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QLED, Mini LED or standard LED? Here are 5 43-inch TVs to compare before upgrading your home entertainment setup
New Delhi, Oct. 18 -- A 43-inch television can be a practical fit for a bedroom, a smaller living room or a home where a larger screen simply will not work. But screen size is only one part of the buying decision. A conventional LED panel, a QLED screen and a Mini LED display can deliver different…
Sutter Health hosts Breast Cancer Panel
SANTA BARBARA, Calif. (KEYT) Sutter Health hosted a breast cancer panel this week in honor of Breast Cancer Awareness Month. Sutter Health Greater Central
A week with no end of outrages
Colorado Inside Out panelist Jon Caldara rounds up a week of political controversies, election mishaps, education scandals and national outrages, arguing that public accountability remains in short supply across Colorado and beyond.
High school students pitch business ideas at 2nd annual Youth Shark Tank competition
High school students from New Hanover and Pender counties pitched original business ideas to a panel of judges Friday during the Genesis Block Foundation’s second annual Youth Entrepreneurship Shark Tank Competition at Cape Fear Community College’s Union Station Building.
Appeals Court Questions Justice Dept. Claim that Trump Owns White House Records
A three-judge panel appeared unconvinced by claims that a federal law requiring the president to preserve and hand over his presidential papers was unconstitutional.
Top global climate science body suspends meeting without deal on major review timeline
By Sudarshan Varadhan Oct 16 (Reuters) - A meeting of the members of the Intergovernmental Panel on Climate Change (IPCC) was suspended without an agreement on a timeline to publish its next review of
Top global climate science body suspends meeting without deal on major review timeline
By Sudarshan VaradhanA meeting of the members of the Intergovernmental Panel on Climate Change (IPCC) was suspended without an agreement on a timeline to publish its next review of the latest science on the warming planet, the IPCC said on Friday.The impasse over the timeline, which has lasted near…
Students explore careers from health care to skilled trades at Career Connect
Wood County Christian School swapped its traditional college and career fair for face-to-face conversations this year, launching a Career Connect panel that brought local professionals to the gymnasium Friday.
Building the Business Beat from the Ground Up
With the U.S. economy facing the most complex and fast-changing environment in recent history, the business beat has never been more vital in newsrooms tasked with distilling a constellation of forces for local communities. Costly tariff policies, labor crises tied to immigration enforcement, and breaks in the global supply chain are testing both local businesses...Read More
Small business supports "orphaned" solar panel owners with Claude
When solar panel installers go out of business, homeowners can be left "orphaned" with loan payments due and no clear path to repairs for their panels.
New White House Press Secretary denies misrepresenting her legal credentials
Building health outside the doctor’s office takes center stage at Aspen Ideas
At a “Health is Wealth” panel, experts from Tulsa and beyond discussed how childcare, transit and access to grocery stores are shaping community health.
New business association coming to Kettering
Leaders sat down for a panel discussion in front of dozens of businesses, where they talked about what the city is working to improve and the barriers they face.
Midterms Could Change the Politics of AI
If Republicans suffer heavy losses, it could push the party toward tougher AI legislation, panelists said
Rep. Terri Sewell hosts healthcare panel with former Speaker of the House Nancy Pelosi
Sewell talked about the role the Affordable Care Act has played in keeping health insurance affordable in Alabama.
Maternal Health Takes Center Stage at Xavier University
Expert panel addresses healthcare policy, advocacy
Idaho lawmakers tee up bill to reform prior authorization, and more health insurance issues
A panel of Idaho lawmakers that studied issues in the health insurance market formalized plans to draft legislation on a range of issues.
Lawyers for Federal Reserve's Lisa Cook say White House hearing set up by Trump is 'biased'
Federal Reserve governor Lisa Cook's lawyers say that a committee set up by the White House last week to investigate an accusation against her is “demonstrably biased," though they did not close the door on the possibility that she would appear before the panel.
YouTube is upending Hollywood — and Alphabet might be the best entertainment bet
The creator economy has turned the entertainment industry on its head this year, with YouTubers now directing box-office hits. Are entertainment giants like Disney (DIS) and Netflix (NFLX) still the stocks to buy? Gerber Kawasaki Wealth & Investment Management CEO Ross Gerber and his expert panel weigh in on the rise of creator-led projects taking hold in the film industry. Today's Market Hang panel consists of Yahoo Finance's Julie Hyman, Business Insider Today executive editor Dan DeFrancesco, Baird investment strategist Ross Mayfield, and SlateStone Wealth partner and chief market strategist Kenny Polcari.
Daldrop Opens for Business in Southern Oswego County
$10 Million Facility in the L. Michael Treadwell Oswego County Industrial Park marks the largest expansion outside of Germany in the company’s 73-year history By Stefan Yablonski [caption id=attachment_11076 align=alignright width=450] Daldrop SBB CEO Jens Daldrop addresses attendees at the 2025 groundbreaking for the project. Daldrop also chairs the advisory board of Germany-based Daldrop Group.[/caption] A new era of cleanroom technology is underway in Central New York. The Daldrop Group’s advanced manufacturing facility and U.S. headquarters is physically built within the L. Michael Treadwell Oswego County Industrial Park. This industrial park is located in the town of Schroeppel. It marks the largest expansion outside of Germany in the company’s 73-year history. Daldrop SBB is based in Neckartailfingen, Germany. It is a global supplier of cleanroom technology, primarily to the pharmaceutical industry. It designs and builds advanced cleanroom environments for the pharmaceutical, biotechnology and medical technology industries. It nvested $10 million in the new project. “We broke ground in 2025; we were under construction all winter. We just opened this spring, early spring,” said Benjamin Morrow, operations manager and control. The company consolidated sites in Salina and DeWitt into the industrial park in Schroeppel, Morrow added. “The next move here is to maximize every square inch of this facility and then we are already looking at the expansion. So, it is more capital investment on equipment — definitely higher-end automation in additional equipment so we can produce more components and then to support the ever-growing base in North America,” Morrow continued. “We are the headquarters for service, maintenance and spare parts. So as Daldrop has more and more installations, they need more and more service, maintenance and spare parts. So that will come out of this facility as well — it already is.” “As a global leader in GMP (global manufacturing support) pharmaceutical cleanrooms for decades, I am very proud to bring manufacturing jobs to Upstate New York,” said Mike Sullivan, president of Daldrop US operations. Key to choosing Southern Oswego County [caption id=attachment_11077 align=alignright width=450] Daldrop SBB at the L. Michael Treadwell Oswego County Industrial Park when the company announced the start of construction.[/caption] Sullivan said that the selection of the Schroeppel industrial park was mainly due to the help of Operation Oswego County and two people in the organization. “Prior to being purchased by Daldrop International from the Stuttgart region of Germany, Vince Bongio was a founding partner in SBB Inc. as well as our head of engineering. We based out of Syracuse due to Vince’s skills in HVAC and the manufacturing capabilities found in Syracuse,” said Sullivan. Bongio moved to Syracuse from California in the 1970s to work in Carrier’s Industrial Division of Large-Scale Petrochemical Refrigeration. Next, he advanced to General Electric’s TV Tube Plant where he got into cleanrooms ,leading to his role of head of engineering for Clestra Cleanrooms where he met Sullivan, their New England distributor. “Vince Bongio is a phenomenal engineer. Formerly of Carrier, he grew up in California and went to Cal Poly,” Sullivan explained. “Carrier hired him right out of college and he moved to Syracuse. He is the reason we are in Syracuse today. He is retiring this year. We are very proud and his legacy is having brought Daldrop to Syracuse.” In 2000, Sullivan, Bazinet, Bongio Inc (SBB) was formed with engineering and manufacturing, based in Syracuse, and sales and construction based in Massachusetts as it is today. “SBB Inc. started in Syracuse. I had a design–build contracting firm out of Massachusetts that was primarily doing all the new technologies coming out of MIT,” Sullivan said. “I started a manufacturing side. A big thing for cleanrooms is the HVAC. Most cleanroom suppliers are architecturally focused people. The strength in Syracuse is HVAC. So, SBB developed with me running sales and construction out of Massachusetts and manufacturing out of Syracuse.” “Daldrop wanted to have a relationship in the States and of those who approached us, they were the only ones who really understood HVAC. So, we were the right fit for them. We did a joint venture focused out of Massachusetts from 2012 to 2018 leveraging their technologies,” Sullivan explained. “The commitment was if we brought their product to the States, we would do that if they built it here. “The pieces that had to be in place to make the investment, they wanted to acquire us, we were great with that. If you looked at business recommendations the general guidance was to build in a low labor area — something like North Carolina — but Syracuse had a strong background in HVAC and we chose Syracuse and Oswego County to be our headquarters in the States. So, it is built off of history, technology and the existing supply chain — bringing jobs back to the area.” During the initial discussions with Daldrop about coming to the U.S., SBB agreed to sell under the conditions Daldrop would manufacture in the U.S. There are many areas that offer incentives and economic packages, but the strength of HVAC expertise and skilled manufacturing was a big part of the discussions for site selection. Coming home [caption id=attachment_11078 align=alignright width=451] Construction moves forward in March at the L. Michael Treadwell Oswego County Industrial Park.[/caption] The second key person to building in Oswego County is Ben Morrow, Sullivan added. “Ben has been working with Daldrop SBB for more than 12 years and has advanced to COO of manufacturing and engineering. Ben grew up in Phoenix, so building a factory for the Germany company in Phoenix is a strong success for both his community and the appreciation of Ben’s skills as a team leader,” Sullivan said. “I went to high school in Phoenix. So, this is like full circle for me. It’s a small world,” Morrow said. “I hadn’t been back to Phoenix since graduation. This is one of the properties that John Trimble of C&S, he is the former president of C&S, he just retired, suggested. He and I were very good personal friends. John was from Mexico and I was from Phoenix. We knew each other from high school. And the architect of this building, Ed Smart of smartDESIGN Architecture in Batavia — I went to high school with him. So, this was a project that’s full circle a coming home kind of thing. The three of us knew each other — kind of like it was meant to be. Very serendipitous.” Schroeppel was one option for Daldrop to consider; the original intent was just to get a warehouse to store some product, he added. The facility is Daldrop’s largest outside of their native country. Total payroll at the facility will be approximately $2.4 million once fully staffed. “Here is 32,000 square feet and we plan to expand and put in an additional 10,000 square feet,” Morrow said. “We have 17.5 acres. We can put at least three more facilities here, just on this property. The master plan submitted for the current building is the first of possible three buildings on the campus.” “If we can find the right people and advance the production according to the plan, we should be able to grow for the next decade. One of the first jobs we filled was our new HR manager, with a primary focus posting and filling new positions,” Sullivan said. Stop the exodus, start hiring [caption id=attachment_11080 align=alignright width=452] Principals at the local Daldrop SBB headquarters, from left: Ben Morrow, Mike Sullivan and Jens Daldrop.[/caption] “I have been coming to Syracuse for 30 years. One of the things I had a hard time watching was the exodus of factories. One of the toughest things is to watch it with my partners’ kids who had to move away for jobs. It is important for us to give opportunity where people’s kids don’t have to leave the area to get work,” Sullivan said. “My responsibility is to find people who have skill sets that want to work and then I have to build opportunity for that work to happen. “After years of watching companies and Vince’s three sons all move out of the areas to get jobs, it is important to us to provide opportunities for the Syracuse region and help grow our company. We have been hiring for our new factory and will continue for the next few years.” “We are hiring and will continue to hire. Currently we have about 19 on staff right now,” Morrow said. “We expect to grow that by about 10 to 15 in the next 12 to 18 months or so. We are at 19 currently — one in the wings. It’s been great being able to hire locally. All these folks that we’ve been hiring, they all live within a few miles from here.” “We hired someone this past week (end of August). She grew up in the area, raised a family and is working down in Florida. She just took a job with us so she can move back and be with her family. We will be moving her back and she should be starting in October. We are very happy to see this happen,” Sullivan said. “I feel strongly about having a spot for the kids to not have to move out of the area. It is better to have people moving into the area.” Currently, Daldrop SBB has openings for finance manager, COO of construction and delivery, as well as mechanical, electrical designers and Revit modelers, construction managers, commissioning agents and many other skills that are needed. Along with Daldrop’s reputation in life science cleanrooms, there is a strong history in semiconductor, electronics, glass, photonics, aerospace and other markets. This may be helpful with any new technologies building in the market such as the Micron expansion and the support network, Sullivan said. “We acquired this property and closed on it two months before any announcement from Micron. It is serendipitous that they’re right down the street from us,” Morrow added. “Everybody started thinking ‘you guys are supporting Micron.’ We were here first. That is not a goal of ours. We may or may not … they are talking to us; it is an opportunity.” The long run [caption id=attachment_11079 align=alignright width=450] Benjamin Morrow, operations manager and control at Daldlrop, speaks during a recent ribbon-cutting event in Schroeppel.[/caption] “Long term, we will expand the Phoenix facility,” Sullivan said. “We built our facility with a campus approach. Sustainability is big. We designed our rooms to be more sustainable. Our building has no gas lines for heat. We put geothermal wells in the ground. We put heat pumps in for heating and cooling out of those wells and we put a large layer of solar panels up on the roof. We worked with National Grid for metering. Our building is a high efficiency model. We upgraded all the instillation and the glass filtering. So, it is a very green building. We will have a very minimal carbon footprint. It also adheres to LEED (Leadership in Energy and Environmental Design) construction standards.” “We are a bunch of HVAC engineers. We did a large scale geothermal and spent the money up front because we knew it made sense in the business sense in the environmental sense and sustainability,” Morrow said. “We have insulated metal panels on walls and roof; we are an envelope from the exterior.” Daldrop, as a global player, has a strong culture of sustainability that is found in all its products including the new facility. The building has been designed with (sixteen) 400-foot deep geothermal wells, high efficiency construction methods, approximately 70 kilowatt solar photovoltaic panels, electric vehicle chargers and 26% recycled content. “Daldrop thinks of long-term investing,” Sullivan said. “On the roof, photovoltaic panels supplement our power. Over half the energy that I use is coming from the sun. We have chargers up front for employee electric vehicles. This place is built to last. This slab that we are walking on, normal buildings are four inches, some go to six inches, we are nine inches all the way through — except where the heavy equipment is — that is 10 to 12 inches thick, solid concrete. It allows us to reconfigure for whatever type of equipment we want to bring in,” Morrow said. “We are authorized by Underwriters Laboratory to self-certify so we don’t need to have an inspector come out and recertify. We get audited often, but we certify our own electronics. The control system in this building is rather high-end. Our thermostat in every room is zoned, independent. We analyze the data; incorporate it with our solar panels.” “There is a lot of competition for people to work. It’s not just about how much salary they are going to make — it’s about the work environment, the ability for stability. We want to make sure our employees have the best environment to work in,” Morrow added. Similarities “One of the reasons I believe why Daldrop chose this area, Phoenix in particular, is because it is a village, a river-based village. Neckartailfingen in Germany where Daldrop is based is also a river-based village, manufacturing community. So, there is a lot of similarities — that smalltown feel,” Morrow said. “We have a lot of connections through multiple employees that lead back to Carrier, also. Everything came together, the timing everything.” “We are thankful for all the economic development support. Everyone has been helping make this happen. So, keep it up, it is working, that is all I got to say, Sullivan said. “If you look at historical industrial manufacturing, this region has skills that have been un-utilized. The northern industrial region has a lot of skills that if we can tap before they go away, we can leverage them. That is what we are trying to do. You’d be surprised at the supply chain left behind from Carrier — that supply chain is still there.” “Operation Oswego County has been fantastic,” Morrow added. “I can’t say enough good things about that group.” What Is Cleanroom Technology Cleanroom technology is a system of specialized engineering, filtration and operational controls used to maintain an extremely low concentration of airborne particles, microbes and chemical vapors. How It Works • Air Filtration: Uses HEPA or ULPA filters to remove 99.97% of tiny particles down to 0.3 microns. • Airflow Control: Directs air in a steady, unidirectional (laminar) or filtered turbulent pattern to push dust away from work areas. • Environmental Regulation: Maintains precise control over temperature, humidity and positive air pressure to block outside air leaks. • Specialized Attire: Requires personnel to wear full-body garments (“bunny suits”), gloves and masks to stop human shedding
Kamala Harris’ political future in question amid report on husband’s concerns
A panel discusses a report claiming Kamala Harris’ husband privately expressed that he does not want her to run for president again and more on ‘Hannity.’
'HIT THE PERFECT NERVE': Metallica's Hetfield hammers political musicians
'The Big Money Show' panelists Lou Basenese and Michael Lee weigh in as Metallica frontman James Hetfield calls out performers who push political agendas on stage.
Women’s health at work shouldn’t have ‘one-size-fits-all’ approach, MD panelists say
The Daily Record hosted a webinar about the healthcare needs of women at every stage of life — and how workplaces and physicians can more comprehensively accommodate them.
Denny's CEO offers business advice, says to 'stay humble'
'The Big Money Show' panel discusses Denny's CEO Christopher Bode's advice on how to run a business but warns not to take on too much.
2026 Voter Insight Panel: Elections, Immigration, and Family
Central Floridians with different political views discuss the U.S. Senate race, democracy, immigration enforcement, and how they navigate political differences with family and friends.
Fire Remains Costliest Cause of Business Interruption Globally as Claim Severity Surges
Average business interruption claims now run 70% higher than property damage claims and continue rising sharply, Allianz Commercial found.
Understanding mental health through listening and sharing
The second day of the conference, “A Healing Presence: The Church’s Call to Mental Health Ministry,” reflects on the state of mental health among ...
5 Samsung Galaxy features you should be using after updating to One UI 9
Android 17 and One UI 9 have brought new features to Samsung phones. Users can get security alerts and custom Now Briefs, and the Quick Panel has new tricks.
Netflix Executive Says AI Has Touched 300 Titles as Director Claims Budget Savings of Up to 40%
Netflix says it has used AI on about 300 titles, while director Kang Yoon-sung told a Busan festival panel that AI workflows can cut film…
Michaelson shares take on Trump’s WH press secretary pick, a frequent guest on his panels
NYCC apologizes for ‘repeated disturbance’ during panel, actor slams fan for ‘disrespecting’ his castmates (exclusive)
“I will always step in to protect that space,” Rogers tells EW, while NYCC producer ReedPop says it’s “taking steps to ensure any future incidents are addressed in a swifter manner.”
Panelists: Entertainment and Conventions Drive Atlantic City’s Future
Jersey Shoreview focuses on successful summer, but challenges remain
Everything announced at Marvel TV's New York Comic Con panel
From "VisionQuest" to "Daredevil: Born Again" Season 3, here's what we learned and saw.
Activists, doctors clash over vaccine repeal proposal at Florida health panel hearing
Florida Department of Health wants to remove the immunization requirements for Hepatitis B, varicella (chicken pox), Haemophilus influenza type b (Hib) and pneumococcal conjugate to attend Florida schools. At a public meeting Thursday, parents rights activists and doctors clashed over the plan.
Panel debates effects increased fentanyl penalties will have on state
A University of Denver panel examined Proposition 132, the November ballot measure that would increase criminal penalties for fentanyl possession and distribution while sparking debate over treatment, prison costs and overdose prevention.
Some Hollywood stars retreat from political debate
'The Big Money Show' panel discusses the growing trend of Hollywood A-listers, including Glen Powell and Dwayne 'The Rock' Johnson, choosing to stay out of political discourse to avoid dividing audiences.
Bert Nash panel to discuss how food, finances and physical health affect wellness
Panelists will discuss how physical health, financial well-being and food security shape overall wellness at an upcoming event hosted by Bert Nash.
2026 Election Preview: Billionaires, AI, and Generational Change
A panel of top political reporters unpack the key races and issues shaping California’s 2026 election.
News and notes from Iowa Startup Week
Last week’s Iowa Startup Week event featured a packed four days of keynotes, panels, and networking opportunities, all aiming to spotlight and celebrate entrepreneurship in Iowa. The Business Record attended several sessions and gathered reactions from attendees. Here are snapshots of what we heard. Iowa is an ‘incredibly rich community’ to help startups Joseph Nelson, co-founder…
Jaya Aysola’s Remarks from UN Panel on Health Care for the Disabled
Speaking on a panel at the SDG Media Zone inside the United Nations headquarters in New York City, LDI Senior Fellow Jaya Aysola, MD, MPH, discussed the ways health care delivery practices currently…
Task force ditches Wyoming-run health insurance plan idea, mulls unorthodox service models
Legislature-assigned panel studying healthcare affordability in Wyoming examines several alternative pricing structures. The task force hopes to continue work next year.
Stephen A. Smith's take on Lane Johnson's retirement reason stuns ESPN panel
ESPN personality Stephen A. Smith drew criticism for the way he addressed Eagles lineman Lane Johnson's decision to retire to address his mental health.
‘A period of lawlessness’: Sports industry professionals gather to discuss mental health and the future of collegiate sports
Jim Steyer ’78 J.D. ’83 hosted the panel Monday evening as part of his speaker series.
Democrats eye political shift as key US Senate races take center stage ahead of midterms
A ‘Special Report’ panel discusses energy costs amid the war in Iran, Michigan Democratic U.S. Senate nominee Abdul El-Sayed’s campaign and key races ahead of the 2026 midterm elections.
Adam Gonzalez Participates in Binational Business Gathering
Adam Gonzalez, chief executive officer of the Council for South Texas Economic Progress, participated in the opening panel of Encuentro Internacional Empresarial 2026 on October 1, 2026. CANACINTRA and the Greater Brownsville Economic Development Corporation organized the gathering as part of a three-day program in Brownsville and Matamoros.
KFF Health Tracking Poll: Health Care Issues in the Lead-Up to the 2026 Midterm Election
Affordability worries continue to top the public’s list of midterm election issues, with health care and gas costs tying as the top economic concern, finds KFF’s new Health Tracking Poll conducted on the SSRS Opinion Panel. Overall, voters trust Democrats more than Republicans to handle health care costs and the cost of living. A quarter...
US appeals court weighs block on Kennedy's vaccine panel appointments
A lawyer for the Trump administration told a federal appeals court on Tuesday that a judge had improperly hamstrung an influential vaccine advisory panel by blocking Health Secretary Robert F. Kennedy Jr.'s handpicked appointees from serving on it.
Michael Douglas Corners Ana Navarro Over Her Politics on 'The View'
After fielding questions from the panel, the actor posed one of his own to the co-host.
Michael Douglas Corners Ana Navarro Over Her Politics on ‘The View’
After fielding questions from the panel, the actor posed one of his own to the co-host.
DeKalb hosts small business summit Oct. 14
Join the DeKalb County Chamber of Commerce Small Business Summit on Oct. 14 at the Emory Conference Center for expert panels.
Napo Pharmaceuticals, a Jaguar Health Family Company, Sponsoring Intestinal Failure Panel Discussion at Pediatric Gastroenterology Conference in Abu Dhabi
Participants in the panel discussion include Dr. Christos Tzivinikos, and Pravin Chaturvedi, PhD, Napo's and Jaguar's Chief Scientific Officer and Chair of the Scientific Advisory Board.
Political experts talk midterm issues, expectations at Catawba panel
SALISBURY — The midterm elections loom in the not-too-distant future, and questions on U.S. electoral systems are as pervasive as ever. The “What’s at Stake” panel at the Catawba College […]
City panel advances $260M settlement in wrongful-conviction cases tied to disgraced cop
The city's law department has turned to mass settlements to resolve cases sooner, resulting in significant savings if the lawsuits reach trial.
Reclaiming 'Health Sovereignty': EU Gastein Forum Confronts A Fragmenting Global Order
Health, long treated as a sanctuary of diplomatic consensus, has entered an era of high politics and ideological division. Leading the closing panel of the EU Health Forum Gastein (EHFG) on Friday (2 October), session chair Ilona Kickbusch, founder of the Global Health Centre at the Graduate Institute in Geneva, highlighted how recent votes at the UN General Assembly demonstrate that nation-states increasingly split and vote instead of searching for consensus.
ACO Expansion Might Change The Case For Investing In agilon health Stock (AGL)
In late September 2026, agilon health reported that The Jackson Clinic and Springfield Clinic would expand their partnerships by joining agilon’s Senior Health Connect ACOs. This extends value-based care support to roughly 30,000 additional Traditional Medicare beneficiaries on top of existing Medicare Advantage panels. The moves deepen agilon health’s integration with large multi-specialty groups, tying more senior lives into full-risk accountable care models that rely heavily on the...
House Health Panel Backs Kratom Sales Rules for Adults 21 and Older
A Pennsylvania House committee voted unanimously for a bill allowing registered retailers to sell natural kratom to adults 21 and older…
Resolution Copper project on track after Ninth Circuit decision
A federal appeals court has left in place a ruling allowing the land exchange tied to the Resolution Copper project to move forward, rejecting a request to reconsider the case. The Sept. 29 decision means the Ninth Circuit will not rehear the case after a three-judge panel earlier this year declined to block the exchange. […]
Pink light helps broccoli grow
Magenta solar panels offer a new way for farmers to harvest renewable energy along with their crops.
Finally: Rose-Tinted Solar Panels Could Let Crops And Electricity Share The Same Land
Could this be the future of solar farming?
Politics doesn't always 'reward what it should': Brian Brenberg
'The Big Money Show' panelists analyze economic data, GDP growth and President Donald Trump's manufacturing push in Texas.
The first early vote numbers are in—and there are reasons for Democrats to feel bullish
FDA puts aging on its regulatory science agenda
At ARDD 2026, senior FDA officials sketch how a therapy targeting aging might one day reach approval, revealing that longevity is a priority.
Elon Musk to return his attention to government, advise Pentagon on future of war
Musk will join Anduril founder Palmer Luckey and former House Speaker Newt Gingrich on a panel for what the Defense Department is calling Project Meridian.
Scientists, Regulators and Industry Convene at PCPC’s 2026 Science Symposium
This annual event offers two days of presentations from experts in their fields, coupled with insight from US regulatory bodies like the Food & Drug Administration (FDA) and the Environmental Protection Agency (EPA).
September Monthly Review: Health MCP Guy?
For all the time I spend talking about APIs and data exchange, this newsletter has had embarrassingly little interoperability of its own. It’s old-school SaaS, baby - UI or bust. Not all of that is my fault! Substack, for all its popularity, is (as mentioned before) really frustrating as my system of record. The primary user it optimizes towards is the reader, whose attention feeds the app, the Notes feed, and the recommendation network that Substack is actually selling. Health API Guy is a reader-supported publication. To receive new posts and support my work, consider becoming a free or paid subscriber. Subscribe They’re falling into the same trap that Medium once sprinted into, albeit at a much more glacial speed. Younger generations may not remember (or never knew) it, but Medium once lured publications like The Ringer and Signal v. Noise onto its platform, only to lose them as it rebuilt itself around a paywall and an algorithmic feed. Substack’s original pitch circa 2020 was the antidote (you own your list), but every new feed feature chips away at it. I get it: writers are generic supply in the eyes of the Substack product team. Generic supply follows demand, so the consistent pressure on the PMs is to generate demand, which leads to every product cycle going toward discovery (Notes, recommendations, the app, live video). The end result lackluster author tools (laggy and broken analytics are truly crippling) all despite the premium price point. The archive is where it crosses from authorial gripes to actual reader impact, though. Across Substack and LinkedIn, I’ve published 1,218 posts and nearly 900,000 words since 2018. Substack’s native search can see only the 464 posts that live on Substack, and even there it’s woefully inadequate at surfacing relevant content (even for the guy who wrote it)! Readers have the same problem, writ large. Ask the Archive Fixing search (for both my readers and my own use) turned out to be extremely non-trivial, unfortunately: There’s no public API for readers to access content RSS exists for new content notification, but it only carries the 20 most recent posts and cuts paid ones off at the preview The only Substack MCP is an admin tool for analytics The export exists for authors, but it’s painfully awkward and slow. So I built something to work around that: the Health API Guy MCP. It’s a private MCP server holding the full text of everything I’ve written across Substack and LinkedIn. Add it to Claude or ChatGPT as a connector and you can ask things like: It pairs keyword search (for acronyms and case names, of which we have many) with semantic search. Every post is also labeled by topic, form, and court case, so you can pull a lawsuit’s (or multiple cases’) entire docket across Substack and LinkedIn in one query: Hail, Healthapiguyhydra This is also a bit of me eating my own cooking. I’ve spent the year arguing that headless healthcare is arriving and that developers want primitives over abstractions. Last week in Hail, Benihydra, I watched Salesforce plug its platform into Claude and bet that the records underneath outlive whatever interface sits on top: Salesforce must believe that the Hydra’s immortal head is the records, permissions, and business logic (in that they will survive whatever happens to the interface). It felt a bit hypocritical to keep my own archive behind a Substack search bar. The archive is the body. Substack is one head, and now whatever tool you might use is another. Will the EHRs follow my lead? Probably not imminently, but one can hope! Why Founding Members Only The MCP is available to Founding Member subscribers. A few reasons: It costs money and time to run. Hosting, the database, Clerk usage and AI compute for search and labeling are significant operational costs (that increase with usage). Substack gives me no way to automate access. There’s no API to check whether someone is a paid subscriber, so every user is manual operations for now. It’s a beta. We’ll need to improve things and parts will break. I’d rather they break for a small group of dedicated readers who will tell me about it. The Founding tier deserved a real benefit. Until now it was mostly a generous tip. Now it comes with something. If you’re already a Founding Member, reply to this email with the address you’d like provisioned. If you’re not and want in, upgrade here. Larger teams (such as companies) can get access too: group subscriptions at the Founding tier come with the group discount. The admin for the subscription can reply with the list of addresses to provision. Get 20% off a group subscription Pricing Founding membership is now a flat $200 a year, replacing the old suggested $150 that readers could adjust. Existing Founding Members will have access grandfathered in at their previous rate. Month in Review Articles Published Make Networks Dumb Again (Sep 11): AI is making old analog networks cheaper to use and flooding them with machine traffic in the process. A plea for agent-native rails with the intelligence at the endpoints, and for Washington to drag them to ubiquity. Interoperability, Unbuttoned (Sep 29): Interoperability is a series of workflows in a trenchcoat, and this post finally takes the trenchcoat off. A color-coded map shows which provider workflows went digital, which are fragmented, and which still run on fax. Video Content Antitrust’s System of Record Problem (Sep 3): The FTC’s investigation into Epic prompted a ninety-minute webinar, now posted with chapters and a smoothed transcript. We get into why market definition, missing B2B share data, and the SSNIP test leave antitrust poorly suited to systems of record, plus why information blocking may be doing more than any pending lawsuit. The Information Exchange: Cerner Milking Edition (Sep 18): This was so fucking fun. Ryan Tucker, Ryan Brickner, Brad Thorson, and I try an Around the Horn format, complete with points, penalties, and a mute button. We debate whether Oracle Health is dead, who would actually buy Cerner (IBM enters the chat), p(Doom), and why the front desk still hands you a clipboard. Regulatory Ask Not What Your Network Can Do (Sep 23): CDC’s RFI on public health data intermediaries lists use cases already served, unevenly, by eCR, lab reporting, IZ Gateway, and syndromic surveillance. The real opportunity sits in one question about AI: a network that can handle the next emergency without another interface project. Court cases Particle v. Epic: The Naughty Schoolteacher (Sep 4): After a summer-long vigil, the answer on Epic’s early summary judgment bid is two paragraphs and a remedial assignment. Particle advances to the next grade, and market definition gets another year of discovery. The Epic Discovery Files (Sep 8): Texas’s motions to compel arrive with a 251-page appendix of requests, objections, and meet-and-confer letters with Cravath. Inside: Epic using generative AI for document review, denied interoperability requests in scope, and Noerr-Pennington raised against lobbying discovery. Epic v. Health Gorilla: “Working as Designed” (Sep 9): Epic wants nothing to do with the data breach MDL, and explaining why puts fresh discovery on the public docket. The spiciest allegation: Health Gorilla told GuardDog to scrub its law firm business from its website instead of cutting off access. Veeva v. Epic: Legal Bypass Surgery (Sep 15): Veeva asks the Wisconsin Supreme Court to skip the Court of Appeals, while law professors and three policy groups line up as amici. Meanwhile, Epic’s lawyers apologize for another round of citation errors, including a quote that never existed. Texas v. Epic: Behind the Black Bars (Sep 17): The court portal served up Epic’s unredacted filings, revealing a $5 million document review budget and the AI workflow behind it. Also inside: the 200-plus company names Texas wants searched, and one very expensive Zoom invitation. OpenEvidence v. Doximity: Consequences Will Follow (Sep 25): OpenEvidence tells the court it will not comply with a discovery order, and its own lawyers at Quinn Emanuel say they won’t defend the choice. Add years of Slack reported unrecoverable, and Rule 37 sanctions come into view. Health Tech Keeps Choosing Violence (Sep 28): Doximity moves to end OpenEvidence’s case, Epic asks Texas to show its work, and a sleepy Audacious Inquiry patent fight sprouts antitrust and information blocking counterclaims. The main event is a long-sealed Cognizant v. Infosys ruling that hints where system of record antitrust claims can survive. EHRs One Verb for Oracle Health (Sep 14): Oracle’s earnings call quantifies every data center to the decimal point, while Oracle Health gets a single verb: “accelerate.” Panning the few healthcare mentions turns up an agentic care management system, a research-to-care ledger play, and the question of whether healthcare gets Larry’s patience. Epic’s Forretress Under Siege (Sep 30): Judy Faulkner tells a panel Epic paused hundreds of projects to harden its software and calls it a “shame,” while a spokesperson insists the roadmap hasn’t changed. Project Glasswing, a Pokémon-branded QAN sprint, and a trove of Jodel grievances reconcile the two Epics and preview the Jevons paradox coming for all software. Industry Analysis Scanning for a Network (Sep 1): Scan.com raises $220M to build the imaging network labs never got, speedrunning Zocdoc’s consumer-to-B2B pivot. Its wedge to network density may be the most American one available: personal injury litigation. The Front Desk Wants the Damn Whole Building (Sep 16): Hello Patient buys Converse Health, pushing its AI front desk into referrals, chart work, and prior auth. The copilot categories keep blurring, and your distribution partner is still your final boss. Cross-industry Comparisons A Different Patchwork Quilt (Sep 10): Healthcare loves to envy open banking, but the US version has no mandate, a toll booth at Chase, and data quality problems of its own. The grass isn’t greener; it’s another American patchwork quilt, and perhaps a worse one. Hail, Benihydra (Sep 21): Salesforce brings its platform into Claude, Slack, and its own agent, inviting the interfaces that might replace it. Cut off one head and more grow back, so long as the records underneath stay put. Living on A Trade Secret Prayer (Sep 22): Six credit unions are suing Fiserv, the Epic of core banking, by claiming their own member records as trade secrets. Banking has no Cures Act, so its lawyers reach for legal alchemy that healthcare has already tried. Other News None this month External Media Nabla Accelerate NYC: I kicked off fall conference season at Nabla’s Accelerate event in New York, where Delphine Groll opened by asking the room to picture the company it wants to become and the one it doesn’t. I liked her framework of bureaucracy, fear, and ego as the blockers. I also love vendor conferences/events in general - different vibe than industry biggies. Healthcare 101 with Nikhil Krishnan: I briefly guest lectured Out-Of-Pocket’s Healthcare 101 class. Appreciated Nikhil’s takeaways cover whether AI doctors can query HIEs, why healthcare’s data-liberation rules beat most industries’, and the hi-res graphic is in the comments. HCN: Epic Probed by the FTC: I joined the HCN guys to talk through the FTC’s investigation into Epic. Cedric’s new hairdo was an unexpected plot twist. The episode also covers MFN drug pricing, healthcare M&A and Eli Lilly’s acquisition streak. Fall Conferences: At eHealth Exchange’s Annual Meeting in Austin on Oct 27, I’ll moderate a panel on the tensions between AI, HIEs, and timely patient access with Jean Ross (Primary Record), Therasa Bell (Kno2), Byron Crowe (Doctronic), and Michael Marchant (Freenome). Here’s the rest of my schedule if you want to meet up: CommonWell (Redwood Shores, CA): Oct 13-14 Will be participating in a fun Jeopardy event Open@Epic (Madison, WI): Oct 20-23 Will be enjoying Verona, Willy Street, and other local adventures eHealth Exchange and Sequoia Project (Austin, TX): Oct 27-29 Yeehaw HLTH (Vegas): Nov 15-18 Groundhog Day, Venetian Edition RSNA (Chicago): Nov 30-Dec 2 See me at “Governing AI in Breast Imaging: What Health Systems Are Actually Doing” Digital Health Counsel 2026 AI Summit (Seattle): December 2-3 Will likely be speaking to a bunch of lawyers about information blocking Posts I Liked ChatGPT’s Epic integration: game changer or nothing burger?: Joshua Liu, MD offers five thoughts on OpenAI’s Epic launch, starting from the point that it rides the same open APIs available to anyone. He argues read-only access leaves ordering to Art and the ambient startups, and asks why HCA is piloting it alongside Commure. He’s sorta a must-follow at this point - consistently excellent, thought-provoking takes. Epic, Lilly, and the Discovery pass: Seth Chaney reads Epic’s first major Discovery deal (with Eli Lilly), as well as its revised developer terms on commercial displays, as the pipe finally opening between EHRs and pharma. Life sciences and health continue to collide. Scott Rossignol on EHR payer platforms and ePA fees: Scott argues the top ambulatory EHR vendors are turning the prior auth mandate into a per-member-per-year toll on payers, for an API whose operating cost has nothing to do with covered lives. His fix is two lines of regulatory text: put the CRD/DTR/PAS certification criteria in the Base EHR definition, and bring payer-facing ePA connectivity under § 170.404’s cost-based fee rules. It’s a good solution. Health API Guy is a reader-supported publication. To receive new posts and support my work, consider becoming a free or paid subscriber. Subscribe
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Photo by GFBJAnother successful Power Breakfast is in the books. The Greater Fayetteville Business Journal hosted its third quarterly Power Breakfast of 2026 on Tuesday, Sept. 29. Local leaders and decision-makers gathered to network and learn from the panel about how established principles drive long-term stability while allowing for operational evolution. The panel featured Managing Partner of Luigi’s Italian Chophouse & Bar, Nate Ernst; Inside Sales at Hubbard Supplyhouse, Mary Grace Hurley; Chief Operations Officer for Copiers Plus, Drew Smith; and CEO of Holmes Security Systems, Stephen Wheeler. The panel was moderated by Lauren Willets, director of the Family Enterprise Center at UNC’s Kenan-Flagler Business School. Throughout the discussion, the panelists returned to a common idea: family businesses thrive when they preserve the relationships and values at their core while remaining open to change.Each panelist shared personal stories that carried practical lessons. Stephen Wheeler emphasized the role of relationships with customers and employees, saying, “What makes a family business successful today is relationships.” Mary Grace Hurley echoed Wheeler’s sentiment, describing relationships as a lasting inheritance, including a customer connection that began when she was young and continued into her working life. “If something’s given to you, that’s going to cost you too,” added Nate Ernst. He explained this philosophy by sharing that, in his view, earning responsibility builds credibility and confidence.Another hot topic was the idea of tradition versus change. For these businesses that have been around for a century or even more, it can be difficult to escape the “we’ve always done it this way” caveat, but these speakers emphasized how change has been an integral part of their growth and longevity. A family business can honor its history without being bound by it.“Innovation and tradition–they don’t have to be competing with one another,” shared Hurley. She pointed to changes in how businesses operate, including the adoption of computers and new management practices. Ernst stressed that adaptation is essential, while Wheeler described how his family’s electrical contracting business had evolved into a security-focused company. The details of the work may change, but identifying and upholding core values is key to embracing change while maintaining the character of a business. “I think it’s just important to remember why you started in the first place. What was your mission? What are your core values? And to reevaluate those,” shared Drew Smith.In addition to the first-hand accounts and wisdom shared by panelists, Moderator Lauren Willets recommended two novels during the panel for those seeking additional educational resources. Those two novels are “Hug of War: How to Lead a Family Business with both Love and Logic”by Cathy Carroll and “In the Company of Family: How to Thrive When Business Is Personal” by Melissa Mitchell-Blitch. Preparing the next generation requires more than handing over a title or company. Wheeler argued that future leaders need genuine passion and a vested interest in the business. The panelists were in agreement that succession is a process, and there is not one clear answer for how to perfectly prepare for it. Leaders must cultivate readiness, keep communication open and make room for the next generation to earn responsibility while being sure not to neglect the business in the here and now. “Today’s Power Breakfast was one of our best events yet! Between the passion and in-depth knowledge of the panelists, the great audience questions and the guidance and expertise of Mrs. Willets, the conversation was both engaging and informative,” shared GFBJ Publisher Faith Hatton. “A lot of small businesses in Fayetteville are family-owned and grown, and it’s great to be able to spotlight some of the businesses that have stood the test of time by strengthening the next generation of leadership and preparing them for ownership. I hope everyone received some inspiration and ideas that they can bring back to their own businesses and organizations!”We thank everyone who attended this Power Breakfast and hope you’ll all join us for the next Power Breakfast on Dec. 8. Details about the event will be shared on our social media and in future email updates. To learn about becoming a Power Breakfast sponsor, contact the Greater Fayetteville Business Journal at 910.240.9697 or marketing@bizfayetteville.com.
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Intel Panther Lake Teardown, 18A, BSPD, GAAFET, SemiAnalysis STEEL
Panther Lake debuts the first commercial implementation of backside power delivery (BSPDN), introduces Intel’s first iteration of gate-all-around (GAA) transistors, and showcases their advanced packaging capabilities with its Foveros-S assembly. With Panther Lake, Intel’s manufacturing arc has shifted from nebulous roadmaps to shipped silicon, a significant milestone on their long road back to competitive semiconductor manufacturing. To evaluate the extent of Intel’s comeback, we tore down Panther Lake. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Our teardown traces 18A from its four-sheet RibbonFETs (Intel’s marketing name for GAAFETs) and gate stacks through contacts, frontside and backside wiring, and the bonded carrier. We explain how these material and integration choices improve gate control and reduce resistance, while adding capacitance, thermal resistance, and process complexity. Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. However, 18A does not lead TSMC N3P, N2 or Samsung SF2 in peak density. Panther Lake’s CPU cores are incremental updates, and the high-end GPU still uses TSMC N3E. Panther Lake assembles one compute tile, one GPU tile, and one I/O tile atop a passive base tile using Intel’s Foveros-S advanced packaging. Both compute tile variants use Intel 18A. The Xe3 GPU options are a 4-core GT1 tile on Intel 3 and a larger 12-core GT2 tile on TSMC N3E. Both I/O tile variants use TSMC N6. [1], [2] Our analysis centers on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery (BSPD) moves the main power network behind the transistor layer, to the backside, separating it from frontside signal routing. We covered BSPD and its impacts in 2024. [3], [4], [5] Intel’s BSPD implementation, branded as “PowerVia”, routes power through dedicated backside metals to nano-TSVs, which connect those rails to local source/drain (S/D) contacts. Implementing that separation requires Intel to build the interconnect stacks from both sides of the wafer. The frontside comprises the M0-M14 signal stack, while the backside comprises the BM0-BM5 power stack. M0 and BM0 are closest to the transistors. The nano-TSVs connect the two sides, but Intel patterns and etches each via from the front after forming the contacts. A narrow via runs from the side of the contact deep into the silicon substrate. Intel then completes the frontside signal metal stack, bonds the wafer to a carrier, flips it and removes the original substrate until the buried via tips are exposed. The backside metal stack is then deposited directly on the revealed vias. The nano-TSV and backside-via profiles taper in opposite directions because Intel forms them from opposite sides of the wafer. The transistor structures form the FEOL. Local contacts and nano-TSVs connect them to the wiring. M0 begins the frontside interconnect stack. The silicon carrier remains attached above the frontside interconnects. It supports the device wafer during substrate removal and backside processing and remains part of the finished chip’s thermal path. PowerVia removes the main power distribution from the congested frontside metals, routing supply through shorter and wider backside wires. Its lateral landing still occupies area in the standard cell, so it recovers less cell area than a direct backside contact. [3] Nano-TSVs beside the logic devices carry VDD or VSS from the backside power network, while signal connections continue upward through the frontside metals. Backside Interconnects Samsung SF2 data is included for comparison to Panther Lake’s within this article. SF2 is the incumbent GAA foundry node but lacks BSPD, serving as a useful reference to evaluate 18A. A full teardown of Samsung’s S26 products, processed on SF2, will be shared soon.Nanosheet-cut EDS comparison. The PowerVia supply path runs from the backside Cu rails through Mo-lined W nano-TSVs to the local transistor contacts. In this cross section, the tapered connection spans roughly 150 nm from the contact level to BM0. The Ta liner confines Cu and promotes adhesion to the surrounding stack; the AlOₓ etch stop controls the next dielectric etch above the rail. Dielectric beneath the ribbons electrically separates the devices from the backside wiring and removes the conducting silicon body below the channel. [6] AlOₓ serves as an etchstop (ES), enabling endpointing and protecting the underlying layers. Low-volatility aluminum fluoride reaction products resist the fluorinated plasma, allowing a thin AlOₓ film to protect the metal while the surrounding low-k dielectric is removed. [6], [7]. While the BM0 and layers above the M1 lines show double AlOx layers, Our SMIC N+3 teardown showed single AlOₓ layers. SMIC uses a simpler local AlOₓ substack, while the remaining cap and etch sequence provide the required landing protection. So why double layers? The closely spaced AlOₓ doublets provide two protected endpoints in the etch sequence. Intel documents an AlOₓ/SiN/AlOₓ stack that explains the benefit. The main dielectric plasma etch stops on the first AlOₓ film; a selective wet clear opens that film; a second plasma etch removes the intermediate SiN and stops on the second AlOₓ film. The final wet clear exposes the metal landing surface. SiN is the intermediate dielectric in Intel’s published example. [8] The second stop protects the metal through a cap breakthrough. Wide openings can etch faster than narrow ones, and etch depth varies across the wafer. Metal under an early-clearing opening would otherwise be exposed while other openings still need more etching. Staged protection widens the process window and reduces metal erosion, corrosion and void formation. [8] TSMC documents AlN/AlOₓ/SiOC/AlOₓ above Cu, with AlN blocking Cu diffusion, and a simpler AlN/SiOC/AlOₓ variant that omits one AlOx film. [9] Levels with different opening sizes, aspect ratios, pattern densities and cap materials need different etch margins. A double AlOx stop is useful where another protected endpoint justifies the added processing. The extra film adds formation, selective opening and cleaning steps, plus another set of interfaces to control adhesion, moisture, and stress. These blanket films are opened through the existing via pattern, so each film does not require another lithography mask. AlOₓ adds parasitic capacitance when it replaces lower-k dielectric; two thin AlOₓ films can nevertheless contain less AlOₓ than one thick film. Total thickness, placement, and theintermediate dielectric determine the electrical cost. Deposition chemistry also changes AlOx permittivity and residual hydroxyl content, which can oxidize the underlying metal. [7], [8], [10], [11] The backside stack separates into relatively fine BM0-BM2 wiring near the devices and coarser BM3-BM5 power distribution. The largest pitch increase occurs between BM2 and BM3. BM0’s pitch closely matches the logic-row height, fitting local power delivery to the cell rows. Higher levels aggregate current through larger conductors: routing density becomes less important than low resistance and current capacity as the network approaches the package. This hierarchy provides wide power wiring for the power delivery network without consuming scarce frontside signal-routing resources. [3] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Frontside Interconnects Intel 18A combines Mo-lined W contacts and nano-TSVs with a separate backside Cu power network. Samsung SF2 keeps power on the frontside, using Ti-based contact interfaces and Ta-based barriers and Co liners around Cu wiring. In 18A standard-cell rows, backside power rails supply the devices through nano-TSVs within the cells, freeing frontside routing resources. Samsung’s M0 accommodates both power and signal connections. From the device toward M0, the connection runs through a Ti-based S/D interface, W contact fill, a Mo-lined W via, and the Cu M0 wire. Mo supplies a conductive nucleation and adhesion layer for W, replacing the resistive TiN liner used in conventional W integration. This increases the effective conduction volume within the feature while retaining W fill and its established polishing, cleaning and etching processes. Intel’s Mo/W patent describes this integration tradeoff. The nano-TSV uses the same Mo-lined W construction in the backside supply path. [12] The move from TiN to Mo is an incremental change. While a full Co or Mo fill can also reduce the volume lost to liners in very small features, it requires new integration schemes that increase complexity and risk. Cu remains attractive for wider wires due to its low resistance. As wires and vias shrink, the diffusion barrier consumes an increasing fraction of their cross-section. [12], [12], [14] Intel uses Co/Ru liners at M0-M1, Co at M2-M4, and Nb at M5-M9. The lower-level liners help Cu adhere and reduce void formation during trench fills. Applied Materials’ Endura has new thermal control that facilitate wetting process, so the thin film continuity is good enough that good capillary pressure will drive Cu atoms to the via bottom without voiding. Intel’s choice to use Nb is particularly interesting. Intel’s Nb patent describes a conductive diffusion barrier intended to reduce the barrier’s contribution to resistance relative to conventional Ta-based barriers, particularly at via bottoms where all current crosses the barrier. The patent pairs Nb in coarser levels with the option of lower-cost PVD processing. [15], [16] The upper metal layers support thicker barriers formed through physical vapor deposition (PVD) despite its worse coverage and uniformity. Meanwhile, the lower metal layers require thinner barriers deposited through conformal atomic layer deposition (ALD). Co/Ru adds another material interface and requires controlled deposition and Cu fill. Changing liners and barriers by metal layer allows Intel to optimize interconnect resistance, process complexity, and reliability. [15, 16] RibbonFET, Intel’s name for its gate-all-around FETs (GAAFETs), replaces the FinFET’s vertical fins with four stacked horizontal silicon nanosheets, allowing the gate to surround the channel on every side. The path to GAAFET begins with the planar transistor. A planar MOSFET places the gate above the channel between its source and drain. Pairing an NMOS with a PMOS transistor creates a CMOS inverter, in which the NMOS pulls the output low for a high input, and the PMOS pulls it high for a low input. The gate must retain electrostatic control of the channel to ensure clean switching. As gate lengths shrank, the drain began to compete with the gate for that control, increasing off-state leakage. Electrostatic control was restored through an architectural evolution that raised the channel into a vertical fin and wrapping the gate around three sides. Called “FinFET”, this new architecture packed more effective channel width into a smaller footprint. Further scaling made it harder to maintain both drive current and leakage within smaller cells, and reintroduced the same problems planar MOSFETs faced. Nanosheet GAAFETs close the fourth side by replacing the vertical fin with a stack of horizontal nanosheets, each surrounded by the gate. The tighter electrostatic control suppresses leakage at shorter gate lengths while stacking adds effective channel width within the cell footprint. In a FinFET process, channel width changes in discrete steps as designers must add or remove whole fins. Nanosheet width can instead be adjusted continuously within the process’s design rules. Wider sheets increase drive current, while narrower sheets reduce capacitance at the cost of drive current. Intel 18A uses stacks of four nanosheets each and varies their widths across logic and SRAM. At the process level, adding more sheets to each stack increases effective channel width and drive current, but complicates fabrication. RibbonFET vs MBCFET Samsung began GAAFET production in 2022 with SF3E, following with SF3 and now SF2. Its ‘MBCFET’ provides a useful structural comparison with Intel’s first RibbonFET implementation. [17] STEEL is digging deeper into SF2, used in the Exynos 2600, and TSMC’s GAAFET N2, used in Apple’s A20 Pro, in upcoming newsletter articles. We’re throwing some teasers on X. Let’s compare Samsung SF2’s MBCFET with Intel 18A’s RibbonFET. Subscribe Even to the untrained eye, Intel’s extra nanosheet is obvious. Intel stacks four ribbons to Samsung’s three. Samsung’s sheets are much wider in these fields, so both sheet count and width matter to the available channel perimeter. Sheet width also changes which silicon surfaces carry current. On conventional (001) silicon, wide nanosheets emphasize the broad top and bottom surfaces, favoring electron transport; the larger sidewall contribution in a narrow sheet favors hole transport. Thinner sheets improve gate control but increase confinement and scattering. This makes width and thickness part of the NMOS/PMOS balance, alongside strain and threshold voltage. [18], [19] GAAFET designs like 18A use different work-function-metal (WFM) stacks for NMOS and PMOS. Around each ribbon, a thin SiOx interfacial layer separates the silicon channel from the HfOx high-k dielectric, with La providing dipole tuning and the WFM wrapping the dielectric. NMOS uses a TiAl-based stack, while PMOS uses TiN WFM. W fills the remaining gate trench, providing a lower-resistivity path where the work-function layers are no longer needed. In this field, the PMOS stacks leave room for W between ribbons, while the NMOS stacks occupy more of those gaps. A silicon-based dielectric marks the P/N boundary, allowing the PMOS and NMOS gates, sharing the same gate trench, to be processed sequentially. Fast logic paths, retention circuits, and SRAM need a family of threshold options. Changing threshold without substantially changing device dimensions, capacitance or fabrication complexity is valuable. FinFET processes typically use different work-function-metal stacks. In a four-ribbon GAA stack, the narrow sheet-to-sheet gap limits how much WFM can fit around each channel. La in the gate dielectric creates interfacial dipoles at the SiOx/HfOx boundary, shifting effective work function and tuning threshold voltage. This gives Intel another control alongside its NMOS and PMOS WFM stacks. Low-threshold devices improve critical-path drive; higher thresholds reduce leakage elsewhere. Dipole tuning is especially useful in GAA because it changes threshold without consuming the narrow intersheet gap with thicker WFM. Precise control of La incorporation, diffusion and interface quality has long been a challenge, limiting viability in high volume production but is now seen from every leading-edge foundry. Intel’s patent describes depositing a dipole-forming oxide above HfOx and annealing it toward the interfacial oxide before completing the work-function and fill metals. This separates threshold tuning from the space available for metal. Newer research addresses the thermal cost: imec’s 2026 dipole-middle research inserts the shifter between two HfOx depositions, shortening the diffusion path while protecting SiOx during patterning. [20], [21]Matched-cut EDS, Intel 18A (left) vs. Samsung SF2 (right). Intel retains raised source/drain epi beneath its contacts, while Samsung recesses W deep into the epi to form a V-shaped Ti-lined interface. The deeper contact increases metal-to-semiconductor area and shortens the current path from the lower sheets, reducing contact and spreading resistance. It also removes epi volume and brings the contact etch closer to the channel ends. Retaining more epi preserves the material available for strain transfer, especially from SiGe into PMOS. These geometries balance contact access against stress engineering and etch margin. [22], [23] Samsung stacks three sheets to Intel’s four ribbons, and both processes use sheet width to tune drive strength. In our Samsung cross-sections, widths range roughly from 19 to 30 nm in the NPU rows and 37 to 50 nm in the CU cell. The Samsung nanosheets taper, with the widest sheet at the bottom and the narrowest at the top. Both processes use HfOx gate dielectric and Ti-based work-function stacks, with Al in the NMOS stack. In the Samsung devices shown here, the dielectric and WFM occupy the intersheet gaps, leaving W above the top sheet. Intel’s PMOS stack leaves more room between ribbons, and W fills those gaps while the thicker NMOS stack leaves W mainly in the upper trench. Gate-stack EDS maps. The W between Intel’s PMOS ribbons provides a conductive path close to the lower gates. Where WFM fills the entire gap, the gate still surrounds the channel, but voltage reaches it through the more resistive work-function films. Thinner WFM and dipole tuning preserve room for low-resistivity fill; Mo and Ru are alternative fill metals being developed for further scaling. [24] A masked, sequential WFM flow explains the different gate heights and inter-nanosheet fill. The proposed sequence below shows how separate NMOS and PMOS work-function steps produce that geometry. Enabled by the BSPDN process, Intel replaces the dense-logic silicon subfin with dielectric, removing the parasitic conduction path below the ribbons and reducing substrate-related capacitance. A retained silicon body as in classical, non-SOI, planar and FinFET designs needs junction and punchthrough-stop engineering to suppress leakage. Dielectric isolation makes that leakage less sensitive to the subfin doping profile but adds removal and fill steps. It also weakens the direct thermal path through silicon, making the contacts, metal stacks and package more important for heat extraction. [24], [26] Fluorine is concentrated around selected Intel device structures in the maps. WF6 is a standard precursor for W nucleation and fill, while barrier films protect adjacent dielectrics from fluorine attack. Low-fluorine W processes reduce the residual-F burden. Chloride-based precursors avoid introducing F during W deposition, but require control of chlorine attack, nucleation and fill quality. The integration target is a continuous, low-resistance W path with a thin protective liner and minimal chemical damage to the surrounding stack. [20], [27], [28] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. We measured cell height, gate pitch, metal geometry, and ribbon dimensions at the XTEM sites shown below. The tables group these dimensions by site and device polarity. Our “sheet cuts” cross the silicon channel and show the ribbons end-on. “gate cuts” run along the channel through successive gates. The 18A logic cell dimensions point to a five-track logic library while the N3E and Intel 3 cell dimensions evidence a seven-track logic library. The DDR-PHY uses wider M0 wires and much larger spacing than core logic. That trades routing density for lower wire resistance and weaker coupling between neighboring nets. The geometry suits the current delivery and coupling requirements of analog, clock, and I/O circuitry. PowerVia lets 18A combine a compact cell height with wider M0 geometry by moving the main power rails off the signal-routing tracks. That relaxes local wire scaling while preserving a small cell footprint. Cell height and gate pitch set the geometric density; pin access and routability determine how much of it a real block can use. [29] The biggest takeaway from our gate-pitch measurements is that Intel 18A compute logic and TSMC N3E GPU logic have similar density in the Bohr representative-cell model. The 18A example is 18.6% denser than the Intel 3 GPU example. Gate pitches are nearly identical across the three sites, so cell height drives most of the difference. The Bohr model combines a four-transistor NAND2 spanning three gate pitches and a 32-transistor scan flip-flop (SFF) spanning nineteen pitches, weighting their densities 60:40. The sensitivity column shows how independently changing cell height and gate pitch by ±1 nm changes the result. This compares representative cell geometries; whole-die density also depends on cell mix and placement. The 18A P-core gives M0 substantially more metal cross section than the N3E vector engine. Treating each profile as a trapezoid gives 2.63 times the area per line and 1.84 times the area after normalization by routing pitch. The larger section reduces the geometric contribution to line resistance and lowers current density for a given current. Taller and wider wires also add capacitance, so circuit delay depends on the balance of resistance and capacitance. The DDR-PHY has less metal area per routing width than the 18A core fields, while remaining above N3E. [30] Area = height × (top CD + bottom CD) / 2, including liners. Area/pitch normalizes by routing width. Taper is the symmetric sidewall angle from vertical, with the largest angle belonging to the DDR-PHY. Compute tile The measurements show how ribbon dimensions and gate-stack geometry vary across the compute tile and between NMOS and PMOS to balance channel drive, gate load and the space needed for the dielectric/WFM stack across logic, SRAM and the DDR-PHY. Width mainly changes available channel perimeter; thickness also changes electrostatic control and carrier confinement. Gate-stack thickness then determines the space left for low-resistivity fill P-core and LP E-core logic Both the P-core and LP E-core use multiple nanosheet widths. Widths are measured on high-magnification XTEMs while wider-field images demonstrate additional width choices within the LP E-core. Multiple widths are expected even within an LP E-core. Timing-critical paths, buffers and cells with different fanout need different drive strengths. The lower-magnification fields show this width diversity beyond the sites quantified in the table. L2 and L3 SRAM GAA gives SRAM designers another way to balance the pull-up (PU), pass-gate (PG), and pull-down (PD) transistors. FinFET bitcells set device strength through fin count while GAA adds nanosheet width as a sizing knob. In a 6T SRAM cell, a strong pull-down relative to the pass-gate limits read disturbance, while a strong pass-gate relative to the pull-up improves writability. During a write, the pass-gate and write driver pull the node storing “1” below the inverter trip point. During a read, the pull-down holds the node storing “0” low. Bias, threshold voltage, mismatch and assist circuitry set the remaining margin. FinFET high-current cells commonly use a PU:PG:PD fin-count pattern of 1:2:2, a device-sizing ratio rather than a current ratio. Ribbon width lets Intel balance SRAM strengths without adding whole fins. The L2 cell uses its narrowest ribbons for PU and widest for PD, improving writability and read stability respectively. Intel’s disclosed HCC operates without assist; its denser HDC uses negative-bitline write assist. Pulling the selected bitline briefly below ground increases pass-gate overdrive so it can overpower the pull-up at lower supply voltage. That buys density and low voltage writability at the cost of boosting circuitry, switching energy, and additional voltage stress that must be controlled. [31], [32] Four rectangular ribbons give the perimeter = 8 × (width + thickness), before corner rounding. PG/PU is 1.49 and PD/PG is 1.16. The L3 structures closely resemble L2 in layout and cell height. Fewer L3 nanosheet widths are tabulated because fewer high-magnification images were available. DDR PHY The DDR-PHY trades density for controlled analog behavior and reliable off-chip signaling. It contains drivers, receivers, delay circuits, and calibration logic that set drive strength, sampling time, and voltage margin. Repeated four-sheet devices with similar widths fit the use of regular transistor units for matching and programmable drive. Its wider local wiring provides room for current delivery and separation of sensitive signals, while consuming more area than a dense core-logic grid. The layout serves the memory channel’s electrical requirements as well as digital logic density. [33] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Intel 3 GPU devices Vector engine logic Intel 3’s XVE logic uses two-fin PMOS and NMOS devices with power rails in M0. Its cell height and M0 pitch give a seven-track geometry, two tracks more than the 18A logic. One-fin groups also appear among the two-fin devices. Intel 3 L2 SRAM The Intel 3 L2 SRAM uses the familiar HCC sizing pattern: one PU fin, two PG fins, and two PD fins. N3E GPU devices Vector engine logic The N3E XVE field contains repeated two-fin devices with seven-track cell geometry. N3E remains a FinFET process, giving Panther Lake a direct FinFET-to-RibbonFET comparison. N3E L2 SRAM The N3E L2 SRAM uses the same PU:PG:PD fin-count pattern of 1:2:2. Panther Lake-U follows Lunar Lake’s floorplan quite closely. Both pair 4 P-cores with 4 LP E-cores and NPU, media and display engines in similar locations. Lunar Lake also uses Xe2, the direct predecessor to Panther Lake’s Xe3 GPU. This makes Lunar Lake the most direct basis for our comparisons. Arrow Lake differs in core count and uses the older Xe-LPG GPU architecture, so we only use it where it offers a more direct component-level comparison. Compute tile Panther Lake compute-tile floorplans remain sparse even months after launch. Intel 18A’s backside metal and dielectric stack must be removed without damaging the underlying structures before a clean transistor-level floorplan can be imaged. Most published die shots hide or heavily process the background, but we are quite proud of the die shot we achieved and are excited to show the work we have done. We measured the areas of the key components on the compute tile and compared them with their Lunar Lake predecessors on TSMC N3B. These help us to capture changes in block area and compare the two chips across process nodes and designs. Our total tile areas exclude the scribe-line area. The compute-plus-GPU subtotal below uses the PTL-U compute tile and GT1 GPU; it excludes the I/O tile and passive base. Individual block areas use the boundaries marked on the floorplans The compute-plus-GPU row is recomputed from the displayed PTL-U and GT1 areas. Component rows use their stated per-region counts and are not an additive partition of the whole tile. The P-core area remains almost unchanged between Lunar Lake and Panther Lake, despite L2 capacity increasing from 2.5 MiB to 3 MiB. Arrow Lake uses the same Lion Cove core as Lunar Lake but also has a 3 MiB L2. Cougar Cove fits 20% more L2 into the same P-core area. The larger private cache keeps more of each core’s working set close to its execution units, reducing access to shared L3 and DRAM. Extra capacity adds storage leakage and lookup energy, so designers balance it against avoided lower-level accesses. The shared P-core L3 cache also shrank by 14.8%. [2] Cougar Cove combines a similar footprint with Intel’s reported power-efficiency improvements. RibbonFET’s tighter channel control reduces leakage, while PowerVia reduces supply droop and allows tighter voltage guardbands. [1] Darkmont’s four-core LP E-core cluster is 5.0% smaller than Skymont’s on Lunar Lake, with most of the reduction in its L2 regions. The 1 MiB region shrank by 8.4% and the 1.5 MiB region by 14.9%. The tag arrays also use one fewer visible row. Tags identify which memory addresses the data array holds, so rearranging them changes the cache’s layout and wiring without requiring less data capacity. [2] The LP E-cores share one L2. This pools capacity and avoids duplicating all the cache machinery, but the four cores contend for its banks and bandwidth. Their separate cluster also keeps light work away from the performance cluster and its L3, allowing that larger domain to sleep. [1], [2] Cache area includes more than the storage cells. Tags identify each line, decoders select rows, sense amplifiers read the small bitline signal, and wires connect to the banks. Splitting an array into smaller sections shortens wordlines and bitlines, improving access speed, but duplicates peripheral circuits. Panther Lake’s smaller cache regions therefore reflect the complete memory implementation, including how much of each region is devoted to storage. [34] Unlike Meteor Lake and Arrow Lake, Panther Lake has no separate SoC tile. The NPU, LP E-cores, memory controllers, PHYs, media and display engines now share the compute tile. This removes an active die and keeps CPU memory traffic on one die. The cost is moving PHY and I/O-related circuitry onto 18A: drivers, receivers and analog circuits must still meet external voltage, loading and signal-integrity requirements, so their area does not shrink like dense digital logic. [1], [2] The biggest shrink comes from the NPU, which occupies 36.9% less area. NPU 5 consolidates the same total INT8 MAC count into half as many neural compute engines. Each of the three NCEs has a larger MAC array to make the complete NCE envelope 22.6% larger than an NPU 4 engine. Consolidation also halves the number of scratchpads and SHAVE DSPs, from 12 to 6. The MAC array handles matrix multiplication and convolution, while SHAVE executes vector and custom operations that fit the array poorly. [1], [2], [35] The paired floorplans identify each NCE envelope and its scratchpad, MAC, and SHAVE regions. Each measured MAC polygon is counted once per NCE in the area accounting below. The scratchpads store weights, activations, and intermediate results near the MAC arrays, allowing repeated use without fetching them again from DRAM. Halving their number delivers the largest measured area saving but leaves less local storage for the same total MAC count. Layers that no longer fit locally require smaller working tiles or more transfers of intermediate data. The benefit depends on keeping the enlarged arrays busy while managing that tighter storage budget. [36] NPU 5 also adds native FP8. Using half the operand width of FP16 reduces storage and transfer demand, helping workloads fit the smaller local memory budget. Lower precision and format-dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile with 4 Xe3 cores on Intel 3 and a larger GT2 tile with 12 Xe3 cores on TSMC N3E. Panther Lake allows us to compare the same GPU architecture across both Intel 3 and TSMC N3E. Wildcat Lake adds a third Xe3 implementation on Intel 18A. A future newsletter will detail Xe3 and its implementation differences across all three process nodes. GT2 scales Xe3 to a different physical layout, with render slices arranged vertically instead of GT1’s horizontal arrangement. Slice placement sets the distances to shared cache banks and the D2D interface. Those wires consume area and add delay, so scaling the number of Xe cores also requires a new balance of cache placement, routing and timing. [1] What’s immediately obvious is that the GT2 tile on TSMC N3E has much smaller Xe cores than GT1. These block areas include logic, caches, and routing. An Xe core on the GT1 tile is ~69% larger than one on Lunar Lake, and ~55% larger than one on GT2. Intel 3 therefore uses substantially more area per Xe core. The block-area gap exceeds the measured logic and SRAM density gaps, bringing routing, timing targets, cell mix, and floorplan allocation into the comparison. The measured vector/matrix engine region is almost unchanged between Lunar Lake and Panther Lake’s GT2 tile. Xe3 retains eight 512-bit vector engines and eight 2048-bit XMX engines per core. Its gains also come from feeding those engines more effectively: more resident threads hide stalls, and variable register allocation lets shaders trade registers per thread against the number of threads kept active. [1] The shared L1/SLM capacity increased by 33% from 192 KiB to 256 KiB, while its area increased only 5%, raising effective density by 27%. L1 retains reused cache lines, while software-managed SLM lets a thread group share data locally. Both reduce traffic to more distant memory. Allocating more SLM per group can also limit how many groups reside on a core at once. [1], [37] The GT1 tile carries 4 MiB of L2 against 16 MiB on the GT2 tile. GT1 divides its L2 cache into four 1 MiB banks, while GT2 uses eight 2 MiB banks. Each bank contains 128 macros, but each N3E macro stores 16 KiB, twice the Intel 3 macro’s 8 KiB capacity. The N3E macro is only 54% larger while holding twice as many bits, giving it 30% higher density: ~23.7 Mbit/mm² versus 18.3 Mbit/mm². Including bank-level circuitry, the gap widens to ~16.9 Mbit/mm² on GT2 versus ~10.4 Mbit/mm² on GT1. GT2 gains density with its macros storing more bits per unit area, and those macros occupy more of each cache bank. Larger macros spread decoder and sense-amplifier overhead across more storage, while a more compact bank layout reduces the share spent on control and routing. The compromise is longer wordlines and bitlines that carry more capacitance. [34] I/O tile Panther Lake uses two I/O tile variants, both fabricated on TSMC N6. The smaller one provides 4 PCIe 5.0 and 8 PCIe 4.0 lanes and serves lower-tier systems as well as those without a discrete GPU, while the larger one adds 8 PCIe 5.0 lanes, bringing the total to 20 lanes, for discrete-GPU connectivity. Panther Lake SKUs with the larger 10- or 12-Xe GPUs use the smaller I/O tile. [38] The smaller I/O tile adds a PCIe 4.0 block and a Thunderbolt block to Lunar Lake’s I/O layout, providing four additional PCIe 4.0 lanes and another Thunderbolt 4 port. Its repeated N6 blocks retain nearly identical areas and layouts. Reusing these proven PHYs and controllers avoids porting and requalifying external interfaces on 18A, where faster digital logic offers less benefit to circuits constrained by the off-chip link. [38] SemiAnalysis’s teardown lab (STEEL) dives deep into the world’s advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. We’re hiring technical experts from system to transistor and everywhere in between. Check out our Careers page. Panther Lake offers scalability and modularity through its disaggregated packaging that partition compute, GPU, and I/O silicon into separate tiles allowing for a suite of tile configurations. This partitioning makes the package part of Intel’s node economics as it determines how much leading-edge wafer area each product consumes, which functions can remain on other processes, and how much configuration freedom Intel can offer from a shared set of tiles. Furthermore, fabricating the compute and GPU tiles separately confines the new 18A process to the compute tile and allows graphics and I/O to use other, more established, and more cost-effective processes. For Panther Lake, the GPU and I/O tiles are assembled alongside the compute tile on a passive silicon base using Foveros-S. Intel’s current technology brief lists a nominal 36 µm pitch for Foveros-S. Through-silicon vias (TSVs) in the base connect the fine wiring above to the larger package connections below. The functional tiles sit side by side on that passive base in a 2.5D configuration. [39] Our cross-section through the compute and GPU tiles shows the package’s wiring hierarchy. Microbumps connect each active tile to the passive silicon base; its fine redistribution layer (RDL) carries the short, dense tile-to-tile links. TSVs carry connections through the base to the package substrate, which fans them out to the much coarser motherboard solder joints. The base supplies interconnect, while computation remains in the active tiles above it. [39] At the compute-tile edge, the higher-magnification inset shows a local microbump spacing of approximately 25.24 µm and a feature width of 12.33 µm. These local spacings are finer than Intel’s nominal Foveros-S value. The X-ray fields further confirm tighter neighboring bumps, consistent across every die-to-die area found on each tile. Additional X-ray analysis is offered after the paywall. Putting the memory controller beside the CPU removes the D2D transfer that CPU memory requests required in Meteor Lake and Arrow Lake. This avoids the extra transmitter, receiver, and link traversal, saving interface energy and latency. Panther Lake’s separate GPU still crosses a D2D link to reach DRAM, so its larger local caches also help contain package traffic. [1], [40] Smaller dies are less likely to contain a random fatal defect, and screening them before assembly prevents one bad tile from consuming a complete package of good silicon. Reuse also spreads design and qualification work across more products. Against those gains, Intel pays for the passive base, D2D circuits, extra bonding and test steps, and losses during assembly. Cost per working product across the portfolio captures the combined effect of wafer yield, reuse, test, and assembly. [29] Wildcat Lake packaging Intel launched Core Series 3, formerly Wildcat Lake, on 16 April 2026 for value mobile and edge systems. Wildcat Lake keeps 18A but removes the passive base and combines more functions on one die to simplify the package. The two products therefore reveal two distinct ways to commercialize the same leading-edge process. [41] Wildcat Lake’s 18A die combines up to two Cougar Cove P-cores, four Darkmont LP E-cores, two Xe3 cores and a smaller NPU. A separate platform-controller die supplies I/O, connected through UCIe, Intel’s first processor implementation of the standard. Consolidating graphics remove a tile boundary and the passive base, reducing assembly complexity for a modest-bandwidth value product. It also ties CPU and graphics scaling to the same die, giving up Panther Lake’s ability to swap in a much larger GPU. [42], [43] In July 2021, Intel CEO Pat Gelsinger set out an ambitious process roadmap aimed at regaining performance leadership by 2025, later described as five nodes in four years. Five years and one CEO later, Intel’s comeback story is not as unambiguously positive as Pat may have hoped. [44], [45] Intel once set the pace for process technology, bringing high-k metal gate technology and FinFETs into volume production years ahead of the rest of the industry. Its 22 nm FinFET process reached consumers with Ivy Bridge in 2012. [46] Intel’s integrated device manufacturing (IDM) model allowed its architects and process engineers to co-optimize products and processes. Starting with Sandy Bridge, Intel dominated x86, while AMD struggled with Bulldozer. That lead faltered at 14 nm and broke at 10 nm. Intel targeted a massive 2.7× density increase, but the node arrived years late and required several revisions before it could support Intel’s full lineup. This delay forced Intel to stretch 14 nm across six generations, while TSMC moved ahead in process technology and AMD recovered in x86. By 2019, Intel was still shipping 14 nm across most of its product stack, with its 10 nm client ramp focused on Ice Lake mobile processors. Meanwhile, TSMC was shipping N7 and N7+, and AMD’s Zen 2 compute chiplets used N7 to raise core counts and improve efficiency. Intel’s process failures were central to its decline, but unsound business decisions furthered their downward slide. Product delays compounded product mistakes, pushing client, server, and FPGA roadmaps off schedule. Several attempts to enter AI (Nervana and Gaudi) and networking (Tofino) also failed to establish lasting businesses. Intel’s recovery has focused on consumer CPUs and advanced packaging. Tiger Lake, Alder Lake, Lunar Lake and now Panther Lake have restored Intel’s consumer roadmap. On the process side, Intel 4 shipped with Meteor Lake, Intel 3 with Granite Rapids and Sierra Forest, and Intel 18A with Panther Lake. Intel has also made advanced packaging part of its foundry offering. However, Intel is still playing catch-up in servers. Several Xeon generations arrived years late and trailed contemporary AMD and Arm server CPUs in performance, efficiency, and core count. The process roadmap is back, but Intel does not hold the same process-technology leadership position it held prior to 10 nm. The introduction of gate-all-around nanosheets and backside power delivery are two of the biggest changes to transistor integration in a decade. Intel took on both changes at once: 18A paired its first RibbonFET with PowerVia in Panther Lake. Panther Lake is a substantial manufacturing milestone. Our cross-sections show how RibbonFET and PowerVia reshape local contacts and wiring, while the floorplans show where architectural consolidation and process choices save area. A sustained competitive lead depends on product performance, cost, yield, and the next implementation. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page.. 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