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Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?

Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.

Jun 14 • 3:14 PM EDT • Technology • newsletter.semianalysis.com

Marc Cucurella transfer news: Real Madrid reach agreement to sign Chelsea full-back

Real Madrid have struck a deal with Chelsea for Marc Cucurella; the move is a blow to incoming Blues boss Xabi Alonso, who is already short of experienced players; Cucurella was a priority signing for new Real manager Jose Mourinho; they fought off competition from Barcelona and Man City

Jun 14 • 2:00 PM EDT • Sports • skysports.com

Georgia's vote-counting method will soon be banned. Lawmakers will try to find a fix this week

Legislators passed a law two years ago barring the use of the QR code printed on ballots that the state relies on to tally votes beyond July 1 of this year, but no replacement method was ever implemented.

Jun 14 • 12:22 PM EDT • Politics • pbs.org

Mid-Hudson Valley business calendar for the week of June 15, 2026

Young Ulster Professionals Meet up, 6 p.m. to 8 p.m. Artisan Beauty Bar, 284 Wall St., Kingston. To register visit ulsterchamber.org.

Jun 14 • 11:46 AM EDT • Business • dailyfreeman.com

Laramie County health and food inspections (6/5/26–6/11/26)

CHEYENNE, Wyo. — The Cheyenne-Laramie County Health Department inspects restaurants, bars, convenience stores, delis, grocery stores, bed and breakfasts

Jun 14 • 11:00 AM EDT • Health • capcity.news

Lewis Hamilton wins the Barcelona-Catalunya GP

Ferrari’s Lewis Hamilton wins the Barcelona-Catalunya Grand Prix, sparking the title fight

Jun 14 • 10:36 AM EDT • Sports • sports.yahoo.com

This Subaru Kei Van Parks Like A Motorcycle But Swallows Half Your Garage

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Jun 14 • 8:00 AM EDT • Technology • carscoops.com

We lived in China and Cambodia. Our daughter found home in Los Angeles.

My daughter barely remembers the years we spent living in China and Cambodia, even though they still shape how I see family and home.

Jun 14 • 6:37 AM EDT • Business • businessinsider.com

Artemis II crew captures rare double auroras on the dark side of Earth as they zoom toward the moon — Space photo of the week

The four astronauts on NASA’s Artemis II mission captured more than they bargained for when they photographed the nightside of Earth, right after starting their historic journey to the moon.

Jun 14 • 6:00 AM EDT • Science • livescience.com

Under Trump, hopes for a mining boom in the Nevada desert

Tonopah has boomed and mostly busted since it's heyday more than a century ago. Trump has raised expectations for renewed prosperity and one local businessman is sprucing up his motel in anticipation of better times.

Jun 14 • 6:00 AM EDT • Politics • latimes.com

See where Wilmington partied in the 1980s

These restaurants, rooms and bars represented some of the many nightspots Wilmington frequented in the 1980s.

Jun 14 • 5:01 AM EDT • Entertainment • starnewsonline.com

Australia vs Türkiye Extended Highlights

Check out the full game highlights between Australia and Türkiye in the 2026 FIFA World Cup™. Announced by Jacqui Oatley and Warren Barton.

Jun 14 • 2:22 AM EDT • Sports • foxsports.com

Bark dust piles catch fire at Cornelius landscape supply business

Cornelius firefighters knocked down a compost fire on Saturday after crews spotted heavy smoke while heading back from another call.

Jun 14 • 12:55 AM EDT • Business • kptv.com

New barber shop opens up in Berks County

They cut the ribbon at Da Gallery and welcomed the community in to see the place.

Jun 13 • 6:06 PM EDT • Business • wfmz.com

Converting A Scanning Electron Microscope Into A TEM Is Surprisingly Easy

Although both a SEM and a TEM are electron microscopes, their working principles and images are very different. Whereas an SEM uses secondary electrons ejected after bombarding a sample’s sur…

Jun 13 • 4:00 PM EDT • Technology • hackaday.com

Why Paul Skenes, at the center of the MLB's labor battle, believes the players need to dig in

When it comes to negotiations for the MLB’s next collective bargaining agreement, there are some misconceptions that Paul Skenes would like to clear...

Jun 13 • 12:00 PM EDT • Sports • post-gazette.com

Barcelona-Catalunya GP Qualifying: George Russell pips Lewis Hamilton to pole position as Charles Lederc crashes out

Jun 13 • 12:00 PM EDT • Sports • skysports.com

Kirby Center celebrating 40 years of entertainment, education, community impact

WILKES-BARRE — Joell Yarmel, executive director of the F.M. Kirby Center for the Performing Arts, said this week that 40 years ago, a group of dreamers believed that live performance could transform a community.

Jun 13 • 9:44 AM EDT • Entertainment • timesleader.com

Portland’s iconic Sports Bra bar pitches investors on national expansion as it bleeds red ink

Financial statements filed in The Sports Bra's latest fundraising effort show declining revenues amid widening operating losses.

Jun 13 • 9:00 AM EDT • Business • oregonlive.com

Portland’s iconic Sports Bra bar pitches investors on national expansion as it bleeds red ink

Financial statements filed in The Sports Bra's latest fundraising effort show declining revenues amid widening operating losses.

Jun 13 • 9:00 AM EDT • Sports • oregonlive.com

Steam machine reportedly sent to reviewers as embargo date and package contents leak

According to a new leak, the first Steam Machine review units may already have been shipped to reviewers and content creators. The rumored review embargo date and possible package contents have also surfaced.

Jun 13 • 7:25 AM EDT • Technology • notebookcheck.net

Democrats have a one-word defense for supporting Graham Platner: Trump

Platner’s backers in Maine say with Trump in office and Senate control on the line, the bar is low and the stakes are high: “Purity politics don’t get us anywhere.”

Jun 13 • 6:00 AM EDT • Politics • washingtonpost.com

Entertainment and education events

The Scottsboro Stampede Pro Rodeo will be held Friday and Saturday, June 19-20. The event is presented by Twisted Horn Rodeo Company and will feature barrel racing, calf roping, steer

Jun 13 • 1:00 AM EDT • Entertainment • jcsentinel.com

How video games became a channel for political influence

From China to Saudi Arabia, governments are investing billions in gaming to project influence and assert control

Jun 13 • 12:00 AM EDT • Politics • ft.com

Gilberto Gil: ‘Politics found us. We had to fight the dictatorship’

He’s been a global music star, a prisoner and Brazil’s minister of culture. Now he’s touring for the last time — or is he?

Jun 13 • 12:00 AM EDT • Politics • ft.com

Judge blocks Trump national parks order, calling it ‘censorship’

A federal court barred the Trump administration from continuing to remove information about civil rights, climate change and other topics from national parks, directing the government to restore what it changed within the coming weeks.

Jun 12 • 9:55 PM EDT • Politics • washingtonpost.com

Bars, restaurants looking forward to bump in business from World Cup

The United States’ World Cup matchup with Paraguay on Friday night is stoking a lot of excitement and a lot of commerce for businesses in the Susquehanna Valley.

Jun 12 • 7:30 PM EDT • Business • wgal.com

Seattle businesses ready to cash in as World Cup kicks off downtown

For Sage Lavner, a bartender at Baba Yaga in Pioneer Square, the excitement is hard to miss.

Jun 12 • 7:24 PM EDT • Business • komonews.com

After closing following a fire 14 months ago, iconic Routt County restaurant is back in business

The new Antlers Café and Bar owner, Chris Braden, is serving up his signature chicken fried steak for customers returning to the historic spot in Yampa following a fire that closed the business for 14...

Jun 12 • 4:36 PM EDT • Business • steamboatpilot.com

Barricaded man prompts SWAT, police response at Fort Lauderdale business

Fort Lauderdale police and SWAT officers responded Friday afternoon to a barricaded man believed to be inside a business after authorities say entered an unauthorized area and refused to leave.

Jun 12 • 4:35 PM EDT • Business • local10.com

Does Jeff Bezos benefit from a NH Business Enterprise Tax cut? - THE JOSIAH BARTLETT CENTER FOR PUBLIC POLICY

New Hampshire’s unique state tax structure is hard to understand, especially for people who don’t own a business. More than a third (36%) of the state General Fund and Education Trust Fund revenue comes from business taxes. The vast majority of that comes from the Business Profits Tax (BPT), but the lesser-known Business Enterprise Tax […]

Jun 12 • 1:29 PM EDT • Business • jbartlett.org

'Still very immature': Texas sports bar owner sounds alarm on NFL's streaming pivot

Texas restaurateur Jim Hallers warns Congress that NFL streaming fragmentation threatens sports bars, citing $30,000 to $40,000 upgrade costs per venue.

Jun 12 • 1:22 PM EDT • Sports • foxbusiness.com

HBOT USA Expands Education and Business Consulting Initiatives as Interest in Hyperbaric Oxygen Therapy Continues to Grow

HBOT USA is expanding its focus on education, compliance, and business consulting to help healthcare professionals build safe and scalable hyper...

Jun 12 • 12:29 PM EDT • Business • markets.businessinsider.com

2026 World Cup schedule, scores, live updates: Canada takes on Bosnia, USMNT takes stage vs. Paraguay in group stage Friday

Jun 12 • 11:04 AM EDT • Sports • sports.yahoo.com

Systematic review identifies key barriers preventing Indian adolescents from seeking mental health care

For many adolescents in India, seeking help for anxiety, depression or emotional distress remains far more difficult than it should be. A new review led by The George Institute for Global Health finds ...

Jun 12 • 7:40 AM EDT • Health • medicalxpress.com

‘Winning at all costs:’ Trump wraps himself in UFC’s bareknuckle image

UFC Freedom 250 marks the culmination of a decades-long relationship between a president and a sport which harnessed bravado to reach the White House.

Jun 12 • 5:09 AM EDT • Politics • usatoday.com

Pope Leo’s visit lays bare Spain’s tangled politics of faith and migration

The American pope's message underlines the rift between his Catholicism and that of Spain's far right.

Jun 12 • 3:20 AM EDT • Politics • aljazeera.com

Washtenaw Business Lens: When homelessness and mental health challenges collide with local businesses

Ann Arbor businesses are feeling the impact of people suffering homelessness and mental health challenges. For this month's "Washtenaw Business Lens," WEMU's Caroline MacGregor and Ann Arbor/Ypsilanti Regional Chamber Executive Vice President and Director of Government Relations, Andy LaBarre discussed these economic impacts with the Executive Director of Washtenaw County Community Mental Health, Trish Cortes.

Jun 12 • 3:00 AM EDT • Business • wemu.org

South Korea vs Czechia Highlights

Check out the full game highlights between South Korea and Czechia in the 2026 FIFA World Cup™. Announced by Jacqui Oatley and Warren Barton.

Jun 11 • 11:49 PM EDT • Sports • foxsports.com

‘It’s very tough’: Texas barbecue businesses adapt as brisket prices climb

Jun 11 • 4:38 PM EDT • Business • ksat.com

Elisabeth Hasselbeck jumps from 'The View' to rival daytime talk show

Elisabeth Hasselbeck has landed a new daytime TV hosting gig after returning to 'The View' earlier this year, as she heads to 'CBS Mornings' under the controversial leadership of Bari Weiss.

Jun 11 • 4:22 PM EDT • Entertainment • ew.com

Trump plans to nominate U.S. Attorney Jay Clayton to be national intelligence director

President Donald Trump announced the nomination on social media amid pressure from Congress to name a permanent replacement for Tulsi Gabbard, who resigned last month.

Jun 11 • 2:59 PM EDT • Politics • pbs.org

Big dreams and even bigger possibilities possible with Science Museum Oklahoma's Barbie experience

Science Museum Oklahoma has a brand-new exhibit celebrating an iconic doll that has inspired children to imagine big through her many careers.

Jun 11 • 2:24 PM EDT • Science • koco.com

Galaxy phones can finally display network speed in the status bar, here’s how

No root, no third-party app: Galaxy smartphones can finally show network speed in the status bar, and we explain how to enable it.

Jun 11 • 2:16 PM EDT • Technology • sammobile.com

Halo: Campaign Evolved Stumbles on Unreal Engine 5, as RTX 5090 Barely Cracks 100 FPS at 1440p Ultra

Halo Campaign Evolved UE5 remake struggles to hit high FPS on RTX 5090 at 1440p, proving optimization worries valid.

Jun 11 • 11:05 AM EDT • Technology • wccftech.com

After years of waiting, One UI 9 finally brings this status bar feature to Galaxy phones

One UI 9 now supports adding a network speed indicator to the status bar and disabling live activities using a Good Lock module.

Jun 11 • 10:34 AM EDT • Technology • androidauthority.com

Barcelona confirm bid to host 2029 Champions League final

Wembley Stadium is also in the running.

Jun 11 • 10:19 AM EDT • Sports • sports.yahoo.com

This 57-Year-Old’s Cheesy, ‘Wildly Fun’ Business Averages $3,200 a Month and Is Headed for $100,000 a Year: ‘Revenue Right Away’

Kiersten Bartlett revamped a beloved childhood snack.

Jun 11 • 10:00 AM EDT • Business • entrepreneur.com

Leaker says new MacBook is ‘100% confirmed’ to get touchscreen

A reputable supply chain leaker just added fresh confirmation that a new touchscreen-equipped MacBook is coming soon.

Jun 11 • 9:43 AM EDT • Technology • 9to5mac.com

Survey shows growing challenge of running a business in Maine

Nearly half of Maine businesses surveyed by the Maine State Chamber of Commerce cite workforce challenges and policy uncertainty as barriers to growth .

Jun 11 • 9:03 AM EDT • Business • mainebiz.biz

Judges are losing patience with lawyers' AI flubs

A Mississippi federal judge removed all four lawyers from a case, barred two from practicing before the court, and issued $8,000 in fines.

Jun 11 • 5:30 AM EDT • Business • businessinsider.com

Manheim Twp. man creates \'bartender\'s handshake\' coin for World Cup

There's a secret handshake among bartenders with high-end drink programs, and it involves an exclusive, rare coin.

Jun 11 • 5:00 AM EDT • Entertainment • lancasteronline.com

PSV’s Ismael Saibari awaiting green light for Bayern Munich move

Bayern Munich have proposed a package of €45m plus €5m in bonuses to PSV for Moroccan attacker Ismael Saibari (25), according to a report by Santi Aouna.Talks continue between the two clubs, with ...

Jun 11 • 5:00 AM EDT • Sports • sports.yahoo.com

WHO urges targeted action to strengthen emergency workforce capacities for shared health risks across the Asia-Pacific region

At a time when the world is more interconnected than ever, the World Health Organization (WHO) is disseminating a comprehensive regional analysis of shared health risks across Asia and the Pacific, urging Member States to invest in enhancing workforce capacities regionwide to mitigate these risks and ensure health systems are better prepared to anticipate, tackle and withstand a range of crises and shocks. Over 100 delegates from 49 countries and areas in the Asia-Pacific region reviewed results from the regional risk analysis during the WHO-led Asia Pacific Health Security Action Framework (APHSAF) Stakeholders Meeting in Malaysia. Synthesizing insights from 21 strategic risk assessments and more than 800 multisectoral experts, the regional analysis highlighted an urgent imperative: countries must proactively invest in emergency workforce preparedness to navigate a landscape where climate hazards, disease outbreaks and geophysical events increasingly overlap. These complex converging crises create devastating, compounding impacts on health systems and communities – reiterating the need for investing in a fit-for-purpose regional health workforce and multisectoral action.Key findings: an evolving risk landscape More than half of the participating countries ranked flooding, cyclones, dengue and pandemic-potential respiratory pathogens as being of high or very high risk, while antimicrobial resistance, landslides and gastroenteritis remain widespread concerns as well. “Given that 51% – over half – of these assessed hazards are deeply interconnected, isolated health interventions are no longer sufficient,” said Dr Saia Ma’u Piukala, WHO Regional Director for the Western Pacific. “Extreme weather events like cyclones and floods directly trigger subsequent disease outbreaks, while environmental degradation – driven by sea-level rise, coastal erosion and saltwater intrusion – fuels health risks across the Pacific. Mitigating these cascading risks requires unified, cross-sectoral action linking environmental, agricultural and public health policies to build true regional resilience.” Priority recommendations for action To address critical vulnerabilities, WHO calls on Member States in the Asia-Pacific region to urgently prioritize the following strategic actions: Bridge workforce capacity gaps. Embed and standardize emergency preparedness within academia to promote regional workforce interoperability. Foster multisectoral coordination. Address ad-hoc taskforce responses and fragmented surge support through formalized contingency plans and standard operating procedures that are frequently updated and tested. Secure sustainable financing for emergencies. Overcome systemic barriers to access dedicated funding for both immediate anticipatory actions and long-term emergency preparedness initiatives. Enable emergency-ready primary health care. Embed emergency management into public health workforce readiness planning. Ensure that emergency planning is inclusive. Establish clear pathways for inclusive emergency planning that actively involves communities most at risk and other vulnerable groups. Optimize communication. Update risk communication and community engagement strategies, aligning them with seasonal risk calendars. Elevating workforce readiness to meet regional health risks While the gaps identified are significant, the Asia-Pacific region possesses solid foundational pillars, including dedicated clinicians, laboratory staff, rapid response teams, emergency medical teams and extensive community networks. However, to adequately address the compounding nature of modern crises, the various components of the emergency workforce must collaborate cohesively. True resilience depends entirely on transforming this currently fragmented workforce into a highly trained, interconnected and rapidly deployable asset. To achieve this, WHO is actively advancing regional workforce capacities through the Global Health Emergency Corps initiative. This initiative – supported by the Gates Foundation and the Institute of Philanthropy – seeks to build a seamless network of emergency workforce across borders and sectors, ensuring that when a crisis strikes, a standardized, well-coordinated and trained workforce is immediately ready to respond. “Scaling up emergency workforce readiness is no longer optional,” said Dr Gina Samaan, Regional Emergency Director for WHO in the Western Pacific. “It is the definitive factor that will determine how effectively the Asia-Pacific region safeguards health and protects lives in an increasingly unpredictable future.” ____________________For more information, or to arrange media interviews, contact: Ara Johannes, WHO Western Pacific Health Emergencies Division: johannesa@who.int WHO Western Pacific Communications: wprocom@who.int

Jun 10 • 8:00 PM EDT • Health • who.int

Facilitators of, barriers to and strategies for health-system guidance implementation: a critical interpretive synthesis

npj Health Systems - Facilitators of, barriers to and strategies for health-system guidance implementation: a critical interpretive synthesis

Jun 10 • 8:00 PM EDT • Health • nature.com

Charles Barkley dares ESPN to fire him after his controversial Cardi B joke during NBA Finals

Charles Barkley reacted to the controversy surrounding the joke he made about Cardi B during the NBA Finals.

Jun 10 • 6:54 PM EDT • Entertainment • ew.com

Record Lobby Cash Shapes EU Pro-business Agenda, Campaigners Say

The corporate titans of the tech, energy and chemicals industries are spending more than ever to influence EU decision-makers, determined to see more business-friendly policies -- and it's paying off, campaigners said Thursday.

Jun 10 • 6:01 PM EDT • Business • barrons.com

Ubisoft Embargoes Journalists Reporting On Latest Round Of Layoffs

This is not typically what embargoes are for

Jun 10 • 5:48 PM EDT • Technology • aftermath.site

Nevada is set to have one of nation’s premier races for governor as Democrats seek to reclaim seat

Nevada Gov. Joe Lombardo, a Republican, will face Democratic Attorney General Aaron Ford in a battle to hold onto his seat in November, setting up what is considered one of the most competitive governor's races in the country.

Jun 10 • 4:28 PM EDT • Politics • pbs.org

The Health and Wellbeing of Formerly Incarcerated People in Connecticut: Insights from the DataHaven Community Wellbeing Survey

By Carter Shannon, Nat Markey, Nora Hodgson, Samantha Lydell, Andrew Carr, and Mark Abraham, DataHaven About this Report Approximately 1 in 5 men aged 18–64 in Connecticut have experienced incarceration at some point in their lives. This population includes people who have been held in a local jail for a single night and those who have served lengthy prison sentences, and it cuts across race, age, geography, and socioeconomic background in ways that reflect broader structural inequities in the criminal legal system. Yet across nearly every indicator of wellbeing, formerly incarcerated people in Connecticut face significant disparities compared to those without an incarceration history. This report explores data on the experiences of formerly incarcerated men in Connecticut from the DataHaven Community Wellbeing Survey (DCWS). The DCWS illuminates significant gaps in economic wellbeing, physical health, mental health, and social support between men with and without incarceration histories in Connecticut. The survey also reveals worse self-reported outcomes for formerly incarcerated people across a range of quality-of-life indicators, with disparities that are often most severe among those who have been incarcerated more than once. These disparities do not arise by chance. They are shaped by a policy landscape that erects lasting barriers to housing, employment, and healthcare for people leaving incarceration, as well as by the physical and psychological toll of incarceration itself. This report is being written in the political context of federal funding cuts to social programs and proposed rollbacks to Medicaid eligibility, changes that will disproportionately impact people with incarceration histories, who are more likely to rely on public health coverage and other safety net supports.

Jun 10 • 4:13 PM EDT • Health • ctdatahaven.org

How AI Will Change the Job Market—and Boost These Health Insurance Stocks

Barclays upgraded its rating of Oscar to overweight, a buy equivalent, and reiterated its overweight rating on Centene in a new research note.

Jun 10 • 1:50 PM EDT • Health • barrons.com

Ubisoft closing studios in Winnipeg and Belgrade and cutting publishing roles worldwide, 380 jobs at risk

Latest round of cuts includes refocusing Barcelona studio on Rainbow Six, with an unknown number of roles affected

Jun 10 • 1:00 PM EDT • Technology • gamesindustry.biz

RWJBarnabas Health Announces Partnership with Union County to Launch Mobile Pediatric Unit, Community Health Clinics

RWJBarnabas Health and Union County today announced the signing of an agreement to roll out a new mobile pediatric unit that will provide local children with essential health services.

Jun 10 • 12:42 PM EDT • Health • rwjbh.org

Trump’s AI fund idea is good politics, but bad economics

Plans to share the gains from technology could cause more problems than they solve

Jun 10 • 12:42 PM EDT • Politics • ft.com

No injuries, no props: CFTC proposes prediction market rules

Prediction markets could soon be barred from offering certain types of sports-related event contracts, including those involving officiating outcomes or player injuries.

Jun 10 • 12:40 PM EDT • Sports • espn.com

Three of four Republicans who forced the release of the Epstein files are now out of jobs

With GOP Rep. Nancy Mace’s embarrassing fifth-place finish in the South Carolina gubernatorial primary Tuesday, three of the four House Republicans who forced the release of the Jeffrey Epstein files will soon no longer hold elected office.

Jun 10 • 11:20 AM EDT • Politics • cnn.com

‘Big Ev’ breaks silence on Barstool absence, reveals gambling addiction

Evan “Big Ev” McDowell broke his silence Wednesday in a video posted to social media, confirming that he checked himself into a residential treatment center for a gambling addiction, in what amounted to his first public statement since disappearing from Barstool Sports content in early April amid allegations that he stiffed multiple illegal bookmakers out…

Jun 10 • 10:35 AM EDT • Sports • sports.yahoo.com

MLB trends: Red Sox's home woes, how Giants lost the Patrick Bailey trade and a bargain free agent making good

Let's check in around the league as the summer drags on

Jun 10 • 8:40 AM EDT • Sports • cbssports.com

Sydney Sweeney reacts to 'Euphoria' 'cast drama' rumors after final season

Sydney Sweeney responded to 'cast drama' rumors after 'Euphoria' ended with a heavily maligned final season, and spoke about 'clickbait' that's written about her.

Jun 10 • 8:14 AM EDT • Entertainment • ew.com

Business Restructuring Review Vol. 25 No. 3 May-June 2026

In This Issue Texas Bankruptcy Court Adopts Barnet Rule Requiring Foreign Debtor to Have U.S. Assets to Be Eligible for Chapter 15 Relief In In re Siu-Fung Ceramics Holdings Limited, No. 24-33299, 2026 WL 382424 (Bankr. S.D. Tex. Feb. 10, 2026), the court denied petitions for chapter 15 recognition of Hong Kong bankruptcy and liquidation proceedings commenced on behalf of an individual debtor and a group of companies that he owned or controlled. According to the court: (i) the corporate debtors' Hong Kong liquidation proceeding was not eligible for chapter 15 recognition because the attorney retainer upon which such relief was based was not funded until nine months after the chapter 15 petition date; and (ii) the individual debtor's Hong Kong bankruptcy case could not be recognized because the debtor's "center of main interests" on the chapter 15 petition date was not in Hong Kong, and he did not even maintain an "establishment" there. [read more …] Southern District of Texas Clarifies Post-Purdue Course for Consensual Third-Party Releases and Gatekeeping Provisions In In re Container Store Group, Inc., 676 B.R. 356 (S.D. Tex. 2026), appeal filed, No. 26-20166 (5th Cir. Apr. 14, 2026), cross appeal filed, No. 26-20166 (5th Cir. Apr. 24, 2026), the U.S. District Court for the Southern District of Texas addressed consensual third-party releases and gatekeeping provisions in the aftermath of the U.S. Supreme Court's ruling in Harrington v. Purdue Pharma L.P., 603 U.S. 204 (2024). Consistent with existing Fifth Circuit precedent, the court confirmed that, in appropriate circumstances, consent for third-party releases may be obtained through a creditor's failure to opt out of granting that consent. But, the court ruled, consent through an opt-out mechanism essentially can never be inferred for creditor classes that stand to receive no recovery under a chapter 11 plan and that are deemed to reject the plan by operation of applicable bankruptcy law. Instead, those classes must affirmatively opt in to any release. The court also narrowed and remanded the bankruptcy court's acceptance of a broad gatekeeping provision, ruling that such provisions must correspond to the restrictions established by Fifth Circuit precedent. [read more …] Delaware Bankruptcy Court: Initial Transferee Need Not Be Defendant in Fraudulent Transfer Avoidance and Recovery Litigation The Bankruptcy Code gives a bankruptcy trustee the power to avoid asset transfers that are either made with the intent to defraud creditors or that are "constructively" fraudulent because an insolvent debtor did not receive adequate value in exchange. The Bankruptcy Code also permits recovery of an avoided transfer from not only the initial recipient, but also from subsequent transferees. Courts disagree over whether a transfer must actually be avoided before the trustee can seek recovery from a subsequent transferee and whether the initial transferee must also be a defendant in the recovery litigation against a subsequent transferee. The U.S. Bankruptcy Court for the District of Delaware weighed in on this debate in Phillips v. SS Associates LLC (In re ONH AFC CS Investors, LLC), No. 23-10931 (CTG), 2026 WL 312892 (Bankr. D. Del. Feb. 4, 2026). The court adopted the majority view, ruling that the initial transferee need not be a defendant in avoidance and recovery litigation against a subsequent transferee, but that the trustee must establish the elements necessary to avoid the initial transfer as part of the recovery litigation. [read more …] New York Bankruptcy Court Weighs In on Adequate Assurance of Future Performance under Assigned Leases and Chapter 11 Plan Exculpation Provisions In order to assume and assign an executory contract or unexpired lease, a bankruptcy trustee must cure most defaults under the agreement and provide "adequate assurance" of the assignee's future performance. However, the Bankruptcy Code provides no guidance as to the meaning of "adequate assurance" other than with respect to shopping center leases. In In re Broadway Realty I Co. LLC, No. 25-11050, 2026 WL 147505 (Bankr. S.D.N.Y. Jan. 19, 2026), the U.S. Bankruptcy Court for the Southern District of New York examined this issue in connection with a proposed assignment of thousands of residential leases as part of a free-and-clear sale of debtors' properties. The court held that "adequate assurance" does not mean a guarantee of the assignee's future performance, but merely demonstration that the assignee has the ability to satisfy the underlying obligations. The bankruptcy court also ruled that an exculpation provision in the debtors' chapter 11 plan exonerating non-estate fiduciaries from liability for actions taken in connection with the chapter 11 case was unobjectionable, provided it was limited in scope to postpetition conduct and actions taken in connection with implementation of the plan after its effective date. [read more …] Newsworthy Corinne Ball (New York) (Hall of Fame), Bruce Bennett (Los Angeles), Carl E. Black (Cleveland), Jeffrey B. Ellman (Atlanta), Brad B. Erens (Chicago), Gregory M. Gordon (Dallas), Heather Lennox (Cleveland/New York), Joshua M. Mester (Los Angeles), and Kevyn D. Orr (Washington) were included in the 2026 edition of Lawdragon 500 Leading Bankruptcy and Restructuring Lawyers. The Daily Business Review selected Isel M. Perez (Miami) as an "On the Rise" winner for the Florida Legal Awards. The Florida Legal Awards annually recognize those who have made significant contributions to the legal industry in Florida. Dan T. Moss (Washington/New York) was inducted as a Fellow in the 37th Class of the American College of Bankruptcy at its Annual Meeting in March 2026 in San Antonio, Texas. Christine Borries (Munich) was ranked in the practice area Restructuring/Insolvency in the 2026 edition of Chambers Germany. The 2027 edition of The Best Lawyers in Singapore™ recognized Sushma Jobanputra (Singapore) in the practice area Insolvency & Reorganization. The restructuring transaction involving Eissmann Automotive North America, Inc. received the "2025 Turnaround of the Year (Large Company)" at the Turnaround Management Association (Detroit) Annual Awards Reception. T. Daniel Reynolds (Cleveland) and Nick Buchta (Cleveland) represented subsidiaries of Eissmann Group Automotive in connection with the parent company's German insolvency proceedings. Roger Dobson (Sydney) is among 40 Jones Day lawyers recognized by The Best Lawyers in Australia 2027 for his contributions in Banking and Finance Law; Distressed Investing & Debt Trading; Insolvency and Reorganization Law; Litigation. An article written by Corinne Ball (New York) titled "Ard Finance—A Global Enterprise Combining an LME With a Foreign Insolvency Proceeding and Chapter 15" was published in the April 21, 2026, edition of the New York Law Journal. An article written by Alex Sapp (New York) titled "Recent Developments in Section 510—Subordination" was published in the 2025 edition of the Norton Annual Survey on Bankruptcy Law. An article written by Brad B. Erens (Chicago) titled "New York Bankruptcy Court Approves Insider DIP Litigation Financing" was published on April 6, 2026, by Lexis Practical Guidance. An article written by Corinne Ball (New York), Dan T. Moss (Washington/New York), David S. Torborg (Washington), and Isel M. Perez (Miami) titled "New York District Court Affirms Narrow Scope of 'Public Policy Exception' in Chapter 15 Cases" was published on April 6, 2026, by Lexis Practical Guidance. An article written by Jeffrey B. Ellman (Atlanta) titled "Statutory Cap on Lease Rejection Damage Claims in Bankruptcy Applies to Solvent Debtors" was published on April 6, 2026, by Lexis Practical Guidance. An article written by Trisha L. Mowbray (Real Estate; Chicago) and Ryan Sims (Washington) titled "Chapter 11 Plan that Abridged Non-Debtor Lessee's Rights to Remain in Possession After Rejection Unconfirmable as Having Been Proposed in Bad Faith" was published on April 6, 2026, by Lexis Practical Guidance. Lawyer Spotlight: Ben Rosenblum Ben Rosenblum, a partner in the New York Office, represents debtors, creditors, and other parties in out-of-court restructurings and court-supervised proceedings, including chapter 11 cases, municipal bankruptcies, international insolvency matters, and stockbroker liquidations. His experience spans industries such as manufacturing, shipping, mining, aviation, energy, real estate, and telecommunications. Ben's notable debtor representations include Peabody Energy, the City of Detroit, Chrysler LLC, Spansion Japan, and Dana Corporation. Significant creditor representations include General Maritime Corporation, Calpine Corporation, American Home Mortgage, and Murray Energy. He currently represents creditors in Puerto Rico's restructuring. He also has extensive experience advising financial institutions on bankruptcy law as applied to derivatives.

Jun 10 • 8:00 AM EDT • Business • jonesday.com

Amazon Expands Its LTL Shipping Business. Old Dominion Freight Tumbles.

Old Dominion Freight Line and FedEx Freight stocks are falling Wednesday after Amazon expands its less-than-truckload shipping service.

Jun 10 • 7:45 AM EDT • Business • barrons.com

Amazon Expands Its LTL Shipping Business. Old Dominion Freight Tumbles.

Old Dominion Freight Line and FedEx Freight shares are falling Wednesday.

Jun 10 • 7:45 AM EDT • Business • barrons.com

New entertainment center being developed in Maricopa

MARICOPA — Plans for new entertainment options in Maricopa are progressing, as developer Scott Bartle is reportedly bringing a new indoor-outdoor entertainment center to the city near Copper Sky Regional

Jun 10 • 5:16 AM EDT • Entertainment • pinalcentral.com

Who owns my name after I sell my business?

I want to use my name for new products, but my former backers are threatening legal action

Jun 10 • 12:00 AM EDT • Business • ft.com

'Iconic' Australian BBQ chain goes out of business after almost 50 years

Barbecues Galore will close dozens of stores across the country with the loss of about 500 jobs.

Jun 9 • 10:31 PM EDT • Business • bbc.com

Andy Cohen reveals Jennifer Lawrence figured out how the 'Summer House' reunion leaked

After Bravo's three-part reunion for 'Summer House,' host Andy Cohen revealed the A-list actress who helped the network find the culprit of the viral leaked audio.

Jun 9 • 9:48 PM EDT • Entertainment • ew.com

Thomas Theatre adds entertainment center to Quinnesec location

President and Owner Tom Andes says the new addition, which has a restaurant, bar, digital arcade, axe throwing and a party room, appeals to everybody.

Jun 9 • 8:49 PM EDT • Entertainment • uppermichiganssource.com

How 'undone science' shaped Chile's glacier protection battle

What is "undone science," and how does it affect environmental policy and regulation around the world? In a recent study published in Tapuya: Latin American Science, Technology and Society, Javiera Barandiarán, ...

Jun 9 • 8:20 PM EDT • Science • phys.org

Earth's first animals barely evolved until sex changed everything

Earth’s earliest animals may have held evolution back because they reproduced asexually, creating low-competition communities that changed very little over time. When environmental pressures pushed them toward sexual reproduction, biodiversity exploded and evolution accelerated dramatically.

Jun 9 • 8:00 PM EDT • Science • sciencedaily.com

Apple Updates App Store Guidelines With Stricter Rules for Low-Quality Apps

Apple updated its App Store Review Guidelines this week, adding stricter language around low-quality apps. The 4.3 Spam rule already barred overly simple apps in saturated categories, but Apple now includes language saying low-effort apps could be pulled from the App Store. Apps in oversaturated categories that are not updated, improved, or do not attract customers may be removed, according to Apple.

Jun 9 • 6:52 PM EDT • Technology • macrumors.com

Detroit summer lineup of events, entertainment, and big-name connections with Embarco Management Founder Mikey Eckstein

Fox 2's Ronia Shamona joins Mikey Eckstein to hear all about Influence Thursdays and so much more

Jun 9 • 4:36 PM EDT • Entertainment • fox2detroit.com

Live Results: Nevada midterm primaries

Nevada Gov. Joe Lombardo will face six Republican challengers in a state primary on Tuesday, while six Democrats will compete for the nomination to reclaim the seat in November.

Jun 9 • 3:45 PM EDT • Politics • pbs.org

Mobile bar owner says uninsured tow truck driver damaged vehicle, impacted business

Graham Simpson, owner of Lost Sailor Mobile Bar, said his business has been impacted after an accident with a tow truck driver.

Jun 9 • 3:33 PM EDT • Business • 12onyourside.com

All the Liquid Glass Changes in macOS Golden Gate

When Liquid Glass launched in macOS Tahoe, Apple faced criticism over how the design looked on the Mac. Some people felt that Liquid Glass in macOS Tahoe was an afterthought with little impact from the design update, while others had issues with contrast, readability, rounded corners, and design consistency. There were long complaint threads on the MacRumors forums and on Reddit, and some people refused to update.

Jun 9 • 3:11 PM EDT • Technology • macrumors.com

City Files Suit Regarding Proposed Business

The City of Greenville has filed a lawsuit in Bond County Circuit Court against the company and three individuals who proposed a sports bar/restaurant business in the former Watson’s Drug Store building on the Greenville square. Named as defendants are W.G.O. Investments, LLC, and member managers of the developer, Joseph Gira, Tim O’Donnell and Dan

Jun 9 • 2:29 PM EDT • Business • wgel.com

Star Fox Developer Revealed, As Free Demo Barrel Rolls Onto Switch 2

Try before you fly

Jun 9 • 12:05 PM EDT • Technology • nintendolife.com

NBA legend Charles Barkley makes wild Cardi B joke during Spurs-Knicks playoffs game

NBA legend Charles Barkley made a wild joke about Cardi B at the San Antonio Spurs-New York Knicks playoffs game as the rapper performed at halftime.

Jun 9 • 11:32 AM EDT • Entertainment • ew.com

Saquon Barkley named to Time 100 Most Influential People in Sports 2026

The Eagles RB continues to earn accolades for his 2,000-yard season.

Jun 9 • 11:04 AM EDT • Sports • sports.yahoo.com

Student-led summit connects local youth with global peers through science, technology, engineering, math

Hawaiʻi International Science Experience is hosting a five-day program designed to break barriers and connect local and global youth in STEM.

Jun 9 • 11:00 AM EDT • Science • bigislandnow.com