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Small Business Financing Is A Stubborn Challenge. Can AI Solve It?
AI is already reshaping community lending. Here are six ways it may ease entrepreneurs' money hunt and help them use credit more strategically.
Are Bank Lobbies Still Relevant?
Local banking leaders say technology is changing the way customers use their banks — and their lobbies By Deborah Jeanne Post [caption id=attachment_11109 align=alignright width=300] Steve Gorczynski is M&T Bank Central New York regional president.[/caption] When was the last time you entered the lobby of your bank? If it’s been a while, you’re part of a trend of eschewing the lobby in favor of ATMs, drive-thrus, online banking and remote deposit. A 2025 study performed by the American Bankers Association revealed that only 9% of consumers use bank branches as their preferred way to do banking and 76% prefer mobile banking. The trend away from the lobby reflects consumer behavior in other areas of doing business, including online shopping instead of perusing the mall, ordering fast food at a kiosk, not at the counter and selecting curbside pick-up rather than walking into the restaurant. Consumers want convenience and going in the lobby adds another layer to the task. It also places consumers face to face with one or more representatives of the business, something less favorable to people feeling burned out from interpersonal interactions. Nixing or at least minimizing the size of the lobby isn’t necessarily negative for banks. Fewer people passing through their doors reduces overhead for building maintenance, staffing and furnishing. Greater reliance on virtual banking can mean closing brick and mortar locations and hiring fewer staffers to cover roles like teller and lending officer. “Our focus is on meeting customers where they are and giving them flexibility in how they bank,” said Steve Gorczynski, M&T Bank Central New York regional president. “While many everyday transactions can be supported digitally and through ATMs, branches remain important for more complex financial needs, offering face-to-face guidance and a more personal banking experience.” Talking with a commercial lender or working on a home mortgage are two examples where meeting face-to-face is more desirable for many people. They can receive immediate feedback to questions and can possibly reach their goals more quickly. But there’s little need to have a large seating area, long counters and numerous tellers for routine banking that’s quicker to handle virtually. Online banking can also help people on the go more readily complete banking tasks such as depositing checks, transferring funds among accounts and checking balances. [caption id=attachment_11135 align=alignright width=300] Tina M. Stephens is the vice president branch administration for Fulton Savings Bank.[/caption] “The traditional bank lobby is certainly being evaluated by most institutions today, as the typical large, open and cavernous spaces do not necessarily meet the needs of today’s customers,” said Tina M. Stephens, vice president branch administration for Fulton Savings Bank. “Traditional lobbies often bisect traditional teller stations and customer service areas, which adds confusion, especially for the demographic who routinely use online banking and only access the lobby for customer service needs.” Despite the rollback in physical locations across the industry, Fulton Savings Bank began modernizing its six branch offices in Oswego and Onondaga counties about three years ago and have finished four offices so far in Baldwinsville, Fulton, Constantia, and Phoenix. “We made the decision to build a new branch across the street from our current office in Brewerton which will be completed by the end of 2026, and we will begin the retrofit of our Central Square office in early 2027,” Stephens said. “Our efforts specifically address where we think customers will be in the next three to five years and have greater flexibility to make changes out into the future.” The bank may be onto something, as numerous reports state that screen-weary Gen Z young adults crave more in-person interactions than virtual ones. If the pendulum continues to swing in that direction, it’s hard to see all physical bank areas disappear, even if they change somewhat. Fulton Savings Bank has also consolidated its teller and customer service representative areas to larger “universal banker” areas, where the bank representative can address all customer retail needs. A one-stop-shop experience appeals to busy banking customers who want to perform a few different banking tasks in one visit. Stephens also said that Fulton Savings Bank made additional technology and security enhancements and created flex spaces to accommodate bank meetings throughout the two-county branch footprint. At Solvay Bank, Elizabeth Lavier, vice president marketing and communications manager, lauded digital and online services as convenient and flexible for managing finances; however, “technology is not meant to replace what matters most: the relationships behind every account that have always been at the heart of community banking,” she said. “Even in today’s digital-first world, people of all ages still value the opportunity to sit down with a trusted banker for personalized guidance. We understand that some of life’s biggest moments call for more than a screen.” Lavier views digital banking as another way for the organization to serve customers rather than a replacement for branches, tellers and lenders, which tend to serve customers better for transactions like buying a first car, purchasing a home, saving for a child’s education, or planning for retirement. “Those conversations, built on understanding, experience and personal guidance, are what community banking is all about,” Lavier said. “At the end of the day, banking is about more than transactions. It’s about helping our customers achieve their goals and being there for them every step of the way. By combining the convenience of digital banking with the care, commitment, and personal service of a local community bank, Solvay Bank offers customers the best of both worlds.” Are Paper Checks Destined to Disappear? With the ubiquity of debit cards, online payments, virtual checks and peer-to-peer payment platforms like Venmo, Zelle and PayPal, will paper checks become passe? “In my view, paper checks are unlikely to disappear in the near future,” said Tina M. Stephens, vice president branch administration for Fulton Savings Bank. “They continue to serve a practical purpose by providing a clear paper trail and tangible proof of payment.” According to the American Banker, a leading trade publication that covers the banking and financial industry, in 2024, checks accounted for 65% of all payment fraud losses. Paper checks should be phased out, according to the publication. “The phrase, ‘The check’s in the mail’ probably sounds strange to younger people because the era of paper checks is rapidly drawing to a close. Put bluntly, checks are an expensive, insecure legacy that is a drag on the U.S. economy. Rather than wait for them to vanish slowly, the pragmatic choice is to strategically accelerate the transition to paperless payments.”
Nvidia’s $235 Billion Buyback Offers a Powerful Lesson for Founders
Founders should bet on themselves by using strong cash flow to strategically reinvest in their business and fuel sustainable growth.
When “DEI” research is cut, what happens to community health?
“I’m just going to run to the grocery store!” How many times have we said this without thinking about it? For most of us, it's usually an easy walk or a short drive to get the cheese we forgot. In reality, though, 13% of the U.S. population (about 39 million people) live in “food deserts,” which means living more than a mile from a grocery store in urban areas and more than 10 miles in rural areas. This was the case for people in Pittsburgh’s Hill District, where a quick run to buy food wasn’t an option. In the 1930s, federal maps marked the Hill as "hazardous" for lending, a practice known as redlining that steered investment away from Black neighborhoods. Decades of disinvestment followed, and residents went about 30 years without a nearby grocery store. This made it hard to keep healthy eating habits and contributed to chronic disease. When a grocery store finally opened in the area in 2013, researchers saw the opportunity and launched the PHRESH study, which initially compared the health of participants from the Hill district to those in the Homewood district. Over time, the study expanded to other factors such as brain health and Alzheimer's risk. Residents like Roderick Blair overcame initial hesitation to share their health data, trusting it would benefit their neighborhood. Then, in August 2026, the NIH abruptly canceled the study’s grant, citing that it was “subjective” and fell outside their scientific scope—an effect of the administration’s interpretation of diversity, equity and inclusion (DEI). Research like PHRESH can help determine what changes in a neighborhood actually improve health, so cutting it has left that question unanswered. Other canceled studies have examined health issues like maternal health, preterm birth rates, or sickle cell disease. Courts have reversed some of these grant cancellations, but not all of them. If we really want America to be healthier, research into why some communities get sicker than others is absolutely critical. The law that created the federal minority health research institute passed with bipartisan support in 2000. But these days, as evidenced by grant cancellations, the political shift in attitudes toward DEI means we often lose access to the health information we need to help all communities thrive. DEI vs. health equity vs. equality and the overlap (or lack thereof) The letters “DEI” evoke very different reactions depending on who you are in the U.S. DEI programs can address gender, disability, age, and other factors, but the fiercest debate centers on race. For some people, hearing DEI brings to mind policies that may have cost them a job or a college seat because they are white. Others see DEI as a matter of justice: a way to expand representation and opportunity for groups that have been historically marginalized. Both perspectives are rooted in lived experience, and both center on the same question: whether hiring and admissions practices are fair. Hiring and admission practices, though related, are not the same as health equity. Health equity is “the attainment of the highest level of health for all people.” It’s the recognition that some groups of people consistently experience worse health outcomes than others. For instance, black mothers die from pregnancy-related complications at three times the rate of white mothers, and rural Americans are more likely to die from issues such as heart disease and cancer. Equity is also often conflated with “equality,” which leads to misunderstanding of how to actually best support communities. Equality ignores the fact that we aren’t all starting life with the same resources or circumstances, whereas equity is about helping people get what they specifically need based on their situation so they have the chance to achieve the same outcome as anyone else. For example, if every household in Pittsburgh got a $30 grocery gift card, that would be equal. But during the decades the Hill District went without a grocery store, that card wouldn’t have helped much. Equity means making sure everyone can actually access a store in the first place. DEI policies can overlap with health equity in many ways. For example, they may help expand access to quality education and stable, well-paying jobs, which in turn can provide health insurance, safer housing, and improved finances—all of which can reduce health disparities. But to make that happen, we first need data to identify disparities in communities and to develop solutions that effectively address them. What we lose when the research stops Community data is important to health equity because: You can’t fix what you don’t see: Data show which communities are most affected by health factors such as infection, heart disease, and cancer. If we don’t know what is happening and where, then we can’t develop interventions to help. Poor health costs everyone: Chronic disease is expensive—both to the individual person and to the overall economy. Understanding what groups of people are most at risk allows us to develop interventions that can save everyone money. Disparities exist for many communities: Health equity includes disparities that exist due to a whole host of factors, such as family background, race and ethnicity, rural vs. suburban residence, gender and sexual orientation, veteran status, disability, and lower income. This means many Americans can benefit from research into differences in health outcomes and how to improve them. Trust is easy to lose: Some participants in the PHRESH study were initially vocal about their concerns about participating. But that trust was earned because the researchers kept their promises and centered their work on the community. When projects are canceled mid-cycle, researchers have no choice but to leave behind communities they had promised to help. This hurts trust in the long run. It’s also a very inefficient use of resources, and it will take significant time and effort to redo the work when the government realizes this work is important again. How should we talk about health equity? This is hard because the words “equity” and “DEI” are currently very politically charged. So whether you’re a public health professional, teacher, or friend, how we talk about this topic matters. The right framing can help people who might otherwise be skeptical see why health equity research is important and deserves funding. Here are some suggestions to help your conversations: Choose your words strategically: Who are you trying to reach with your message? Are they likely to be resistant to terms like “diversity” and “equity”? If so, find alternative words to use to still get the message across. It is frustrating to be in that position, but the goal of improving health is too important not to try to make inroads. Sometimes simply reframing can help the message reach those who need to hear it. Focus on the problem: The terms “health equity” and “DEI” are abstract. Make it more specific. For example, discuss differences in maternal death or ways to improve health outcomes in rural communities. These still have equity at their core but will likely be better understood by those you’re talking with. Focus on systems: Disparities exist, but if they are communicated poorly, people can mistakenly think the issue is the individual’s fault. Disparities are largely driven by failures of the system—such as lack of access to health care and a long legacy of racism. When discussing the disparities, frame them around these systemic issues to ensure blame isn’t placed on the individuals impacted. Tell stories: Personalize these policies by using stories from those impacted that connect to the data you’re trying to convey. This helps make the policies and outcomes more concrete and meaningful. Bottom line Some communities end up sicker than others. That’s just the facts. We can argue about the best way to do that research, but canceling it simply because it may be linked to DEI doesn’t make anyone healthier. It just leaves communities like the Hill district behind. And in the end, it causes us all to move backward in our efforts to improve health in this country. Love, EM Big thanks to MacKenzie Isaac & Legairre Radden, who reviewed this piece and generously shared their expertise and lived experience to help improve it. Dr. Liz Marnik, PhD, is Executive Director of The Evidence Collective and a science communicator and immunologist working at the intersection of public trust, science, and public health. To discuss communication training on topics like health equity and storytelling, email Liz at liz@yle.health or learn more on our website. Your Local Epidemiologist (YLE) comprises a team of experts, ranging from physicians to immunologists to epidemiologists to nutritionists, working together with one goal: to “translate” ever-evolving public health science so that people are well-equipped to make evidence-based decisions. The YLE suite of newsletters reaches over 475,000 people across more than 132 countries. This newsletter is free to everyone, thanks to the generous support of fellow YLE community members. To support the effort, subscribe or upgrade below: Your Local Epidemiologist is a reader-supported publication. 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Propaganda or a PSA, Trump's latest ad blitz is paid for by you.
Criticism spills over on strategically timed ads paid for by the U.S. government touting the alleged achievements of President Donald Trump.
BALLON D’OR REGRESSION | OPEN THREAD
Welcome to The Daily Merengue! THESE ARE YOUR MODS: Ezek XI, Valyrian Steel, KungFuZizou, NeRObutBlanco, Felipejack, and Juninho TALENT RECESSION INDICATOR A major talent recession indicator is when Ballon d’or nominees are practically begging and lobbying for the Ballon d’or in their public interviews. The interviews from Lamine and Mbappe are strategically released by the […]
New Jersey Community Colleges Offer Hands-On Data Science, AI Training
As employers seek workers who can effectively use data science and artificial intelligence, the County College of Morris and Camden County College are working to train students quickly and strategically.
World’s largest economy joins Saudi Arabia, Turkey and Israel in battle for Red Sea influence as it lifts sanctions on Eritrea despite its role in Ethiopia war that killed 600,000
The United States has lifted sanctions on Eritrea imposed over its role in the deadly war in neighbouring Ethiopia, as Washington seeks to “advance US regional interests” in a country strategically positioned along the Red Sea
Frustration grows as Houthis widen Middle East conflict with US unwilling to intervene
Dramatic recent advances by the Iran-backed Houthis, including the seizure of a strategically important island in the Red Sea, have dealt another blow to a region reeling from the US war with Iran and exacerbated an already severe global energy crisis. But neither the US nor its key ally Saudi Arabia has a clear plan to beat back the group, multiple sources told CNN, leading many in the region to ask where the counteroffensive will come from.
The Benefits And Risks Every Business Leader Needs To Understand About AI
Businesses that consciously embrace AI, seizing its revolutionary advantages while skillfully and strategically handling its risks
The Benefits And Risks Every Business Leader Needs To Understand About AI
Businesses that consciously embrace AI, seizing its revolutionary advantages while skillfully and strategically handling its risks
The politics and possibilities of ‘AI could kill us all’
I found myself fielding a lot of questions from folks who don’t usually talk much about AI this week. They were mostly along the lines of “do you think AI is going to kill us all?” or “how worried should I be about this human extinction stuff?” Motivating this wave of existential anxiety was the highly dramatic resignation of now-former Anthropic employee Jacob Coxon, who quit his job while publicly sharing his concerns about safety practices at the leading AI companies. More specifically, he declared that almost everyone at OpenAI and Anthropic, the leading AI labs, believes that there’s a decent chance the AI systems they’re producing could “kill us all” by the end of the decade, and the companies aren’t “acting responsibly.” Other AI safety researchers, including those still employed at Anthropic and OpenAI, all confirmed that yes, Coxon is correct, they’re all worried that their company’s products might prove fatal for the entire human race as well. Two more AI employees quit and joined the chorus. Now, the warning shot has been covered everywhere from the Wall Street Journal to Fox News to WIRED to the Guardian. I understand why all this sounds scary, but my response to those who have asked, has generally been: No, you don’t need to worry that AI will kill go rogue and kill us all. But that does not mean we shouldn’t worry, period. Far from it. The companies building AI products are now among the wealthiest and most powerful entities in the world. And they very much are building enormous engines of mass surveillance, extraction, and automation. They can and have allowed their AI systems to carry out felony hacks of other companies, provided the government with autonomously generated kill lists, and sold enterprise technology to firms around the world that is explicitly intended to replace jobs. But “AI” has done these things not because they have all-powerful minds of their own but, ultimately, because people have programmed, calibrated, and directed them to. In other words, it’s not AI we need to worry the most about. It’s the people and corporations working to profit from and gain power by deploying it. The technology is sophisticated, sure, and, especially in cybersecurity contexts, potentially disruptive to plenty of existing systems. But if we want to stop this predatory, profiteering, and extractive form of AI—and it’s worth noting that at this point, most people do—we absolutely can. A quick note/plea: I can only do all of this with the support of readers like you, so if you find value in independent, critical tech journalism and analysis, please consider becoming a paid subscriber. I want to keep as much of this un-paywalled as absolutely possible, and I need your support to do so. Many thanks to all who continue to chip in, it’s very much appreciated. Onward. Subscribe First, some context: AI industry folks like Coxon have been discussing the prospect that AI will destroy humanity for years. Even before the beginning of the AI boom, many working in the industry, from the executive staff to the rank and file researchers, have obsessed over ‘x-risk’, or the possibility that AI will become sentient or semi-sentient and move one way or another to exterminate humanity. This is ostensibly why Elon Musk bankrolled OpenAI in the first place, and is the grounds for his lawsuit alleging OpenAI betrayed its charter by abandoning its nonprofit status to become a commercial enterprise. Many AI engineers and startup founders have calculated their own personal p(doom), or the probability that the tech product they are working on will initiate an actual humanity-extinguishing apocalypse. 10-25% p(doom)s are pretty common. (I wrote about a long weekend I spent among these folks at one of their top conferences here, to give you an idea of their ideas and belief systems.) Sam Altman himself drove the narrative of the imminent rise of a super-powerful AI, or artificial general intelligence, to prominence by declaring that the technology he was building posed an existential risk to humanity. This idea is in other words baked into the DNA of modern AI companies and into the products they engineer. It’s also why the industry is routinely accused, by myself and others, of “doom marketing,” ie, using such proclamations and framings to impart the sheer power of the technology behind your product onto investors, partners, consumers, and the state. Some ambient understanding of this tendency may have helped prevent the press from repeating the claim every time one of the x-risk folks made it over the years, including when they quit their jobs at AI companies while doing so. Yet Coxon’s AI x-risk alarm has broken containment, as they say, and has exposed the idea to the mainstream media once again. This has happened, I think, for a number of reasons. First, when AI CEOs were going around saying AI might kill everyone in 2023, their companies were well-capitalized, but not nearly to the extent they are today. They were more easily dismissed as eccentric geeks of the sort that Silicon Valley is supposed to produce. Now, not only do their products have much greater market saturation, but people are more aware of a) the often unethical ways the executives and companies comport themselves b) the other adverse impacts of AI that have already arrived, and c) the physical cost of building these systems, particularly when it comes to data centers. Finally, toss in the constant stream of headlines in 2026 about AI models going rogue or potentially upending the world’s infrastructure. [ ](https://www.bloodinthemachine.com/p/with-the-backlash-to-data-centers) [ With the backlash to data centers, Flock and AI glasses, a mass opposition to big tech is underway. Silicon Valley is in denial. ](https://www.bloodinthemachine.com/p/with-the-backlash-to-data-centers) Brian Merchant · Aug 27 [ Read full story ](https://www.bloodinthemachine.com/p/with-the-backlash-to-data-centers) As a result, general sentiment was already overwhelmingly skeptical of AI and its overlords, so the table was pretty well set for someone to come along and say ‘just a reminder, the companies that are building the product that promises to take your job and leave a data center in your neighborhood also think that it might exterminate the human race’ and get a strong reaction from the media and the public. The question is: Should we understand this stuff as hype, strategically fanned to feed already swelling valuations? Is it doom marketing? Genuine cause for alarm that the infrastructure that undergirds modern life is facing a novel threat vector? Or reason to be sincerely worried that AI companies are amassing too much power, and that their products are genuinely dangerous? The answer, I’m afraid, is “yes.” Let me try to untangle all of this a bit, because arguments over how to navigate this moment are extremely heated right now, as they are essentially arguments over how to approach the politics of AI at a moment where there may be a unique opening for action. Those sympathetic to AI alignment concerns and x risk arguments—which increasingly includes a faction on the left who want to shut down AI over safety concerns—argue that people who dismiss AI as all hype have their heads in the sand. Meanwhile, critics of the x-risk narrative—which I might note includes a cadre of investors and tech folks on the right, too—argue that it is hype and can be used to further inflate valuations or for pursuing regulatory capture. The challenge is that many feel that dismissing AI as just hype or purely marketing also diminishes the urgency of taking on the AI industry as the novel and threat to labor, civil society, and the public sphere it is; others that by accepting the industry’s own terms, we imbue it with undue power and enable it. But let’s be clear: Declarations that AI is so powerful it might end the world are a kind of marketing, and anyone who says otherwise is just as off base as those who say that’s all that it is. If you don’t think that these sub-trillion dollar companies have higher-ups who noticed that when their founders talked about super-powerful dangerous AI they got spikes in media interest and phone calls from investors, or that those founders didn’t notice that themselves, and lean into certain narratives to advantage their products, then I don’t know what to tell you. Not all marketing is a Pepsi ad campaign with a celebrity spokesperson. Yet confronting the AI industry should certainly be considered an urgent project. Do I share the x-riskers’ fear that out-of-control, super-intelligent AI agents might end the world? I do not. I’ve read a good deal of AI extinction literature over the last couple of years and I have not come across a credible, step-by-step documentation of how exactly AI might move from self-recursively improving AI to killing every single human on the planet. Most of what I’ve read seems predicated on a sort of reverse Ian Malcolmian logic: Eventually, it becomes smart enough and AI, uh, finds a way (to exterminate humanity). Are the AI companies also overstating and dramatizing what their products can do? Yes, pretty much all the time. They’re in a knife fight for market share and are trying to win customers and government contracts before their investors come knocking. And yet. They have concentrated enormous amounts of compute, have extensive data collection and surveillance capacities, have inserted themselves into the state in numerous capacities, including military kill chains, and they are being run by egomaniacal billionaires who are rushing to monopolize an entire new market. The way I think about their most recent frightening-seeming exploits is not as a “swarm of rogue AI agents building a new civilization” or whatever, but as corporations with a hitherto-unimaginable amount of compute at their disposal recklessly experimenting with automation programs, completely unafraid of any repercussions because we have been unwilling or unable to impose any on them. So I think we should welcome any newfound imperative to hold them accountable. I also think that ultimately, the AI critics, Pause AI folks, leftists, doomers, effective altruists, and, honestly, most of the public, want a lot of the same things: legitimate checks and limits on AI companies’ power, actual transparency into what the companies are doing, and for more of AI to be under public control. (Ultimately, a lot of what animates the x-risk fears are rooted in just that: a fear of losing control.) How we move towards all this, exactly, is the question of the day, and while there’s much to be argued over in terms of building a viable political platform to challenge the AI industry’s power, I do want to cast a vote against one particular approach. Not to pick on Chris here, as there are a lot of folks out there proposing stuff like this, and the policy ideas actually stem from AI safety groups. But not only would this be challenging to land politically (I can already hear the ‘China will beat us to AGI’ calls) and all but unworkable in practice, this approach is a) far too limiting, b) fails to address the current harms caused by AI and c) would likely only wind up serving Anthropic and OpenAI; it’s what regulatory capture looks like in action. Full model transparency is the floor for what should be on offer here. If these companies believe their products will kill us, the very least we deserve is to know how. It’s in the public interest. I would also argue we might get a lot of the way to stopping any currently envisioned robot apocalypse simply by forcing AI companies to assume liability, and to submit to the full brunt of the law. If Sam Altman were liable to be charged with a felony for approving the hack on Hugging Face1, if Google was forced to pay defamation fines each time it published a false and injurious AI Overviews, these companies might suddenly find cause to restrain their models’ output, and we might hear less about rogue AI. We would need to introduce new frameworks and available tools for tracking automated lawbreaking, to be sure, but I’d wager that little would frighten the AI companies more than actually being held accountable for what their products enable. To that end, Illinois has passed an AI liability law, which the industry fought tooth and nail, and Florida is considering one. The next steps would be towards moving AI under public control; again, it’s only reasonable, since everyone, not just AI insiders, should get a say over how a technology whose developers say might kill us is developed and deployed. Dismantling the whole industrial project as currently structured should be on the table, too, pending democratic input. But that’s for another post. For now, suffice to say that while I won’t be losing any sleep about an AI-enabled extinction event, Mr. Coxon and co. have given us an opportunity to underscore the urgency of the clear and present damage AI companies are doing, the extreme power they wield and the extent to which they hold themselves unaccountable, and the abundance of political capital there is out there for taking them on. Subscribe 1 Purely speculative! I do not know if he did or not.
Sudan’s conflict worsening, UN political and peacebuilding chief warns
On 24 August, the Security Council held a briefing on Sudan at the request by Denmark to discuss the protection of civilians and the humanitarian consequences of the ongoing conflict. “The consequences of this conflict will be long-lasting and should shock us all,” said Rosemary DiCarlo, Under-Secretary-General for Political and Peacebuilding Affairs.Civilians face one of the worst humanitarian crises, she said, as they deal with frequent drone attacks against markets, schools, fuel stations and water infrastructure, and the rainy season. Some 13 million people have fled their homes, but access challenges have made it impossible to confirm the true death toll, "it is likely to be in the hundreds of thousands", she said. “Brutal mass killings and atrocities, abductions of women and girls and mass rapes are recurring patterns,” she warned.In North Kordofan, drone attacks continue as both parties compete for control of strategically important towns, she said, reiterating deep concern at the imminent risk of large-scale atrocities by the Rapid Support Forces in and around El abdede. Drone strikes near Tina, on Sudan’s border with Chad, where the refugee influx has intensified pressure on already scarce land, have led to violent disputes over resources. Plus numerous armed movements are pursuing their own territorial and political interests. The UN continues to support efforts of the QUAD - United States, Saudi Arabia, Egypt, United Arab Emirates – for a humanitarian truce. And it is working with the Quintet partners, the African Union, the Intergovernmental Authority on Development (IGAD), the League of Arab States, and the European Union to help advance a viable political path. “Our goal is to build confidence in the political path and pave the way for an inclusive Sudanese-led dialogue for a shared vision for the country’s future,” she said. Sudanese authorities have also bolstered efforts to support civilian dialogue. “Their desire for an inclusive and durable peace is clear,” she said. Both parties must now make concrete commitments on releasing of prisioners, particularly vulnerable groups such as women and children. “The Personal Envoy will travel to Sudan shortly to advance these conversations," she said.
Constitutional Politics in Action – Part I: The Petitions for the Constitutional Review of the 16th and the 17th Amendments of the Hungarian Fundamental Law
The Fidesz-KDNP parliamentary group submitted petitions to the Constitutional Court in July 2026 challenging Hungary’s newly adopted Sixteenth and Seventeenth Amendments. The petitions demonstrate how constitutional doctrine can be strategically reconfigured when political actors move from exercising constitutional power to challenging its exercise by others. After losing control of constitutional power, Fidesz strategically reconfigures elements of domestic doctrine that had been used to resist its own autocratization.
Viewpoint: Europe needs a new scientific contract
The White House's new science strategy should be required reading in the Berlaymont and every European capital.Not because Europe should copy it. Parts of it should concern Europeans deeply. But because it asks the question Europe has so far avoided while steadily losing ground in the global race for technological leadership.Europe already possesses many of the world's finest universities, scientists and research-intensive companies. It produces world-leading research in fields ranging from quantum technologies and biotechnology to climate science. Yet time and again Europe generates the scientific breakthroughs while others build the companies, industries and strategic advantages around them, particularly in digital technologies. Increasingly, we find ourselves regulating technologies whose underlying capabilities were developed elsewhere.This is not primarily a scientific failure. It is an institutional one.The settlement that shaped modern science policy emerged after the Second World War. In Science, the Endless Frontier, Vannevar Bush argued that governments should invest in fundamental research while protecting scientists from political direction. Public investment was justified precisely because no government, university or company could predict where the next transformative discovery would emerge.That scientific contract served liberal democracies extraordinarily well. It underpinned decades of advances in medicine, computing, energy and communications, but the world for which it was designed no longer exists.Artificial intelligence is transforming not only technology but the production of knowledge itself. Advanced chips, computing power, data and scientific instruments have become strategic assets. Scientific knowledge now diffuses globally almost instantly. Competitive advantage increasingly lies not in making discoveries first, but in possessing the infrastructure, capital, engineering capability and institutions required to translate those ideas into products, industries and strategic advantage.The old boundaries between science, industrial policy, national security and geopolitics have largely disappeared. Dual-use technologies now underpin both economic power and military deterrence.The US has recognised this shift. In July, the White House published Science: A New Golden Age, a comprehensive attempt to rethink the relationship between science and national power. The report builds on Bush's legacy, but departs from his framework in important ways. Science is no longer treated simply as the source of future discoveries. It is presented as the foundation of economic resilience, technological leadership and national security. AI, advanced infrastructure and the capacity to build become as important as discovery itself.Yet the report also reveals a striking paradox. The same administration calling for “a new golden age” of US science has simultaneously proposed deep cuts to the federal research enterprise while expanding political influence over the allocation of public research funding. Europe should therefore distinguish between the report's diagnosis and its prescription. The diagnosis, that science has become a strategic asset, is compelling. But the prescription is self-defeating. Long-term technological leadership depends on strong universities, academic freedom and the institutional autonomy that makes scientific discovery possible. This distinction matters. Bush's achievement was never simply to make science serve national strength. It was to establish a division of labour in which governments invested in research without attempting to direct discovery itself. Scientific breakthroughs emerge precisely because researchers retain the freedom to pursue questions whose value cannot yet be demonstrated and whose conclusions cannot be anticipated.Neither China, nor the USAs science becomes more strategically important, the temptation to politicise it inevitably grows. But scientific freedom is not an obstacle to technological leadership, it is an essential precondition.China represents the opposite model. For decades it has integrated science, manufacturing, infrastructure and industrial policy into a single national strategy. Its ability to mobilise resources around critical technologies is formidable. But it does so within an authoritarian system where scientific priorities are increasingly inseparable from political power.Europe should imitate neither model. It should learn from the strategic ambition of the US without importing its growing politicisation of science. And it should learn from China's capacity to build without adopting its concentration of power.Instead, Europe needs a scientific contract of its own. Bush's scientific contract protected the freedom to discover because the defining challenge of the 20th century was producing new knowledge. Europe's next scientific contract must preserve that freedom while ensuring that scientific discoveries can be converted into technological, industrial and strategic capability. Because in a transactional world, Europe's freedom to shape its own future depends on its capacity to build it.Related articlesThe US ‘golden age’ science strategy: what Europeans need to knowEuropean researchers sound the alarm that Trump rule changes will hit cooperationNIH turmoil risks reciprocal EU-US access to health research fundingThis does not mean subordinating free science to competitiveness or industrial policy. On the contrary. Scientific autonomy remains the first principle of Europe's next scientific contract. Governments should not direct scientific discovery. Their responsibility is to ensure that Europe's scientific, industrial, financial and regulatory institutions work together rather than in isolation.Meeting that responsibility requires far more than research funding. European researchers need access to world-class computing infrastructure, advanced laboratories, shared datasets and scientific facilities. Innovative companies need patient capital, testing environments and a genuine single market in which they can scale without facing 27 different regulatory regimes. Public procurement must evolve from purchasing existing technologies to creating markets for new ones. Regulators must become partners in experimentation rather than guardians of yesterday's rules.A connecting architectureEurope does not need to invent the Defense Advanced Research Projects Agency (Darpa) model from scratch. Britain's Aria, Germany's Sprind and Wellcome Leap already show that Europe can build institutions capable of taking high-risk, mission-oriented bets while preserving democratic accountability. The challenge now is not to create more isolated initiatives, but to connect them to Europe's broader scientific, industrial and financial system so that breakthrough discoveries can scale.Above all, Europe must stop treating research, innovation, industrial policy, finance and security as separate policy domains. The challenge is no longer to create excellent institutions in each of these fields, but to make them work as one European innovation system. Europe's strength will increasingly depend not on excellence within institutions, but on excellence across them.Europe's ambition should be neither to imitate the US nor to emulate China. It should demonstrate that scientific freedom, democratic legitimacy and technological capability are not competing objectives, but mutually reinforcing strengths. In an age of geopolitical rivalry, Europe's greatest advantage may ultimately be its ability to attract the world's best talent by combining scientific freedom, democratic openness and technological ambition.Bush's scientific contract helped define the 20th century because it protected the freedom to discover. Europe's challenge is not to abandon that achievement but to extend it. The defining task of Europe's next scientific contract is to preserve the freedom to discover while building Europe's capacity to translate scientific discovery into technological power.Kaare Nielsen is founder of Pomus, a Danish think tank on science and innovation.
Praxis Profit launches new executive advisory service to help Tahoe business owners strategically maximize profitability
SOUTH LAKE TAHOE, Calif. – Praxis Profit, a boutique strategic chief financial officer advisory firm, announced today its full-suite of financial decision-making consultancy service including cash flow visibility, margin protection and executive level financial decision-making...
Explaining The Comcast and NBCUniversal Divorce
(Welcome to the “Most Important Story of the Week”, my bi-weekly strategy column analyzing the most important (but often not buzziest) news story of the last two weeks. I’m the Entertainment Strategy Guy, a former streaming executive who now analyzes business strategy in the entertainment industry. Please subscribe.) I hope everyone had a happy Fourth of July in America, celebrating the country’s 250th birthday. Frankly, I am bummed the 250th wasn’t a bigger celebration, but that’s a different topic for a different Substack. While it was generally a quiet week on the entertainment/streaming/media business fronts, we still had some interesting news stories. Actually, that kinda undersells one of the stories, a huge, huge, huge divestment that could upend the entertainment landscape... So let’s get right to it. In today’s column, I’ll cover Comcast spinning off the rest of NBCUniversal, an entertainment company investing in an LLM company and an LLM-owner investing in a movie studio, the latest round of threats of digital tariffs, and more. Let’s dive in. Subscribe Most Important Story of the Week - Most: Comcast/NBCU Breakup!!!! If I had to describe my reaction to Comcast spinning out NBCUniversal, it feels like a relationship ending, either breaking up or divorcing. Comcast’s decision to spin off the rest of NBCUniversal, after spinning off some of its cable assets into Versant last year, really does feel like a family breaking up under “irreconcilable differences”. Of my stereotypes of the entertainment moguls, my go-to for Comcast CEO Brian Roberts—heir to the Comcast fortune, but a man who’s been at the helm for 24 years now, and president for twelve years before that—is that he likes building empires. He cut his teeth acquiring cable rivals in the 1990s and tried to buy Disney repeatedly, then settled for NBCUniversal after a long court battle. (Contrast this with Rupert Murdoch, a man who also loved to buy, but would also sell when the price is right. Murdoch made Fox out of nothing, but then sold 20th Century Fox to Disney, arguably at the top of the market. So I understood why he sold.) But I don’t understand Roberts’ motivation to sell now. I have some explanations but no single, super-satisfying explanation. Strategically, it would just make more sense to have kept NBCUniversal in-house, especially for a one-time empire builder like Comcast. Yet one powerful force—arguably the decider in modern capitalism—likely overwhelmed all other considerations. At first, I thought I’d arrange my thoughts as a “Five Why” analysis, digging through each layer of the puzzle. But instead, I found myself asking, “But…why?” (And I only ended up with four sections.) So let’s look at Comcast from that angle. Then, at the end, I’ll give my biggest strategic recommendation for every company in Hollywood. It’s obvious, but sometimes, the obvious strategy is the most ignored. But…Why? The Stock Market, Conglomerations, and Sum of the Parts Analysis We’re just getting started with this issue, but the rest is for paid subscribers of the Entertainment Strategy Guy, so if you’d like to find out… Why Comcast could never get a “tech company” valuation The not-so-secret motivation for Comcast What Versant has to do with all of this The key strategic advice I think every entertainment exec should follow (though it’s really obvious) Some big AI investment news… Whether we’ll see digital tariffs… And more… ...please subscribe! We can only keep doing this great work with your support.
Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?
Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.
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Viewpoint: FP10 should remain open, excellent and secure
Europe is right to worry about research security. Foreign interference is real. So is the misuse of sensitive knowledge. Universities working in sensitive areas such as AI, quantum, semiconductors and advanced materials cannot afford to ignore the geopolitical environment around them.But Europe is in danger of drawing the wrong conclusion, one that would increase, not reduce, its strategic vulnerabilities.If the EU applies an “EU preference” logic to the next Framework Programme for research and innovation (FP10), it will weaken one of its greatest strategic assets: a research system built on openness, excellence and international collaboration. In the name of security, Europe could end up advancing science more slowly, innovating less effectively and making itself less attractive to global talent and partners in advanced science and technology.That would be a serious mistake.The EU preference included in Article 10 of the proposed European Competitiveness Fund may make sense in some industrial or deployment contexts, but is far harder to justify when applied to collaborative research in advanced science and technology, where excellence and global connectivity are crucial. Research is not procurement. It does not thrive when isolated. It advances through access to the best ideas, the best people, the best facilities and the best data, wherever they are found. This is why FP10 should not simply absorb industrial policy logic by default. Doing so would risk importing instruments that are ill-suited to research and that ultimately increase vulnerability rather than resilience.For universities of science and technology, the issue is especially acute. These institutions sit at the frontier of knowledge and technology creation in the very fields Europe sees as critical for its future competitiveness and resilience. They know better than most that security risks are real. But they also know that openness and security are not opposites. In practice, they have to be made to work together. Research security is not about closing doors. It is about building resilience through collective responsibility, trust, proportionate safeguards and better governance. That is a fundamentally different approach from default restriction.The risks of non-collaborationThe real danger in the current debate is that Europe talks too much about the risks of collaboration and not enough about the risks of non-collaboration. Those risks are strategic too. Cut researchers off from international networks and Europe loses access to knowledge, data, infrastructures and talent. Slow down global collaboration in critical technologies and Europe slows down its own progress on cutting-edge science. Make participation rules unpredictable and Europe weakens its attractiveness to researchers and investors alike.In other words, over-restricting collaboration will create strategic vulnerabilities, particularly in advanced science and technologies.This point is often underestimated in policy discussions that frame openness mainly as a value to be defended. Europe’s scientific strength, technological development and long-term competitiveness depend on remaining connected to the best research ecosystems in the world. For a continent that wants to accelerate deep tech, strengthen industrial capacity and reduce strategic dependencies, weakening the excellence base would be self-defeating. That does not mean ignoring risk. Quite the opposite. Universities are already strengthening due diligence, internal governance, awareness-raising, screening procedures and compliance support. Across Europe, institutions are working to manage risks linked to foreign interference, sanctions, export controls and the misuse of research. The right response is not complacency. It is better risk management. But that means targeted, evidence-based and proportionate measures, not blunt top-down restrictions with wide spillover effects. In the daily reality of universities, openness and restriction often coexist. The real challenge is how to apply safeguards without sliding into securitisation that damages academic freedom, open science and international cooperation. Restrict partners, not nationsMore restrictive treatment of collaborators from European Economic Area members Iceland, Liechtenstein and Norway, or from Switzerland and the UK, is strategically very difficult to justify. These are deeply embedded partners in Europe’s research and innovation ecosystem. Beyond that, Europe should still resist default exclusion and instead rely on case-by-case assessment. The relevant question is not nationality in the abstract. It is the actual risk profile of a collaboration: the institution, the affiliations, the field, the knowledge involved, the intended use and the safeguards available. Screening should focus on institutions and affiliations rather than nationality alone. Related articlesParliament ‘misreads’ link between Horizon Europe and ECF, Commission official saysFrustration grows at governance gap in next Horizon EuropeIf EU preference logic is imported into research without careful calibration, the likely result is a chilling effect. Researchers may step back from legitimate and beneficial collaboration, even where risks are manageable. International partners may see Europe as less predictable. And Europe may end up undermining the very excellence base it needs to compete, scale up and lead in strategic technologies, thereby increasing its dependence on others.FP10 should do the opposite. It should remain open by default, with restrictions used only exceptionally, and then on the basis of clear evidence. It should integrate research security into open science and research integrity frameworks, not set them against each other. And it should recognise that academic freedom, scientific excellence and responsible international collaboration are not obstacles to Europe’s security, they are part of it. Europe needs stronger tools to protect itself. But it also needs the discipline to avoid measures that would weaken it and increase its strategic vulnerabilities in the process. In FP10, that means staying open, excellent and secure.Louise Drogoul is senior advisor for innovation and sustainability at the Cesaer university association.
Mental health solutions for the digital age
Ask the digital natives of Gen Z about the source of their biggest mental health challenges, and most will say social media and AI.Several of the nearly 400 guests at the third annual Gen Z Wellness Summit, presented by the Friends of Semel Teen Advisory Council at UCLA on March 8, explicitly named the endless stream of content on their phones as serious stressors. “Everybody is addicted to (Tik Tok) as if they were addicted to substances,” said Jantin Asmar, 17, a senior at Virtual Academy in Antelope Valley. “We’re always chasing that dopamine. We’re expecting that dopamine rush and it’s really decaying our interactions with others.” High school student Jantin Asmar was among nearly 400 people who attended the third annual Gen Z Wellness Summit. (Photo by Sandy Cohen) Even young teens feel pressure to be on social media constantly, both to consume content and collect “likes,” said 13-year-olds Chloe and Sophia, both students at Brentwood School. “Everyone’s always on, and you miss stuff if you’re not on it,” Chloe said, adding that social media’s emphasis on appearances is leading to eating disorders: “That’s a big thing for our generation.”The incessant influx of images and updates creates expectations that “weigh teenagers down,” said Linda Kou, 16, a junior at San Gabriel High School.Even though digital spaces allow people to connect with others beyond their immediate surroundings, it doesn’t always translate to real-life community, said Kelah Morgan, 17, a senior at Animo South Los Angeles Charter High School. High school students Kelah Morgan, left, and Linda Kou, shared about the challenges presented by social media. (Photo by Sandy Cohen) “Even if you see people saying that they relate to you online, it might be hard to find people in your personal life who you see every day who you feel comfortable enough to say, ‘You see me online, but this is me in real life and what I’m actually going through,’” she said.Solutions for our digital timesThe Gen Z Wellness Summit was intentionally designed as a free, in-person gathering where young people interested in mental health from across the southland could meet in person. “Peer support is the most important element of maintaining our mental health in community,” said Helena Hansen, MD, PhD, director of UCLA’s Semel Institute for Neuroscience and Human Behavior.Keynote speakers at the summit addressed AI, social connection and self-empowerment, while breakout sessions included discussions about eating disorders, dating, substance use, phone detox and breathwork. Here are some of the day’s top takeaways:Beware of FOPO: Scott Barry Kaufman, PhD, a psychology professor at Columbia University, said that rather than FOMO, or fear of missing out, we ought to be more aware of FOPO: fear of people’s opinions. “Just think about how much your FOPO might be holding you back in your life,” Dr. Kaufman said. “And just that inner contemplation should be enough for you to change your life, because there’s so many things we don’t go after because we have debilitating FOPO.”We don’t need to feel like we’re the best – or what he called “narcissistic self-esteem” – but it’s helpful to acknowledge our own worth, recognize our good qualities and develop self-belief in the skills and talents we’ve cultivated. When we have that – dignity and self-respect, without needing everyone to like us – FOPO is less of a concern.Self-reflection is most effective in community: “When we try to self-reflect alone, we sometimes ruminate,” said Ira Bedzow, PhD, executive director of the Emory University Purpose Project. “But when we self-reflect with people that we trust … (it) allows us to hold ourselves accountable to different ways of seeing and different ways of hearing and different ways of being.”Opening up about our experiences and listening to others are skills we can develop, Dr. Bedzow said.He invited students to participate in what he called a “fishbowl exercise,” where four students sat in a small circle, surrounded by a dozen or so students forming a larger circle. Those in the inner circle answered such questions as: “What stops you from being you today?” and “What helps you feel most like you?”Within minutes, the group in the small circle (the fishbowl), were sharing intimately about their life challenges as those in the outer circle nodded in understanding.After the exercise, one participant said, “I felt like I wasn’t alone, that it wasn’t just me who feels that way.”Another remarked on how “personal” it felt to share face-to-face with others, even strangers.Don’t let AI crush your creativity: Theoretical neuroscientist Vivienne Ming, PhD, has been studying artificial intelligence for more than 20 years. And while she said “it’s reasonable to be concerned” about the fast-growing technology, it can also help humans become better problem-solvers when used strategically.“The smartest thing on the planet today are humans and machines working together creatively,” Dr. Ming said. “What gets more valuable in humans as machines get smarter? Our ability to explore the unknown.“Your unique voice is literally your value to the world … but most of us for most of our lives have been taught to not be unique,” she continued. “Be your own person. Celebrate being different. It is genuinely, measurably, truly valuable.”In a breakout session called “Phone Detox? IYKYK: Living Your Story IRL” led by Don Grant, PhD, students shared their frustrations with AI compromising academic work, art and creativity.“Art is a translation of human experience,” one participant said. “When people use AI, they diminish their own human experience.”Dr. Grant urged them, as “the last generation to remember a world before AI,” to remember the power of imagination and creativity – and to act on it.Remember that social media distorts perceptions: Stuart B. Murray, PhD, PsyD, who directs the Eating Disorders Program and Translational Research in Eating Disorders Program at UCLA, asked the students in his breakout session to take a spontaneous selfie and edit it to conform with society’s beauty standards. All 20 girls in the room immediately got to work, thickening their hair, slimming their faces, plumping their lips.“The pressure to look like what we present on social media can be crippling,” Dr. Murray said. “We now know that social media use is part of a causal pathway into an eating disorder.”Adolescents and young adults are most at risk of developing an eating disorder, he said, with one in three students on college campuses exhibiting clinically meaningful eating-disorder symptoms. More than 4 million people in California will have an eating disorder in their lifetime.Even for those who don’t develop anorexia or bulimia, the ubiquity of modified images online distorts what we consider normal, making us feel worse about ourselves. Remembering that, he and other speakers said, might inspire us to log off occasionally and spend time in the real world with people who love us as we are.
The “Last Mile” Problem Slowing AI Transformation
Few companies have been able to fundamentally change their operating and business models around AI. The primary obstacle to progress is rarely model quality or data availability, but rather the “last mile” of transformation where technical capability must meet organizational design. There are seven frictions that contribute to this problem: proliferation of pilots, the productivity gap, process debt, the identity problem of tribal knowledge, agentic governance, architectural complexity, and the efficiency trap. To overcome these, companies need to focus on clean-sheet process redesign, strategically capturing knowledge, and managing their new digital workforce.
AI@Work in Business
UNCG’s Bryan School launches AI for Impact, an executive workshop helping leaders strategically and ethically integrate AI for future success.
Science of fitting in: Do best friends or popular peers shape teen behavior?
As kids enter adolescence, peer influence splits in two—often in ways adults miss. Following 543 middle schoolers for one semester, researchers found that best friends shape teens’ inner lives, from emotional struggles to academic challenges, while popular peers influence public, status-driven behaviors like social media use and weight concerns. Far from being easily swayed, adolescents navigate peer influence strategically—an insight frequently overlooked by parents and educators.
Live Nation Entertainment Full Year And Fourth Quarter 2025 Results
In 2025, the bond between artists and their global fan bases reached new heights, fueling another year of double-digit growth. As artists continue to unlock untapped markets and headline the world’s most iconic stadiums, we’ve built momentum that carries us into a record-breaking 2026. We’re not just building venues; we’re crafting world-class stages designed to elevate the artist’s vision and their connection to fans. By strategically expanding our global footprint and investing in premium, upgraded infrastructure, we provide the canvas for career-defining performances. This investment doesn’t just drive ticket sales—it revitalizes local economies and cements our venues as cultural anchors. With a deep pipeline of large-scale shows and ticket demand continuing its ascent, we are positioned for another year of double-digit operating income and AOI growth in 2026. Our commitment to being the ultimate partner for artists ensures we are set to compound this double-digit growth for years to come. – Michael Rapino, President and CEO
Forest Health Work Resumes at Pescadero Creek Park
As of late January 2026, crews have returned to Pescadero Creek Park to continue a multi-year project to ecologically restore forest health and reduce fire fuels over approximately 541 acres strategically located throughout the park.
Black women on the nightmare of seeking healthcare in the US: ‘I have to be my own doctor’
Many Black women in the US report moving through medical settings strategically as a means of survival
NBCUniversal strategically leans into sports as it prepares for 'Legendary February'
NBCUniversal's calling card used to be "Must See TV," but the modern media world has pushed the company in a new direction, led by live sports.
Exclusive: Estée Lauder Companies Has Put Three Brands Up for Sale
The conglomerate is strategically shopping a cluster of its lines, including Too Faced, Smashbox and Dr. Jart in a package deal.
Evaluation of WHO’s coordination in health emergencies helps guide humanitarian reforms
The recent evaluation of the Global Health Cluster sheds new light on how WHO, in its unique role as the Inter-Agency Standing Committee (IASC) Cluster Lead Agency (CLA) for health, coordinates life-saving health responses in humanitarian crises. It highlights how WHO works through partnerships to reach the most vulnerable crisis-affected populations and strengthen collective action in increasingly complex emergencies. Serving both learning and accountability purposes, the evaluation provided timely and actionable recommendations that are helping to strategically position WHO during the ongoing IASC Humanitarian Reset and the broader UN 2.0 reforms, where prioritization and new ways of working are taking shape. The evaluation was conducted between 2024 and 2025, at a time when humanitarian action funding was plummeting by more than 50%, triggering the launch of the IASC Humanitarian Reset. While restructuring and prioritization across the humanitarian landscape were underway, the evaluation, through iterative feedback loops, shared emerging findings that helped identify the most crucial coordination functions needed. This was especially important at a time when humanitarian needs and health risks due to armed conflict and natural hazards were increasing, while the capacity of health partners to support Member States to equitably reach all populations affected by crises and deliver response was at risk. The evaluation found that the Global Health Cluster (GHC) remains a highly relevant mechanism for strengthening health coordination in crises and has delivered efficiently despite limited resources. It noted strong collaboration with partners and highlighted opportunities to deepen integration within WHO structures and further enhance inter-cluster cooperation. The evaluation also identified areas where greater emphasis on transition planning, national coordination capacity and linkages between humanitarian response and health system strengthening would bring added value. While the GHC has achieved many of its strategic objectives, improvements in monitoring systems would help better demonstrate collective impact. The recommendations will help strengthen the IASC CLA coordination function across WHO, at all levels, and with all partners. It is noted that going forward WHO needs to continue to support capacity to fulfil coordination functions, in line with the IASC Humanitarian Reset whilst ensuring collective prioritization of health cluster action and quality coverage of the health response. The evaluation will help WHO strengthen locally-led action, national ownership and leadership of the sector, and linkages between health system strengthening activities. Additionally, the evaluation evidence will be used to optimize resource mobilization for the GHC and strengthen WHO’s capacity to deliver, plan for and monitor and evaluate results across the Organization. Read the evaluation Global Health Cluster https://healthcluster.who.int/ WHO’s work in health emergencies https://www.who.int/emergencies/overview
2025 Health and Human Services Policy Advisors Institute
October 28-29, the National Governors Association Center for Best Practices (NGA Center) brought together Governors’ health and human services policy advisors representing 28 states and territories in Santa Fe, New Mexico, for the annual Health and Human Services Institute. This year’s institute explored the theme “Stretching the Dollar: Strategically Financing Health and Human Services,” including […]
2025 Health and Human Services Policy Advisors Institute
October 28-29, the National Governors Association Center for Best Practices (NGA Center) brought together Governors’ health and human services policy advisors representing 28 states and territories in Santa Fe, New Mexico, for the annual Health and Human Services Institute. This year’s institute explored the theme “Stretching the Dollar: Strategically Financing Health and Human Services,” including […]