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Colorado business confidence improves but still pessimistic
Halfway into the year, business confidence across Colorado has improved but is still negative, a new report found. The Leeds Business Confidence Index, a measurement of how business leaders across Colorado feel about the future of the national and state economy, increased by one point to a score of 43, according to a report released […]
CMS announces QualTech event focusing on innovative technology to improve health outcomes
The Centers for Medicare & Medicaid Services yesterday announced the launch of QualTech, a new event created to identify innovative technology that improves health outcomes. CMS is seeking participants from U.S-based teams, academic institutions, nonprofit organizations, private sector companies, industry associations and other stakeholders to propose technology solutions in advance of the event.
Health Minute: September is Prostate Cancer Awareness Month
September is Prostate Cancer Awareness Month, and in the U.S. the number of new cases continues to increase with the steepest rise in advanced stages of the disease, according to the American Cancer Society. But early diagnosis significantly improves odds of survival. In today’s Health Minute, Mandy Gaither explains why screening is not “one size fits all” and what experts say every man should do when it comes to this cancer.
Oklahoma Health Care Authority improves access to medication to treat opioid use disorder
Oklahoma Medicaid recipients can now access a long-acting medication to treat opioid use disorder with fewer barriers.
Colorado business confidence improves but still pessimistic
Halfway into the year, business confidence across Colorado has improved but is still negative, a new report found. The Leeds Business Confidence Index, a measurement of how business leaders across Colorado feel about the future of the national and state economy, increased by one point to a score of 43, according to a report released […]
Marvel Tōkon PC Patch Improves Struggling Steam Version
Arc System Works’ new Marvel tag fighter has been struggling on PC since beta
Health Minute: September is Prostate Cancer Awareness Month
September is Prostate Cancer Awareness Month, and in the U.S. the number of new cases continues to increase with the steepest rise in advanced stages of the disease, according to the American Cancer Society. But early diagnosis significantly improves odds of survival. In today’s Health Minute, Mandy Gaither explains why screening is not “one size fits all” and what experts say every man should do when it comes to this cancer.
Health Minute: September is Prostate Cancer Awareness Month
September is Prostate Cancer Awareness Month, and in the U.S. the number of new cases continues to increase with the steepest rise in advanced stages of the disease, according to the American Cancer Society. But early diagnosis significantly improves odds of survival. In today’s Health Minute, Mandy Gaither explains why screening is not “one size fits all” and what experts say every man should do when it comes to this cancer.
Health Minute: September is Prostate Cancer Awareness Month
September is Prostate Cancer Awareness Month, and in the U.S. the number of new cases continues to increase with the steepest rise in advanced stages of the disease, according to the American Cancer Society. But early diagnosis significantly improves odds of survival. In today’s Health Minute, Mandy Gaither explains why screening is not “one size fits all” and what experts say every man should do when it comes to this cancer.
Oregon forest health improves slightly in 2025, but don't celebrate
Tree survey finds fewer acres damaged by drought, disease, pests and storms An Oregon Department of Forestry aerial survey indicates Oregon tree health improved in 2025, with a slight dip […]
Democrats’ view of Trump’s first term improves in retrospect, poll finds
Recent ratings of the state of American democracy in 2020 rose by eight points compared with surveys of Democrats that year.
Engrams Embedding Entendre: Codesign for Efficient DRAM/SSD Offloading
Engram extends standard token embeddings with learned multi-token lookups. Recurring local patterns retrieve vectors directly, reducing the need to reconstruct them through attention and feed-forward layers. With Engram model architecture optimization, it allows for lower HBM capacity to be needed for models at the same quality. This does not mean there won’t be an insane demand for HBM but it just means that model architecture will continue to innovate around constraints. This model architecture design is naturally codesigned for parameter offloading: each token accesses a few embedding rows whose addresses depend on token IDs, not hidden states. The runtime can prefetch those rows from host DRAM while earlier layers compute, keeping the table outside HBM without transferring entire weight matrices. Our Memory model contains our latest estimates of quarter by quarter HBM, DRAM, & NAND supply and demand. Offloading frees HBM for model weights and KV cache, potentially supporting larger batches or more concurrent sessions. When DRAM becomes the next constraint, NVMe offers another tier. Recommendation systems already cache frequently or recently accessed embedding rows in faster memory while backing colder rows with SSDs. After NVIDIA roadmap had to change due to massively despec’ing Rubin Ultra from 1024GB to now ~200GB of HBM per chip, model architecture optimizations like emgram maybe helpful. Our DeepSeek-V4.1-Flash configuration uses roughly 189 GiB of memory for Engram. We replace it with a memory-mapped (mmap) file and measure serving performance with offload to SSD. Later on in our report, we will show our Engram offloading experiments along with the official InferenceX agentic inference serving results on Engram models like DeepSeekv4.1 Flash across all 6 NVIDIA GPU SKUs along with MI355X. Unsurprisingly, the CUDA Moat is still mogging MI355X on the ultra popular DeepSeekV4.1 Flash model. We also show how even on high capacity HBM SKUs, offloading emgrams to DRAM could result in even better performance for most of the pareto than keeping the emgram in HBM. Our benchmark has been widely reproduced, validated and/or supported by almost every major buyer of compute from Google Cloud to Microsoft Azure to Oracle, to Meta and many more. Furthermore, it has the support of the ML community including from vLLM, LMCache, SGLang, PyTorch, Huggingface and the support of major labs like OpenAI, MiniMax, ZAI, Qwen, Moonshot Kimi, etc. Star the InferenceX GitHub repository if you find the open-source benchmark and data useful!. InferenceX is the only inference benchmark in the world to have TPUv7, Jalapeño, Nvidia Rubin NVL72, AMD, and soon, SambaNova and Trainium. Due to how realistic AgentX scenario is to real world agentic inference workloads, AMD has committed to collaborating on MI455X UALoE72 too. DeepSeek did not release the original paper’s two trained Engram models. We replicated its setup on fineweb-edu using the released code and training hyperparameters, at an estimated 6E18 FLOPs per run. We observed the same U-shape scaling: Engram improved performance over pure MoE baselines. We also reproduced DeepSeek’s results, where earlier-layer representations with Engram resembled those of later layers. Like the original Engram paper, it is possible to probe Engram’s gate scores to see what n-grams DeepSeek-V4.1-Flash makes the most use of. Our gate scan finds names, code fragments, relational phrasing, and boilerplate. These examples prioritize interesting-ness over gate strength. One unexpected result was Wright : Ace Attorney. These examples suggest learned memory optimizes the training objective, not a judgment of which facts deserve storage. Licenses, bibliography fragments, API scaffolding, and website furniture can provide prediction shortcuts, so the value of additional Engram capacity may depend on what survives data preparation. This does not show that table capacity is “wasted”: the evaluation-corpus scan establishes neither training exposure nor the capacity occupied by each category. For offloading, strong gates do not identify cache-hot rows. Low gates do not automatically save reads either: computing the gate requires the retrieved key and undoes the performance gain of a fused kernel. Skipping reads would require a separate usefulness predictor before retrieval. In the original paper’s inference-time ablation, factual-knowledge benchmarks retained just 29–44% of their original performance, while reading comprehension retained 81–93%. This is due to the training–inference mismatch. The resulting degradation therefore measures this trained model’s dependence on Engram, not the performance difference between models trained with and without it. In our ablations, suppressing Engram worsens token likelihood across all evaluated domains, especially encyclopedia text and several code corpora. Surprisingly, GSM8K accuracy stays within measured run-to-run variation and removing Engram has no effect. Engram is not a detachable dictionary beside an unchanged MoE. Removing it changes downstream features and expert selection. We tested whether rerouting hurts or compensates by holding tokens fixed in a teacher-forced experiment on CRUXEval, a code-reasoning benchmark of small Python functions where the model predicts a function’s output from its code and an input, and scoring the reference answer. Removing Engram raised answer loss from 0.2848 to 0.3093 bits/token. Forcing the ablated model to use the original Engram-on expert choices made it worse still, at 0.3375 bits/token. Rerouting partially compensates for the missing memory. Memory features and expert selection work together, rather than following a clean “memory stores facts; experts reason” division. On the same CRUXeval, removing Engram during either phase reduced accuracy and increased generated tokens; removing it throughout produced the largest changes. Keeping Engram for prefill leads to more correct answers than keeping for decode likely due to semantically richer KV cache transferred to decode workers, allowing it to mitigate some of the performance loss. Engram’s table is large, but each lookup is small. DeepSeek-V4.1-Flash requests 24 rows at each of two Engram layers, about 12.4 KiB per processed token position across the model, or 3.1 KiB per GPU when split across four GPUs. Currently as of Day 7 since Model Release, MI355X is still 2-4x worse performance per dollar compared to B200 even when normalized by Mi355X’s lower TCO. Our full total cost of ownership breakdown comes from our AI Cloud TCO Model along with monthly market surveys of over 100+ gpu clouds & gpu cloud customers. On the Day 0 release of DeepSeekv4.1 Flash, NVIDIA vLLM works out of the box with zero issues across all 6 SKUs: H100, H200, B200, B300, GB200, GB300! This was thanks to the amazing work by the NVIDIA & Interact teams! In comparison, AMD vLLM did not work on day 0 for DeepSeekv4.1 Flash.Source: SemiAnalysis InferenceX AMD’s vLLM documentation points to using vllm/vllm-openai-rocm:deepseekv41-flash-0909, but from hour 0 of the model release to hour 23, AMD has not publicly released the image. AMD claims, “SPEED IS THE MOAT,” yet it has still not released it by the 23rd hour. We wish that, going forward, the AMD team has a better process for hour 0 model releases. Eventually when they did publicly release for “day 0” image support, performance-wise, it is currently up to 14.8x worse perf per dollar than H200 and up to 42x worse perf per dollar than B200/B300. The power of the CUDA MOAT is NVIDIA’s collaboration with its massive 6 million-developer community ecosystem including most of the vLLM & SGLang & Tokenspeed maintainers which means that CUDA is optimized on day 0. Overall, AMD did make significant improvements but the performance per dollar is still currently 2-4x worse than B200. AgentX Engram DRAM Offloading Improving Performance The HBM and DRAM offload use the same GPU kernel to select and dequantize rows. With HBM, it reads GPU memory; with Unified Virtual Addressing (UVA), it reads pinned host memory directly. Both support full decode graphs. Moving the table into HBM accelerates only the sparse lookup, leaving decoder computation and communication unchanged, resulting in little overall benefit while consuming memory otherwise available to KV cache. Another benefit of Engram offloaded to DRAM which means you can reduce the communication overhead by using less HBM GPUs per replica. For example, when enabling Engram offloading on B300, we are able to switch from TP4 to now TP2 which improves the pareto curve by up to 1.6x. When iso-model quality, less HBM is required as the engrams could be offloaded to host DRAM. Thus HBM bandwidth matters way more than HBM capacity. For inference workloads where memory bandwidth matters the most, 4-hi HBM provides the best $/bandwidth and therefore lowest cost per token. If China continues to make more and more revolutionary model architecture innovations, soon it could potentially 0Hi HBM stacks. [ ](https://newsletter.semianalysis.com/p/long-live-the-short-king-why-4-hi) [ Long Live the Short King: Why 4-hi HBM Wins ](https://newsletter.semianalysis.com/p/long-live-the-short-king-why-4-hi) Myron Xie, Bryan Shan, and 3 others · Sep 13 [ Read full story ](https://newsletter.semianalysis.com/p/long-live-the-short-king-why-4-hi) Moreover, on B300 and week-0 stack, moving the Engram table back to HBM did not improve results and stay within run-to-run variance. This is a result of the work optimizing DRAM offload, such as async, and overlap. SSD Offloading On B200, we created a unoptimized vLLM fork and stored the Engram tables in memory-mapped files on local SSDs. File backing lets the OS reclaim table pages when other applications need RAM. Pages already cached in memory can be served without reading the SSD again. Furthermore, note that we were unable to turn on GDS The unoptimized SSD implementation changes how rows reach the GPU. It copies row IDs to the CPU, deduplicates them, gathers the requested rows into pinned buffers, copies those rows back to the GPU and dequantizes them. This work runs between segments of the GPU execution graph. Native UVA performs row selection and dequantization directly on the GPU, avoiding the CPU round trip. A warm filesystem cache removes physical SSD reads, but leaves the coordination, row gathering and transfers. This is why a file already cached in RAM can still perform worse than a pinned DRAM table. The comparison measures the whole serving path; it does not separate the time spent on each of these operations. B200 DRAM dominates both measured SSD serving curves in total tokens per dollar and P90 interactivity. Near 125 tokens/s/user, DRAM delivers 121 million total tokens per dollar versus 52 million for SSD. For production serving, SSD offloading is likely not worth the tradeoff. On the B200 configurations we measured, SSD offloading loses on both measures: every observed SSD point has a DRAM alternative that delivers higher P90 interactivity and more total tokens per dollar. The only points where Cheaper storage does not automatically produce a cheaper inference service. Moving Engram to SSD leaves the same four expensive GPUs and the rest of the server in place. Reclaiming RAM only creates an economic benefit if it enables a cheaper server configuration or additional useful capacity. The current unoptimized path provides neither benefit, and the filesystem cache still consumes RAM when table pages are resident. Next we will look at the mechanisms and specific implementation of ngrams from DeepSeekv4.1 Flash, LongCat, Qwen3.8 Flash Next.
Teaching science and religion in a connected way strengthens STEM engagement
Teaching science and religious education (RE) in a more connected way improves students' engagement with science and boosts interest in STEM careers, according to a UCL study. The findings suggest that ...
Health Minute: September is Prostate Cancer Awareness Month
September is Prostate Cancer Awareness Month, and in the U.S. the number of new cases continues to increase with the steepest rise in advanced stages of the disease, according to the American Cancer Society. But early diagnosis significantly improves odds of survival. In today’s Health Minute, Mandy Gaither explains why screening is not “one size fits all” and what experts say every man should do when it comes to this cancer.
How AI Is Helping Growing Businesses Take the Complexity Out of Payroll
As AI becomes commonplace in payroll technology, small- and mid-sized business leaders should evaluate how AI improves how payroll operates from start to finish.
LG Display unveils FLiPP OLED technology with up to 1.6x higher brightness and 2.4x longer lifespan
LG Display says FLiPP improves OLED aperture ratio by 55%. The process supports panels from 1 to 100 inches and can improve substrate utilization by up to 64%.
Health Minute: September is Prostate Cancer Awareness Month
September is Prostate Cancer Awareness Month, and in the U.S. the number of new cases continues to increase with the steepest rise in advanced stages of the disease, according to the American Cancer Society. But early diagnosis significantly improves odds of survival. In today’s Health Minute, Mandy Gaither explains why screening is not “one size fits all” and what experts say every man should do when it comes to this cancer.
Michigan State football improves to 2-0, convincingly beats EMU
Michigan State is 2-0 after a convincing win over Eastern Michigan.
Health Minute: September is Prostate Cancer Awareness Month
September is Prostate Cancer Awareness Month, and in the U.S. the number of new cases continues to increase with the steepest rise in advanced stages of the disease, according to the American Cancer Society. But early diagnosis significantly improves odds of survival. In today’s Health Minute, Mandy Gaither explains why screening is not “one size fits all” and what experts say every man should do when it comes to this cancer.
Pomegranate Compound Improves Heart Function Up to 80% in Mice With Heart Failure
A juicy development.
New Boone Health ambulance station improves response times in south Columbia
Boone Health officials held a dedication ceremony and open house Monday morning for their new ambulance station in South Columbia. Paramedics said the new facil
Dawnwalker's First Big PS5 Patch Adds an Even Easier Difficulty Mode and Improves Combat
Sun's up
Longines Improves Its Classic, Complicated Chronograph. It's Still an Absurd Bargain
Longines continues its Master Collection overhaul with an update to the line's most iconic watch, the Moonphase Chronograph.
German Business Sentiment Improves, Shrugging Off Middle East Uncertainties
Confidence among firms picked up a little this month, though the roller-coaster ride of oil prices in recent weeks suggested the recovery could be fragile.
Va. health dept. improves nursing home inspection backlog, reforms sanction criteria for facilities
Stories of neglect in care or unsanitary living situations have plagued several of Virginia’s nursing home facilities.
Ohio University Chemistry Professor Eric Masson develops open-source software to advance chemical research
New computational platform, Equilibrist, simplifies complex chemical data analysis and improves the reliability and reproducibility of scientific results.
Health Minute: September is Prostate Cancer Awareness Month
September is Prostate Cancer Awareness Month, and in the U.S. the number of new cases continues to increase with the steepest rise in advanced stages of the disease, according to the American Cancer Society. But early diagnosis significantly improves odds of survival. In today’s Health Minute, Mandy Gaither explains why screening is not “one size fits all” and what experts say every man should do when it comes to this cancer.
Why rheumatoid arthritis pain may persist even when inflammation is under control
Pain and fatigue in rheumatoid arthritis can persist even after inflammation improves, with depression, poor sleep, obesity, smoking, and chronic pain potentially helping sustain symptoms. Researchers say identifying these hidden drivers could prevent unnecessary medication changes and lead to more personalized treatment.
WHO recognizes healthy, innovative cities across the Western Pacific Region
Nine Healthy City champions from across the World Health Organization (WHO) Western Pacific Region received special recognition at an awarding ceremony during the 11th Global Conference of the Alliance for Healthy Cities in Sydney, Australia.The WHO Regional Office for the Western Pacific has presented the Healthy Cities Recognition Awards every two years since 2004 to celebrate innovative and impactful city-led initiatives that improve the health and well-being of urban populations.Eight cities received awards for their best practices, and one National Forum received the WHO Regional Director’s Special Award in recognition of its long-standing leadership in advancing the Healthy Cities movement.Awardees were selected through a rigorous evaluation process and recognized for demonstrating measurable, innovative and sustainable approaches to health challenges faced by cities.Remarking on the significance of the awards, Dr Huong Tran, Director of the Division of Health Promotion, Disease Prevention and Control at the Regional Office, said that, “There is no single blueprint for a healthy city. What works in one context may need to be adapted to another. But by sharing our experiences, including what worked, what was challenging, and what we learnt along the way, we can help one another move faster and further.”Award-winning cities and initiativesThis year's awards recognize outstanding city-led initiatives that have demonstrated measurable impact, innovation and sustainability in advancing health initiatives for urban populations.Baguio City (Philippines) – Data for equity: informing action, improving healthDr Donnabel Tubera-Panes, City Epidemiologist – Medical Officer IV of the Health Services Office accepted the award on behalf of Baguio City. Photo credit: Maria BoyadgisBaguio City was recognized for developing a pioneering Livability Index that provides village-level data across all 128 barangays (villages), enabling evidence-based planning and more equitable allocation of resources. By integrating community participation and institutionalizing the index within city planning and budgeting processes, the city has demonstrated how data can drive action to reduce health and social inequities.Eunpyeong-gu (Seoul, Republic of Korea) – Communities living in vulnerable situations: advancing health equity through community engagementVice Mayor Honourable Ahn Hyoung Jun accepted the award on behalf of Eunpyeong-gu. Photo credit: Maria BoyadgisEunpyeong-gu was recognized for its inclusive health equity programme supporting vulnerable populations, including isolated older adults and LGBTQI+ communities. Through peer-led community networks, social cooperatives and inclusive service design, the district has strengthened access to care, promoted social inclusion and advanced community ownership of health initiatives.Madiun City (Indonesia) – Adapting and mitigating climate-related crises: building heat resilience and preventing flood-related health risksMs Yuni Dwi Purwani, Secretary General of the National Forum for Indonesian Healthy Cities/Regencies, accepted the award on behalf of Madiun City. Photo credit: Maria BoyadgisMadiun City was recognized for its SUPERMIE (Sustainable Public Environmental Management Initiative) – a community-based environmental governance model that addresses urban flooding, climate resilience and environmental sustainability. The initiative contributed to reductions in flood-prone areas, greenhouse gas emissions, diarrhoeal disease and dengue fever, while at the same time improving food security through neighbourhood food gardens. The programme has already been replicated in 15 cities and regencies across Indonesia.Macao Special Administrative Region (China) – Protecting communities from tobacco and alcohol-related harms: tackling commercial drivers of riskDr LO Iek Long, Director of the Health Bureau, Macao SAR, China accepted the award on behalf of Macao. Photo credit: Maria BoyadgisMacao SAR was recognized for implementing a comprehensive and integrated approach to tobacco and alcohol control. Through legislation, monitoring systems, enforcement, public awareness campaigns and multisectoral partnerships, the programme has strengthened protection against major risk factors for noncommunicable diseases and established a model that is highly transferable to other urban settings.Phnom Penh Capital City (Cambodia) – Safe, active and health-enabling transport: advancing health and reducing inequities in urban mobilityH.E. Khoung Sreng, Governor of Phnom Penh Capital City accepted the award on behalf of Phnom Penh Capital City. Photo credit: Maria BoyadgisPhnom Penh received the award for its Safe School Zone Project, which combines infrastructure improvements, speed management, enforcement, education and stakeholder engagement to protect children and communities. The initiative has demonstrated measurable reductions in crashes and vehicle speeds while providing a scalable model for safer urban mobility across the country.Quezon City (Philippines) – Transforming food environments: addressing policy, market and urban design drivers of health and nutritionMs Jirah Asa M. Sideco, Chief of the Nutrition Section of the Quezon City Health Department accepted the award on behalf of Quezon City. Photo credit: Maria BoyadgisQuezon City was recognized for its public food procurement policy that promotes healthier diets through government-run institutions and feeding programmes. Supported by strong policy frameworks and monitoring systems, the initiative improves access to nutritious food for vulnerable populations while serving as a benchmark for other local governments.Samarinda City (Indonesia) – Preventing violence and promoting gender equality: transforming urban systems, norms and spaces Mrs Rinda Wahyuni, Chairperson of Samarinda Healthy City Forum accepted the award on behalf of Samarinda City. Photo credit: Maria BoyadgisSamarinda City was recognized for its multisectoral approach to preventing violence and advancing gender equality. Responding to local evidence on violence against women and children, the city has positioned violence prevention as a public health priority, bringing together health services, schools, social welfare institutions, law enforcement, civil society and community leaders to strengthen prevention, reporting, survivor-centred support and legal protection. Through inclusive policies, community engagement and sustainable city financing, Samarinda has developed a locally owned and scalable model for creating safer, more equitable and inclusive urban communities.Singapore – Age-friendly cities: transforming systems to bridge generations for a healthier tomorrowDr Tan Weng Mooi, Director, Integrated Health Promotion, accepted the award on behalf of Singapore. Photo credit: Maria BoyadgisSingapore received recognition for its Healthy Precinct Framework, which translates national healthy ageing priorities into neighbourhood-level action. The initiative integrates preventive care, social support, service coordination and age-friendly environments while actively engaging older persons, caregivers and community organizations. Its expansion across multiple precincts demonstrates its scalability and long-term sustainability.WHO Regional Director’s Special AwardNational Forum for Indonesian Healthy Cities/Regencies (Indonesia)Ms Yuni Dwi Purwani, Secretary General of the National Forum for Indonesian Healthy Cities/Regencies, accepted the award on behalf of the National Forum. Photo credit: Maria BoyadgisThe WHO Regional Director's Special Award was presented to the National Forum for Indonesian Healthy Cities/Regencies (FKKSI) in recognition of its long-standing leadership in advancing the Healthy Cities movement across Indonesia. As a national platform bringing together local governments, communities, academia and civil society, FKKSI has played a critical role in promoting collaboration, capacity-building, knowledge exchange and advocacy. Its efforts have strengthened and institutionalized healthy urban development nationwide and established a model for multisectoral engagement in the Region. Healthy Cities for allThe 2026 Healthy Cities Recognition Awards highlight how cities can lead transformative action on health by addressing climate change, inequity, ageing, nutrition, mobility, social inclusion, violence prevention and the commercial determinants of health. The recognized initiatives demonstrate that local governments, communities and partners can work together to create healthier, safer and more resilient urban environments for everyone. As urban populations continue to grow across the Western Pacific Region, WHO remains committed to supporting cities in advancing health, equity and sustainable development through the Healthy Cities approach and the Alliance for Healthy Cities. ###Note to editorsSince 2004, the WHO Healthy Cities Recognition Awards have provided a platform for cities to share innovative and effective approaches to improving health and well-being. The awards recognize achievements in areas including climate resilience, healthy ageing, health equity, gender equality, tobacco and alcohol control, urban mobility, nutrition and data-driven governance. In 2026, more than 150 submissions were received from cities and local governments across the Western Pacific Region. The titles and affiliations of awardees are presented as they were at the time the photo was taken.______________For more information, or to arrange media interviews, contact: WHO Regional Office for the Western Pacific: wprocom@who.int
Va. health dept. improves nursing home inspection backlog, reforms sanction criteria for facilities
With reform efforts underway, the Virginia Department of Health officials said they aim to adopt sanction criteria by the end of the year to rein in bad actors and get troubled facilities back on track.
NVIDIA DLSS 5 Technical Preview Review
NVIDIA DLSS 5 is the first technology that adds to a scene rather than reconstructing it—a generative model running locally that magically improves things. In our DLSS 5 Technical Preview we look at how the model works, what it costs in performance, and how much control developers really have.
Could humans ever communicate with whales?
Ever since the earliest known recording of whale song was made in 1949, researchers have been captivated by the wails, rumbles, clicks, grunts and squeals of their communication. As technology improves, scientists are decoding the intricate patterns that make different species’ vocalisations distinctive. Madeleine Finlay hears from Emma Bryce, a journalist who has spent months investigating human efforts to understand whale song. She explains how this knowledge could help us better protect whales from human-made harms.Credits:1. Valeria Vergara/Raincoast Conservation Foundation2. Footage courtesy of Raincoast Conservation Foundation - Obtained for research under SARA permit XMMS 4 20263. Video by Amanda Cotton/Project CETI4. Footage courtesy of Valeria Vergara and GREMM. Obtained for research under SARA permits QUE-MM02-2016 and QUE-LEP-001-20185. Project CETI6. Project CETI
Sunflowers could help improve South Dakota soil health, crop yields
A 26-year USDA study reveals that adding sunflowers to corn-soybean crop rotations boosts dry-year corn yields by 35% and improves overall soil health.
Health Minute: September is Prostate Cancer Awareness Month
September is Prostate Cancer Awareness Month, and in the U.S. the number of new cases continues to increase with the steepest rise in advanced stages of the disease, according to the American Cancer Society. But early diagnosis significantly improves odds of survival. In today’s Health Minute, Mandy Gaither explains why screening is not “one size fits all” and what experts say every man should do when it comes to this cancer.
Calcium-rich whey permeate improves bone health in postmenopausal women, study finds
AFI AFI COPENHAGEN, Denmark, Oct. 20, 2026 (GLOBE NEWSWIRE) -- Twice-daily supplementation with calcium-rich whey permeate supports the maintenance of bone mineral density in postmenopausal women, according to a 12-month clinical study.[1] Declining oestrogen levels during menopause can accelerate bone loss and reduce bone mineral density, increasing osteoporosis risk. The findings come from the RENEW project, a research collaboration investigating how calcium-rich permeate from whey production
I tried Sonos' sleek new Beam Ultra soundbar, and it packs huge Dolby Atmos sound into a small package
The new Sonos Beam Ultra improves on the standard Beam by adding up-firing audio drivers that bounce Dolby Atmos sound effects off your ceiling.
DeShon Elliott Practices, Rico Dowdle Improves
PITTSBURGH — Pittsburgh Steelers strong safety DeShon Elliott had his 21-day practice window opened for him to return from the […]
Dr. Jeff Bird: New Endeavors in Youth Sports
By Dr. Jeff Bird— MUNCIE, IN—Participation in youth sports improves outcomes for children in multiple important parameters. The data is convincing. Youth sports participation is linked to significant improvements in physical health, cognitive function, and social-emotional development. I ha
You Bought AI to Save Time. So Why Are You Busier Than Ever?
AI improves productivity only when leaders fix the underlying business system, delegate outcomes effectively, and stop managing every task.
Down 22 points, Mohonasen football scores comeback win at Bethlehem
Mohonasen improves to 2-1.
How Being an Involved Grandparent Improves Physical and Mental Health
The grandparenting role can provide a sense of purpose and improve physical and mental health
WHO joins Pre-COP31 to advance climate action that delivers for people’s health
The World Health Organization (WHO) is joining Pacific leaders, governments and partners at Pre-COP31 in Fiji from 5 to 8 October to advance health priorities in climate action and strengthen the Pacific voice ahead of the 31st Conference of the Parties (COP31) to the United Nations Framework Convention on Climate Change (UNFCCC).COP31, to be held next month in Antalya, Türkiye, marks an important step for global climate and health action. Health is one of the 10 priority themes of the COP31 Action Agenda, “Dynamic and Resilient Health Systems”, and a dedicated Health Day will take place on 9 November, the first day of COP31. The inclusion of health reflects growing global recognition that climate action and health are closely connected. The climate crisis is affecting population health globally. Across the WHO Western Pacific Region, which includes Pacific island countries and areas, the consequences of climate change include extreme heat, cyclones, floods, rising sea levels, food and water insecurity, infectious diseases and disruptions to essential health services. The Pacific in particular faces additional challenges. A recent review of 76 hospitals in 14 Pacific island countries found that 62% of health facilities are located within 500 metres of the sea or a river, leaving them particularly exposed to flooding, storm surges and sea-level rise.Bringing Pacific priorities to the global climate agendaThe Pacific Pre-COP31 provides an important opportunity for Pacific countries and partners to consolidate regional priorities and bring the experiences and leadership of Pacific communities into global climate discussions.Pacific countries have been advancing practical approaches to protect health in a changing climate, including strengthening climate-resilient health systems, improving preparedness for extreme weather events, building resilient health infrastructure and mobilizing climate finance for health. “This Pre-COP is an important moment for the Pacific, bringing global climate discussions to a region that has long been at the forefront of the climate crisis. It provides an opportunity for Pacific countries and areas to set their priorities, experiences and leadership on the global stage, and to ensure that the realities of Pacific communities are genuinely reflected in the decisions made on climate action,” said Dr Saia Ma’u Piukala, WHO Regional Director for the Western Pacific.Throughout this week, WHO will co-convene and participate in high-level discussions and events focused on climate and health, climate resilience, adaptation, financing and implementation. “Climate finance is essential for resilient and healthy Pacific communities,” emphasized Dr Mark Jacobs, WHO Representative to the South Pacific and Director of Pacific Technical Support. “We must ensure that financing reaches the people, communities and essential services most exposed to climate risks, supporting locally defined priorities and investments.”WHO will work with partners to strengthen the integration of health considerations across climate policies and investments, including national climate plans and resilience initiatives.Health as a driver of climate actionAmid the risks to health and pressures on health systems, well-strategized and implemented climate action can deliver significant health benefits. Investments in clean energy, sustainable transport, resilient infrastructure, food systems and nature-based solutions have proven to reduce health risks while contributing to climate mitigation and adaptation.“Climate action is truly an investment in health. Cleaner energy, healthier food systems and climate-resilient health services can protect lives while building stronger communities. We now need to turn these opportunities into action and make health a core part of climate investments,” said Dr Sandro Demaio, Director and Head of Office, WHO Asia-Pacific Centre for Environment and Health in the Western Pacific Region. “These benefits demonstrate that climate action is not only about reducing future risks. It is also an opportunity to improve lives today while building healthier, safer and more resilient societies.”At COP31 next month, WHO will also support the Health Pavilion, which will bring together the global health community and partners to advance health and equity within climate negotiations. With COP31 poised to move health higher on the global climate agenda, WHO will continue working with countries and partners across the Western Pacific Region and globally to strengthen climate-resilient and low-carbon health systems, and ensure that climate action protects and improves people’s health.____________________Media contactsElizabeth Bennett, WHO Asia-Pacific Centre for Environment and Health in the Western Pacific Region, elizabeth.bennett@who.intJulia Dongwhan Shin, WHO Asia-Pacific Centre for Environment and Health in the Western Pacific Region, dong.shin@who.intWHO Western Pacific Communications, wprocom@who.int
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Our teardown traces 18A from its four-sheet RibbonFETs (Intel’s marketing name for GAAFETs) and gate stacks through contacts, frontside and backside wiring, and the bonded carrier. We explain how these material and integration choices improve gate control and reduce resistance, while adding capacitance, thermal resistance, and process complexity. Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. However, 18A does not lead TSMC N3P, N2 or Samsung SF2 in peak density. Panther Lake’s CPU cores are incremental updates, and the high-end GPU still uses TSMC N3E. Panther Lake assembles one compute tile, one GPU tile, and one I/O tile atop a passive base tile using Intel’s Foveros-S advanced packaging. Both compute tile variants use Intel 18A. The Xe3 GPU options are a 4-core GT1 tile on Intel 3 and a larger 12-core GT2 tile on TSMC N3E. Both I/O tile variants use TSMC N6. [1], [2] Our analysis centers on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery (BSPD) moves the main power network behind the transistor layer, to the backside, separating it from frontside signal routing. We covered BSPD and its impacts in 2024. [3], [4], [5] Intel’s BSPD implementation, branded as “PowerVia”, routes power through dedicated backside metals to nano-TSVs, which connect those rails to local source/drain (S/D) contacts. Implementing that separation requires Intel to build the interconnect stacks from both sides of the wafer. The frontside comprises the M0-M14 signal stack, while the backside comprises the BM0-BM5 power stack. M0 and BM0 are closest to the transistors. The nano-TSVs connect the two sides, but Intel patterns and etches each via from the front after forming the contacts. A narrow via runs from the side of the contact deep into the silicon substrate. Intel then completes the frontside signal metal stack, bonds the wafer to a carrier, flips it and removes the original substrate until the buried via tips are exposed. The backside metal stack is then deposited directly on the revealed vias. The nano-TSV and backside-via profiles taper in opposite directions because Intel forms them from opposite sides of the wafer. The transistor structures form the FEOL. Local contacts and nano-TSVs connect them to the wiring. M0 begins the frontside interconnect stack. The silicon carrier remains attached above the frontside interconnects. It supports the device wafer during substrate removal and backside processing and remains part of the finished chip’s thermal path. PowerVia removes the main power distribution from the congested frontside metals, routing supply through shorter and wider backside wires. Its lateral landing still occupies area in the standard cell, so it recovers less cell area than a direct backside contact. [3] Nano-TSVs beside the logic devices carry VDD or VSS from the backside power network, while signal connections continue upward through the frontside metals. Backside Interconnects Samsung SF2 data is included for comparison to Panther Lake’s within this article. SF2 is the incumbent GAA foundry node but lacks BSPD, serving as a useful reference to evaluate 18A. A full teardown of Samsung’s S26 products, processed on SF2, will be shared soon.Nanosheet-cut EDS comparison. The PowerVia supply path runs from the backside Cu rails through Mo-lined W nano-TSVs to the local transistor contacts. In this cross section, the tapered connection spans roughly 150 nm from the contact level to BM0. The Ta liner confines Cu and promotes adhesion to the surrounding stack; the AlOₓ etch stop controls the next dielectric etch above the rail. Dielectric beneath the ribbons electrically separates the devices from the backside wiring and removes the conducting silicon body below the channel. [6] AlOₓ serves as an etchstop (ES), enabling endpointing and protecting the underlying layers. Low-volatility aluminum fluoride reaction products resist the fluorinated plasma, allowing a thin AlOₓ film to protect the metal while the surrounding low-k dielectric is removed. [6], [7]. While the BM0 and layers above the M1 lines show double AlOx layers, Our SMIC N+3 teardown showed single AlOₓ layers. SMIC uses a simpler local AlOₓ substack, while the remaining cap and etch sequence provide the required landing protection. So why double layers? The closely spaced AlOₓ doublets provide two protected endpoints in the etch sequence. Intel documents an AlOₓ/SiN/AlOₓ stack that explains the benefit. The main dielectric plasma etch stops on the first AlOₓ film; a selective wet clear opens that film; a second plasma etch removes the intermediate SiN and stops on the second AlOₓ film. The final wet clear exposes the metal landing surface. SiN is the intermediate dielectric in Intel’s published example. [8] The second stop protects the metal through a cap breakthrough. Wide openings can etch faster than narrow ones, and etch depth varies across the wafer. Metal under an early-clearing opening would otherwise be exposed while other openings still need more etching. Staged protection widens the process window and reduces metal erosion, corrosion and void formation. [8] TSMC documents AlN/AlOₓ/SiOC/AlOₓ above Cu, with AlN blocking Cu diffusion, and a simpler AlN/SiOC/AlOₓ variant that omits one AlOx film. [9] Levels with different opening sizes, aspect ratios, pattern densities and cap materials need different etch margins. A double AlOx stop is useful where another protected endpoint justifies the added processing. The extra film adds formation, selective opening and cleaning steps, plus another set of interfaces to control adhesion, moisture, and stress. These blanket films are opened through the existing via pattern, so each film does not require another lithography mask. AlOₓ adds parasitic capacitance when it replaces lower-k dielectric; two thin AlOₓ films can nevertheless contain less AlOₓ than one thick film. Total thickness, placement, and theintermediate dielectric determine the electrical cost. Deposition chemistry also changes AlOx permittivity and residual hydroxyl content, which can oxidize the underlying metal. [7], [8], [10], [11] The backside stack separates into relatively fine BM0-BM2 wiring near the devices and coarser BM3-BM5 power distribution. The largest pitch increase occurs between BM2 and BM3. BM0’s pitch closely matches the logic-row height, fitting local power delivery to the cell rows. Higher levels aggregate current through larger conductors: routing density becomes less important than low resistance and current capacity as the network approaches the package. This hierarchy provides wide power wiring for the power delivery network without consuming scarce frontside signal-routing resources. [3] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Frontside Interconnects Intel 18A combines Mo-lined W contacts and nano-TSVs with a separate backside Cu power network. Samsung SF2 keeps power on the frontside, using Ti-based contact interfaces and Ta-based barriers and Co liners around Cu wiring. In 18A standard-cell rows, backside power rails supply the devices through nano-TSVs within the cells, freeing frontside routing resources. Samsung’s M0 accommodates both power and signal connections. From the device toward M0, the connection runs through a Ti-based S/D interface, W contact fill, a Mo-lined W via, and the Cu M0 wire. Mo supplies a conductive nucleation and adhesion layer for W, replacing the resistive TiN liner used in conventional W integration. This increases the effective conduction volume within the feature while retaining W fill and its established polishing, cleaning and etching processes. Intel’s Mo/W patent describes this integration tradeoff. The nano-TSV uses the same Mo-lined W construction in the backside supply path. [12] The move from TiN to Mo is an incremental change. While a full Co or Mo fill can also reduce the volume lost to liners in very small features, it requires new integration schemes that increase complexity and risk. Cu remains attractive for wider wires due to its low resistance. As wires and vias shrink, the diffusion barrier consumes an increasing fraction of their cross-section. [12], [12], [14] Intel uses Co/Ru liners at M0-M1, Co at M2-M4, and Nb at M5-M9. The lower-level liners help Cu adhere and reduce void formation during trench fills. Applied Materials’ Endura has new thermal control that facilitate wetting process, so the thin film continuity is good enough that good capillary pressure will drive Cu atoms to the via bottom without voiding. Intel’s choice to use Nb is particularly interesting. Intel’s Nb patent describes a conductive diffusion barrier intended to reduce the barrier’s contribution to resistance relative to conventional Ta-based barriers, particularly at via bottoms where all current crosses the barrier. The patent pairs Nb in coarser levels with the option of lower-cost PVD processing. [15], [16] The upper metal layers support thicker barriers formed through physical vapor deposition (PVD) despite its worse coverage and uniformity. Meanwhile, the lower metal layers require thinner barriers deposited through conformal atomic layer deposition (ALD). Co/Ru adds another material interface and requires controlled deposition and Cu fill. Changing liners and barriers by metal layer allows Intel to optimize interconnect resistance, process complexity, and reliability. [15, 16] RibbonFET, Intel’s name for its gate-all-around FETs (GAAFETs), replaces the FinFET’s vertical fins with four stacked horizontal silicon nanosheets, allowing the gate to surround the channel on every side. The path to GAAFET begins with the planar transistor. A planar MOSFET places the gate above the channel between its source and drain. Pairing an NMOS with a PMOS transistor creates a CMOS inverter, in which the NMOS pulls the output low for a high input, and the PMOS pulls it high for a low input. The gate must retain electrostatic control of the channel to ensure clean switching. As gate lengths shrank, the drain began to compete with the gate for that control, increasing off-state leakage. Electrostatic control was restored through an architectural evolution that raised the channel into a vertical fin and wrapping the gate around three sides. Called “FinFET”, this new architecture packed more effective channel width into a smaller footprint. Further scaling made it harder to maintain both drive current and leakage within smaller cells, and reintroduced the same problems planar MOSFETs faced. Nanosheet GAAFETs close the fourth side by replacing the vertical fin with a stack of horizontal nanosheets, each surrounded by the gate. The tighter electrostatic control suppresses leakage at shorter gate lengths while stacking adds effective channel width within the cell footprint. In a FinFET process, channel width changes in discrete steps as designers must add or remove whole fins. Nanosheet width can instead be adjusted continuously within the process’s design rules. Wider sheets increase drive current, while narrower sheets reduce capacitance at the cost of drive current. Intel 18A uses stacks of four nanosheets each and varies their widths across logic and SRAM. At the process level, adding more sheets to each stack increases effective channel width and drive current, but complicates fabrication. RibbonFET vs MBCFET Samsung began GAAFET production in 2022 with SF3E, following with SF3 and now SF2. Its ‘MBCFET’ provides a useful structural comparison with Intel’s first RibbonFET implementation. [17] STEEL is digging deeper into SF2, used in the Exynos 2600, and TSMC’s GAAFET N2, used in Apple’s A20 Pro, in upcoming newsletter articles. We’re throwing some teasers on X. Let’s compare Samsung SF2’s MBCFET with Intel 18A’s RibbonFET. Subscribe Even to the untrained eye, Intel’s extra nanosheet is obvious. Intel stacks four ribbons to Samsung’s three. Samsung’s sheets are much wider in these fields, so both sheet count and width matter to the available channel perimeter. Sheet width also changes which silicon surfaces carry current. On conventional (001) silicon, wide nanosheets emphasize the broad top and bottom surfaces, favoring electron transport; the larger sidewall contribution in a narrow sheet favors hole transport. Thinner sheets improve gate control but increase confinement and scattering. This makes width and thickness part of the NMOS/PMOS balance, alongside strain and threshold voltage. [18], [19] GAAFET designs like 18A use different work-function-metal (WFM) stacks for NMOS and PMOS. Around each ribbon, a thin SiOx interfacial layer separates the silicon channel from the HfOx high-k dielectric, with La providing dipole tuning and the WFM wrapping the dielectric. NMOS uses a TiAl-based stack, while PMOS uses TiN WFM. W fills the remaining gate trench, providing a lower-resistivity path where the work-function layers are no longer needed. In this field, the PMOS stacks leave room for W between ribbons, while the NMOS stacks occupy more of those gaps. A silicon-based dielectric marks the P/N boundary, allowing the PMOS and NMOS gates, sharing the same gate trench, to be processed sequentially. Fast logic paths, retention circuits, and SRAM need a family of threshold options. Changing threshold without substantially changing device dimensions, capacitance or fabrication complexity is valuable. FinFET processes typically use different work-function-metal stacks. In a four-ribbon GAA stack, the narrow sheet-to-sheet gap limits how much WFM can fit around each channel. La in the gate dielectric creates interfacial dipoles at the SiOx/HfOx boundary, shifting effective work function and tuning threshold voltage. This gives Intel another control alongside its NMOS and PMOS WFM stacks. Low-threshold devices improve critical-path drive; higher thresholds reduce leakage elsewhere. Dipole tuning is especially useful in GAA because it changes threshold without consuming the narrow intersheet gap with thicker WFM. Precise control of La incorporation, diffusion and interface quality has long been a challenge, limiting viability in high volume production but is now seen from every leading-edge foundry. Intel’s patent describes depositing a dipole-forming oxide above HfOx and annealing it toward the interfacial oxide before completing the work-function and fill metals. This separates threshold tuning from the space available for metal. Newer research addresses the thermal cost: imec’s 2026 dipole-middle research inserts the shifter between two HfOx depositions, shortening the diffusion path while protecting SiOx during patterning. [20], [21]Matched-cut EDS, Intel 18A (left) vs. Samsung SF2 (right). Intel retains raised source/drain epi beneath its contacts, while Samsung recesses W deep into the epi to form a V-shaped Ti-lined interface. The deeper contact increases metal-to-semiconductor area and shortens the current path from the lower sheets, reducing contact and spreading resistance. It also removes epi volume and brings the contact etch closer to the channel ends. Retaining more epi preserves the material available for strain transfer, especially from SiGe into PMOS. These geometries balance contact access against stress engineering and etch margin. [22], [23] Samsung stacks three sheets to Intel’s four ribbons, and both processes use sheet width to tune drive strength. In our Samsung cross-sections, widths range roughly from 19 to 30 nm in the NPU rows and 37 to 50 nm in the CU cell. The Samsung nanosheets taper, with the widest sheet at the bottom and the narrowest at the top. Both processes use HfOx gate dielectric and Ti-based work-function stacks, with Al in the NMOS stack. In the Samsung devices shown here, the dielectric and WFM occupy the intersheet gaps, leaving W above the top sheet. Intel’s PMOS stack leaves more room between ribbons, and W fills those gaps while the thicker NMOS stack leaves W mainly in the upper trench. Gate-stack EDS maps. The W between Intel’s PMOS ribbons provides a conductive path close to the lower gates. Where WFM fills the entire gap, the gate still surrounds the channel, but voltage reaches it through the more resistive work-function films. Thinner WFM and dipole tuning preserve room for low-resistivity fill; Mo and Ru are alternative fill metals being developed for further scaling. [24] A masked, sequential WFM flow explains the different gate heights and inter-nanosheet fill. The proposed sequence below shows how separate NMOS and PMOS work-function steps produce that geometry. Enabled by the BSPDN process, Intel replaces the dense-logic silicon subfin with dielectric, removing the parasitic conduction path below the ribbons and reducing substrate-related capacitance. A retained silicon body as in classical, non-SOI, planar and FinFET designs needs junction and punchthrough-stop engineering to suppress leakage. Dielectric isolation makes that leakage less sensitive to the subfin doping profile but adds removal and fill steps. It also weakens the direct thermal path through silicon, making the contacts, metal stacks and package more important for heat extraction. [24], [26] Fluorine is concentrated around selected Intel device structures in the maps. WF6 is a standard precursor for W nucleation and fill, while barrier films protect adjacent dielectrics from fluorine attack. Low-fluorine W processes reduce the residual-F burden. Chloride-based precursors avoid introducing F during W deposition, but require control of chlorine attack, nucleation and fill quality. The integration target is a continuous, low-resistance W path with a thin protective liner and minimal chemical damage to the surrounding stack. [20], [27], [28] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. We measured cell height, gate pitch, metal geometry, and ribbon dimensions at the XTEM sites shown below. The tables group these dimensions by site and device polarity. Our “sheet cuts” cross the silicon channel and show the ribbons end-on. “gate cuts” run along the channel through successive gates. The 18A logic cell dimensions point to a five-track logic library while the N3E and Intel 3 cell dimensions evidence a seven-track logic library. The DDR-PHY uses wider M0 wires and much larger spacing than core logic. That trades routing density for lower wire resistance and weaker coupling between neighboring nets. The geometry suits the current delivery and coupling requirements of analog, clock, and I/O circuitry. PowerVia lets 18A combine a compact cell height with wider M0 geometry by moving the main power rails off the signal-routing tracks. That relaxes local wire scaling while preserving a small cell footprint. Cell height and gate pitch set the geometric density; pin access and routability determine how much of it a real block can use. [29] The biggest takeaway from our gate-pitch measurements is that Intel 18A compute logic and TSMC N3E GPU logic have similar density in the Bohr representative-cell model. The 18A example is 18.6% denser than the Intel 3 GPU example. Gate pitches are nearly identical across the three sites, so cell height drives most of the difference. The Bohr model combines a four-transistor NAND2 spanning three gate pitches and a 32-transistor scan flip-flop (SFF) spanning nineteen pitches, weighting their densities 60:40. The sensitivity column shows how independently changing cell height and gate pitch by ±1 nm changes the result. This compares representative cell geometries; whole-die density also depends on cell mix and placement. The 18A P-core gives M0 substantially more metal cross section than the N3E vector engine. Treating each profile as a trapezoid gives 2.63 times the area per line and 1.84 times the area after normalization by routing pitch. The larger section reduces the geometric contribution to line resistance and lowers current density for a given current. Taller and wider wires also add capacitance, so circuit delay depends on the balance of resistance and capacitance. The DDR-PHY has less metal area per routing width than the 18A core fields, while remaining above N3E. [30] Area = height × (top CD + bottom CD) / 2, including liners. Area/pitch normalizes by routing width. Taper is the symmetric sidewall angle from vertical, with the largest angle belonging to the DDR-PHY. Compute tile The measurements show how ribbon dimensions and gate-stack geometry vary across the compute tile and between NMOS and PMOS to balance channel drive, gate load and the space needed for the dielectric/WFM stack across logic, SRAM and the DDR-PHY. Width mainly changes available channel perimeter; thickness also changes electrostatic control and carrier confinement. Gate-stack thickness then determines the space left for low-resistivity fill P-core and LP E-core logic Both the P-core and LP E-core use multiple nanosheet widths. Widths are measured on high-magnification XTEMs while wider-field images demonstrate additional width choices within the LP E-core. Multiple widths are expected even within an LP E-core. Timing-critical paths, buffers and cells with different fanout need different drive strengths. The lower-magnification fields show this width diversity beyond the sites quantified in the table. L2 and L3 SRAM GAA gives SRAM designers another way to balance the pull-up (PU), pass-gate (PG), and pull-down (PD) transistors. FinFET bitcells set device strength through fin count while GAA adds nanosheet width as a sizing knob. In a 6T SRAM cell, a strong pull-down relative to the pass-gate limits read disturbance, while a strong pass-gate relative to the pull-up improves writability. During a write, the pass-gate and write driver pull the node storing “1” below the inverter trip point. During a read, the pull-down holds the node storing “0” low. Bias, threshold voltage, mismatch and assist circuitry set the remaining margin. FinFET high-current cells commonly use a PU:PG:PD fin-count pattern of 1:2:2, a device-sizing ratio rather than a current ratio. Ribbon width lets Intel balance SRAM strengths without adding whole fins. The L2 cell uses its narrowest ribbons for PU and widest for PD, improving writability and read stability respectively. Intel’s disclosed HCC operates without assist; its denser HDC uses negative-bitline write assist. Pulling the selected bitline briefly below ground increases pass-gate overdrive so it can overpower the pull-up at lower supply voltage. That buys density and low voltage writability at the cost of boosting circuitry, switching energy, and additional voltage stress that must be controlled. [31], [32] Four rectangular ribbons give the perimeter = 8 × (width + thickness), before corner rounding. PG/PU is 1.49 and PD/PG is 1.16. The L3 structures closely resemble L2 in layout and cell height. Fewer L3 nanosheet widths are tabulated because fewer high-magnification images were available. DDR PHY The DDR-PHY trades density for controlled analog behavior and reliable off-chip signaling. It contains drivers, receivers, delay circuits, and calibration logic that set drive strength, sampling time, and voltage margin. Repeated four-sheet devices with similar widths fit the use of regular transistor units for matching and programmable drive. Its wider local wiring provides room for current delivery and separation of sensitive signals, while consuming more area than a dense core-logic grid. The layout serves the memory channel’s electrical requirements as well as digital logic density. [33] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Intel 3 GPU devices Vector engine logic Intel 3’s XVE logic uses two-fin PMOS and NMOS devices with power rails in M0. Its cell height and M0 pitch give a seven-track geometry, two tracks more than the 18A logic. One-fin groups also appear among the two-fin devices. Intel 3 L2 SRAM The Intel 3 L2 SRAM uses the familiar HCC sizing pattern: one PU fin, two PG fins, and two PD fins. N3E GPU devices Vector engine logic The N3E XVE field contains repeated two-fin devices with seven-track cell geometry. N3E remains a FinFET process, giving Panther Lake a direct FinFET-to-RibbonFET comparison. N3E L2 SRAM The N3E L2 SRAM uses the same PU:PG:PD fin-count pattern of 1:2:2. Panther Lake-U follows Lunar Lake’s floorplan quite closely. Both pair 4 P-cores with 4 LP E-cores and NPU, media and display engines in similar locations. Lunar Lake also uses Xe2, the direct predecessor to Panther Lake’s Xe3 GPU. This makes Lunar Lake the most direct basis for our comparisons. Arrow Lake differs in core count and uses the older Xe-LPG GPU architecture, so we only use it where it offers a more direct component-level comparison. Compute tile Panther Lake compute-tile floorplans remain sparse even months after launch. Intel 18A’s backside metal and dielectric stack must be removed without damaging the underlying structures before a clean transistor-level floorplan can be imaged. Most published die shots hide or heavily process the background, but we are quite proud of the die shot we achieved and are excited to show the work we have done. We measured the areas of the key components on the compute tile and compared them with their Lunar Lake predecessors on TSMC N3B. These help us to capture changes in block area and compare the two chips across process nodes and designs. Our total tile areas exclude the scribe-line area. The compute-plus-GPU subtotal below uses the PTL-U compute tile and GT1 GPU; it excludes the I/O tile and passive base. Individual block areas use the boundaries marked on the floorplans The compute-plus-GPU row is recomputed from the displayed PTL-U and GT1 areas. Component rows use their stated per-region counts and are not an additive partition of the whole tile. The P-core area remains almost unchanged between Lunar Lake and Panther Lake, despite L2 capacity increasing from 2.5 MiB to 3 MiB. Arrow Lake uses the same Lion Cove core as Lunar Lake but also has a 3 MiB L2. Cougar Cove fits 20% more L2 into the same P-core area. The larger private cache keeps more of each core’s working set close to its execution units, reducing access to shared L3 and DRAM. Extra capacity adds storage leakage and lookup energy, so designers balance it against avoided lower-level accesses. The shared P-core L3 cache also shrank by 14.8%. [2] Cougar Cove combines a similar footprint with Intel’s reported power-efficiency improvements. RibbonFET’s tighter channel control reduces leakage, while PowerVia reduces supply droop and allows tighter voltage guardbands. [1] Darkmont’s four-core LP E-core cluster is 5.0% smaller than Skymont’s on Lunar Lake, with most of the reduction in its L2 regions. The 1 MiB region shrank by 8.4% and the 1.5 MiB region by 14.9%. The tag arrays also use one fewer visible row. Tags identify which memory addresses the data array holds, so rearranging them changes the cache’s layout and wiring without requiring less data capacity. [2] The LP E-cores share one L2. This pools capacity and avoids duplicating all the cache machinery, but the four cores contend for its banks and bandwidth. Their separate cluster also keeps light work away from the performance cluster and its L3, allowing that larger domain to sleep. [1], [2] Cache area includes more than the storage cells. Tags identify each line, decoders select rows, sense amplifiers read the small bitline signal, and wires connect to the banks. Splitting an array into smaller sections shortens wordlines and bitlines, improving access speed, but duplicates peripheral circuits. Panther Lake’s smaller cache regions therefore reflect the complete memory implementation, including how much of each region is devoted to storage. [34] Unlike Meteor Lake and Arrow Lake, Panther Lake has no separate SoC tile. The NPU, LP E-cores, memory controllers, PHYs, media and display engines now share the compute tile. This removes an active die and keeps CPU memory traffic on one die. The cost is moving PHY and I/O-related circuitry onto 18A: drivers, receivers and analog circuits must still meet external voltage, loading and signal-integrity requirements, so their area does not shrink like dense digital logic. [1], [2] The biggest shrink comes from the NPU, which occupies 36.9% less area. NPU 5 consolidates the same total INT8 MAC count into half as many neural compute engines. Each of the three NCEs has a larger MAC array to make the complete NCE envelope 22.6% larger than an NPU 4 engine. Consolidation also halves the number of scratchpads and SHAVE DSPs, from 12 to 6. The MAC array handles matrix multiplication and convolution, while SHAVE executes vector and custom operations that fit the array poorly. [1], [2], [35] The paired floorplans identify each NCE envelope and its scratchpad, MAC, and SHAVE regions. Each measured MAC polygon is counted once per NCE in the area accounting below. The scratchpads store weights, activations, and intermediate results near the MAC arrays, allowing repeated use without fetching them again from DRAM. Halving their number delivers the largest measured area saving but leaves less local storage for the same total MAC count. Layers that no longer fit locally require smaller working tiles or more transfers of intermediate data. The benefit depends on keeping the enlarged arrays busy while managing that tighter storage budget. [36] NPU 5 also adds native FP8. Using half the operand width of FP16 reduces storage and transfer demand, helping workloads fit the smaller local memory budget. Lower precision and format-dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile with 4 Xe3 cores on Intel 3 and a larger GT2 tile with 12 Xe3 cores on TSMC N3E. Panther Lake allows us to compare the same GPU architecture across both Intel 3 and TSMC N3E. Wildcat Lake adds a third Xe3 implementation on Intel 18A. A future newsletter will detail Xe3 and its implementation differences across all three process nodes. GT2 scales Xe3 to a different physical layout, with render slices arranged vertically instead of GT1’s horizontal arrangement. Slice placement sets the distances to shared cache banks and the D2D interface. Those wires consume area and add delay, so scaling the number of Xe cores also requires a new balance of cache placement, routing and timing. [1] What’s immediately obvious is that the GT2 tile on TSMC N3E has much smaller Xe cores than GT1. These block areas include logic, caches, and routing. An Xe core on the GT1 tile is ~69% larger than one on Lunar Lake, and ~55% larger than one on GT2. Intel 3 therefore uses substantially more area per Xe core. The block-area gap exceeds the measured logic and SRAM density gaps, bringing routing, timing targets, cell mix, and floorplan allocation into the comparison. The measured vector/matrix engine region is almost unchanged between Lunar Lake and Panther Lake’s GT2 tile. Xe3 retains eight 512-bit vector engines and eight 2048-bit XMX engines per core. Its gains also come from feeding those engines more effectively: more resident threads hide stalls, and variable register allocation lets shaders trade registers per thread against the number of threads kept active. [1] The shared L1/SLM capacity increased by 33% from 192 KiB to 256 KiB, while its area increased only 5%, raising effective density by 27%. L1 retains reused cache lines, while software-managed SLM lets a thread group share data locally. Both reduce traffic to more distant memory. Allocating more SLM per group can also limit how many groups reside on a core at once. [1], [37] The GT1 tile carries 4 MiB of L2 against 16 MiB on the GT2 tile. GT1 divides its L2 cache into four 1 MiB banks, while GT2 uses eight 2 MiB banks. Each bank contains 128 macros, but each N3E macro stores 16 KiB, twice the Intel 3 macro’s 8 KiB capacity. The N3E macro is only 54% larger while holding twice as many bits, giving it 30% higher density: ~23.7 Mbit/mm² versus 18.3 Mbit/mm². Including bank-level circuitry, the gap widens to ~16.9 Mbit/mm² on GT2 versus ~10.4 Mbit/mm² on GT1. GT2 gains density with its macros storing more bits per unit area, and those macros occupy more of each cache bank. Larger macros spread decoder and sense-amplifier overhead across more storage, while a more compact bank layout reduces the share spent on control and routing. The compromise is longer wordlines and bitlines that carry more capacitance. [34] I/O tile Panther Lake uses two I/O tile variants, both fabricated on TSMC N6. The smaller one provides 4 PCIe 5.0 and 8 PCIe 4.0 lanes and serves lower-tier systems as well as those without a discrete GPU, while the larger one adds 8 PCIe 5.0 lanes, bringing the total to 20 lanes, for discrete-GPU connectivity. Panther Lake SKUs with the larger 10- or 12-Xe GPUs use the smaller I/O tile. [38] The smaller I/O tile adds a PCIe 4.0 block and a Thunderbolt block to Lunar Lake’s I/O layout, providing four additional PCIe 4.0 lanes and another Thunderbolt 4 port. Its repeated N6 blocks retain nearly identical areas and layouts. Reusing these proven PHYs and controllers avoids porting and requalifying external interfaces on 18A, where faster digital logic offers less benefit to circuits constrained by the off-chip link. [38] SemiAnalysis’s teardown lab (STEEL) dives deep into the world’s advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. We’re hiring technical experts from system to transistor and everywhere in between. Check out our Careers page. Panther Lake offers scalability and modularity through its disaggregated packaging that partition compute, GPU, and I/O silicon into separate tiles allowing for a suite of tile configurations. This partitioning makes the package part of Intel’s node economics as it determines how much leading-edge wafer area each product consumes, which functions can remain on other processes, and how much configuration freedom Intel can offer from a shared set of tiles. Furthermore, fabricating the compute and GPU tiles separately confines the new 18A process to the compute tile and allows graphics and I/O to use other, more established, and more cost-effective processes. For Panther Lake, the GPU and I/O tiles are assembled alongside the compute tile on a passive silicon base using Foveros-S. Intel’s current technology brief lists a nominal 36 µm pitch for Foveros-S. Through-silicon vias (TSVs) in the base connect the fine wiring above to the larger package connections below. The functional tiles sit side by side on that passive base in a 2.5D configuration. [39] Our cross-section through the compute and GPU tiles shows the package’s wiring hierarchy. Microbumps connect each active tile to the passive silicon base; its fine redistribution layer (RDL) carries the short, dense tile-to-tile links. TSVs carry connections through the base to the package substrate, which fans them out to the much coarser motherboard solder joints. The base supplies interconnect, while computation remains in the active tiles above it. [39] At the compute-tile edge, the higher-magnification inset shows a local microbump spacing of approximately 25.24 µm and a feature width of 12.33 µm. These local spacings are finer than Intel’s nominal Foveros-S value. The X-ray fields further confirm tighter neighboring bumps, consistent across every die-to-die area found on each tile. Additional X-ray analysis is offered after the paywall. Putting the memory controller beside the CPU removes the D2D transfer that CPU memory requests required in Meteor Lake and Arrow Lake. This avoids the extra transmitter, receiver, and link traversal, saving interface energy and latency. Panther Lake’s separate GPU still crosses a D2D link to reach DRAM, so its larger local caches also help contain package traffic. [1], [40] Smaller dies are less likely to contain a random fatal defect, and screening them before assembly prevents one bad tile from consuming a complete package of good silicon. Reuse also spreads design and qualification work across more products. Against those gains, Intel pays for the passive base, D2D circuits, extra bonding and test steps, and losses during assembly. Cost per working product across the portfolio captures the combined effect of wafer yield, reuse, test, and assembly. [29] Wildcat Lake packaging Intel launched Core Series 3, formerly Wildcat Lake, on 16 April 2026 for value mobile and edge systems. Wildcat Lake keeps 18A but removes the passive base and combines more functions on one die to simplify the package. The two products therefore reveal two distinct ways to commercialize the same leading-edge process. [41] Wildcat Lake’s 18A die combines up to two Cougar Cove P-cores, four Darkmont LP E-cores, two Xe3 cores and a smaller NPU. A separate platform-controller die supplies I/O, connected through UCIe, Intel’s first processor implementation of the standard. Consolidating graphics remove a tile boundary and the passive base, reducing assembly complexity for a modest-bandwidth value product. It also ties CPU and graphics scaling to the same die, giving up Panther Lake’s ability to swap in a much larger GPU. [42], [43] In July 2021, Intel CEO Pat Gelsinger set out an ambitious process roadmap aimed at regaining performance leadership by 2025, later described as five nodes in four years. Five years and one CEO later, Intel’s comeback story is not as unambiguously positive as Pat may have hoped. [44], [45] Intel once set the pace for process technology, bringing high-k metal gate technology and FinFETs into volume production years ahead of the rest of the industry. Its 22 nm FinFET process reached consumers with Ivy Bridge in 2012. [46] Intel’s integrated device manufacturing (IDM) model allowed its architects and process engineers to co-optimize products and processes. Starting with Sandy Bridge, Intel dominated x86, while AMD struggled with Bulldozer. That lead faltered at 14 nm and broke at 10 nm. Intel targeted a massive 2.7× density increase, but the node arrived years late and required several revisions before it could support Intel’s full lineup. This delay forced Intel to stretch 14 nm across six generations, while TSMC moved ahead in process technology and AMD recovered in x86. By 2019, Intel was still shipping 14 nm across most of its product stack, with its 10 nm client ramp focused on Ice Lake mobile processors. Meanwhile, TSMC was shipping N7 and N7+, and AMD’s Zen 2 compute chiplets used N7 to raise core counts and improve efficiency. Intel’s process failures were central to its decline, but unsound business decisions furthered their downward slide. Product delays compounded product mistakes, pushing client, server, and FPGA roadmaps off schedule. Several attempts to enter AI (Nervana and Gaudi) and networking (Tofino) also failed to establish lasting businesses. Intel’s recovery has focused on consumer CPUs and advanced packaging. Tiger Lake, Alder Lake, Lunar Lake and now Panther Lake have restored Intel’s consumer roadmap. On the process side, Intel 4 shipped with Meteor Lake, Intel 3 with Granite Rapids and Sierra Forest, and Intel 18A with Panther Lake. Intel has also made advanced packaging part of its foundry offering. However, Intel is still playing catch-up in servers. Several Xeon generations arrived years late and trailed contemporary AMD and Arm server CPUs in performance, efficiency, and core count. The process roadmap is back, but Intel does not hold the same process-technology leadership position it held prior to 10 nm. The introduction of gate-all-around nanosheets and backside power delivery are two of the biggest changes to transistor integration in a decade. Intel took on both changes at once: 18A paired its first RibbonFET with PowerVia in Panther Lake. Panther Lake is a substantial manufacturing milestone. Our cross-sections show how RibbonFET and PowerVia reshape local contacts and wiring, while the floorplans show where architectural consolidation and process choices save area. A sustained competitive lead depends on product performance, cost, yield, and the next implementation. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page.. 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