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Language Access: A Strategic Performance Driver for Providers
Learn how a total cost of ownership approach to language access can improve efficiency, patient outcomes, compliance and financial performance.
Vanderbilt Clarksville Hospital getting multimillion-dollar health record system upgrade
Vanderbilt Clarksville Hospital is transitioning to Epic, a new electronic health record system designed to enhance the coordination of care and improve efficiency.
Barclays is slashing 5,000 jobs in an AI push
Barclays said it is cutting 5,000 jobs due to "technology change efficiency driven by AI."
Week Two: Where to Watch Michigan State vs. Eastern Michigan
The Spartans look to sharpen their red-zone efficiency and shore up a vulnerable secondary as they host the Eagles for a high-stakes cross-county clash in East Lansing.
How Baton Rouge businesses are putting AI to work
Artificial intelligence is moving faster than many businesses anticipated, forcing leaders to continually rethink how their organizations adopt the technology, train employees and improve efficiency. For Baton Rouge companies, the challenge is not simply implementing AI, but finding practical ways to integrate it into everyday operations. As Business Report writes in its Best Places to […]
CVS Health Flagged “High-Trend” Costs on September 9. Here’s Where the Stock Could Go
CVS Health told the Wells Fargo Healthcare Conference that medical costs are still running hot, and the warning pulled the whole managed care sector down with it. Underneath the caution, management detailed an operating-efficiency push most investors skipped past.
Slime mould has no brain, no neurons and no central control, yet when scientists placed food at 36 locations matching cities around Tokyo, it grew a network strikingly similar to the rail system — with comparable efficiency, cost and resilience
A single-celled organism with no brain solved a transportation puzzle that took human engineers decades to perfect.
Widespread AI adoption in private practice produces measurable efficiency gains
European imaging experts recently conducted an expansive study, involving 10 different AI tools from seven separate vendors, implemented across 20 centers staffed by 58 rads.
Pixel 11's Tensor G6 and Pixel 10's Tensor G5 still fall behind in performance per watt, testing shows
Geekerwan's first efficiency test of the Tensor G6 and G5 shows that both trail the Snapdragon 8 Elite and Apple's A-series chips in CPU and GPU performance per watt, while the Kirin 9030 Pro matches the Tensor chips despite being manufactured on a much older process node.
FDA clears Bracco’s new ultrasound contrast delivery system for cardiovascular imaging
The VueJect ultrasound contrast delivery system was designed to improve workflow efficiency and provide consistency from one user to the next.
Vermont firms slash energy costs with new projects
Efficiency Vermont projects are set to save state businesses $78 million in energy costs over their lifetime.
What If Your Business Could Grow Without Hiring More Employees?
Business growth isn’t about hiring more employees, but using AI to improve efficiency, increase profitability, and build a thriving business.
National Color Graphics purchases new press
Spokane-based National Color Graphics Inc. has become the first commercial printer in the U.S. to install the Fujifilm Revoria Press PC2120, an advanced digital printing system designed to expand color capabilities, automate production, and improve efficiency.
How AI is adding to health care affordability concerns
AI was touted as a way to improve efficiency in health care. But in the short run, it's adding to cost pressures.
Apple Unveils A20 Pro as First 2nm Smartphone Chip
Apple today revealed the A20 Pro chip in the iPhone 18 Pro and iPhone 18 Pro Max, built on a brand new architecture using 2nm process technology. Apple described the A20 Pro as "an exceptional chip that sets a new bar for mobile computing". The chip has a 6-core CPU design with two new super cores that Apple says are up to 20% faster, calling them "desktop class" and "the fastest in any smartphone," alongside four new efficiency cores.
Advancing manufacturing through a trusted partnership
Learn how a contractor and Cleveland-based manufacturer partnered to modernize the production, improve efficiency and support future growth.
Jane Muir: Champion of Community and Leader in Business Law
Getting your Trinity Audio player ready... Setting the standard for efficiency and community engagement, while blending professional acumen with altruism Jane Muir is a leader in the Miami legal landscape. She founded J. Muir & Associates in 2018 and has spent over 15 years building a business law practice, a strong team and a sterling […]
How Hürzeler’s Tactics Have Changed Brighton in 2026/27
The German tactical mastermind has weaponized relentless high-pressing and clinical efficiency, transforming the Seagulls into a fearless scoring machine that currently rivals Europe’s most elite heavyweights.
Chivas Thrash Pumas and Take the AP26 Lead!
What Guadalajara did tonight belongs in soccer academies. With a dominant performance from start to finish, quick and fluid ball movement, an efficiency few teams can match, and a Nación Rojiblanca t...
Dave Toub comments on possible efficiency concerns for Harrison Butker
During his press conference, Kansas City Chiefs coordinator Dave Toub addressed possible concerns about kicker Harrison Butker | @EdEastonJr
McDonald’s Has a New Growth Strategy. Business Leaders Should Pay Attention
McDonald’s NEXT strategy shows how businesses can use technology, efficiency, and human-centered leadership to drive sustainable growth.
How The House Of Beautiful Business Is Building An Economy For The Post-AI World
The House of Beautiful Business built a 30,000-person community betting connection, not efficiency, is the real edge as AI reshapes work and business.
Novel material’s magnetism could improve electronics’ speed, efficiency
A material thinner than a human hair may foster faster computing devices that demand less energy and store more data, according to a multi-institutional team led by researchers in the Penn State College of Earth and Mineral Sciences.
Navigating the American Dream: How Integrated Financial Tools, Credit and Rewards Can Help Small Businesses Succeed
(Feature Impact) Owning a small business has been a cornerstone of the “American Dream” for generations. It represents the chance to transform a passion into a livelihood and legacy. However, turning dreams into reality is rarely a smooth or easy process and requires more than ambition alone. Today’s business owners need support and access to tools that enable them to overcome challenges and keep growing.#placement_678081_0_i{width:100%;margin:0 auto;}var rnd = window.rnd || Math.floor(Math.random()*10e6);var pid678081 = window.pid678081 || rnd;var plc678081 = window.plc678081 || 0;var abkw = window.abkw || '';var absrc = 'https://ads.empowerlocal.co/adserve/;ID=181918;size=0x0;setID=678081;type=js;sw='+screen.width+';sh='+screen.height+';spr='+window.devicePixelRatio+';kw='+abkw+';pid='+pid678081+';place='+(plc678081++)+';rnd='+rnd+';click=CLICK_MACRO_PLACEHOLDER';var _absrc = absrc.split("type=js"); absrc = _absrc[0] + 'type=js;referrer=' + encodeURIComponent(document.location.href) + _absrc[1];document.write('');Recent research conducted by the Capital One Insights Center shows 75% of more than 1,000 surveyed small business owners with more than one employee and annual revenues of up to $20 million are confident about the future, and 69% believe their business is actively primed for growth.While this optimism is promising, 47% of business owners still said their operations either stayed the same or became less efficient over the past year, citing issues like back-office friction and fragmented financial systems that make it difficult to get a clear picture of the health of their businesses.If you’re a small business owner eager to grow but not sure how to get there, start with this advice from real small business owners and experts at Capital One.Identify Sources of FrictionBefore you can pour effort into growth, you must understand what barriers are holding you back. Take time to look under the hood of your business to identify where time and energy is being lost.For example, you may be among the 78% of small business owners who feel stressed and uncertain about expense management – think hours spent hunting for receipts, manually entering numbers into software and reconciling accounts. Operational challenges aren’t just a hassle; they also pull attention away from important priorities like serving your customers and planning for growth. “We were focused on making as many candles as possible, especially during the busy season,” said Katie Roering, co-owner of Fontana Candle Co. “A lot of the back-office tasks like procurement, raw material purchasing, forecasting – all the really important things – were done at 3 a.m., 8 p.m. or on Saturday and Sunday, and there really just was not enough time in the day to get everything done that we needed to. We just knew as we continued to grow, we needed to streamline our processes, build out our team and keep moving forward.”Use Integrated Tools to Manage FinancesInstead of balancing 10 different tracking and analysis tools, you can turn to one-stop solutions to improve efficiency. Time gets lost when you’re forced to manually gather and interpret relevant data before you’re able to act. You need a platform that handles the busywork for you.Integrated, or “all-in-one,” financial tools – like accounting and bookkeeping platforms with automation capabilities or business credit cards featuring built-in analytical tools – allow you to easily stay on top of cash flow and day-to-day operations. For small businesses where every hour and dollar makes a difference, consolidating and automating systems can have an immediate impact. In fact, 51% of survey respondents said integrated tools have already fueled their growth.Leverage Credit Access and Rewards WiselyGrowth requires capital, so access to credit is a game-changer for many business owners, with 77% describing it as a key factor in achieving business resilience. Having funds accessible when you need them makes your business more capable of weathering storms such as equipment failures and seasonal slowdowns. It also puts the power in your hands to act when an exciting opportunity presents itself, like an inventory flash sale or the chance to advertise in a new market.Access to credit comes with another advantage: rewards. By using credit cards for your daily business expenses, you can earn cash back, points or travel rewards. Whether you redeem these to cover everyday expenses, book business trips or reinvest in the business, they can act as a bonus source of income. Learn to maximize rewards like the 84% of small business cardholders surveyed so you aren’t leaving money on the table.To learn more about how small business owners can identify obstacles, employ integrated financial tools and use credit as a tool for growth, read the full report at capitalone.com/about/insights-center.Photos courtesy of Shutterstock
Uber to shed 10% of workers as it moves to cut costs and simplify its business
CEO Dara Khosrowshahi said Uber is removing organizational layers and taking other steps to boost its efficiency.
Chivas thrash Pumas and storm to top spot in AP26!
What Guadalajara did tonight belongs in football academies. With total control of the ball from start to finish, efficiency that few can match, and a Rojiblanca Nation that never stopped making the AK...
Scientists mix a simple molecule into perovskite solar layer, and efficiency climbs past 25.6%
Tests showed the combined layer was less prone to clumping and covered the surface more completely.
Jazz Should Consider Trading for Mavericks Center
Upgrading the frontcourt could turn Utah into a legitimate Western Conference threat by swapping Jusuf Nurkić for Daniel Gafford’s elite rim protection and high-efficiency vertical spacing.
AI for Science Shifts from Efficiency Boost to Systemic Reform of Research
AI for Science has entered its 'second half' — shifting from building AI-powered research tools to restructuring the entire research ecosystem, according to E Weinan, an academician of the Chinese Academy of Sciences.
NVIDIA RTX Spark PCs Arrive Next Month In Two “N1X” SoC Configs, One With a 20 Core CPU, 6144 Core GPU & Up To 128 GB Memory, Other With 18 Core CPU, 5120 Core GPU & Up To 32 GB Memory
NVIDIA's RTX Spark PCs are officially launching in October, powered by the N1X SoC, to deliver game-changing performance & efficiency.
How Small Pharmacy Expansion Will Impact CVS Health (CVS) Investors
CVS Health has been rolling out smaller pharmacy focused stores, expanding MinuteClinic sites and raising its 2026 revenue and earnings outlook, alongside new efforts in benefit transparency and women’s midlife health research. The push into underserved neighborhoods with compact pharmacies and clinics points to a tighter focus on access, operating efficiency and aligning physical sites with where prescription demand actually shows up. This article examines how CVS Health’s investment...
Jason Sanders Leads These Fantasy Football Week 4 Kicker Sits
With Week 4 approaching, several kickers could see their opportunities limited by matchup, offensive efficiency and expected field-goal volume.
Why advanced diagnostics are essential for health equity in Asia
The Asia-Pacific region faces a growing diagnostic gap. Discover how scaling advanced diagnostics can improve healthcare equity, efficiency and patient outcomes across the region.
Farmer trusted AI after it gave good advice, then it helped wipe out 25 acres of his crops
The 67-year-old farmer was recommended by the AI to use high-efficiency flupyrimethalin and flusulfasulfaether to kill weeds and mix it with thiamethoxazine and methyl salt. As reported...
Paolo Banchero is Set to Lead With Vengeance
Fueled by a bitter playoff exit, Orlando’s cornerstone demands collective urgency and peak efficiency to transform the Magic from first-round mainstays into legitimate Eastern Conference powerhouses.
Made in America: How AI is keeping this U.S. factory competitive
GE Appliances is leaning heavily into artificial intelligence to improve quality and efficiency on the factory floor.
Where Public Health Meets Public Safety: What Healthcare Design Can Teach Us About Modern Justice Facilities
For decades, justice facility planning centered on security, operational efficiency and durability.
Scientists reveal why walking gets so much harder with age
As we age, the body appears to sacrifice walking efficiency in exchange for stability. Older adults stiffen the ankle more with each step, which may help prevent falls but also forces the muscles to work harder while producing less forward motion. This leads to shorter strides, slower walking, and faster fatigue. Exercises targeting balance, coordination, and lower-leg strength could help preserve mobility.
Scientists identify design rules for the best thermoelectric materials
Researchers from Tokyo Metropolitan University have used a theoretical framework to derive design rules for creating new thermoelectric materials. The efficiency of converting thermal energy to electricity ...
California tire rules opposed by most Business Journal readers
More than 80% of Business Journal poll respondents oppose California's new replacement tire efficiency rules, citing concerns about consumer costs.
This bird flies thousands of miles, but its wings have a catch
Scientists have uncovered an unexpected trade-off in the wings of the European nightjar, a bird that migrates thousands of kilometers but sacrifices high-speed flight efficiency to hunt insects with remarkable agility. Even more surprisingly, it generates thrust on the upward wingbeat, a technique that could inspire new flying technologies.
November ballot includes five government efficiency questions
There are five questions for city voters aimed at making government more efficient.
Ubisoft plans cuts at German studios, adding to wave of workforce reductions
Ubisoft is planning to reduce its workforce in Germany, where it operates a trio of studios, by about 100 workers, Game File has learned. The company wants to offer employees buyouts to, should enough people accept, avoid having to lay anyone off. “In Germany, we initiated discussions with the Works Council last week regarding a proposed voluntary departure plan across Ubisoft Dusseldorf, Ubisoft Berlin & Ubisoft Mainz,” a company rep told Game File. A “works council” is a union-like group representing employees. “The voluntary plan is the primary measure being proposed to support the intended organizational changes,” the Ubisoft rep added. The company declined to confirm the scale of the potential headcount cut. Of the impacted studios, Mainz might be the best known to the public. It leads development of the Anno series and shipped the well-reviewed strategy game Anno 117: Pax Romana in November 2025. Berlin and Dusseldorf operate as support studios within Ubisoft’s creative network. Berlin recently supported the development of Rainbow Six Siege and the Rayman Legends Retold remake. Dusseldorf also contributed to those projects, as well as The Settlers and Ubisoft-branded escape rooms. Dusseldorf is the biggest of the three studios, with some 400+ workers, compared to just over 100 at the other two, a source familiar with the reductions and the teams told Game File. More than half of these new reductions of about 100 people are expected to happen at Dusseldorf. The planned cuts were announced at a town hall for the German studios on Tuesday of last week. In an email follow-up, the studio group’s managing director, Benedikt Grindel, said the cuts were intended to “best position our German studios for the future... with a clearer focus on their role, capabilities and organizational setup needed for the work ahead.” The email was an echo of the past. In January 2025, Grindel had emailed the Ubisoft developers in his region (or studio “zone”) to explain that a round of 185 cuts at the time, including about 65 at Dusseldorf, were “essential to improve our operational efficiency and ensure the long-term sustainability of our studios, the zone and the company.” A half-decade of continued job cuts Ubisoft has been aggressively cutting its headcount for years. At the end of September 2022, it had 20,729 workers. By the end of March 2026, that total was down to 16,590. Studio management is trying to trim costs as it grapples with a changing industry and a drought of releases, let alone hits. The company announced earlier this year that it had reduced its costs since 2022 by “nearly €325 million” ($362m) and planned to lower them through 2028 by another €180 million ($200m). In June the company said it was closing down its Winnipeg and Belgrade studios and cutting roles in its Barcelona team. Even commercial and creative success hasn’t spared studios from this ongoing company-wide contraction. As Game File was nailing down details around the proposed cuts in Germany, Ubisoft management was informing workers of cuts in its Singapore studio, which shipped a hit remake of Assassin’s Creed IV: Black Flag this past July. Some 70 positions in Singapore are being eliminated “to align the studio with upcoming production needs,” per a company rep’s statement to Game File. In early 2024, a large team in the Singapore studio launched the multiplayer pirate game Skull & Bones. It performed poorly but has been supported with regular content updates since. Many of Ubisoft’s studios around the world are heavily subsidized via regional grants and tax breaks. Singapore had been among them for years, but received no such local assistance in the 12 months ending this past March. News of the Singapore cuts broke today alongside word that Ubisoft is also proposing the closure of RedLynx, pending negotiations with officials. The Finnish studio behind the motorbike series Trials was founded in 2000 and sold to Ubisoft in 2011. As reported by VGC (and corroborated by Game File), Ubisoft management told employees it could not come up with a new, sustainable assignment for RedLynx. The 2025 workforce at Ubisoft Dusseldorf were straight-up cuts. This time, Ubisoft is hoping the reductions at its trio of German studios will largely come from workers taking a payout to leave. The company offered such voluntary dismissals at its Massive Entertainment studio (The Division) a year ago. For the German studios’ buyouts this time around, Ubisoft and the Works Council had discussed a formula that’d pay a worker’s monthly salary multiplied by 1.5 and by the number of years they’ve worked at the company, according to Game File sources. The formula is still subject to negotiations with the Works Council and has not yet been part of an official offer to workers. It could be adjusted up or down, and it could be supplemented with additional bonuses. Asked about the floated payout formula, a Ubisoft rep told Game File, “The terms of a potential voluntary departure program remain subject to negotiation with employee representatives. No final agreement has been reached, and we won’t comment on specific proposals while discussions are ongoing.” Game File is a reader-supported publication. To receive new posts and support my work, consider becoming a free or paid subscriber. Subscribe Item 2: Epic’s AI adventures Epic Games (Fortnite, the Unreal engine) is all-in on using AI to try to transform the way it makes video games and game-making tools. It’s leaders appear to be undeterred by any resistance among gamers and some game developers around generative AI—and instead emboldened by advances, particularly in AI-assisted programming. A recap of the last three days: On Monday, Bloomberg reported that Epic management told workers last week that development of an upcoming game combining Star Wars and Marvel characters would be “AI first.” Employees would be expected to use AI models such as Claude to code the game. A manager told Epic’s developers there would be “[n]o more hand-written code” and that art for the game would be “generated with full AI workflows,” per the outlet. Just ahead of that story running, Epic founder Tim Sweeney tweeted: “We have a huge pivot underway here at Epic, moving developers around to retool for maximum AI acceleration. The aim isn’t to do the same stuff with fewer people, but to enable everyone here to build MORE and BETTER stuff, and to bring the benefits to all teams using Unreal.” In a follow-up, Sweeney predicted that most game development processes would be at least three times faster a year from now than they were in January 2026, thanks to AI. To a person on X who told him he was failing to read the room, Sweeney said: “Much of the room wants it to be 2016 again, but it’s not. Our job, as the provider of tools and technology to much of the industry, is to design for the present that is and the future that will soon be.” On Wednesday, Epic announced it was releasing a faster launcher for its Epic Games Store marketplace. It did so by stating in a blog post as clear as could be that the launcher is an AI-enabled, vibe-coded project: Programming is hard. So, instead of doing that, we vibe coded a new Epic Games Launcher that’s way faster and more responsive than the current one, and has a new look. Programming is hard? That was unexpected phrasing from a company founded by a legendarily great programmer. Back in 2011, Sweeney told me that he’d picked up programming quickly as a kid and rejoiced at the power it gave him. “I could look at any program that anybody else had written and, with enough effort, build something cooler.” Item 3: The Xbox Labs experiment (and one of the people behind it) Microsoft’s Xbox division, which is flooding the zone with announcements lately, yesterday revealed a new internal tech-tinkering team called Xbox Labs. In the words of Xbox boss Asha Sharma Labs is “a small group of game makers, engineers and scientists whose job is to turn emerging ideas into things our players and developers can experience.” Conventional wisdom coming out of the announcement is that Labs is a team that’ll focus on ideas driven by generative AI. In her announcement, Sharma cited some of the dizzying achievements in tech and gaming over the past month as AI agents and other AI tools have been deployed to swiftly figure out how popular games work, then rebuild them and mix them up. She mentioned seeing ”games rapidly decompiled and rebuilt to run on hardware they were never originally designed to support” and said “[p]erhaps more surprisingly, we’ve seen many of the biggest games in the world have been remixed into the source code of another.” (Minecraft plus Elden Ring, for example, or Fortnite + Super Monkey Ball + Overwatch + Diablo + others.) Sharma also cited the work of Windows PC games being ported to run in browsers, a seeming reference to a recent AI-assisted fan port of Halo. Or perhaps Call of Duty or GTA. Sharma didn’t use the specific term “AI” in her memo, but she came close, citing AI “agents” and their potential for game-making tools that Labs could help craft: I think XBOX has an important role to play here. Coding became the first major workload for agents because they can write, run, and test software. Games share many of those same properties, and people spend more than 72 billion hours a year playing XBOX games, roughly five times the estimated time spent writing code worldwide. We’ve spent 25 years learning how to make great games, and I want our game makers to help shape what these new technologies make possible. As we learn, we’ll share the tools we build with developers across the industry, just as we always have. When I asked an Xbox rep if Labs was an AI-centric team, they said genAI was not the focus, describing it as having a broader mandate for using new tech in new ways in gaming. As an example, they pointed to Xbox’s recently launched disc-to-digital gaming usage rights program. Microsoft didn’t specifically name anyone involved full-time in Xbox Labs yesterday, but on social media and LinkedIn, I spotted Adrian Mato IDing himself as leading the creatio of tools at Labs and talking up the launch. Mato first caught my attention in late September, when he said on X that he was “starting to build a new team at Xbox focused on products and tools for how games get built and distributed as agentic tools become more capable.” At the time, he framed AI-based tools as a supplement to traditional game dev tools. “I don’t think we need to replace them,” he said. Since then, he’s publicly shown interest in AI and in games. He’s recently spent some of his X feed marveling at the power of AI agents and praising the lighting in the latest Gears of War. Following the Labs announcement yesterday, he enthused about the Xbox Labs’ stylish landing page. He wrote: “We built some fun tools to art-direct shaders in real time, experimented with interactive ASCII art, and sprinkled in lots of tiny details. “Move your mouse to leave a colorful trail that reveals the original footage, or interact with the video to trigger bursts of particles. “A lot of love went into making it all feel just right. “More to come”
Caltech breakthrough brings fiber-optic performance to silicon chips
Caltech scientists have created ultra-low-loss optical pathways on silicon chips that approach the efficiency of fiber optics and dramatically outperform existing technology at visible wavelengths. The breakthrough could unlock more powerful lasers, miniature atomic sensors and clocks, quantum systems, and more energy-efficient data centers.
How New Casino Plans At PENN Entertainment (PENN) Have Changed Its Investment Story
PENN Entertainment held a groundbreaking ceremony on 14 September 2026 for the future Hollywood Casino Hotel Council Bluffs, a land-based property intended to replace the adjacent Ameristar Council Bluffs riverboat casino, subject to regulatory approvals, with opening targeted for 2028. The move shifts capital into a land-based resort format that can concentrate gaming, hotel, and non-gaming spend in one property. This matters for guest economics, cost efficiency, and how PENN Entertainment...
Dairy farmers look to nutrition tools to improve efficiency, health
Zinpro Corporation discovery researcher Daryl Kleinschmit says he’s visiting with dairy farmers about improving efficiency during World Dairy Expo this week. “Improve transition health, reduce lameness, improve reproduction. So I think it’s the same topics every year, maybe a little different spin. But every year people come with a lot of the same questions, depending […]
Weiser joins lawsuit challenging new fuel economy standards
“The federal government’s backsliding on standards for the next five years requires less fuel economy than what the U.S. fleet of new cars and trucks achieved in 2021. Rolling back fuel efficiency standards will cost Coloradans even more at the gas pump, harm public health, and undermine our nation’s position in the EV market. These clean car rules are part of our clean energy future and that’s why we are challenging this illegal action,” said Attorney General Weiser.
PSE&G, Jersey City small business highlight utility’s energy efficiency investment
PSE&G joined Jewel Electric Supply and Jersey City Mayor James Solomon on Sept. 28 for an event highlighting energy efficiency investments.
ALTANFEETHI Expands Business, Targets SAR 4.2 Billion Market Value
Expands BusinessRIYADH, SA / ACCESS Newswire / September 15, 2026 / has posted rapid growth over the past five years, expanding from operating terminals into a full travel and hospitality ecosystem built on a heritage dating back to 1979, the company said, as it targets a market value of about 4.Since launching a new growth phase in 2021, the company has focused on building a more diversified and sustainable business model, centred on raising operational efficiency, diversifying revenue sources,
Chance discovery boosts the efficiency of perovskite tandem solar cells
Controlling the additive concentration gradient in mixed-halide perovskite formulations affects how well they perform as solar cells.
Daldrop Opens for Business in Southern Oswego County
$10 Million Facility in the L. Michael Treadwell Oswego County Industrial Park marks the largest expansion outside of Germany in the company’s 73-year history By Stefan Yablonski [caption id=attachment_11076 align=alignright width=450] Daldrop SBB CEO Jens Daldrop addresses attendees at the 2025 groundbreaking for the project. Daldrop also chairs the advisory board of Germany-based Daldrop Group.[/caption] A new era of cleanroom technology is underway in Central New York. The Daldrop Group’s advanced manufacturing facility and U.S. headquarters is physically built within the L. Michael Treadwell Oswego County Industrial Park. This industrial park is located in the town of Schroeppel. It marks the largest expansion outside of Germany in the company’s 73-year history. Daldrop SBB is based in Neckartailfingen, Germany. It is a global supplier of cleanroom technology, primarily to the pharmaceutical industry. It designs and builds advanced cleanroom environments for the pharmaceutical, biotechnology and medical technology industries. It nvested $10 million in the new project. “We broke ground in 2025; we were under construction all winter. We just opened this spring, early spring,” said Benjamin Morrow, operations manager and control. The company consolidated sites in Salina and DeWitt into the industrial park in Schroeppel, Morrow added. “The next move here is to maximize every square inch of this facility and then we are already looking at the expansion. So, it is more capital investment on equipment — definitely higher-end automation in additional equipment so we can produce more components and then to support the ever-growing base in North America,” Morrow continued. “We are the headquarters for service, maintenance and spare parts. So as Daldrop has more and more installations, they need more and more service, maintenance and spare parts. So that will come out of this facility as well — it already is.” “As a global leader in GMP (global manufacturing support) pharmaceutical cleanrooms for decades, I am very proud to bring manufacturing jobs to Upstate New York,” said Mike Sullivan, president of Daldrop US operations. Key to choosing Southern Oswego County [caption id=attachment_11077 align=alignright width=450] Daldrop SBB at the L. Michael Treadwell Oswego County Industrial Park when the company announced the start of construction.[/caption] Sullivan said that the selection of the Schroeppel industrial park was mainly due to the help of Operation Oswego County and two people in the organization. “Prior to being purchased by Daldrop International from the Stuttgart region of Germany, Vince Bongio was a founding partner in SBB Inc. as well as our head of engineering. We based out of Syracuse due to Vince’s skills in HVAC and the manufacturing capabilities found in Syracuse,” said Sullivan. Bongio moved to Syracuse from California in the 1970s to work in Carrier’s Industrial Division of Large-Scale Petrochemical Refrigeration. Next, he advanced to General Electric’s TV Tube Plant where he got into cleanrooms ,leading to his role of head of engineering for Clestra Cleanrooms where he met Sullivan, their New England distributor. “Vince Bongio is a phenomenal engineer. Formerly of Carrier, he grew up in California and went to Cal Poly,” Sullivan explained. “Carrier hired him right out of college and he moved to Syracuse. He is the reason we are in Syracuse today. He is retiring this year. We are very proud and his legacy is having brought Daldrop to Syracuse.” In 2000, Sullivan, Bazinet, Bongio Inc (SBB) was formed with engineering and manufacturing, based in Syracuse, and sales and construction based in Massachusetts as it is today. “SBB Inc. started in Syracuse. I had a design–build contracting firm out of Massachusetts that was primarily doing all the new technologies coming out of MIT,” Sullivan said. “I started a manufacturing side. A big thing for cleanrooms is the HVAC. Most cleanroom suppliers are architecturally focused people. The strength in Syracuse is HVAC. So, SBB developed with me running sales and construction out of Massachusetts and manufacturing out of Syracuse.” “Daldrop wanted to have a relationship in the States and of those who approached us, they were the only ones who really understood HVAC. So, we were the right fit for them. We did a joint venture focused out of Massachusetts from 2012 to 2018 leveraging their technologies,” Sullivan explained. “The commitment was if we brought their product to the States, we would do that if they built it here. “The pieces that had to be in place to make the investment, they wanted to acquire us, we were great with that. If you looked at business recommendations the general guidance was to build in a low labor area — something like North Carolina — but Syracuse had a strong background in HVAC and we chose Syracuse and Oswego County to be our headquarters in the States. So, it is built off of history, technology and the existing supply chain — bringing jobs back to the area.” During the initial discussions with Daldrop about coming to the U.S., SBB agreed to sell under the conditions Daldrop would manufacture in the U.S. There are many areas that offer incentives and economic packages, but the strength of HVAC expertise and skilled manufacturing was a big part of the discussions for site selection. Coming home [caption id=attachment_11078 align=alignright width=451] Construction moves forward in March at the L. Michael Treadwell Oswego County Industrial Park.[/caption] The second key person to building in Oswego County is Ben Morrow, Sullivan added. “Ben has been working with Daldrop SBB for more than 12 years and has advanced to COO of manufacturing and engineering. Ben grew up in Phoenix, so building a factory for the Germany company in Phoenix is a strong success for both his community and the appreciation of Ben’s skills as a team leader,” Sullivan said. “I went to high school in Phoenix. So, this is like full circle for me. It’s a small world,” Morrow said. “I hadn’t been back to Phoenix since graduation. This is one of the properties that John Trimble of C&S, he is the former president of C&S, he just retired, suggested. He and I were very good personal friends. John was from Mexico and I was from Phoenix. We knew each other from high school. And the architect of this building, Ed Smart of smartDESIGN Architecture in Batavia — I went to high school with him. So, this was a project that’s full circle a coming home kind of thing. The three of us knew each other — kind of like it was meant to be. Very serendipitous.” Schroeppel was one option for Daldrop to consider; the original intent was just to get a warehouse to store some product, he added. The facility is Daldrop’s largest outside of their native country. Total payroll at the facility will be approximately $2.4 million once fully staffed. “Here is 32,000 square feet and we plan to expand and put in an additional 10,000 square feet,” Morrow said. “We have 17.5 acres. We can put at least three more facilities here, just on this property. The master plan submitted for the current building is the first of possible three buildings on the campus.” “If we can find the right people and advance the production according to the plan, we should be able to grow for the next decade. One of the first jobs we filled was our new HR manager, with a primary focus posting and filling new positions,” Sullivan said. Stop the exodus, start hiring [caption id=attachment_11080 align=alignright width=452] Principals at the local Daldrop SBB headquarters, from left: Ben Morrow, Mike Sullivan and Jens Daldrop.[/caption] “I have been coming to Syracuse for 30 years. One of the things I had a hard time watching was the exodus of factories. One of the toughest things is to watch it with my partners’ kids who had to move away for jobs. It is important for us to give opportunity where people’s kids don’t have to leave the area to get work,” Sullivan said. “My responsibility is to find people who have skill sets that want to work and then I have to build opportunity for that work to happen. “After years of watching companies and Vince’s three sons all move out of the areas to get jobs, it is important to us to provide opportunities for the Syracuse region and help grow our company. We have been hiring for our new factory and will continue for the next few years.” “We are hiring and will continue to hire. Currently we have about 19 on staff right now,” Morrow said. “We expect to grow that by about 10 to 15 in the next 12 to 18 months or so. We are at 19 currently — one in the wings. It’s been great being able to hire locally. All these folks that we’ve been hiring, they all live within a few miles from here.” “We hired someone this past week (end of August). She grew up in the area, raised a family and is working down in Florida. She just took a job with us so she can move back and be with her family. We will be moving her back and she should be starting in October. We are very happy to see this happen,” Sullivan said. “I feel strongly about having a spot for the kids to not have to move out of the area. It is better to have people moving into the area.” Currently, Daldrop SBB has openings for finance manager, COO of construction and delivery, as well as mechanical, electrical designers and Revit modelers, construction managers, commissioning agents and many other skills that are needed. Along with Daldrop’s reputation in life science cleanrooms, there is a strong history in semiconductor, electronics, glass, photonics, aerospace and other markets. This may be helpful with any new technologies building in the market such as the Micron expansion and the support network, Sullivan said. “We acquired this property and closed on it two months before any announcement from Micron. It is serendipitous that they’re right down the street from us,” Morrow added. “Everybody started thinking ‘you guys are supporting Micron.’ We were here first. That is not a goal of ours. We may or may not … they are talking to us; it is an opportunity.” The long run [caption id=attachment_11079 align=alignright width=450] Benjamin Morrow, operations manager and control at Daldlrop, speaks during a recent ribbon-cutting event in Schroeppel.[/caption] “Long term, we will expand the Phoenix facility,” Sullivan said. “We built our facility with a campus approach. Sustainability is big. We designed our rooms to be more sustainable. Our building has no gas lines for heat. We put geothermal wells in the ground. We put heat pumps in for heating and cooling out of those wells and we put a large layer of solar panels up on the roof. We worked with National Grid for metering. Our building is a high efficiency model. We upgraded all the instillation and the glass filtering. So, it is a very green building. We will have a very minimal carbon footprint. It also adheres to LEED (Leadership in Energy and Environmental Design) construction standards.” “We are a bunch of HVAC engineers. We did a large scale geothermal and spent the money up front because we knew it made sense in the business sense in the environmental sense and sustainability,” Morrow said. “We have insulated metal panels on walls and roof; we are an envelope from the exterior.” Daldrop, as a global player, has a strong culture of sustainability that is found in all its products including the new facility. The building has been designed with (sixteen) 400-foot deep geothermal wells, high efficiency construction methods, approximately 70 kilowatt solar photovoltaic panels, electric vehicle chargers and 26% recycled content. “Daldrop thinks of long-term investing,” Sullivan said. “On the roof, photovoltaic panels supplement our power. Over half the energy that I use is coming from the sun. We have chargers up front for employee electric vehicles. This place is built to last. This slab that we are walking on, normal buildings are four inches, some go to six inches, we are nine inches all the way through — except where the heavy equipment is — that is 10 to 12 inches thick, solid concrete. It allows us to reconfigure for whatever type of equipment we want to bring in,” Morrow said. “We are authorized by Underwriters Laboratory to self-certify so we don’t need to have an inspector come out and recertify. We get audited often, but we certify our own electronics. The control system in this building is rather high-end. Our thermostat in every room is zoned, independent. We analyze the data; incorporate it with our solar panels.” “There is a lot of competition for people to work. It’s not just about how much salary they are going to make — it’s about the work environment, the ability for stability. We want to make sure our employees have the best environment to work in,” Morrow added. Similarities “One of the reasons I believe why Daldrop chose this area, Phoenix in particular, is because it is a village, a river-based village. Neckartailfingen in Germany where Daldrop is based is also a river-based village, manufacturing community. So, there is a lot of similarities — that smalltown feel,” Morrow said. “We have a lot of connections through multiple employees that lead back to Carrier, also. Everything came together, the timing everything.” “We are thankful for all the economic development support. Everyone has been helping make this happen. So, keep it up, it is working, that is all I got to say, Sullivan said. “If you look at historical industrial manufacturing, this region has skills that have been un-utilized. The northern industrial region has a lot of skills that if we can tap before they go away, we can leverage them. That is what we are trying to do. You’d be surprised at the supply chain left behind from Carrier — that supply chain is still there.” “Operation Oswego County has been fantastic,” Morrow added. “I can’t say enough good things about that group.” What Is Cleanroom Technology Cleanroom technology is a system of specialized engineering, filtration and operational controls used to maintain an extremely low concentration of airborne particles, microbes and chemical vapors. How It Works • Air Filtration: Uses HEPA or ULPA filters to remove 99.97% of tiny particles down to 0.3 microns. • Airflow Control: Directs air in a steady, unidirectional (laminar) or filtered turbulent pattern to push dust away from work areas. • Environmental Regulation: Maintains precise control over temperature, humidity and positive air pressure to block outside air leaks. • Specialized Attire: Requires personnel to wear full-body garments (“bunny suits”), gloves and masks to stop human shedding
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Among the federal government’s many responsibilities is the work it does to protect public health. Federal agencies monitor our food supply to ensure safety, conduct research to better understand emerging health threats, provide funding for public health programs in communities and work to detect and respond to disease outbreaks. Americans rely on these efforts every day—in a 2024 online survey, 74% of respondents said that “if the federal government issued safety guidance about food you eat regularly,” they would follow it. Changes to Federal Public Health Capacity The Trump administration’s efforts to reshape the federal government have resulted in significant impacts on our nation’s public health capacity over the past 20 months, affecting the response to health concerns such as measles, Ebola and cyclosporiasis. Agencies with core public health, food safety and disease prevention responsibilities experienced large workforce decreases during the first year of the administration. At the Centers for Disease Control and Prevention, for instance, the workforce in February 2026 was 26.7% smaller than in September 2024 before the start of the Trump administration. The Food and Drug Administration saw a similarly steep decline of 21.6%. Agencies such as the National Institutes of Health, Substance Abuse and Mental Health Services Administration and Food Safety and Inspection Service also experienced large workforce decreases. (function(){function e(){window.addEventListener(`message`,function(e){if(e.data[`datawrapper-height`]!==void 0){var t=document.querySelectorAll(`iframe`);for(var n in e.data[`datawrapper-height`])for(var r=0,i;i=t[r];r++)if(i.contentWindow===e.source){var a=e.data[`datawrapper-height`][n]+`px`;i.style.height=a}}})}e()})(); Changes can also be seen in crucial public health occupations. The number of federal food inspectors, for example, decreased by more than half between September 2024 and February 2026, going from 1,035 to 473. This is the lowest number of food inspectors employed by the federal government since at least 2005. By February 2026, there were also 33.3% fewer federal public health program specialists, whose work includes advising federal funding recipients on public health activities and analyzing the effectiveness of public health programs. Government’s capacity is diminished as employees with specialized knowledge and experience in protecting the public and responding to health risks depart, leaving agencies less prepared to carry out their public health missions. There also have been vacancies in critical high-level leadership positions at public health agencies, most notably at the CDC, which had a permanent Senate-confirmed director for less than a month between January 2025 and early August 2026. Although the CDC has previously been led by acting directors at the start of an administration, the nearly yearlong gap since the departure of the administration’s first permanent director in August 2025 is without precedent. As of August 2026, the FDA is also currently without a Senate-confirmed commissioner following the previous commissioner’s resignation in May 2026. Additionally, public health agencies are experiencing increased politicization of their leadership ranks. In agencies such as the CDC and Food Safety and Inspection Service, the number of individuals in the Senior Executive Service—the most senior career leaders in government—has declined significantly, while at the same time the number of political appointees has reached record levels. (function(){function e(){window.addEventListener(`message`,function(e){if(e.data[`datawrapper-height`]!==void 0){var t=document.querySelectorAll(`iframe`);for(var n in e.data[`datawrapper-height`])for(var r=0,i;i=t[r];r++)if(i.contentWindow===e.source){var a=e.data[`datawrapper-height`][n]+`px`;i.style.height=a}}})}e()})(); (function(){function e(){window.addEventListener(`message`,function(e){if(e.data[`datawrapper-height`]!==void 0){var t=document.querySelectorAll(`iframe`);for(var n in e.data[`datawrapper-height`])for(var r=0,i;i=t[r];r++)if(i.contentWindow===e.source){var a=e.data[`datawrapper-height`][n]+`px`;i.style.height=a}}})}e()})(); At the CDC, for example, the number of career SES decreased 42.9% between December 2024 and February 2026, while the number of non-Senate confirmed political appointees at the agency was six times larger than the agency’s historical average from 2009 and 2024. Knowledgeable career leaders are integral to the ability of public health agencies to carry out their work with scientific integrity and professional judgment, and rapid leadership turnover and increased politicization threaten agencies’ ability to make evidence-based decisions to protect our health. The upheaval and politicization in public health agencies have also negatively affected employee engagement. Strong employee engagement is crucial to the ability of agencies to carry out their mission and successfully provide essential services to the public. In the 2025 Public Service Viewpoint Survey conducted by the Partnership for Public Service, the Department of Health and Human Services—which encompasses major public health agencies such as the CDC and FDA—had an employee engagement and satisfaction score of 20.4 out of 100, one of the lowest among large agencies. Only 2.8% of HHS employees indicated trust in their political leaders and only 8.7% reported confidence that they could report a suspected violation of law or regulation without retaliation. Employees at HHS also reported that the agency’s ability to provide services to the public had suffered. Nearly half of employees at HHS, 47.5%, said their work unit was worse at delivering quality services compared to its performance in 2024. In addition, 57.8% said their work unit was performing worse at fulfilling stakeholder needs. In addition to the work done within federal agencies, the federal government also distributes significant funding for public health and disease prevention work to state and local governments, nonprofits and small businesses—funding which has been significantly disrupted. At the CDC, for example, there was a 71.9% decrease in the amount of project grant funding issued in fiscal year 2025 compared to fiscal year 2024. The FDA also issued far less funding in fiscal year 2025—a 21.3% decrease from its fiscal year 2024 funding. Changes in federal funding include the ending of grants to community organizations that worked on HIV prevention and the cancellation of funding for research into improvements to patient safety and healthcare quality. These changes go beyond federal agencies to impact the broader public health ecosystem, including the state and local health departments responsible for much of the on-the-ground public health work in their communities. About 80% of the CDC’s domestic funding is directed towards state and local partners—meaning that cuts to CDC funding can ultimately result in cuts to state and local public health capacity. Federal agencies also provide expertise and assistance to state and local health agencies as they deal with particular health challenges, but workforce cuts have resulted in fewer federal employees available to help. The Impact of Changes to Public Health Capacity These changes to federal public health capacity are not abstract concerns. Disrupted programs, reduced funding and lost expertise at public health agencies across all levels of government threaten the public’s physical well-being and safety. In some cases, this has already led to harm. The most immediate impacts of federal cuts were seen in interruptions to ongoing public health programs and crisis responses. In one instance, when CDC grants were canceled during the 2025 Texas measles outbreak—the most severe measles outbreak in 25 years—public health officials in Lubbock, Texas were forced to pause parts of their measles response work supported by the frozen funding. Lubbock’s director of public health further said that a lack of available CDC experts to reach out to for advice “definitely” impacted the department’s response to the measles crisis. Cuts to federal funding also forced Dallas County Health and Human Services to cut staff and cancel 50 community vaccination clinics during the outbreak. Public health work outside of major outbreak responses was also disrupted. For example, in April 2025, the Milwaukee Public Health Department was unexpectedly unable to reach experts on lead poisoning due to firings at the CDC when responding to concerns about lead contamination in Milwaukee public schools. Due to federal workforce cuts, several programs at the CDC, including Alzheimer’s and epilepsy programs, have also become trapped in limbo—existing on paper, but without the staff necessary to operate. More recent crises reveal how federal cuts have weakened the public health infrastructure needed to prevent and respond to dangerous new outbreaks. Internationally, cuts at the U.S. Agency for International Development eliminated funding for disease testing and contact tracing abroad, which delayed detection of and responses to the 2026 Ebola outbreak in the Democratic Republic of Congo. While international outbreaks may seem far removed, the unchecked spread of disease in any country can quickly pose a danger to economic well-being, security and health around the world. Within the United States, public health cuts inhibited responses to the summer 2026 outbreak of the food-borne parasite cyclospora. At the federal level, cuts to funding for lab equipment and for CDC staff with expertise in parasitic infections—including 9 out of 11 staff members at the lab responsible for identifying parasitic outbreaks in 2025— contributed to the largest reporting delay in outbreak cases at the CDC in 15 years. Conflicting communications from the FDA about the source of the outbreak, which followed cuts to the agency’s communications department, additionally led to confusion among the public about how to best avoid infection. At the same time, cuts to HHS funding and support for local and state public health slowed some health departments’ responses to the crisis. The exact costs of these delays, constraints and confusion in public health responses are difficult to estimate. However, their message is clear: federal cuts have already made containing threats to public health even more of a challenge. Conclusion Protecting public health—from food safety to disease prevention—is one of the federal government’s most important missions. Dramatic and haphazard cuts to federal agencies and funding have already disrupted the public health system, impacting the response to challenges such as measles, lead poisoning and cyclosporiasis. The U.S. public health system needed improvement before these disruptions. Since 2022, federal leadership and coordination in response to public health outbreaks has been on the Government Accountability Office’s High-Risk List of areas in need of attention to improve government effectiveness and efficiency. Recent cuts only compound these concerns. The chaotic dismantling of government and resulting disruptions to crucial functions like public health and disease prevention highlight the need for meaningful reform and concrete policy proposals to reimagine how government can better serve the public and be more effective, responsive and accountable. To learn more about the impact of federal cuts to public health and science more broadly, visit The Cost of Cutting American Science. Learn more For more information on the Partnership for Public Service’s government reform initiative, visit Government for a New Era. View here In line with The Cost of Cutting American Science, federal workforce data in this brief is as of February 2026
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Panther Lake debuts the first commercial implementation of backside power delivery (BSPDN), introduces Intel’s first iteration of gate-all-around (GAA) transistors, and showcases their advanced packaging capabilities with its Foveros-S assembly. With Panther Lake, Intel’s manufacturing arc has shifted from nebulous roadmaps to shipped silicon, a significant milestone on their long road back to competitive semiconductor manufacturing. To evaluate the extent of Intel’s comeback, we tore down Panther Lake. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Our teardown traces 18A from its four-sheet RibbonFETs (Intel’s marketing name for GAAFETs) and gate stacks through contacts, frontside and backside wiring, and the bonded carrier. We explain how these material and integration choices improve gate control and reduce resistance, while adding capacitance, thermal resistance, and process complexity. Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. However, 18A does not lead TSMC N3P, N2 or Samsung SF2 in peak density. Panther Lake’s CPU cores are incremental updates, and the high-end GPU still uses TSMC N3E. Panther Lake assembles one compute tile, one GPU tile, and one I/O tile atop a passive base tile using Intel’s Foveros-S advanced packaging. Both compute tile variants use Intel 18A. The Xe3 GPU options are a 4-core GT1 tile on Intel 3 and a larger 12-core GT2 tile on TSMC N3E. Both I/O tile variants use TSMC N6. [1], [2] Our analysis centers on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery (BSPD) moves the main power network behind the transistor layer, to the backside, separating it from frontside signal routing. We covered BSPD and its impacts in 2024. [3], [4], [5] Intel’s BSPD implementation, branded as “PowerVia”, routes power through dedicated backside metals to nano-TSVs, which connect those rails to local source/drain (S/D) contacts. Implementing that separation requires Intel to build the interconnect stacks from both sides of the wafer. The frontside comprises the M0-M14 signal stack, while the backside comprises the BM0-BM5 power stack. M0 and BM0 are closest to the transistors. The nano-TSVs connect the two sides, but Intel patterns and etches each via from the front after forming the contacts. A narrow via runs from the side of the contact deep into the silicon substrate. Intel then completes the frontside signal metal stack, bonds the wafer to a carrier, flips it and removes the original substrate until the buried via tips are exposed. The backside metal stack is then deposited directly on the revealed vias. The nano-TSV and backside-via profiles taper in opposite directions because Intel forms them from opposite sides of the wafer. The transistor structures form the FEOL. Local contacts and nano-TSVs connect them to the wiring. M0 begins the frontside interconnect stack. The silicon carrier remains attached above the frontside interconnects. It supports the device wafer during substrate removal and backside processing and remains part of the finished chip’s thermal path. PowerVia removes the main power distribution from the congested frontside metals, routing supply through shorter and wider backside wires. Its lateral landing still occupies area in the standard cell, so it recovers less cell area than a direct backside contact. [3] Nano-TSVs beside the logic devices carry VDD or VSS from the backside power network, while signal connections continue upward through the frontside metals. Backside Interconnects Samsung SF2 data is included for comparison to Panther Lake’s within this article. SF2 is the incumbent GAA foundry node but lacks BSPD, serving as a useful reference to evaluate 18A. A full teardown of Samsung’s S26 products, processed on SF2, will be shared soon.Nanosheet-cut EDS comparison. The PowerVia supply path runs from the backside Cu rails through Mo-lined W nano-TSVs to the local transistor contacts. In this cross section, the tapered connection spans roughly 150 nm from the contact level to BM0. The Ta liner confines Cu and promotes adhesion to the surrounding stack; the AlOₓ etch stop controls the next dielectric etch above the rail. Dielectric beneath the ribbons electrically separates the devices from the backside wiring and removes the conducting silicon body below the channel. [6] AlOₓ serves as an etchstop (ES), enabling endpointing and protecting the underlying layers. Low-volatility aluminum fluoride reaction products resist the fluorinated plasma, allowing a thin AlOₓ film to protect the metal while the surrounding low-k dielectric is removed. [6], [7]. While the BM0 and layers above the M1 lines show double AlOx layers, Our SMIC N+3 teardown showed single AlOₓ layers. SMIC uses a simpler local AlOₓ substack, while the remaining cap and etch sequence provide the required landing protection. So why double layers? The closely spaced AlOₓ doublets provide two protected endpoints in the etch sequence. Intel documents an AlOₓ/SiN/AlOₓ stack that explains the benefit. The main dielectric plasma etch stops on the first AlOₓ film; a selective wet clear opens that film; a second plasma etch removes the intermediate SiN and stops on the second AlOₓ film. The final wet clear exposes the metal landing surface. SiN is the intermediate dielectric in Intel’s published example. [8] The second stop protects the metal through a cap breakthrough. Wide openings can etch faster than narrow ones, and etch depth varies across the wafer. Metal under an early-clearing opening would otherwise be exposed while other openings still need more etching. Staged protection widens the process window and reduces metal erosion, corrosion and void formation. [8] TSMC documents AlN/AlOₓ/SiOC/AlOₓ above Cu, with AlN blocking Cu diffusion, and a simpler AlN/SiOC/AlOₓ variant that omits one AlOx film. [9] Levels with different opening sizes, aspect ratios, pattern densities and cap materials need different etch margins. A double AlOx stop is useful where another protected endpoint justifies the added processing. The extra film adds formation, selective opening and cleaning steps, plus another set of interfaces to control adhesion, moisture, and stress. These blanket films are opened through the existing via pattern, so each film does not require another lithography mask. AlOₓ adds parasitic capacitance when it replaces lower-k dielectric; two thin AlOₓ films can nevertheless contain less AlOₓ than one thick film. Total thickness, placement, and theintermediate dielectric determine the electrical cost. Deposition chemistry also changes AlOx permittivity and residual hydroxyl content, which can oxidize the underlying metal. [7], [8], [10], [11] The backside stack separates into relatively fine BM0-BM2 wiring near the devices and coarser BM3-BM5 power distribution. The largest pitch increase occurs between BM2 and BM3. BM0’s pitch closely matches the logic-row height, fitting local power delivery to the cell rows. Higher levels aggregate current through larger conductors: routing density becomes less important than low resistance and current capacity as the network approaches the package. This hierarchy provides wide power wiring for the power delivery network without consuming scarce frontside signal-routing resources. [3] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Frontside Interconnects Intel 18A combines Mo-lined W contacts and nano-TSVs with a separate backside Cu power network. Samsung SF2 keeps power on the frontside, using Ti-based contact interfaces and Ta-based barriers and Co liners around Cu wiring. In 18A standard-cell rows, backside power rails supply the devices through nano-TSVs within the cells, freeing frontside routing resources. Samsung’s M0 accommodates both power and signal connections. From the device toward M0, the connection runs through a Ti-based S/D interface, W contact fill, a Mo-lined W via, and the Cu M0 wire. Mo supplies a conductive nucleation and adhesion layer for W, replacing the resistive TiN liner used in conventional W integration. This increases the effective conduction volume within the feature while retaining W fill and its established polishing, cleaning and etching processes. Intel’s Mo/W patent describes this integration tradeoff. The nano-TSV uses the same Mo-lined W construction in the backside supply path. [12] The move from TiN to Mo is an incremental change. While a full Co or Mo fill can also reduce the volume lost to liners in very small features, it requires new integration schemes that increase complexity and risk. Cu remains attractive for wider wires due to its low resistance. As wires and vias shrink, the diffusion barrier consumes an increasing fraction of their cross-section. [12], [12], [14] Intel uses Co/Ru liners at M0-M1, Co at M2-M4, and Nb at M5-M9. The lower-level liners help Cu adhere and reduce void formation during trench fills. Applied Materials’ Endura has new thermal control that facilitate wetting process, so the thin film continuity is good enough that good capillary pressure will drive Cu atoms to the via bottom without voiding. Intel’s choice to use Nb is particularly interesting. Intel’s Nb patent describes a conductive diffusion barrier intended to reduce the barrier’s contribution to resistance relative to conventional Ta-based barriers, particularly at via bottoms where all current crosses the barrier. The patent pairs Nb in coarser levels with the option of lower-cost PVD processing. [15], [16] The upper metal layers support thicker barriers formed through physical vapor deposition (PVD) despite its worse coverage and uniformity. Meanwhile, the lower metal layers require thinner barriers deposited through conformal atomic layer deposition (ALD). Co/Ru adds another material interface and requires controlled deposition and Cu fill. Changing liners and barriers by metal layer allows Intel to optimize interconnect resistance, process complexity, and reliability. [15, 16] RibbonFET, Intel’s name for its gate-all-around FETs (GAAFETs), replaces the FinFET’s vertical fins with four stacked horizontal silicon nanosheets, allowing the gate to surround the channel on every side. The path to GAAFET begins with the planar transistor. A planar MOSFET places the gate above the channel between its source and drain. Pairing an NMOS with a PMOS transistor creates a CMOS inverter, in which the NMOS pulls the output low for a high input, and the PMOS pulls it high for a low input. The gate must retain electrostatic control of the channel to ensure clean switching. As gate lengths shrank, the drain began to compete with the gate for that control, increasing off-state leakage. Electrostatic control was restored through an architectural evolution that raised the channel into a vertical fin and wrapping the gate around three sides. Called “FinFET”, this new architecture packed more effective channel width into a smaller footprint. Further scaling made it harder to maintain both drive current and leakage within smaller cells, and reintroduced the same problems planar MOSFETs faced. Nanosheet GAAFETs close the fourth side by replacing the vertical fin with a stack of horizontal nanosheets, each surrounded by the gate. The tighter electrostatic control suppresses leakage at shorter gate lengths while stacking adds effective channel width within the cell footprint. In a FinFET process, channel width changes in discrete steps as designers must add or remove whole fins. Nanosheet width can instead be adjusted continuously within the process’s design rules. Wider sheets increase drive current, while narrower sheets reduce capacitance at the cost of drive current. Intel 18A uses stacks of four nanosheets each and varies their widths across logic and SRAM. At the process level, adding more sheets to each stack increases effective channel width and drive current, but complicates fabrication. RibbonFET vs MBCFET Samsung began GAAFET production in 2022 with SF3E, following with SF3 and now SF2. Its ‘MBCFET’ provides a useful structural comparison with Intel’s first RibbonFET implementation. [17] STEEL is digging deeper into SF2, used in the Exynos 2600, and TSMC’s GAAFET N2, used in Apple’s A20 Pro, in upcoming newsletter articles. We’re throwing some teasers on X. Let’s compare Samsung SF2’s MBCFET with Intel 18A’s RibbonFET. Subscribe Even to the untrained eye, Intel’s extra nanosheet is obvious. Intel stacks four ribbons to Samsung’s three. Samsung’s sheets are much wider in these fields, so both sheet count and width matter to the available channel perimeter. Sheet width also changes which silicon surfaces carry current. On conventional (001) silicon, wide nanosheets emphasize the broad top and bottom surfaces, favoring electron transport; the larger sidewall contribution in a narrow sheet favors hole transport. Thinner sheets improve gate control but increase confinement and scattering. This makes width and thickness part of the NMOS/PMOS balance, alongside strain and threshold voltage. [18], [19] GAAFET designs like 18A use different work-function-metal (WFM) stacks for NMOS and PMOS. Around each ribbon, a thin SiOx interfacial layer separates the silicon channel from the HfOx high-k dielectric, with La providing dipole tuning and the WFM wrapping the dielectric. NMOS uses a TiAl-based stack, while PMOS uses TiN WFM. W fills the remaining gate trench, providing a lower-resistivity path where the work-function layers are no longer needed. In this field, the PMOS stacks leave room for W between ribbons, while the NMOS stacks occupy more of those gaps. A silicon-based dielectric marks the P/N boundary, allowing the PMOS and NMOS gates, sharing the same gate trench, to be processed sequentially. Fast logic paths, retention circuits, and SRAM need a family of threshold options. Changing threshold without substantially changing device dimensions, capacitance or fabrication complexity is valuable. FinFET processes typically use different work-function-metal stacks. In a four-ribbon GAA stack, the narrow sheet-to-sheet gap limits how much WFM can fit around each channel. La in the gate dielectric creates interfacial dipoles at the SiOx/HfOx boundary, shifting effective work function and tuning threshold voltage. This gives Intel another control alongside its NMOS and PMOS WFM stacks. Low-threshold devices improve critical-path drive; higher thresholds reduce leakage elsewhere. Dipole tuning is especially useful in GAA because it changes threshold without consuming the narrow intersheet gap with thicker WFM. Precise control of La incorporation, diffusion and interface quality has long been a challenge, limiting viability in high volume production but is now seen from every leading-edge foundry. Intel’s patent describes depositing a dipole-forming oxide above HfOx and annealing it toward the interfacial oxide before completing the work-function and fill metals. This separates threshold tuning from the space available for metal. Newer research addresses the thermal cost: imec’s 2026 dipole-middle research inserts the shifter between two HfOx depositions, shortening the diffusion path while protecting SiOx during patterning. [20], [21]Matched-cut EDS, Intel 18A (left) vs. Samsung SF2 (right). Intel retains raised source/drain epi beneath its contacts, while Samsung recesses W deep into the epi to form a V-shaped Ti-lined interface. The deeper contact increases metal-to-semiconductor area and shortens the current path from the lower sheets, reducing contact and spreading resistance. It also removes epi volume and brings the contact etch closer to the channel ends. Retaining more epi preserves the material available for strain transfer, especially from SiGe into PMOS. These geometries balance contact access against stress engineering and etch margin. [22], [23] Samsung stacks three sheets to Intel’s four ribbons, and both processes use sheet width to tune drive strength. In our Samsung cross-sections, widths range roughly from 19 to 30 nm in the NPU rows and 37 to 50 nm in the CU cell. The Samsung nanosheets taper, with the widest sheet at the bottom and the narrowest at the top. Both processes use HfOx gate dielectric and Ti-based work-function stacks, with Al in the NMOS stack. In the Samsung devices shown here, the dielectric and WFM occupy the intersheet gaps, leaving W above the top sheet. Intel’s PMOS stack leaves more room between ribbons, and W fills those gaps while the thicker NMOS stack leaves W mainly in the upper trench. Gate-stack EDS maps. The W between Intel’s PMOS ribbons provides a conductive path close to the lower gates. Where WFM fills the entire gap, the gate still surrounds the channel, but voltage reaches it through the more resistive work-function films. Thinner WFM and dipole tuning preserve room for low-resistivity fill; Mo and Ru are alternative fill metals being developed for further scaling. [24] A masked, sequential WFM flow explains the different gate heights and inter-nanosheet fill. The proposed sequence below shows how separate NMOS and PMOS work-function steps produce that geometry. Enabled by the BSPDN process, Intel replaces the dense-logic silicon subfin with dielectric, removing the parasitic conduction path below the ribbons and reducing substrate-related capacitance. A retained silicon body as in classical, non-SOI, planar and FinFET designs needs junction and punchthrough-stop engineering to suppress leakage. Dielectric isolation makes that leakage less sensitive to the subfin doping profile but adds removal and fill steps. It also weakens the direct thermal path through silicon, making the contacts, metal stacks and package more important for heat extraction. [24], [26] Fluorine is concentrated around selected Intel device structures in the maps. WF6 is a standard precursor for W nucleation and fill, while barrier films protect adjacent dielectrics from fluorine attack. Low-fluorine W processes reduce the residual-F burden. Chloride-based precursors avoid introducing F during W deposition, but require control of chlorine attack, nucleation and fill quality. The integration target is a continuous, low-resistance W path with a thin protective liner and minimal chemical damage to the surrounding stack. [20], [27], [28] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. We measured cell height, gate pitch, metal geometry, and ribbon dimensions at the XTEM sites shown below. The tables group these dimensions by site and device polarity. Our “sheet cuts” cross the silicon channel and show the ribbons end-on. “gate cuts” run along the channel through successive gates. The 18A logic cell dimensions point to a five-track logic library while the N3E and Intel 3 cell dimensions evidence a seven-track logic library. The DDR-PHY uses wider M0 wires and much larger spacing than core logic. That trades routing density for lower wire resistance and weaker coupling between neighboring nets. The geometry suits the current delivery and coupling requirements of analog, clock, and I/O circuitry. PowerVia lets 18A combine a compact cell height with wider M0 geometry by moving the main power rails off the signal-routing tracks. That relaxes local wire scaling while preserving a small cell footprint. Cell height and gate pitch set the geometric density; pin access and routability determine how much of it a real block can use. [29] The biggest takeaway from our gate-pitch measurements is that Intel 18A compute logic and TSMC N3E GPU logic have similar density in the Bohr representative-cell model. The 18A example is 18.6% denser than the Intel 3 GPU example. Gate pitches are nearly identical across the three sites, so cell height drives most of the difference. The Bohr model combines a four-transistor NAND2 spanning three gate pitches and a 32-transistor scan flip-flop (SFF) spanning nineteen pitches, weighting their densities 60:40. The sensitivity column shows how independently changing cell height and gate pitch by ±1 nm changes the result. This compares representative cell geometries; whole-die density also depends on cell mix and placement. The 18A P-core gives M0 substantially more metal cross section than the N3E vector engine. Treating each profile as a trapezoid gives 2.63 times the area per line and 1.84 times the area after normalization by routing pitch. The larger section reduces the geometric contribution to line resistance and lowers current density for a given current. Taller and wider wires also add capacitance, so circuit delay depends on the balance of resistance and capacitance. The DDR-PHY has less metal area per routing width than the 18A core fields, while remaining above N3E. [30] Area = height × (top CD + bottom CD) / 2, including liners. Area/pitch normalizes by routing width. Taper is the symmetric sidewall angle from vertical, with the largest angle belonging to the DDR-PHY. Compute tile The measurements show how ribbon dimensions and gate-stack geometry vary across the compute tile and between NMOS and PMOS to balance channel drive, gate load and the space needed for the dielectric/WFM stack across logic, SRAM and the DDR-PHY. Width mainly changes available channel perimeter; thickness also changes electrostatic control and carrier confinement. Gate-stack thickness then determines the space left for low-resistivity fill P-core and LP E-core logic Both the P-core and LP E-core use multiple nanosheet widths. Widths are measured on high-magnification XTEMs while wider-field images demonstrate additional width choices within the LP E-core. Multiple widths are expected even within an LP E-core. Timing-critical paths, buffers and cells with different fanout need different drive strengths. The lower-magnification fields show this width diversity beyond the sites quantified in the table. L2 and L3 SRAM GAA gives SRAM designers another way to balance the pull-up (PU), pass-gate (PG), and pull-down (PD) transistors. FinFET bitcells set device strength through fin count while GAA adds nanosheet width as a sizing knob. In a 6T SRAM cell, a strong pull-down relative to the pass-gate limits read disturbance, while a strong pass-gate relative to the pull-up improves writability. During a write, the pass-gate and write driver pull the node storing “1” below the inverter trip point. During a read, the pull-down holds the node storing “0” low. Bias, threshold voltage, mismatch and assist circuitry set the remaining margin. FinFET high-current cells commonly use a PU:PG:PD fin-count pattern of 1:2:2, a device-sizing ratio rather than a current ratio. Ribbon width lets Intel balance SRAM strengths without adding whole fins. The L2 cell uses its narrowest ribbons for PU and widest for PD, improving writability and read stability respectively. Intel’s disclosed HCC operates without assist; its denser HDC uses negative-bitline write assist. Pulling the selected bitline briefly below ground increases pass-gate overdrive so it can overpower the pull-up at lower supply voltage. That buys density and low voltage writability at the cost of boosting circuitry, switching energy, and additional voltage stress that must be controlled. [31], [32] Four rectangular ribbons give the perimeter = 8 × (width + thickness), before corner rounding. PG/PU is 1.49 and PD/PG is 1.16. The L3 structures closely resemble L2 in layout and cell height. Fewer L3 nanosheet widths are tabulated because fewer high-magnification images were available. DDR PHY The DDR-PHY trades density for controlled analog behavior and reliable off-chip signaling. It contains drivers, receivers, delay circuits, and calibration logic that set drive strength, sampling time, and voltage margin. Repeated four-sheet devices with similar widths fit the use of regular transistor units for matching and programmable drive. Its wider local wiring provides room for current delivery and separation of sensitive signals, while consuming more area than a dense core-logic grid. The layout serves the memory channel’s electrical requirements as well as digital logic density. [33] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Intel 3 GPU devices Vector engine logic Intel 3’s XVE logic uses two-fin PMOS and NMOS devices with power rails in M0. Its cell height and M0 pitch give a seven-track geometry, two tracks more than the 18A logic. One-fin groups also appear among the two-fin devices. Intel 3 L2 SRAM The Intel 3 L2 SRAM uses the familiar HCC sizing pattern: one PU fin, two PG fins, and two PD fins. N3E GPU devices Vector engine logic The N3E XVE field contains repeated two-fin devices with seven-track cell geometry. N3E remains a FinFET process, giving Panther Lake a direct FinFET-to-RibbonFET comparison. N3E L2 SRAM The N3E L2 SRAM uses the same PU:PG:PD fin-count pattern of 1:2:2. Panther Lake-U follows Lunar Lake’s floorplan quite closely. Both pair 4 P-cores with 4 LP E-cores and NPU, media and display engines in similar locations. Lunar Lake also uses Xe2, the direct predecessor to Panther Lake’s Xe3 GPU. This makes Lunar Lake the most direct basis for our comparisons. Arrow Lake differs in core count and uses the older Xe-LPG GPU architecture, so we only use it where it offers a more direct component-level comparison. Compute tile Panther Lake compute-tile floorplans remain sparse even months after launch. Intel 18A’s backside metal and dielectric stack must be removed without damaging the underlying structures before a clean transistor-level floorplan can be imaged. Most published die shots hide or heavily process the background, but we are quite proud of the die shot we achieved and are excited to show the work we have done. We measured the areas of the key components on the compute tile and compared them with their Lunar Lake predecessors on TSMC N3B. These help us to capture changes in block area and compare the two chips across process nodes and designs. Our total tile areas exclude the scribe-line area. The compute-plus-GPU subtotal below uses the PTL-U compute tile and GT1 GPU; it excludes the I/O tile and passive base. Individual block areas use the boundaries marked on the floorplans The compute-plus-GPU row is recomputed from the displayed PTL-U and GT1 areas. Component rows use their stated per-region counts and are not an additive partition of the whole tile. The P-core area remains almost unchanged between Lunar Lake and Panther Lake, despite L2 capacity increasing from 2.5 MiB to 3 MiB. Arrow Lake uses the same Lion Cove core as Lunar Lake but also has a 3 MiB L2. Cougar Cove fits 20% more L2 into the same P-core area. The larger private cache keeps more of each core’s working set close to its execution units, reducing access to shared L3 and DRAM. Extra capacity adds storage leakage and lookup energy, so designers balance it against avoided lower-level accesses. The shared P-core L3 cache also shrank by 14.8%. [2] Cougar Cove combines a similar footprint with Intel’s reported power-efficiency improvements. RibbonFET’s tighter channel control reduces leakage, while PowerVia reduces supply droop and allows tighter voltage guardbands. [1] Darkmont’s four-core LP E-core cluster is 5.0% smaller than Skymont’s on Lunar Lake, with most of the reduction in its L2 regions. The 1 MiB region shrank by 8.4% and the 1.5 MiB region by 14.9%. The tag arrays also use one fewer visible row. Tags identify which memory addresses the data array holds, so rearranging them changes the cache’s layout and wiring without requiring less data capacity. [2] The LP E-cores share one L2. This pools capacity and avoids duplicating all the cache machinery, but the four cores contend for its banks and bandwidth. Their separate cluster also keeps light work away from the performance cluster and its L3, allowing that larger domain to sleep. [1], [2] Cache area includes more than the storage cells. Tags identify each line, decoders select rows, sense amplifiers read the small bitline signal, and wires connect to the banks. Splitting an array into smaller sections shortens wordlines and bitlines, improving access speed, but duplicates peripheral circuits. Panther Lake’s smaller cache regions therefore reflect the complete memory implementation, including how much of each region is devoted to storage. [34] Unlike Meteor Lake and Arrow Lake, Panther Lake has no separate SoC tile. The NPU, LP E-cores, memory controllers, PHYs, media and display engines now share the compute tile. This removes an active die and keeps CPU memory traffic on one die. The cost is moving PHY and I/O-related circuitry onto 18A: drivers, receivers and analog circuits must still meet external voltage, loading and signal-integrity requirements, so their area does not shrink like dense digital logic. [1], [2] The biggest shrink comes from the NPU, which occupies 36.9% less area. NPU 5 consolidates the same total INT8 MAC count into half as many neural compute engines. Each of the three NCEs has a larger MAC array to make the complete NCE envelope 22.6% larger than an NPU 4 engine. Consolidation also halves the number of scratchpads and SHAVE DSPs, from 12 to 6. The MAC array handles matrix multiplication and convolution, while SHAVE executes vector and custom operations that fit the array poorly. [1], [2], [35] The paired floorplans identify each NCE envelope and its scratchpad, MAC, and SHAVE regions. Each measured MAC polygon is counted once per NCE in the area accounting below. The scratchpads store weights, activations, and intermediate results near the MAC arrays, allowing repeated use without fetching them again from DRAM. Halving their number delivers the largest measured area saving but leaves less local storage for the same total MAC count. Layers that no longer fit locally require smaller working tiles or more transfers of intermediate data. The benefit depends on keeping the enlarged arrays busy while managing that tighter storage budget. [36] NPU 5 also adds native FP8. Using half the operand width of FP16 reduces storage and transfer demand, helping workloads fit the smaller local memory budget. Lower precision and format-dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile with 4 Xe3 cores on Intel 3 and a larger GT2 tile with 12 Xe3 cores on TSMC N3E. Panther Lake allows us to compare the same GPU architecture across both Intel 3 and TSMC N3E. Wildcat Lake adds a third Xe3 implementation on Intel 18A. A future newsletter will detail Xe3 and its implementation differences across all three process nodes. GT2 scales Xe3 to a different physical layout, with render slices arranged vertically instead of GT1’s horizontal arrangement. Slice placement sets the distances to shared cache banks and the D2D interface. Those wires consume area and add delay, so scaling the number of Xe cores also requires a new balance of cache placement, routing and timing. [1] What’s immediately obvious is that the GT2 tile on TSMC N3E has much smaller Xe cores than GT1. These block areas include logic, caches, and routing. An Xe core on the GT1 tile is ~69% larger than one on Lunar Lake, and ~55% larger than one on GT2. Intel 3 therefore uses substantially more area per Xe core. The block-area gap exceeds the measured logic and SRAM density gaps, bringing routing, timing targets, cell mix, and floorplan allocation into the comparison. The measured vector/matrix engine region is almost unchanged between Lunar Lake and Panther Lake’s GT2 tile. Xe3 retains eight 512-bit vector engines and eight 2048-bit XMX engines per core. Its gains also come from feeding those engines more effectively: more resident threads hide stalls, and variable register allocation lets shaders trade registers per thread against the number of threads kept active. [1] The shared L1/SLM capacity increased by 33% from 192 KiB to 256 KiB, while its area increased only 5%, raising effective density by 27%. L1 retains reused cache lines, while software-managed SLM lets a thread group share data locally. Both reduce traffic to more distant memory. Allocating more SLM per group can also limit how many groups reside on a core at once. [1], [37] The GT1 tile carries 4 MiB of L2 against 16 MiB on the GT2 tile. GT1 divides its L2 cache into four 1 MiB banks, while GT2 uses eight 2 MiB banks. Each bank contains 128 macros, but each N3E macro stores 16 KiB, twice the Intel 3 macro’s 8 KiB capacity. The N3E macro is only 54% larger while holding twice as many bits, giving it 30% higher density: ~23.7 Mbit/mm² versus 18.3 Mbit/mm². Including bank-level circuitry, the gap widens to ~16.9 Mbit/mm² on GT2 versus ~10.4 Mbit/mm² on GT1. GT2 gains density with its macros storing more bits per unit area, and those macros occupy more of each cache bank. Larger macros spread decoder and sense-amplifier overhead across more storage, while a more compact bank layout reduces the share spent on control and routing. The compromise is longer wordlines and bitlines that carry more capacitance. [34] I/O tile Panther Lake uses two I/O tile variants, both fabricated on TSMC N6. The smaller one provides 4 PCIe 5.0 and 8 PCIe 4.0 lanes and serves lower-tier systems as well as those without a discrete GPU, while the larger one adds 8 PCIe 5.0 lanes, bringing the total to 20 lanes, for discrete-GPU connectivity. Panther Lake SKUs with the larger 10- or 12-Xe GPUs use the smaller I/O tile. [38] The smaller I/O tile adds a PCIe 4.0 block and a Thunderbolt block to Lunar Lake’s I/O layout, providing four additional PCIe 4.0 lanes and another Thunderbolt 4 port. Its repeated N6 blocks retain nearly identical areas and layouts. Reusing these proven PHYs and controllers avoids porting and requalifying external interfaces on 18A, where faster digital logic offers less benefit to circuits constrained by the off-chip link. [38] SemiAnalysis’s teardown lab (STEEL) dives deep into the world’s advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. We’re hiring technical experts from system to transistor and everywhere in between. Check out our Careers page. Panther Lake offers scalability and modularity through its disaggregated packaging that partition compute, GPU, and I/O silicon into separate tiles allowing for a suite of tile configurations. This partitioning makes the package part of Intel’s node economics as it determines how much leading-edge wafer area each product consumes, which functions can remain on other processes, and how much configuration freedom Intel can offer from a shared set of tiles. Furthermore, fabricating the compute and GPU tiles separately confines the new 18A process to the compute tile and allows graphics and I/O to use other, more established, and more cost-effective processes. For Panther Lake, the GPU and I/O tiles are assembled alongside the compute tile on a passive silicon base using Foveros-S. Intel’s current technology brief lists a nominal 36 µm pitch for Foveros-S. Through-silicon vias (TSVs) in the base connect the fine wiring above to the larger package connections below. The functional tiles sit side by side on that passive base in a 2.5D configuration. [39] Our cross-section through the compute and GPU tiles shows the package’s wiring hierarchy. Microbumps connect each active tile to the passive silicon base; its fine redistribution layer (RDL) carries the short, dense tile-to-tile links. TSVs carry connections through the base to the package substrate, which fans them out to the much coarser motherboard solder joints. The base supplies interconnect, while computation remains in the active tiles above it. [39] At the compute-tile edge, the higher-magnification inset shows a local microbump spacing of approximately 25.24 µm and a feature width of 12.33 µm. These local spacings are finer than Intel’s nominal Foveros-S value. The X-ray fields further confirm tighter neighboring bumps, consistent across every die-to-die area found on each tile. Additional X-ray analysis is offered after the paywall. Putting the memory controller beside the CPU removes the D2D transfer that CPU memory requests required in Meteor Lake and Arrow Lake. This avoids the extra transmitter, receiver, and link traversal, saving interface energy and latency. Panther Lake’s separate GPU still crosses a D2D link to reach DRAM, so its larger local caches also help contain package traffic. [1], [40] Smaller dies are less likely to contain a random fatal defect, and screening them before assembly prevents one bad tile from consuming a complete package of good silicon. Reuse also spreads design and qualification work across more products. Against those gains, Intel pays for the passive base, D2D circuits, extra bonding and test steps, and losses during assembly. Cost per working product across the portfolio captures the combined effect of wafer yield, reuse, test, and assembly. [29] Wildcat Lake packaging Intel launched Core Series 3, formerly Wildcat Lake, on 16 April 2026 for value mobile and edge systems. Wildcat Lake keeps 18A but removes the passive base and combines more functions on one die to simplify the package. The two products therefore reveal two distinct ways to commercialize the same leading-edge process. [41] Wildcat Lake’s 18A die combines up to two Cougar Cove P-cores, four Darkmont LP E-cores, two Xe3 cores and a smaller NPU. A separate platform-controller die supplies I/O, connected through UCIe, Intel’s first processor implementation of the standard. Consolidating graphics remove a tile boundary and the passive base, reducing assembly complexity for a modest-bandwidth value product. It also ties CPU and graphics scaling to the same die, giving up Panther Lake’s ability to swap in a much larger GPU. [42], [43] In July 2021, Intel CEO Pat Gelsinger set out an ambitious process roadmap aimed at regaining performance leadership by 2025, later described as five nodes in four years. Five years and one CEO later, Intel’s comeback story is not as unambiguously positive as Pat may have hoped. [44], [45] Intel once set the pace for process technology, bringing high-k metal gate technology and FinFETs into volume production years ahead of the rest of the industry. Its 22 nm FinFET process reached consumers with Ivy Bridge in 2012. [46] Intel’s integrated device manufacturing (IDM) model allowed its architects and process engineers to co-optimize products and processes. Starting with Sandy Bridge, Intel dominated x86, while AMD struggled with Bulldozer. That lead faltered at 14 nm and broke at 10 nm. Intel targeted a massive 2.7× density increase, but the node arrived years late and required several revisions before it could support Intel’s full lineup. This delay forced Intel to stretch 14 nm across six generations, while TSMC moved ahead in process technology and AMD recovered in x86. By 2019, Intel was still shipping 14 nm across most of its product stack, with its 10 nm client ramp focused on Ice Lake mobile processors. Meanwhile, TSMC was shipping N7 and N7+, and AMD’s Zen 2 compute chiplets used N7 to raise core counts and improve efficiency. Intel’s process failures were central to its decline, but unsound business decisions furthered their downward slide. Product delays compounded product mistakes, pushing client, server, and FPGA roadmaps off schedule. Several attempts to enter AI (Nervana and Gaudi) and networking (Tofino) also failed to establish lasting businesses. Intel’s recovery has focused on consumer CPUs and advanced packaging. Tiger Lake, Alder Lake, Lunar Lake and now Panther Lake have restored Intel’s consumer roadmap. On the process side, Intel 4 shipped with Meteor Lake, Intel 3 with Granite Rapids and Sierra Forest, and Intel 18A with Panther Lake. Intel has also made advanced packaging part of its foundry offering. However, Intel is still playing catch-up in servers. Several Xeon generations arrived years late and trailed contemporary AMD and Arm server CPUs in performance, efficiency, and core count. The process roadmap is back, but Intel does not hold the same process-technology leadership position it held prior to 10 nm. The introduction of gate-all-around nanosheets and backside power delivery are two of the biggest changes to transistor integration in a decade. Intel took on both changes at once: 18A paired its first RibbonFET with PowerVia in Panther Lake. Panther Lake is a substantial manufacturing milestone. Our cross-sections show how RibbonFET and PowerVia reshape local contacts and wiring, while the floorplans show where architectural consolidation and process choices save area. A sustained competitive lead depends on product performance, cost, yield, and the next implementation. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page.. 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The Cost of Cutting American Science: How Federal Cuts Diminish Public Health Capacity
Among the federal government’s many responsibilities is the work it does to protect public health. Federal agencies monitor our food supply to ensure safety, conduct research to better understand emerging health threats, provide funding for public health programs in communities and work to detect and respond to disease outbreaks. Americans rely on these efforts every day—in a 2024 online survey, 74% of respondents said that “if the federal government issued safety guidance about food you eat regularly,” they would follow it. Changes to Federal Public Health Capacity The Trump administration’s efforts to reshape the federal government have resulted in significant impacts on our nation’s public health capacity over the past 20 months, affecting the response to health concerns such as measles, Ebola and cyclosporiasis. Agencies with core public health, food safety and disease prevention responsibilities experienced large workforce decreases during the first year of the administration. At the Centers for Disease Control and Prevention, for instance, the workforce in February 2026 was 26.7% smaller than in September 2024 before the start of the Trump administration. The Food and Drug Administration saw a similarly steep decline of 21.6%. Agencies such as the National Institutes of Health, Substance Abuse and Mental Health Services Administration and Food Safety and Inspection Service also experienced large workforce decreases. (function(){function e(){window.addEventListener(`message`,function(e){if(e.data[`datawrapper-height`]!==void 0){var t=document.querySelectorAll(`iframe`);for(var n in e.data[`datawrapper-height`])for(var r=0,i;i=t[r];r++)if(i.contentWindow===e.source){var a=e.data[`datawrapper-height`][n]+`px`;i.style.height=a}}})}e()})(); Changes can also be seen in crucial public health occupations. The number of federal food inspectors, for example, decreased by more than half between September 2024 and February 2026, going from 1,035 to 473. This is the lowest number of food inspectors employed by the federal government since at least 2005. By February 2026, there were also 33.3% fewer federal public health program specialists, whose work includes advising federal funding recipients on public health activities and analyzing the effectiveness of public health programs. Government’s capacity is diminished as employees with specialized knowledge and experience in protecting the public and responding to health risks depart, leaving agencies less prepared to carry out their public health missions. There also have been vacancies in critical high-level leadership positions at public health agencies, most notably at the CDC, which had a permanent Senate-confirmed director for less than a month between January 2025 and early August 2026. Although the CDC has previously been led by acting directors at the start of an administration, the nearly yearlong gap since the departure of the administration’s first permanent director in August 2025 is without precedent. As of August 2026, the FDA is also currently without a Senate-confirmed commissioner following the previous commissioner’s resignation in May 2026. Additionally, public health agencies are experiencing increased politicization of their leadership ranks. In agencies such as the CDC and Food Safety and Inspection Service, the number of individuals in the Senior Executive Service—the most senior career leaders in government—has declined significantly, while at the same time the number of political appointees has reached record levels. (function(){function e(){window.addEventListener(`message`,function(e){if(e.data[`datawrapper-height`]!==void 0){var t=document.querySelectorAll(`iframe`);for(var n in e.data[`datawrapper-height`])for(var r=0,i;i=t[r];r++)if(i.contentWindow===e.source){var a=e.data[`datawrapper-height`][n]+`px`;i.style.height=a}}})}e()})(); (function(){function e(){window.addEventListener(`message`,function(e){if(e.data[`datawrapper-height`]!==void 0){var t=document.querySelectorAll(`iframe`);for(var n in e.data[`datawrapper-height`])for(var r=0,i;i=t[r];r++)if(i.contentWindow===e.source){var a=e.data[`datawrapper-height`][n]+`px`;i.style.height=a}}})}e()})(); At the CDC, for example, the number of career SES decreased 42.9% between December 2024 and February 2026, while the number of non-Senate confirmed political appointees at the agency was six times larger than the agency’s historical average from 2009 and 2024. Knowledgeable career leaders are integral to the ability of public health agencies to carry out their work with scientific integrity and professional judgment, and rapid leadership turnover and increased politicization threaten agencies’ ability to make evidence-based decisions to protect our health. The upheaval and politicization in public health agencies have also negatively affected employee engagement. Strong employee engagement is crucial to the ability of agencies to carry out their mission and successfully provide essential services to the public. In the 2025 Public Service Viewpoint Survey conducted by the Partnership for Public Service, the Department of Health and Human Services—which encompasses major public health agencies such as the CDC and FDA—had an employee engagement and satisfaction score of 20.4 out of 100, one of the lowest among large agencies. Only 2.8% of HHS employees indicated trust in their political leaders and only 8.7% reported confidence that they could report a suspected violation of law or regulation without retaliation. Employees at HHS also reported that the agency’s ability to provide services to the public had suffered. Nearly half of employees at HHS, 47.5%, said their work unit was worse at delivering quality services compared to its performance in 2024. In addition, 57.8% said their work unit was performing worse at fulfilling stakeholder needs. In addition to the work done within federal agencies, the federal government also distributes significant funding for public health and disease prevention work to state and local governments, nonprofits and small businesses—funding which has been significantly disrupted. At the CDC, for example, there was a 71.9% decrease in the amount of project grant funding issued in fiscal year 2025 compared to fiscal year 2024. The FDA also issued far less funding in fiscal year 2025—a 21.3% decrease from its fiscal year 2024 funding. Changes in federal funding include the ending of grants to community organizations that worked on HIV prevention and the cancellation of funding for research into improvements to patient safety and healthcare quality. These changes go beyond federal agencies to impact the broader public health ecosystem, including the state and local health departments responsible for much of the on-the-ground public health work in their communities. About 80% of the CDC’s domestic funding is directed towards state and local partners—meaning that cuts to CDC funding can ultimately result in cuts to state and local public health capacity. Federal agencies also provide expertise and assistance to state and local health agencies as they deal with particular health challenges, but workforce cuts have resulted in fewer federal employees available to help. The Impact of Changes to Public Health Capacity These changes to federal public health capacity are not abstract concerns. Disrupted programs, reduced funding and lost expertise at public health agencies across all levels of government threaten the public’s physical well-being and safety. In some cases, this has already led to harm. The most immediate impacts of federal cuts were seen in interruptions to ongoing public health programs and crisis responses. In one instance, when CDC grants were canceled during the 2025 Texas measles outbreak—the most severe measles outbreak in 25 years—public health officials in Lubbock, Texas were forced to pause parts of their measles response work supported by the frozen funding. Lubbock’s director of public health further said that a lack of available CDC experts to reach out to for advice “definitely” impacted the department’s response to the measles crisis. Cuts to federal funding also forced Dallas County Health and Human Services to cut staff and cancel 50 community vaccination clinics during the outbreak. Public health work outside of major outbreak responses was also disrupted. For example, in April 2025, the Milwaukee Public Health Department was unexpectedly unable to reach experts on lead poisoning due to firings at the CDC when responding to concerns about lead contamination in Milwaukee public schools. Due to federal workforce cuts, several programs at the CDC, including Alzheimer’s and epilepsy programs, have also become trapped in limbo—existing on paper, but without the staff necessary to operate. More recent crises reveal how federal cuts have weakened the public health infrastructure needed to prevent and respond to dangerous new outbreaks. Internationally, cuts at the U.S. Agency for International Development eliminated funding for disease testing and contact tracing abroad, which delayed detection of and responses to the 2026 Ebola outbreak in the Democratic Republic of Congo. While international outbreaks may seem far removed, the unchecked spread of disease in any country can quickly pose a danger to economic well-being, security and health around the world. Within the United States, public health cuts inhibited responses to the summer 2026 outbreak of the food-borne parasite cyclospora. At the federal level, cuts to funding for lab equipment and for CDC staff with expertise in parasitic infections—including 9 out of 11 staff members at the lab responsible for identifying parasitic outbreaks in 2025— contributed to the largest reporting delay in outbreak cases at the CDC in 15 years. Conflicting communications from the FDA about the source of the outbreak, which followed cuts to the agency’s communications department, additionally led to confusion among the public about how to best avoid infection. At the same time, cuts to HHS funding and support for local and state public health slowed some health departments’ responses to the crisis. The exact costs of these delays, constraints and confusion in public health responses are difficult to estimate. However, their message is clear: federal cuts have already made containing threats to public health even more of a challenge. Conclusion Protecting public health—from food safety to disease prevention—is one of the federal government’s most important missions. Dramatic and haphazard cuts to federal agencies and funding have already disrupted the public health system, impacting the response to challenges such as measles, lead poisoning and cyclosporiasis. The U.S. public health system needed improvement before these disruptions. Since 2022, federal leadership and coordination in response to public health outbreaks has been on the Government Accountability Office’s High-Risk List of areas in need of attention to improve government effectiveness and efficiency. Recent cuts only compound these concerns. The chaotic dismantling of government and resulting disruptions to crucial functions like public health and disease prevention highlight the need for meaningful reform and concrete policy proposals to reimagine how government can better serve the public and be more effective, responsive and accountable. To learn more about the impact of federal cuts to public health and science more broadly, visit The Cost of Cutting American Science. Learn more For more information on the Partnership for Public Service’s government reform initiative, visit Government for a New Era. View here In line with The Cost of Cutting American Science, federal workforce data in this brief is as of February 2026
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