frontside signal-routing resources. [3] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Frontside Interconnects Intel 18A combines Mo-lined W contacts and nano-TSVs with a separate backside Cu power network. Samsung SF2 keeps power on the frontside, using Ti-based contact interfaces and Ta-based barriers and Co liners around Cu wiring. In 18A standard-cell rows, backside power rails supply the devices through nano-TSVs within the cells, freeing frontside routing resources. Samsung’s M0 accommodates both power and signal connections. From the device toward M0, the connection runs through a Ti-based S/D interface, W contact fill, a Mo-lined W via, and the Cu M0 wire. Mo supplies a conductive nucleation and adhesion layer for W, replacing the resistive TiN liner used in conventional W integration. This increases the effective conduction volume within the feature while retaining W fill and its established polishing, cleaning and etching processes. Intel’s Mo/W patent describes this integration tradeoff. The nano-TSV uses the same Mo-lined W construction in the backside supply path. [12] The move from TiN to Mo is an incremental change. While a full Co or Mo fill can also reduce the volume lost to liners in very small features, it requires new integration schemes that increase complexity and risk. Cu remains attractive for wider wires due to its low resistance. As wires and vias shrink, the diffusion barrier consumes an increasing fraction of their cross-section. [12], [12], [14] Intel uses Co/Ru liners at M0-M1, Co at M2-M4, and Nb at M5-M9. The lower-level liners help Cu adhere and reduce void formation during trench fills. Applied Materials’ Endura has new thermal control that facilitate wetting process, so the thin film continuity is good enough that good capillary pressure will drive Cu atoms to the via bottom without voiding. Intel’s choice to use Nb is particularly interesting. Intel’s Nb patent describes a conductive diffusion barrier intended to reduce the barrier’s contribution to resistance relative to conventional Ta-based barriers, particularly at via bottoms where all current crosses the barrier. The patent pairs Nb in coarser levels with the option of lower-cost PVD processing. [15], [16] The upper metal layers support thicker barriers formed through physical vapor deposition (PVD) despite its worse coverage and uniformity. Meanwhile, the lower metal layers require thinner barriers deposited through conformal atomic layer deposition (ALD). Co/Ru adds another material interface and requires controlled deposition and Cu fill. Changing liners and barriers by metal layer allows Intel to optimize interconnect resistance, process complexity, and reliability. [15, 16] RibbonFET, Intel’s name for its gate-all-around FETs (GAAFETs), replaces the FinFET’s vertical fins with four stacked horizontal silicon nanosheets, allowing the gate to surround the channel on every side. The path to GAAFET begins with the planar transistor. A planar MOSFET places the gate above the channel between its source and drain. Pairing an NMOS with a PMOS transistor creates a CMOS inverter, in which the NMOS pulls the output low for a high input, and the PMOS pulls it high for a low input. The gate must retain electrostatic control of the channel to ensure clean switching. As gate lengths shrank, the drain began to compete with the gate for that control, increasing off-state leakage. Electrostatic control was restored through an architectural evolution that raised the channel into a vertical fin and wrapping the gate around three sides. Called “FinFET”, this new architecture packed more effective channel width into a smaller footprint. Further scaling made it harder to maintain both drive current and leakage within smaller cells, and reintroduced the same problems planar MOSFETs faced. Nanosheet GAAFETs close the fourth side by replacing the vertical fin with a stack of horizontal nanosheets, each surrounded by the gate. The tighter electrostatic control suppresses leakage at shorter gate lengths while stacking adds effective channel width within the cell footprint. In a FinFET process, channel width changes in discrete steps as designers must add or remove whole fins. Nanosheet width can instead be adjusted continuously within the process’s design rules. Wider sheets increase drive current, while narrower sheets reduce capacitance at the cost of drive current. Intel 18A uses stacks of four nanosheets each and varies their widths across logic and SRAM. At the process level, adding more sheets to each stack increases effective channel width and drive current, but complicates fabrication. RibbonFET vs MBCFET Samsung began GAAFET production in 2022 with SF3E, following with SF3 and now SF2. Its ‘MBCFET’ provides a useful structural comparison with Intel’s first RibbonFET implementation. [17] STEEL is digging deeper into SF2, used in the Exynos 2600, and TSMC’s GAAFET N2, used in Apple’s A20 Pro, in upcoming newsletter articles. We’re throwing some teasers on X. Let’s compare Samsung SF2’s MBCFET with Intel 18A’s RibbonFET. Subscribe Even to the untrained eye, Intel’s extra nanosheet is obvious. Intel stacks four ribbons to Samsung’s three. Samsung’s sheets are much wider in these fields, so both sheet count and width matter to the available channel perimeter. Sheet width also changes which silicon surfaces carry current. On conventional (001) silicon, wide nanosheets emphasize the broad top and bottom surfaces, favoring electron transport; the larger sidewall contribution in a narrow sheet favors hole transport. Thinner sheets improve gate control but increase confinement and scattering. This makes width and thickness part of the NMOS/PMOS balance, alongside strain and threshold voltage. [18], [19] GAAFET designs like 18A use different work-function-metal (WFM) stacks for NMOS and PMOS. Around each ribbon, a thin SiOx interfacial layer separates the silicon channel from the HfOx high-k dielectric, with La providing dipole tuning and the WFM wrapping the dielectric. NMOS uses a TiAl-based stack, while PMOS uses TiN WFM. W fills the remaining gate trench, providing a lower-resistivity path where the work-function layers are no longer needed. In this field, the PMOS stacks leave room for W between ribbons, while the NMOS stacks occupy more of those gaps. A silicon-based dielectric marks the P/N boundary, allowing the PMOS and NMOS gates, sharing the same gate trench, to be processed sequentially. Fast logic paths, retention circuits, and SRAM need a family of threshold options. Changing threshold without substantially changing device dimensions, capacitance or fabrication complexity is valuable. FinFET processes typically use different work-function-metal stacks. In a four-ribbon GAA stack, the narrow sheet-to-sheet gap limits how much WFM can fit around each channel. La in the gate dielectric creates interfacial dipoles at the SiOx/HfOx boundary, shifting effective work function and tuning threshold voltage. This gives Intel another control alongside its NMOS and PMOS WFM stacks. Low-threshold devices improve critical-path drive; higher thresholds reduce leakage elsewhere. Dipole tuning is especially useful in GAA because it changes threshold without consuming the narrow intersheet gap with thicker WFM. Precise control of La incorporation, diffusion and interface quality has long been a challenge, limiting viability in high volume production but is now seen from every leading-edge foundry. Intel’s patent describes depositing a dipole-forming oxide above HfOx and annealing it toward the interfacial oxide before completing the work-function and fill metals. This separates threshold tuning from the space available for metal. Newer research addresses the thermal cost: imec’s 2026 dipole-middle research inserts the shifter between two HfOx depositions, shortening the diffusion path while protecting SiOx during patterning. [20], [21]Matched-cut EDS, Intel 18A (left) vs. Samsung SF2 (right). Intel retains raised source/drain epi beneath its contacts, while Samsung recesses W deep into the epi to form a V-shaped Ti-lined interface. The deeper contact increases metal-to-semiconductor area and shortens the current path from the lower sheets, reducing contact and spreading resistance. It also removes epi volume and brings the contact etch closer to the channel ends. Retaining more epi preserves the material available for strain transfer, especially from SiGe into PMOS. These geometries balance contact access against stress engineering and etch margin. [22], [23] Samsung stacks three sheets to Intel’s four ribbons, and both processes use sheet width to tune drive strength. In our Samsung cross-sections, widths range roughly from 19 to 30 nm in the NPU rows and 37 to 50 nm in the CU cell. The Samsung nanosheets taper, with the widest sheet at the bottom and the narrowest at the top. Both processes use HfOx gate dielectric and Ti-based work-function stacks, with Al in the NMOS stack. In the Samsung devices shown here, the dielectric and WFM occupy the intersheet gaps, leaving W above the top sheet. Intel’s PMOS stack leaves more room between ribbons, and W fills those gaps while the thicker NMOS stack leaves W mainly in the upper trench. Gate-stack EDS maps. The W between Intel’s PMOS ribbons provides a conductive path close to the lower gates. Where WFM fills the entire gap, the gate still surrounds the channel, but voltage reaches it through the more resistive work-function films. Thinner WFM and dipole tuning preserve room for low-resistivity fill; Mo and Ru are alternative fill metals being developed for further scaling. [24] A masked, sequential WFM flow explains the different gate heights and inter-nanosheet fill. The proposed sequence below shows how separate NMOS and PMOS work-function steps produce that geometry. Enabled by the BSPDN process, Intel replaces the dense-logic silicon subfin with dielectric, removing the parasitic conduction path below the ribbons and reducing substrate-related capacitance. A retained silicon body as in classical, non-SOI, planar and FinFET designs needs junction and punchthrough-stop engineering to suppress leakage. Dielectric isolation makes that leakage less sensitive to the subfin doping profile but adds removal and fill steps. It also weakens the direct thermal path through silicon, making the contacts, metal stacks and package more important for heat extraction. [24], [26] Fluorine is concentrated around selected Intel device structures in the maps. WF6 is a standard precursor for W nucleation and fill, while barrier films protect adjacent dielectrics from fluorine attack. Low-fluorine W processes reduce the residual-F burden. Chloride-based precursors avoid introducing F during W deposition, but require control of chlorine attack, nucleation and fill quality. The integration target is a continuous, low-resistance W path with a thin protective liner and minimal chemical damage to the surrounding stack. [20], [27], [28] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. We measured cell height, gate pitch, metal geometry, and ribbon dimensions at the XTEM sites shown below. The tables group these dimensions by site and device polarity. Our “sheet cuts” cross the silicon channel and show the ribbons end-on. “gate cuts” run along the channel through successive gates. The 18A logic cell dimensions point to a five-track logic library while the N3E and Intel 3 cell dimensions evidence a seven-track logic library. The DDR-PHY uses wider M0 wires and much larger spacing than core logic. That trades routing density for lower wire resistance and weaker coupling between neighboring nets. The geometry suits the current delivery and coupling requirements of analog, clock, and I/O circuitry. PowerVia lets 18A combine a compact cell height with wider M0 geometry by moving the main power rails off the signal-routing tracks. That relaxes local wire scaling while preserving a small cell footprint. Cell height and gate pitch set the geometric density; pin access and routability determine how much of it a real block can use. [29] The biggest takeaway from our gate-pitch measurements is that Intel 18A compute logic and TSMC N3E GPU logic have similar density in the Bohr representative-cell model. The 18A example is 18.6% denser than the Intel 3 GPU example. Gate pitches are nearly identical across the three sites, so cell height drives most of the difference. The Bohr model combines a four-transistor NAND2 spanning three gate pitches and a 32-transistor scan flip-flop (SFF) spanning nineteen pitches, weighting their densities 60:40. The sensitivity column shows how independently changing cell height and gate pitch by ±1 nm changes the result. This compares representative cell geometries; whole-die density also depends on cell mix and placement. The 18A P-core gives M0 substantially more metal cross section than the N3E vector engine. Treating each profile as a trapezoid gives 2.63 times the area per line and 1.84 times the area after normalization by routing pitch. The larger section reduces the geometric contribution to line resistance and lowers current density for a given current. Taller and wider wires also add capacitance, so circuit delay depends on the balance of resistance and capacitance. The DDR-PHY has less metal area per routing width than the 18A core fields, while remaining above N3E. [30] Area = height × (top CD + bottom CD) / 2, including liners. Area/pitch normalizes by routing width. Taper is the symmetric sidewall angle from vertical, with the largest angle belonging to the DDR-PHY. Compute tile The measurements show how ribbon dimensions and gate-stack geometry vary across the compute tile and between NMOS and PMOS to balance channel drive, gate load and the space needed for the dielectric/WFM stack across logic, SRAM and the DDR-PHY. Width mainly changes available channel perimeter; thickness also changes electrostatic control and carrier confinement. Gate-stack thickness then determines the space left for low-resistivity fill P-core and LP E-core logic Both the P-core and LP E-core use multiple nanosheet widths. Widths are measured on high-magnification XTEMs while wider-field images demonstrate additional width choices within the LP E-core. Multiple widths are expected even within an LP E-core. Timing-critical paths, buffers and cells with different fanout need different drive strengths. The lower-magnification fields show this width diversity beyond the sites quantified in the table. L2 and L3 SRAM GAA gives SRAM designers another way to balance the pull-up (PU), pass-gate (PG), and pull-down (PD) transistors. FinFET bitcells set device strength through fin count while GAA adds nanosheet width as a sizing knob. In a 6T SRAM cell, a strong pull-down relative to the pass-gate limits read disturbance, while a strong pass-gate relative to the pull-up improves writability. During a write, the pass-gate and write driver pull the node storing “1” below the inverter trip point. During a read, the pull-down holds the node storing “0” low. Bias, threshold voltage, mismatch and assist circuitry set the remaining margin. FinFET high-current cells commonly use a PU:PG:PD fin-count pattern of 1:2:2, a device-sizing ratio rather than a current ratio. Ribbon width lets Intel balance SRAM strengths without adding whole fins. The L2 cell uses its narrowest ribbons for PU and widest for PD, improving writability and read stability respectively. Intel’s disclosed HCC operates without assist; its denser HDC uses negative-bitline write assist. Pulling the selected bitline briefly below ground increases pass-gate overdrive so it can overpower the pull-up at lower supply voltage. That buys density and low voltage writability at the cost of boosting circuitry, switching energy, and additional voltage stress that must be controlled. [31], [32] Four rectangular ribbons give the perimeter = 8 × (width + thickness), before corner rounding. PG/PU is 1.49 and PD/PG is 1.16. The L3 structures closely resemble L2 in layout and cell height. Fewer L3 nanosheet widths are tabulated because fewer high-magnification images were available. DDR PHY The DDR-PHY trades density for controlled analog behavior and reliable off-chip signaling. It contains drivers, receivers, delay circuits, and calibration logic that set drive strength, sampling time, and voltage margin. Repeated four-sheet devices with similar widths fit the use of regular transistor units for matching and programmable drive. Its wider local wiring provides room for current delivery and separation of sensitive signals, while consuming more area than a dense core-logic grid. The layout serves the memory channel’s electrical requirements as well as digital logic density. [33] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Intel 3 GPU devices Vector engine logic Intel 3’s XVE logic uses two-fin PMOS and NMOS devices with power rails in M0. Its cell height and M0 pitch give a seven-track geometry, two tracks more than the 18A logic. One-fin groups also appear among the two-fin devices. Intel 3 L2 SRAM The Intel 3 L2 SRAM uses the familiar HCC sizing pattern: one PU fin, two PG fins, and two PD fins. N3E GPU devices Vector engine logic The N3E XVE field contains repeated two-fin devices with seven-track cell geometry. N3E remains a FinFET process, giving Panther Lake a direct FinFET-to-RibbonFET comparison. N3E L2 SRAM The N3E L2 SRAM uses the same PU:PG:PD fin-count pattern of 1:2:2. Panther Lake-U follows Lunar Lake’s floorplan quite closely. Both pair 4 P-cores with 4 LP E-cores and NPU, media and display engines in similar locations. Lunar Lake also uses Xe2, the direct predecessor to Panther Lake’s Xe3 GPU. This makes Lunar Lake the most direct basis for our comparisons. Arrow Lake differs in core count and uses the older Xe-LPG GPU architecture, so we only use it where it offers a more direct component-level comparison. Compute tile Panther Lake compute-tile floorplans remain sparse even months after launch. Intel 18A’s backside metal and dielectric stack must be removed without damaging the underlying structures before a clean transistor-level floorplan can be imaged. Most published die shots hide or heavily process the background, but we are quite proud of the die shot we achieved and are excited to show the work we have done. We measured the areas of the key components on the compute tile and compared them with their Lunar Lake predecessors on TSMC N3B. These help us to capture changes in block area and compare the two chips across process nodes and designs. Our total tile areas exclude the scribe-line area. The compute-plus-GPU subtotal below uses the PTL-U compute tile and GT1 GPU; it excludes the I/O tile and passive base. Individual block areas use the boundaries marked on the floorplans The compute-plus-GPU row is recomputed from the displayed PTL-U and GT1 areas. Component rows use their stated per-region counts and are not an additive partition of the whole tile. The P-core area remains almost unchanged between Lunar Lake and Panther Lake, despite L2 capacity increasing from 2.5 MiB to 3 MiB. Arrow Lake uses the same Lion Cove core as Lunar Lake but also has a 3 MiB L2. Cougar Cove fits 20% more L2 into the same P-core area. The larger private cache keeps more of each core’s working set close to its execution units, reducing access to shared L3 and DRAM. Extra capacity adds storage leakage and lookup energy, so designers balance it against avoided lower-level accesses. The shared P-core L3 cache also shrank by 14.8%. [2] Cougar Cove combines a similar footprint with Intel’s reported power-efficiency improvements. RibbonFET’s tighter channel control reduces leakage, while PowerVia reduces supply droop and allows tighter voltage guardbands. [1] Darkmont’s four-core LP E-core cluster is 5.0% smaller than Skymont’s on Lunar Lake, with most of the reduction in its L2 regions. The 1 MiB region shrank by 8.4% and the 1.5 MiB region by 14.9%. The tag arrays also use one fewer visible row. Tags identify which memory addresses the data array holds, so rearranging them changes the cache’s layout and wiring without requiring less data capacity. [2] The LP E-cores share one L2. This pools capacity and avoids duplicating all the cache machinery, but the four cores contend for its banks and bandwidth. Their separate cluster also keeps light work away from the performance cluster and its L3, allowing that larger domain to sleep. [1], [2] Cache area includes more than the storage cells. Tags identify each line, decoders select rows, sense amplifiers read the small bitline signal, and wires connect to the banks. Splitting an array into smaller sections shortens wordlines and bitlines, improving access speed, but duplicates peripheral circuits. Panther Lake’s smaller cache regions therefore reflect the complete memory implementation, including how much of each region is devoted to storage. [34] Unlike Meteor Lake and Arrow Lake, Panther Lake has no separate SoC tile. The NPU, LP E-cores, memory controllers, PHYs, media and display engines now share the compute tile. This removes an active die and keeps CPU memory traffic on one die. The cost is moving PHY and I/O-related circuitry onto 18A: drivers, receivers and analog circuits must still meet external voltage, loading and signal-integrity requirements, so their area does not shrink like dense digital logic. [1], [2] The biggest shrink comes from the NPU, which occupies 36.9% less area. NPU 5 consolidates the same total INT8 MAC count into half as many neural compute engines. Each of the three NCEs has a larger MAC array to make the complete NCE envelope 22.6% larger than an NPU 4 engine. Consolidation also halves the number of scratchpads and SHAVE DSPs, from 12 to 6. The MAC array handles matrix multiplication and convolution, while SHAVE executes vector and custom operations that fit the array poorly. [1], [2], [35] The paired floorplans identify each NCE envelope and its scratchpad, MAC, and SHAVE regions. Each measured MAC polygon is counted once per NCE in the area accounting below. The scratchpads store weights, activations, and intermediate results near the MAC arrays, allowing repeated use without fetching them again from DRAM. Halving their number delivers the largest measured area saving but leaves less local storage for the same total MAC count. Layers that no longer fit locally require smaller working tiles or more transfers of intermediate data. The benefit depends on keeping the enlarged arrays busy while managing that tighter storage budget. [36] NPU 5 also adds native FP8. Using half the operand width of FP16 reduces storage and transfer demand, helping workloads fit the smaller local memory budget. Lower precision and format-dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile with 4 Xe3 cores on Intel 3 and a larger GT2 tile with 12 Xe3 cores on TSMC N3E. Panther Lake allows us to compare the same GPU architecture across both Intel 3 and TSMC N3E. Wildcat Lake adds a third Xe3 implementation on Intel 18A. A future newsletter will detail Xe3 and its implementation differences across all three process nodes. GT2 scales Xe3 to a different physical layout, with render slices arranged vertically instead of GT1’s horizontal arrangement. Slice placement sets the distances to shared cache banks and the D2D interface. Those wires consume area and add delay, so scaling the number of Xe cores also requires a new balance of cache placement, routing and timing. [1] What’s immediately obvious is that the GT2 tile on TSMC N3E has much smaller Xe cores than GT1. These block areas include logic, caches, and routing. An Xe core on the GT1 tile is ~69% larger than one on Lunar Lake, and ~55% larger than one on GT2. Intel 3 therefore uses substantially more area per Xe core. The block-area gap exceeds the measured logic and SRAM density gaps, bringing routing, timing targets, cell mix, and floorplan allocation into the comparison. The measured vector/matrix engine region is almost unchanged between Lunar Lake and Panther Lake’s GT2 tile. Xe3 retains eight 512-bit vector engines and eight 2048-bit XMX engines per core. Its gains also come from feeding those engines more effectively: more resident threads hide stalls, and variable register allocation lets shaders trade registers per thread against the number of threads kept active. [1] The shared L1/SLM capacity increased by 33% from 192 KiB to 256 KiB, while its area increased only 5%, raising effective density by 27%. L1 retains reused cache lines, while software-managed SLM lets a thread group share data locally. Both reduce traffic to more distant memory. Allocating more SLM per group can also limit how many groups reside on a core at once. [1], [37] The GT1 tile carries 4 MiB of L2 against 16 MiB on the GT2 tile. GT1 divides its L2 cache into four 1 MiB banks, while GT2 uses eight 2 MiB banks. Each bank contains 128 macros, but each N3E macro stores 16 KiB, twice the Intel 3 macro’s 8 KiB capacity. The N3E macro is only 54% larger while holding twice as many bits, giving it 30% higher density: ~23.7 Mbit/mm² versus 18.3 Mbit/mm². Including bank-level circuitry, the gap widens to ~16.9 Mbit/mm² on GT2 versus ~10.4 Mbit/mm² on GT1. GT2 gains density with its macros storing more bits per unit area, and those macros occupy more of each cache bank. Larger macros spread decoder and sense-amplifier overhead across more storage, while a more compact bank layout reduces the share spent on control and routing. The compromise is longer wordlines and bitlines that carry more capacitance. [34] I/O tile Panther Lake uses two I/O tile variants, both fabricated on TSMC N6. The smaller one provides 4 PCIe 5.0 and 8 PCIe 4.0 lanes and serves lower-tier systems as well as those without a discrete GPU, while the larger one adds 8 PCIe 5.0 lanes, bringing the total to 20 lanes, for discrete-GPU connectivity. Panther Lake SKUs with the larger 10- or 12-Xe GPUs use the smaller I/O tile. [38] The smaller I/O tile adds a PCIe 4.0 block and a Thunderbolt block to Lunar Lake’s I/O layout, providing four additional PCIe 4.0 lanes and another Thunderbolt 4 port. Its repeated N6 blocks retain nearly identical areas and layouts. Reusing these proven PHYs and controllers avoids porting and requalifying external interfaces on 18A, where faster digital logic offers less benefit to circuits constrained by the off-chip link. [38] SemiAnalysis’s teardown lab (STEEL) dives deep into the world’s advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. We’re hiring technical experts from system to transistor and everywhere in between. Check out our Careers page. Panther Lake offers scalability and modularity through its disaggregated packaging that partition compute, GPU, and I/O silicon into separate tiles allowing for a suite of tile configurations. This partitioning makes the package part of Intel’s node economics as it determines how much leading-edge wafer area each product consumes, which functions can remain on other processes, and how much configuration freedom Intel can offer from a shared set of tiles. Furthermore, fabricating the compute and GPU tiles separately confines the new 18A process to the compute tile and allows graphics and I/O to use other, more established, and more cost-effective processes. For Panther Lake, the GPU and I/O tiles are assembled alongside the compute tile on a passive silicon base using Foveros-S. Intel’s current technology brief lists a nominal 36 µm pitch for Foveros-S. Through-silicon vias (TSVs) in the base connect the fine wiring above to the larger package connections below. The functional tiles sit side by side on that passive base in a 2.5D configuration. [39] Our cross-section through the compute and GPU tiles shows the package’s wiring hierarchy. Microbumps connect each active tile to the passive silicon base; its fine redistribution layer (RDL) carries the short, dense tile-to-tile links. TSVs carry connections through the base to the package substrate, which fans them out to the much coarser motherboard solder joints. The base supplies interconnect, while computation remains in the active tiles above it. [39] At the compute-tile edge, the higher-magnification inset shows a local microbump spacing of approximately 25.24 µm and a feature width of 12.33 µm. These local spacings are finer than Intel’s nominal Foveros-S value. The X-ray fields further confirm tighter neighboring bumps, consistent across every die-to-die area found on each tile. Additional X-ray analysis is offered after the paywall. Putting the memory controller beside the CPU removes the D2D transfer that CPU memory requests required in Meteor Lake and Arrow Lake. This avoids the extra transmitter, receiver, and link traversal, saving interface energy and latency. Panther Lake’s separate GPU still crosses a D2D link to reach DRAM, so its larger local caches also help contain package traffic. [1], [40] Smaller dies are less likely to contain a random fatal defect, and screening them before assembly prevents one bad tile from consuming a complete package of good silicon. Reuse also spreads design and qualification work across more products. Against those gains, Intel pays for the passive base, D2D circuits, extra bonding and test steps, and losses during assembly. Cost per working product across the portfolio captures the combined effect of wafer yield, reuse, test, and assembly. [29] Wildcat Lake packaging Intel launched Core Series 3, formerly Wildcat Lake, on 16 April 2026 for value mobile and edge systems. Wildcat Lake keeps 18A but removes the passive base and combines more functions on one die to simplify the package. The two products therefore reveal two distinct ways to commercialize the same leading-edge process. [41] Wildcat Lake’s 18A die combines up to two Cougar Cove P-cores, four Darkmont LP E-cores, two Xe3 cores and a smaller NPU. A separate platform-controller die supplies I/O, connected through UCIe, Intel’s first processor implementation of the standard. Consolidating graphics remove a tile boundary and the passive base, reducing assembly complexity for a modest-bandwidth value product. It also ties CPU and graphics scaling to the same die, giving up Panther Lake’s ability to swap in a much larger GPU. [42], [43] In July 2021, Intel CEO Pat Gelsinger set out an ambitious process roadmap aimed at regaining performance leadership by 2025, later described as five nodes in four years. Five years and one CEO later, Intel’s comeback story is not as unambiguously positive as Pat may have hoped. [44], [45] Intel once set the pace for process technology, bringing high-k metal gate technology and FinFETs into volume production years ahead of the rest of the industry. Its 22 nm FinFET process reached consumers with Ivy Bridge in 2012. [46] Intel’s integrated device manufacturing (IDM) model allowed its architects and process engineers to co-optimize products and processes. Starting with Sandy Bridge, Intel dominated x86, while AMD struggled with Bulldozer. That lead faltered at 14 nm and broke at 10 nm. Intel targeted a massive 2.7× density increase, but the node arrived years late and required several revisions before it could support Intel’s full lineup. This delay forced Intel to stretch 14 nm across six generations, while TSMC moved ahead in process technology and AMD recovered in x86. By 2019, Intel was still shipping 14 nm across most of its product stack, with its 10 nm client ramp focused on Ice Lake mobile processors. Meanwhile, TSMC was shipping N7 and N7+, and AMD’s Zen 2 compute chiplets used N7 to raise core counts and improve efficiency. Intel’s process failures were central to its decline, but unsound business decisions furthered their downward slide. Product delays compounded product mistakes, pushing client, server, and FPGA roadmaps off schedule. Several attempts to enter AI (Nervana and Gaudi) and networking (Tofino) also failed to establish lasting businesses. Intel’s recovery has focused on consumer CPUs and advanced packaging. Tiger Lake, Alder Lake, Lunar Lake and now Panther Lake have restored Intel’s consumer roadmap. On the process side, Intel 4 shipped with Meteor Lake, Intel 3 with Granite Rapids and Sierra Forest, and Intel 18A with Panther Lake. Intel has also made advanced packaging part of its foundry offering. However, Intel is still playing catch-up in servers. Several Xeon generations arrived years late and trailed contemporary AMD and Arm server CPUs in performance, efficiency, and core count. The process roadmap is back, but Intel does not hold the same process-technology leadership position it held prior to 10 nm. The introduction of gate-all-around nanosheets and backside power delivery are two of the biggest changes to transistor integration in a decade. Intel took on both changes at once: 18A paired its first RibbonFET with PowerVia in Panther Lake. Panther Lake is a substantial manufacturing milestone. Our cross-sections show how RibbonFET and PowerVia reshape local contacts and wiring, while the floorplans show where architectural consolidation and process choices save area. A sustained competitive lead depends on product performance, cost, yield, and the next implementation. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page.. 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Disney reveals 'Percy Jackson,' 'American Horror Story' and Hulu experiences for San Diego Comic-Con
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Comic-Con 2026 Panels, Activations, Cosplay & Convention Floor
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NASA eClips and GLOBE Educators Strengthen a Regional STEM Ecosystem in Coastal Virginia
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Boston Retail Solutions Expands into Live Events & Entertainment Segment
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Exposome Signature: A multi‑system view of human adaptation to spaceflight
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L’Oréal Expands Sports and Entertainment Marketing with PSG and Plénitude Arena Partnerships
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Shingles can hit younger than you think. The vaccine can prevent excruciating pain
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JUVENTUS AND WWE ANNOUNCE STRATEGIC PARTNERSHIP TO CONNECT SPORT, ENTERTAINMENT AND GLOBAL FAN CULTURE
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Science Through Shadows: How Astronomical Alignments Reveal the Universe
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NASA Selects Projects to Engage Communities Across the US With NASA Science
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How sports marketing is shifting from media buys to moment-based activation
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Glycerol is a new ally for heat production and bone health
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Girl Scouts Event Brings Space Science to the Next Generation
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Beauty Brands Are Coming for Sports—and They Want More Than Exposure
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Arts and Entertainment Agenda, Feb. 20-27
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Match Preview presented by DigAlert: LA Galaxy vs Sporting Kansas City
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Educators & Teens Get Hands-On With TEMPO Data to Help Investigate Local Air Quality
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Scientist whose work revealed immune system-hypertension link to receive the 2026 Joseph A. Vita Award
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T-Mobile for Business Offers Up to $1,100 Off the iPhone 17 Pro With SuperMobile Activation
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Philadelphia faces calls for a data center moratorium amid spreading AI fear and talk of a slowdown
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Students Connect NASA Science With Indigenous Knowledge to Study Coastal Erosion
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Union Station will host a World Cup marketplace for Kansas City's small businesses
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Disney Entertainment Television Sets Comic-Con 2026 Panels, Activities
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Shingles is linked to inflammation in the brain. Research shows how to cut dementia risk.
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