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Epidemiologist Neil Vora joins Mongabay’s board as it expands global reach and planetary health coverage
Neil Vora has worked on Ebola outbreaks in Liberia and the Democratic Republic of the Congo and ran New York City’s COVID-19 contact-tracing operation that traced more than 700,000 people. Now the physician and epidemiologist is joining Mongabay’s board of directors. The Ebola deployments came during nearly a decade at the U.S. Centers for Disease […]
GTA 6 PS5 Pro Upgrades Finally Revealed: Frame-Rate, Upscaling, Ray Tracing Confirmed
Rockstar has delivered the details.
NMSU Physical Science Laboratory marks 80 years of aerospace, defense research
NMSU's Physical Science Laboratory celebrates 80 years, tracing its evolution from White Sands rocket testing to modern aerospace and defense research.
Microsoft Unveils Biggest DirectX Raytracing Upgrade Since 2018, Bringing More Efficient Ray Tracing To NVIDIA, AMD & Intel GPUs
Microsoft's DirectX 12 Agility SDK 1.722 enhances ray tracing efficiency with up to 66x performance improvements and new Clustered Geometry features.
Phantom Blade Zero Gets a 5 GB Day One Patch That Improves Ray Tracing Performance, but S-Game Warns Against New NVIDIA Drivers
A day-one patch for Phantom Blade Zero boosts ray tracing, but NVIDIA users should avoid the latest driver.
Phantom Blade Zero PC Performance Benchmarks – Fast-Paced Wuxia That Looks Phenomenal In Path Tracing & Boosted By NVIDIA RTX Tech
Phantom Blade Zero is out now on PC, offering increased graphics fidelity through NVIDIA's DLSS 4.5 technology, Path Tracing, and much more.
Morocco health alert issued due to diphtheria: US Embassy
In the North African country of Morocco, the country’s Ministry of Health reported a small diphtheria outbreak with clusters in multiple regions in Morocco in late September. Moroccan health teams are tracing contacts and providing preventive treatment and vaccines. This has prompted the US Embassy to issue a health alert for U.S. citizens in Morocco. Diphtheria is a serious bacterial infection. It spreads primarily from person to person through coughs and sneezes (respiratory droplets). Most Americans were vaccinated as children and have received Td or TdaP boosters as adults. The risk to U.S. citizens in Morocco remains low. U.S. Citizens may contact their local doctors if they would like immunizations. Embassy officials advise citizens to watch out for the following symptoms: Sore throat or hoarse voice, mild fever, a thick gray or white coating in the throat or nose, swollen neck and trouble swallowing or breathing. If you or a family member has trouble breathing or swallowing, please contact your local doctor. They also advise on the following actions concerning vaccines: Check your vaccination records and your family members’ records. Get a booster if you need one. Adults need a diphtheria booster (Td or Tdap) every 10 years. Make sure your children are up to date on their routine vaccines. Outbreak News Today is a reader-supported publication. To receive new posts and support my work, consider becoming a free or paid subscriber. Subscribe
P.T. Native PC Port 1.0 Is Out Now With DLSS 4.5, Frame Generation, Ray Tracing, Mods, And More
Hideo Kojima,P.T.,PlayStation 4,LoreanXavier,Vulkan,Konami,NVIDIA DLSS 4.5,AMD FSR 3.1,Intel XeSS,Silent Hills
Gears of War: E-Day Performance Benchmark Review
Gears of War: E-Day is a prequel set 14 years before the original game. Built on Unreal Engine 5 with RTX Mega Geometry, DLSS 4.5, FSR 4, XeSS, and ray tracing, we examine graphics quality, VRAM usage, upscaling options, and how it performs across a wide range of modern GPUs.
The Witcher 3 Remastered Crushes GPUs With Path Tracing, but Free Mod Claws Back Up to 30% Performance
Following its surprise announcement during this year's gamescom Opening Night Live, The Witcher 3 Remastered is now available on PC, PlayStation 5, Xbox Series X|S, and Nintendo Switch 2. While the number of improvements to gameplay is staggering and well thought out, what most were looking forward to was the visual uplift, which includes very demanding path tracing support on PC. Thankfully, a mod has already come to the rescue, as it did after the launch of the Next-Gen update, optimizing both ray tracing and path tracing for better performance with minimal loss of quality. "Faster RT/PT in The Witcher […]
Something Took Wing in Paleocene Sunsets
More than 56 million years ago, something took wing. Now, combining ancient fossils with genomes from living species, researchers are rewriting the bat family tree, and tracing these creatures toward their mysterious beginnings in Paleocene Europe.
Emeryville’s Folkmanis Puppets Celebrates 50 Years as a Family-Run Business
Folkmanis Puppets celebrates 50 years in Emeryville, tracing the family-run company from its Berkeley beginnings to its longtime Park Avenue home.
NVIDIA Unleashes The Next Chapter of Neural Rendering & Path Tracing With RTX Kit SDK While RTX Mega Geometry 2.0 SDK Gives Devs the Ability To Stream Insane Levels of Detail
NVIDIA unleashes RTX Kit and RTX Mega Geometry 2.0 SDKs, giving devs a taste of next-gen Neural Rendering, Path Tracing & game technologies.
CONTROL Resonant PC Performance Analysis & Tuning Guide – How To Get The Best Experience On PC
CONTROL Resonant offers optimized graphics settings improving performance by 91% without ray tracing and 77% with it on RTX 4060, showcasing Remedy's Northlight Engine.
DNA, a link to the past — Historical society presents program with local science educator Rutland
Getting your Trinity Audio player ready... Have you ever wondered how DNA can help uncover the past? From identifying individuals, tracing ancient migrations, and revealing genetic histories, DNA can also […]
Ebola outbreak update: Cases and deaths; Dungu health zone, Haut-Uélé province now affected
A total of 73 new confirmed cases of Ebola Virus Disease (EVD) were reported on September 18, 2026, including 25 community deaths. Of these confirmed cases, 46 were from Ituri province, 18 from North Kivu, 6 from Haut-Uélé, and 3 from Tshopo. A new health zone, Dungu, in Haut-Uélé province, was affected during the day. As this zone borders South Sudan, strengthening cross-border surveillance is necessary. During the day on September 18, 2026, 12 deaths within Ebola Treatment Centers (ETCs)—10 in Ituri and 2 in North Kivu—were unfortunately recorded, bringing the total number of deaths for the day to 37. However, 41 patients were declared recovered (30 in Ituri, 6 in Haut-Uélé, 3 in North Kivu, and 2 in Tshopo) after testing negative for EVD twice. Since the start of the epidemic in the Democratic Republic of the Congo (DRC), a cumulative total of 7,614 confirmed cases, including 3,676 deaths, has been recorded, representing a case fatality rate of 48.3%. The epicenter remains Ituri province, which accounts for 77.2% of the confirmed cases reported across the seven affected provinces and also accounts for 63.0% of the new confirmed cases. A new health zone was affected on September 18, 2026. Consequently, 63 out of 167 health zones (37.7%) across 7 provinces are affected. Subscribe to Outbreak News TV on YouTube Response measures feature 97% traveler screening at entry points, surveillance expansion to new area Dungu, and community outreach sensitizing over 110,000 people in one day. The Democratic Republic of the Congo’s health system faces deep, structural constraints that predate the current Ebola outbreak and make epidemic response far harder. These problems are most acute in rural areas and the conflict-affected east. Outbreak News Today is a reader-supported publication. To receive new posts and support my work, consider becoming a free or paid subscriber. Subscribe Eastern provinces have seen health facilities damaged, looted, or abandoned. Insecurity delays patients, blocks supply deliveries, and exposes staff to attacks. Millions of displaced people live in camps with poor water, sanitation, and health services, increasing outbreak risk. Vast distances and poor roads mean many people walk hours or days to reach care. These same weaknesses explain why Ebola has continued to spread into new, under-prepared health zones even as some original hotspots show improvement: surveillance, laboratory turnaround, contact tracing, and infection control remain thin outside the best-supported sites. The Ministry of Health and partners have scaled up treatment centres, laboratories, and vaccination in the current outbreak, and some digital surveillance systems (DHIS2) provide a useful backbone. However, the underlying gaps in staffing, basic infrastructure, reliable funding, and logistics have not been closed. Without sustained investment in those foundations, the system will remain vulnerable to both routine disease burden and the next large outbreak. If you like the reporting on Outbreak News Today, please consider a paid subscription for $5/month or $30 a year. Help support the cause of this niche journalism. It is appreciated.
Even the RTX 5090 can't hit 60FPS in Control Resonant without upscaling
TechPowerUp testing shows Control Resonant can drop the RTX 5090 to 48 FPS at native 4K with ray tracing, making upscaling essential.
How myth-busting science changed cerebral palsy
Research from Adelaide continues to play a major role in changing the world's understanding of cerebral palsy, tracing its causes back to genetics and reducing costly litigation against obstetricians. ...
Two measles cases confirmed in Wayne County
Wayne County, N.Y. confirms its first two measles cases, both in unvaccinated people. Officials say public risk is low as contact tracing and isolation begin, with a renewed push for vaccination.
The Cost of Cutting American Science: How Federal Cuts Diminish Public Health Capacity
Among the federal government’s many responsibilities is the work it does to protect public health. Federal agencies monitor our food supply to ensure safety, conduct research to better understand emerging health threats, provide funding for public health programs in communities and work to detect and respond to disease outbreaks. Americans rely on these efforts every day—in a 2024 online survey, 74% of respondents said that “if the federal government issued safety guidance about food you eat regularly,” they would follow it. Changes to Federal Public Health Capacity The Trump administration’s efforts to reshape the federal government have resulted in significant impacts on our nation’s public health capacity over the past 20 months, affecting the response to health concerns such as measles, Ebola and cyclosporiasis. Agencies with core public health, food safety and disease prevention responsibilities experienced large workforce decreases during the first year of the administration. At the Centers for Disease Control and Prevention, for instance, the workforce in February 2026 was 26.7% smaller than in September 2024 before the start of the Trump administration. The Food and Drug Administration saw a similarly steep decline of 21.6%. Agencies such as the National Institutes of Health, Substance Abuse and Mental Health Services Administration and Food Safety and Inspection Service also experienced large workforce decreases. (function(){function e(){window.addEventListener(`message`,function(e){if(e.data[`datawrapper-height`]!==void 0){var t=document.querySelectorAll(`iframe`);for(var n in e.data[`datawrapper-height`])for(var r=0,i;i=t[r];r++)if(i.contentWindow===e.source){var a=e.data[`datawrapper-height`][n]+`px`;i.style.height=a}}})}e()})(); Changes can also be seen in crucial public health occupations. The number of federal food inspectors, for example, decreased by more than half between September 2024 and February 2026, going from 1,035 to 473. This is the lowest number of food inspectors employed by the federal government since at least 2005. By February 2026, there were also 33.3% fewer federal public health program specialists, whose work includes advising federal funding recipients on public health activities and analyzing the effectiveness of public health programs. Government’s capacity is diminished as employees with specialized knowledge and experience in protecting the public and responding to health risks depart, leaving agencies less prepared to carry out their public health missions. There also have been vacancies in critical high-level leadership positions at public health agencies, most notably at the CDC, which had a permanent Senate-confirmed director for less than a month between January 2025 and early August 2026. Although the CDC has previously been led by acting directors at the start of an administration, the nearly yearlong gap since the departure of the administration’s first permanent director in August 2025 is without precedent. As of August 2026, the FDA is also currently without a Senate-confirmed commissioner following the previous commissioner’s resignation in May 2026. Additionally, public health agencies are experiencing increased politicization of their leadership ranks. In agencies such as the CDC and Food Safety and Inspection Service, the number of individuals in the Senior Executive Service—the most senior career leaders in government—has declined significantly, while at the same time the number of political appointees has reached record levels. (function(){function e(){window.addEventListener(`message`,function(e){if(e.data[`datawrapper-height`]!==void 0){var t=document.querySelectorAll(`iframe`);for(var n in e.data[`datawrapper-height`])for(var r=0,i;i=t[r];r++)if(i.contentWindow===e.source){var a=e.data[`datawrapper-height`][n]+`px`;i.style.height=a}}})}e()})(); (function(){function e(){window.addEventListener(`message`,function(e){if(e.data[`datawrapper-height`]!==void 0){var t=document.querySelectorAll(`iframe`);for(var n in e.data[`datawrapper-height`])for(var r=0,i;i=t[r];r++)if(i.contentWindow===e.source){var a=e.data[`datawrapper-height`][n]+`px`;i.style.height=a}}})}e()})(); At the CDC, for example, the number of career SES decreased 42.9% between December 2024 and February 2026, while the number of non-Senate confirmed political appointees at the agency was six times larger than the agency’s historical average from 2009 and 2024. Knowledgeable career leaders are integral to the ability of public health agencies to carry out their work with scientific integrity and professional judgment, and rapid leadership turnover and increased politicization threaten agencies’ ability to make evidence-based decisions to protect our health. The upheaval and politicization in public health agencies have also negatively affected employee engagement. Strong employee engagement is crucial to the ability of agencies to carry out their mission and successfully provide essential services to the public. In the 2025 Public Service Viewpoint Survey conducted by the Partnership for Public Service, the Department of Health and Human Services—which encompasses major public health agencies such as the CDC and FDA—had an employee engagement and satisfaction score of 20.4 out of 100, one of the lowest among large agencies. Only 2.8% of HHS employees indicated trust in their political leaders and only 8.7% reported confidence that they could report a suspected violation of law or regulation without retaliation. Employees at HHS also reported that the agency’s ability to provide services to the public had suffered. Nearly half of employees at HHS, 47.5%, said their work unit was worse at delivering quality services compared to its performance in 2024. In addition, 57.8% said their work unit was performing worse at fulfilling stakeholder needs. In addition to the work done within federal agencies, the federal government also distributes significant funding for public health and disease prevention work to state and local governments, nonprofits and small businesses—funding which has been significantly disrupted. At the CDC, for example, there was a 71.9% decrease in the amount of project grant funding issued in fiscal year 2025 compared to fiscal year 2024. The FDA also issued far less funding in fiscal year 2025—a 21.3% decrease from its fiscal year 2024 funding. Changes in federal funding include the ending of grants to community organizations that worked on HIV prevention and the cancellation of funding for research into improvements to patient safety and healthcare quality. These changes go beyond federal agencies to impact the broader public health ecosystem, including the state and local health departments responsible for much of the on-the-ground public health work in their communities. About 80% of the CDC’s domestic funding is directed towards state and local partners—meaning that cuts to CDC funding can ultimately result in cuts to state and local public health capacity. Federal agencies also provide expertise and assistance to state and local health agencies as they deal with particular health challenges, but workforce cuts have resulted in fewer federal employees available to help. The Impact of Changes to Public Health Capacity These changes to federal public health capacity are not abstract concerns. Disrupted programs, reduced funding and lost expertise at public health agencies across all levels of government threaten the public’s physical well-being and safety. In some cases, this has already led to harm. The most immediate impacts of federal cuts were seen in interruptions to ongoing public health programs and crisis responses. In one instance, when CDC grants were canceled during the 2025 Texas measles outbreak—the most severe measles outbreak in 25 years—public health officials in Lubbock, Texas were forced to pause parts of their measles response work supported by the frozen funding. Lubbock’s director of public health further said that a lack of available CDC experts to reach out to for advice “definitely” impacted the department’s response to the measles crisis. Cuts to federal funding also forced Dallas County Health and Human Services to cut staff and cancel 50 community vaccination clinics during the outbreak. Public health work outside of major outbreak responses was also disrupted. For example, in April 2025, the Milwaukee Public Health Department was unexpectedly unable to reach experts on lead poisoning due to firings at the CDC when responding to concerns about lead contamination in Milwaukee public schools. Due to federal workforce cuts, several programs at the CDC, including Alzheimer’s and epilepsy programs, have also become trapped in limbo—existing on paper, but without the staff necessary to operate. More recent crises reveal how federal cuts have weakened the public health infrastructure needed to prevent and respond to dangerous new outbreaks. Internationally, cuts at the U.S. Agency for International Development eliminated funding for disease testing and contact tracing abroad, which delayed detection of and responses to the 2026 Ebola outbreak in the Democratic Republic of Congo. While international outbreaks may seem far removed, the unchecked spread of disease in any country can quickly pose a danger to economic well-being, security and health around the world. Within the United States, public health cuts inhibited responses to the summer 2026 outbreak of the food-borne parasite cyclospora. At the federal level, cuts to funding for lab equipment and for CDC staff with expertise in parasitic infections—including 9 out of 11 staff members at the lab responsible for identifying parasitic outbreaks in 2025— contributed to the largest reporting delay in outbreak cases at the CDC in 15 years. Conflicting communications from the FDA about the source of the outbreak, which followed cuts to the agency’s communications department, additionally led to confusion among the public about how to best avoid infection. At the same time, cuts to HHS funding and support for local and state public health slowed some health departments’ responses to the crisis. The exact costs of these delays, constraints and confusion in public health responses are difficult to estimate. However, their message is clear: federal cuts have already made containing threats to public health even more of a challenge. Conclusion Protecting public health—from food safety to disease prevention—is one of the federal government’s most important missions. Dramatic and haphazard cuts to federal agencies and funding have already disrupted the public health system, impacting the response to challenges such as measles, lead poisoning and cyclosporiasis. The U.S. public health system needed improvement before these disruptions. Since 2022, federal leadership and coordination in response to public health outbreaks has been on the Government Accountability Office’s High-Risk List of areas in need of attention to improve government effectiveness and efficiency. Recent cuts only compound these concerns. The chaotic dismantling of government and resulting disruptions to crucial functions like public health and disease prevention highlight the need for meaningful reform and concrete policy proposals to reimagine how government can better serve the public and be more effective, responsive and accountable. To learn more about the impact of federal cuts to public health and science more broadly, visit The Cost of Cutting American Science. Learn more For more information on the Partnership for Public Service’s government reform initiative, visit Government for a New Era. View here In line with The Cost of Cutting American Science, federal workforce data in this brief is as of February 2026
The Cost of Cutting American Science: How Federal Cuts Diminish Public Health Capacity
Among the federal government’s many responsibilities is the work it does to protect public health. Federal agencies monitor our food supply to ensure safety, conduct research to better understand emerging health threats, provide funding for public health programs in communities and work to detect and respond to disease outbreaks. Americans rely on these efforts every day—in a 2024 online survey, 74% of respondents said that “if the federal government issued safety guidance about food you eat regularly,” they would follow it. Changes to Federal Public Health Capacity The Trump administration’s efforts to reshape the federal government have resulted in significant impacts on our nation’s public health capacity over the past 20 months, affecting the response to health concerns such as measles, Ebola and cyclosporiasis. Agencies with core public health, food safety and disease prevention responsibilities experienced large workforce decreases during the first year of the administration. At the Centers for Disease Control and Prevention, for instance, the workforce in February 2026 was 26.7% smaller than in September 2024 before the start of the Trump administration. The Food and Drug Administration saw a similarly steep decline of 21.6%. Agencies such as the National Institutes of Health, Substance Abuse and Mental Health Services Administration and Food Safety and Inspection Service also experienced large workforce decreases. (function(){function e(){window.addEventListener(`message`,function(e){if(e.data[`datawrapper-height`]!==void 0){var t=document.querySelectorAll(`iframe`);for(var n in e.data[`datawrapper-height`])for(var r=0,i;i=t[r];r++)if(i.contentWindow===e.source){var a=e.data[`datawrapper-height`][n]+`px`;i.style.height=a}}})}e()})(); Changes can also be seen in crucial public health occupations. The number of federal food inspectors, for example, decreased by more than half between September 2024 and February 2026, going from 1,035 to 473. This is the lowest number of food inspectors employed by the federal government since at least 2005. By February 2026, there were also 33.3% fewer federal public health program specialists, whose work includes advising federal funding recipients on public health activities and analyzing the effectiveness of public health programs. Government’s capacity is diminished as employees with specialized knowledge and experience in protecting the public and responding to health risks depart, leaving agencies less prepared to carry out their public health missions. There also have been vacancies in critical high-level leadership positions at public health agencies, most notably at the CDC, which had a permanent Senate-confirmed director for less than a month between January 2025 and early August 2026. Although the CDC has previously been led by acting directors at the start of an administration, the nearly yearlong gap since the departure of the administration’s first permanent director in August 2025 is without precedent. As of August 2026, the FDA is also currently without a Senate-confirmed commissioner following the previous commissioner’s resignation in May 2026. Additionally, public health agencies are experiencing increased politicization of their leadership ranks. In agencies such as the CDC and Food Safety and Inspection Service, the number of individuals in the Senior Executive Service—the most senior career leaders in government—has declined significantly, while at the same time the number of political appointees has reached record levels. (function(){function e(){window.addEventListener(`message`,function(e){if(e.data[`datawrapper-height`]!==void 0){var t=document.querySelectorAll(`iframe`);for(var n in e.data[`datawrapper-height`])for(var r=0,i;i=t[r];r++)if(i.contentWindow===e.source){var a=e.data[`datawrapper-height`][n]+`px`;i.style.height=a}}})}e()})(); (function(){function e(){window.addEventListener(`message`,function(e){if(e.data[`datawrapper-height`]!==void 0){var t=document.querySelectorAll(`iframe`);for(var n in e.data[`datawrapper-height`])for(var r=0,i;i=t[r];r++)if(i.contentWindow===e.source){var a=e.data[`datawrapper-height`][n]+`px`;i.style.height=a}}})}e()})(); At the CDC, for example, the number of career SES decreased 42.9% between December 2024 and February 2026, while the number of non-Senate confirmed political appointees at the agency was six times larger than the agency’s historical average from 2009 and 2024. Knowledgeable career leaders are integral to the ability of public health agencies to carry out their work with scientific integrity and professional judgment, and rapid leadership turnover and increased politicization threaten agencies’ ability to make evidence-based decisions to protect our health. The upheaval and politicization in public health agencies have also negatively affected employee engagement. Strong employee engagement is crucial to the ability of agencies to carry out their mission and successfully provide essential services to the public. In the 2025 Public Service Viewpoint Survey conducted by the Partnership for Public Service, the Department of Health and Human Services—which encompasses major public health agencies such as the CDC and FDA—had an employee engagement and satisfaction score of 20.4 out of 100, one of the lowest among large agencies. Only 2.8% of HHS employees indicated trust in their political leaders and only 8.7% reported confidence that they could report a suspected violation of law or regulation without retaliation. Employees at HHS also reported that the agency’s ability to provide services to the public had suffered. Nearly half of employees at HHS, 47.5%, said their work unit was worse at delivering quality services compared to its performance in 2024. In addition, 57.8% said their work unit was performing worse at fulfilling stakeholder needs. In addition to the work done within federal agencies, the federal government also distributes significant funding for public health and disease prevention work to state and local governments, nonprofits and small businesses—funding which has been significantly disrupted. At the CDC, for example, there was a 71.9% decrease in the amount of project grant funding issued in fiscal year 2025 compared to fiscal year 2024. The FDA also issued far less funding in fiscal year 2025—a 21.3% decrease from its fiscal year 2024 funding. Changes in federal funding include the ending of grants to community organizations that worked on HIV prevention and the cancellation of funding for research into improvements to patient safety and healthcare quality. These changes go beyond federal agencies to impact the broader public health ecosystem, including the state and local health departments responsible for much of the on-the-ground public health work in their communities. About 80% of the CDC’s domestic funding is directed towards state and local partners—meaning that cuts to CDC funding can ultimately result in cuts to state and local public health capacity. Federal agencies also provide expertise and assistance to state and local health agencies as they deal with particular health challenges, but workforce cuts have resulted in fewer federal employees available to help. The Impact of Changes to Public Health Capacity These changes to federal public health capacity are not abstract concerns. Disrupted programs, reduced funding and lost expertise at public health agencies across all levels of government threaten the public’s physical well-being and safety. In some cases, this has already led to harm. The most immediate impacts of federal cuts were seen in interruptions to ongoing public health programs and crisis responses. In one instance, when CDC grants were canceled during the 2025 Texas measles outbreak—the most severe measles outbreak in 25 years—public health officials in Lubbock, Texas were forced to pause parts of their measles response work supported by the frozen funding. Lubbock’s director of public health further said that a lack of available CDC experts to reach out to for advice “definitely” impacted the department’s response to the measles crisis. Cuts to federal funding also forced Dallas County Health and Human Services to cut staff and cancel 50 community vaccination clinics during the outbreak. Public health work outside of major outbreak responses was also disrupted. For example, in April 2025, the Milwaukee Public Health Department was unexpectedly unable to reach experts on lead poisoning due to firings at the CDC when responding to concerns about lead contamination in Milwaukee public schools. Due to federal workforce cuts, several programs at the CDC, including Alzheimer’s and epilepsy programs, have also become trapped in limbo—existing on paper, but without the staff necessary to operate. More recent crises reveal how federal cuts have weakened the public health infrastructure needed to prevent and respond to dangerous new outbreaks. Internationally, cuts at the U.S. Agency for International Development eliminated funding for disease testing and contact tracing abroad, which delayed detection of and responses to the 2026 Ebola outbreak in the Democratic Republic of Congo. While international outbreaks may seem far removed, the unchecked spread of disease in any country can quickly pose a danger to economic well-being, security and health around the world. Within the United States, public health cuts inhibited responses to the summer 2026 outbreak of the food-borne parasite cyclospora. At the federal level, cuts to funding for lab equipment and for CDC staff with expertise in parasitic infections—including 9 out of 11 staff members at the lab responsible for identifying parasitic outbreaks in 2025— contributed to the largest reporting delay in outbreak cases at the CDC in 15 years. Conflicting communications from the FDA about the source of the outbreak, which followed cuts to the agency’s communications department, additionally led to confusion among the public about how to best avoid infection. At the same time, cuts to HHS funding and support for local and state public health slowed some health departments’ responses to the crisis. The exact costs of these delays, constraints and confusion in public health responses are difficult to estimate. However, their message is clear: federal cuts have already made containing threats to public health even more of a challenge. Conclusion Protecting public health—from food safety to disease prevention—is one of the federal government’s most important missions. Dramatic and haphazard cuts to federal agencies and funding have already disrupted the public health system, impacting the response to challenges such as measles, lead poisoning and cyclosporiasis. The U.S. public health system needed improvement before these disruptions. Since 2022, federal leadership and coordination in response to public health outbreaks has been on the Government Accountability Office’s High-Risk List of areas in need of attention to improve government effectiveness and efficiency. Recent cuts only compound these concerns. The chaotic dismantling of government and resulting disruptions to crucial functions like public health and disease prevention highlight the need for meaningful reform and concrete policy proposals to reimagine how government can better serve the public and be more effective, responsive and accountable. To learn more about the impact of federal cuts to public health and science more broadly, visit The Cost of Cutting American Science. Learn more For more information on the Partnership for Public Service’s government reform initiative, visit Government for a New Era. View here In line with The Cost of Cutting American Science, federal workforce data in this brief is as of February 2026
Victor Oladipo’s Comeback Plea Reveals Thunder’s Greatest Trade Chain
Tracing a decade of asset management, this veteran’s request spotlights the strategic trades that transformed Serge Ibaka into Shai Gilgeous-Alexander and built Oklahoma City's current championship foundation.
Mark Walter and Magic Johnson’s Dodgers deal gets the Pablo Torre treatment
The sports investigative journalist examines Mark Walter’s Dodgers purchase, tracing financial ties involving Magic Johnson.
New CTE Study Delivers Sobering Reality Check on Long-Term Health Risks for NFL Players
As NFL teams close out the 2026 preseason and turn toward opening weekend, a new medical study is forcing a harder look at what football costs its players long after the final whistle. Dr. Daniel Daneshvar, a Harvard Medical School researcher, has spent years tracing the link between repeated head impacts and brain disease in […] The post New CTE Study Delivers Sobering Reality Check on Long-Term Health Risks for NFL Players appeared first on Gridiron Heroics.
Cyclosporiasis outbreak exposes a weakened US public health system
During the height of the summer outbreak of cyclosporiasis, Dea Lancaster set aside her usual duties as nurse coordinator at Michigan's Washtenaw County Health Department to call patients, asking about their symptoms and tracing the contaminated food they ate.
The Witcher 3: Wild Hunt - Remastered for PS5 Pro will run at 60fps with ray tracing and support PSSR
The performance mode on PS5 Pro gets a bump and can run unlocked and it can hit up to "90fps or something".
NVIDIA DLSS 4.5 Ray Reconstruction Review
NVIDIA DLSS 4.5 Ray Reconstruction boosts image quality with a new AI-powered model that uses 20% more parameters and 35% more compute, all without sacrificing performance. Our testing shows that ray-traced visuals are enhanced, offering crisper, richer textures, especially in path tracing.
Review reveals how nicotine damages blood vessels and heart health
A review published today in Nature Reviews Cardiology provides the most detailed picture yet of how nicotine damages the cardiovascular system – tracing the biological chain of events from the moment nicotine binds to receptors in blood vessel walls through to the atherosclerotic plaque rupture that triggers heart attacks and strokes.
Google Messages RCS breaks with ‘3100’ error for some, especially Galaxy switchers
An issue with Google Messages appears to be breaking RCS for some users, with much of the problem tracing back...
Exhausted health workers in Congo struggle to keep up as Ebola outpaces contact tracing
Gédéon Banga Ngbape and his team of community health workers are laboring tirelessly in eastern Congo to track the country’s fastest-growing Ebola outbreak.
'The Game Feels Super Smooth': Wolverine Will Run at 60fps with Ray Tracing on Base PS5
Insomniac wizardry
Ozempic may have revealed the brain’s hidden “craving center”
Ozempic-like drugs appear to weaken more than hunger—they may also reduce cravings for alcohol and other addictive substances. Scientists are increasingly tracing this effect to the lateral septum, a brain region that helps connect memories and surroundings with rewarding experiences. Packed with GLP-1 receptors, it may act as a crucial control point between thinking about a reward and feeling compelled to pursue it. The discovery could open new approaches to treating addiction as well as obesity.
US officials focus on identification and rapid action as measles cases rise
Authorities in Delaware tackle cluster with vaccination and contract tracing – but field has been weakened by cuts
Why health officials do not have a good handle on the current Ebola outbreak
To get slightly ahead of the virus, health officials need to quickly identify people at risk of infection, a practice known as contact tracing. That's a challenge in the Democratic Republic of Congo.
Before Lettuce Felled Thousands, a Cilantro-Linked Cyclospora Outbreak Sickened New Yorkers
New York City health officials shared details of how they traced a much smaller cyclosporiasis outbreak, showing the difficulty of tracing contamination.
Southern Indiana health department conducting contact tracing of diarrhea-causing parasite
Federal and state health investigators say the most common thread they’re hearing right now is iceberg lettuce, including prepackaged lettuce.
Assassin's Creed Black Flag Resynced Performance Benchmark Review
Ubisoft's Assassin's Creed Black Flag Resynced breathes new life into the classic with modern graphics, gameplay improvements and full ray tracing support. In our performance review, we examine its graphical fidelity, VRAM usage, upscaling options, and how well it runs across a wide range of modern GPUs.
PBS, BBC Set New ‘Nova’ Evolution Science Series Tracing ‘The Epic Journey of Life’ (EXCLUSIVE)
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Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?
Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.
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To reduce hospitalizations and deaths from seasonal influenza, Sri Lanka is taking proactive steps to expand access to rapid diagnostic testing and ensure prompt initiation of treatment. National clinical guidelines recommend the use of oseltamivir for individuals at high risk of complications, helping prevent severe illness and shorten the duration of infection. This strategy not only saves lives but also supports local pharmaceutical production, contributing to a reliable supply of antivirals for both seasonal outbreaks and future pandemics.Read moreBHUTAN BOOSTS PANDEMIC INFLUENZA READINESS WITH PANDEMIC INFLUENZA PREPAREDNESS FRAMEWORK PARTNERSHIP CONTRIBUTION SUPPORTED TRAINING AND SIMULATIONSOriginally developed in 2012, the National Influenza Pandemic Preparedness and Response Plan (NIPPRP) has long served as Bhutan’s central framework for managing influenza threats. 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The webinar provided an opportunity to share situational updates, discuss surveillance gaps, and reinforce coordination mechanisms critical for early detection and rapid response to avian influenza threats. Read moreOther Key PIP Updates (July-December 2025)MEMBER STATES:Bangladesh drafted and conducted a series of Core Group Meetings in 2025 to review and update the National Pandemic Preparedness and Response Plan for Respiratory Pathogens. In addition, the country carried out Rapid Response Team (RRT) trainings on seasonal and avian influenza and other re‑emerging infectious diseases. Bangladesh also updated its epidemiological data‑training programme for physicians at sentinel surveillance sites, using a revised epidemiological data‑collection tool.Bhutan revised and updated its National Influenza Pandemic Preparedness and Response Plan (NIPPRP) in 2025 and developed a national Standard Operating Procedure (SOP) for influenza outbreak management. 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The training emphasized correct marking and reporting of influenza samples as “unsubtypable” or “not subtyped” where applicable, to ensure accurate national surveillance.Maldives conducted simulation exercises in three atolls based on its existing National Pandemic Preparedness and Response Plan (NPPRP). The country plans to conduct similar exercises in three additional atolls after updating the NPPRP in 2026. In addition, Maldives conducted training on FluID and FluMart as part of a broader data‑management training package for Ministry of Health and Health Protection Agency officials, aimed at improving routine reporting to WHO platforms and the DHIS2 system.In Myanmar, technical support was provided to the National Influenza Centre (NIC) through dedicated human‑resource support (January–December 2025) to sustain data management and laboratory detection capacity for influenza and other emerging and re‑emerging respiratory viruses. This support also included strengthening genomic sequencing capacity.Nepal conducted a consultative workshop on the National Pandemic Preparedness and Response Plan (NPPRP) in July 2025. The workshop engaged key stakeholders from multiple sectors to review lessons from past pandemic responses, assess current mechanisms, and gather critical inputs for strengthening national preparedness. Key recommendations included revising the 2019 NPPRP and developing an updated Influenza Pandemic Preparedness Plan aligned with emerging risks, national priorities, and relevant international frameworks. Nepal also held a two day workshop dedicated to advancing the National Action Plan for Genomic Surveillance, aimed at reinforcing the country’s capacities for early detection and monitoring of emerging respiratory pathogens.Sri Lanka received the final report from WHO on the feasibility assessment for conducting an Influenza Burden of Disease (BoD) study in the country. The assessment, conducted from 28 April to 9 May 2025, included a desk review of existing data sources, document review, visits to sentinel surveillance sites, and key informant interviews. The study identified critical data sources required for a future BoD assessment, as well as their availability and quality. Officials from the Epidemiology Unit, the National Influenza Centre (NIC), and SARI/ILI sentinel hospitals across the country participated in the assessment.Timor Leste conducted on‑the‑job training and monitoring activities at two sentinel surveillance sites to strengthen surveillance and laboratory capacity for the detection of SARI, ILI, ARI, and other respiratory infections. REGIONAL OFFICE:SEARO conducted a Member States Consultation on the first draft of the Regional Roadmap and Strategic Action Framework for implementing WHO’s PRET‑based broad respiratory pathogen pandemic planning for 2026–2031. The consultation took place on 29–30 October 2025 during the final two days of the Regional PIP PC Annual Review and PRET Meeting in Colombo, Sri Lanka. Participants included representatives from Member States, WHO Country Offices, WHO SEARO, WHO Headquarters, partner agencies, and invited multidisciplinary technical experts. They reviewed the draft and provided detailed feedback, which has since been incorporated into a revised version. The consultation helped shape a shared regional vision for robust, PRET‑aligned pandemic preparedness, building on country‑level progress, addressing existing gaps and challenges, and aligning with global and regional health security frameworks. The publication is planned for release during the SEAR regional committee in 2026.SEARO documented the evolution of the National Influenza Pandemic Preparedness Planning process in the Region, tracing its development from its origins as a planning tool for responding to avian influenza outbreaks in 2006, through the experiences of the 2009 and 2019 pandemics, to the current status. The document outlines the way forward for respiratory pathogen pandemic planning across all 10 SEAR countries, aligning future national plans with WHO’s PRET Framework for broad respiratory pathogen pandemic preparedness.The Infectious Hazard Management (IHM) Unit has drafted the WHO South‑East Asia Regional Guidance on Influenza Prevention and Control, aligned with the Global Influenza Strategy and other regional initiatives. The draft is currently under review. Although this technical product was developed in response to a request from the Ministry of Public Health of the Democratic People’s Republic of Korea (MoPH‑DPRK), SEARO is finalizing it for use not only in DPRK but also across all Member States in the Region.The Immunization and Vaccine Development (IVD) Unit, in collaboration with WHE/SEARO, completed a regional landscape analysis on key barriers, challenges, and opportunities for the introduction of seasonal influenza vaccination in WHO South‑East Asia Regional (SEAR) countries.Additionally, the Immunization and Vaccine Development (IVD) Unit has completed a regional landscape analysis of influenza vaccine procurement systems across the WHO South‑East Asia Region (SEAR).KEY MEETINGS AND PUBLICATIONSMEETINGS:Six-month progress review of the implementation of the PIP-PC workplans in SEAR, focusing on Outputs 1 and 2 for the period January to June 2025, and held virtually across three sessions on 4, 8, and 10 July 2025. Read moreAnnual Regional Meeting (Hybrid) on Pandemic Influenza Preparedness (PIP) Partnership Contribution (PC) and WHO’s Preparedness and Resilience for Emerging Threats (PRET) Implementation in SEAR in Colombo, Sri Lanka, 27 to 30 October 2025. Read more18th Bi-regional Meeting (Virtual) of National Influenza Centres (NICs) and influenza surveillance in WHO South-East Asia and Western Pacific Regions from 9 to 11 September 2025. Read morePUBLICATIONSImplications of influenza A virus surveillance in Southeast Asian Region countries: a scoping review of approaches for the surveillance of swine influenza viruses at human-swine interfaces. Read moreAnnual South-East Asia regional meeting on operational planning for implementation of global influenza strategy and preparedness for respiratory viruses in 2025 Report on annual review meeting of implementation of pandemic influenza preparedness (PIP) partnership Contribution (PC) Fund in South-East Asia Region and the simulation exercise on PRET Status of influenza in who south-East Asia Region
Camden County resident diagnosed with active tuberculosis; health officials investigating
The Camden County Department of Health confirmed a resident has been diagnosed with active tuberculosis and is currently receiving treatment while officials conduct contact tracing.
Tracking global water circulation using atomic fingerprints
Scientists have developed a powerful new way to trace the journey of water across the planet by reading tiny atomic clues hidden inside it. Slightly heavier versions of hydrogen and oxygen, called isotopes, shift in predictable ways as water evaporates and moves through the atmosphere. By combining eight advanced climate models into a single ensemble, researchers created the most accurate large-scale simulation yet of how water circulates worldwide.
Scientists Found a Way to Track Water as It Moves Around the Planet
Scientists have found a powerful new way to follow water as it moves around the planet—by tracking subtle “fingerprints” hidden inside its atoms.
Classroom grants bring science to life for local students
Virtually tracing the blood vessels through the chambers of a sheep’s heart and following the path of air through the lungs allowed seventh graders at Berry Creek Middle School to move beyond just reading about...
The poison frog that fooled scientists for decades
Researchers discovered that a poison frog species described decades ago was based on a mix-up involving the wrong museum specimen. The frog tied to the official species name turned out to be brown, not the colorful animal shown in the original photo. After tracing old records and images, scientists corrected the error and reclassified the frog as part of an already-known species. The case underscores how vital museum collections are—and how even small mistakes can ripple through science for years.
AMD FSR 4 Redstone Review
AMD's FSR Redstone is finally here—and it's more than just another FSR update. With ML-powered frame generation that can match (and sometimes beat) DLSS, smarter ray tracing cleanup, and excellent driver-level support, Redstone turns FSR into a competitive performance solution.